CN106102327A - A kind of adhering method of glued membrane - Google Patents
A kind of adhering method of glued membrane Download PDFInfo
- Publication number
- CN106102327A CN106102327A CN201610664310.2A CN201610664310A CN106102327A CN 106102327 A CN106102327 A CN 106102327A CN 201610664310 A CN201610664310 A CN 201610664310A CN 106102327 A CN106102327 A CN 106102327A
- Authority
- CN
- China
- Prior art keywords
- glued membrane
- base
- top board
- printed board
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
Abstract
The adhering method of a kind of glued membrane of the present invention belongs to circuit assembly technical field.The present invention is a kind of method of rapid link glued membrane, by using special glue film adhesive tool, can play quickly positioning and reducing bonding number of times between glued membrane with heat sink, printed board.Glued membrane adhesive tool is made up of top board (1), base (2) origin reference location pin (3) anti-deviation positioning pin (4) hole, location (5).The present invention can significantly improve the bonding accuracy of glued membrane and reduce the bonding cycle.
Description
Technical field
The adhering method of a kind of glued membrane of the present invention, belongs to circuit assembly technical field.
Background technology
Printed board I institute each problem on have use, no matter fly control series or inertial navigation series again or other
The product of field series, almost the product of each series has printed board.And I the function printed board of 90% problem all need
Wanting bonding cold drawing to play the effect of heat radiation, the heat radiation quality of one piece of printed board directly influences a cabinet even whole system
Operation quality, the bonding hot sticky two parts of cold bonding that are broadly divided into of current printed board, traditional adhering method complex procedures, concordance
Difference, error is big.When especially encountering the printed board that in printed board, via devices is many and little, being very easy to when bonding cold drawing will
Cold drawing shelters from pad and can not find in time, thus wastes time and delay Task Progress and cause subsequent handling normally to enter
OK.
Summary of the invention
The purpose of the present invention is to propose to the adhering method of a kind of new glued membrane, solve high-volume printed board now bonding
During the complex procedures that occurs, concordance is poor, error greatly, phenomenon.During gluing so that guarantee printed board afterwards is hot and cold
Quickly, the task of accurate, light complete cost procedure.
The technical scheme that the present invention takes is: the adhering method of a kind of glued membrane, it is characterised in that the method realize step
As follows:
1, the design cold and hot viscous frock of glued membrane, the cold and hot viscous frock of glued membrane is rectangular steel plates structure, is divided into upper and lower two-layer, and upper strata is
The top board 1 of rectangle, lower floor is the base 2 of rectangle；Top board 1 matches with the profile of base 2；
2, there is hole 5, a location at the corner of top board 1 respectively；
3, anti-deviation positioning pin 4 at origin reference location pin 3 and 4 it is respectively equipped with at 4 on base 2；At 4, origin reference location pin 3 is respectively
Corresponding with the position, locking cylindrical void position that printed board locking strip preformed hole position, glued membrane are reserved；At 4 anti-deviation positioning pin 4 respectively with
Position, hole, location 5 at top board 1 four jiaos is corresponding, and can be with the use of；
4, the locking strip preformed hole position of printed board is inserted in origin reference location pin 3, then by locking cylindrical void position reserved for glued membrane
It is inserted in origin reference location pin 3, finally heat sink is locked cylindrical void position and is inserted in origin reference location pin 3；
5, with syringe, acetone is injected the corner of printed board, is used for pasting fixing heat sink and glued membrane, printed board combination
Part；
6, the hole 5, location at top board 1 four jiaos is inserted in the anti-deviation positioning pin 4 at base 2 four jiaos；
7, cold and hot to the top board 1 combined and base 2 glued membrane viscous frock is put into vulcanizer and carry out hot sticky.
The present invention has the advantage that and beneficial effect: the present invention is the hot and cold viscous process of heat sink in assembling printed board
A significant innovation, due to traditional adhering method complex procedures, concordance is poor, and error is big.Especially encounter in printed board
During many and little printed board of via devices, being very easy to that when bonding cold drawing cold drawing shelters from pad can not find in time,
Thus waste time and delay Task Progress, and cause subsequent handling to be normally carried out.Compare traditional hot and cold viscous bonding side
Method, the present invention has advantage quick, accurate, light.Use this method carry out bonding after, have the advantage that
1, first glued membrane is fixed by origin reference location pin (3) with printed board；Location is quick, accurate, position, hole aligns without skew.
Whether glued membrane directly contacts with printed board, block very clear to pad, can remove specialized staff inspection link from.
3, heat sink cold bonding step is shortened to 4 work steps by 5 work steps, and the action of injection acetone is shortened to 1 time by 2 times.
4, installation time was shortened to 3 minutes by original 10 minutes.
5, this frock only weighs 6 kilograms, only need to put in base by top board, time-consuming only 2 seconds, between base and top board
Be designed with anti-deviation positioning pin, can solve machine in uphill process vibration displacement to glued membrane and position, printed board weld tabs hole
The skew caused, both hands are easily sent in machine.
Accompanying drawing explanation
Fig. 1 top board structural representation
Fig. 2 lower bottom base schematic diagram
Wherein top board (1), for base (2), origin reference location pin (3), anti-deviation positioning pin (4), hole, location (5).
Detailed description of the invention
A kind of adhering method of glued membrane, it is characterised in that the method to realize step as follows:
1, the design cold and hot viscous frock of glued membrane, the cold and hot viscous frock of glued membrane is rectangular steel plates structure, is divided into upper and lower two-layer, and upper strata is
The top board 1 of rectangle, lower floor is the base 2 of rectangle；Top board 1 matches with the profile of base 2；
2, there is hole 5, a location at the corner of top board 1 respectively；
3, anti-deviation positioning pin 4 at origin reference location pin 3 and 4 it is respectively equipped with at 4 on base 2；At 4, origin reference location pin 3 is respectively
Corresponding with the position, locking cylindrical void position that printed board locking strip preformed hole position, glued membrane are reserved；At 4 anti-deviation positioning pin 4 respectively with
Position, hole, location 5 at top board 1 four jiaos is corresponding, and can be with the use of；
4, the locking strip preformed hole position of printed board is inserted in origin reference location pin 3, then by locking cylindrical void position reserved for glued membrane
It is inserted in origin reference location pin 3, finally heat sink is locked cylindrical void position and is inserted in origin reference location pin 3；
5, with syringe, acetone is injected the corner of printed board, is used for pasting fixing heat sink and glued membrane, printed board combination
Part；
6, the hole 5, location at top board 1 four jiaos is inserted in the anti-deviation positioning pin 4 at base 2 four jiaos；
7, cold and hot to the top board 1 combined and base 2 glued membrane viscous frock is put into vulcanizer and carry out hot sticky.
Below in conjunction with Figure of description, the present invention is elaborated.
Step 1: prepare printed board, glued membrane, heat sink, hot and cold viscous frock.
Step 2: printed board put on tooling base (2), makes locking strip borehole jack reserved in printed board enter on base (2)
Four origin reference location pins (3) on.
Step 3: glued membrane is placed in printed board, four benchmark that the locking strip borehole jack making glued membrane reserved enters on base (2)
On alignment pin (3).And check whether glued membrane shelters from pad.
Step 4: heat sink is placed on printed board and forms molectron on glued membrane.Make locking strip borehole jack reserved on heat sink
Enter on four origin reference location pins (3) on base (2).
Step 5: acetone injects the corner of printed board with syringe, is used for pasting fixing heat sink and glued membrane, printed board
Molectron.
Step 6: top board (1) is covered the heat sink to fix and glued membrane, printed board molectron base (2) on.
Make in four anti-deviation positioning pins (4) that four on top board (1) corner hole, location (5) are inserted on base (2) corner.
Step 7: the top board (1) combined and the cold and hot viscous frock of base (2) glued membrane are put into vulcanizer and carried out hot sticky.
Claims (1)
1. the adhering method of a glued membrane, it is characterised in that the method to realize step as follows:
(1) the design cold and hot viscous frock of glued membrane, the cold and hot viscous frock of glued membrane is rectangular steel plates structure, is divided into upper and lower two-layer, and upper strata is square
The top board (1) of shape, lower floor is the base (2) of rectangle；Top board (1) matches with the profile of base (2)；
(2) there is hole, a location (5) at the corner of top board (1) respectively；
(3) anti-deviation positioning pin (4) at origin reference location pin (3) and 4 it is respectively equipped with at 4 on base (2)；Origin reference location pin (3) at 4
Corresponding with the position, locking cylindrical void position that printed board locking strip preformed hole position, glued membrane are reserved respectively；Anti-deviation positioning pin (4) at 4
Corresponding with hole, location (5) position at top board (1) corner respectively, and can be with the use of；
(4) the locking strip preformed hole position of printed board is inserted in origin reference location pin (3), then by locking cylindrical void position set reserved for glued membrane
Enter in origin reference location pin (3), finally heat sink is locked cylindrical void position and is inserted in origin reference location pin (3)；
(5) with syringe, acetone is injected the corner of printed board, is used for pasting fixing heat sink and glued membrane, printed board molectron；
(6) hole, location (5) at top board (1) corner is inserted in the anti-deviation positioning pin (4) at base (2) corner；
(7) top board (1) combined and the cold and hot viscous frock of base (2) glued membrane are put into vulcanizer and carried out hot sticky.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610664310.2A CN106102327B (en) | 2016-08-12 | 2016-08-12 | A kind of adhering method of glue film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610664310.2A CN106102327B (en) | 2016-08-12 | 2016-08-12 | A kind of adhering method of glue film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106102327A true CN106102327A (en) | 2016-11-09 |
| CN106102327B CN106102327B (en) | 2019-01-01 |
Family
ID=57457374
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610664310.2A Active CN106102327B (en) | 2016-08-12 | 2016-08-12 | A kind of adhering method of glue film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106102327B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114891449A (en) * | 2022-04-25 | 2022-08-12 | 歌尔股份有限公司 | Laser adhesive film bonding process method and smart watch |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020152609A1 (en) * | 1999-02-23 | 2002-10-24 | Samsung Electro-Mechanics Co., Ltd. | Method and device for coupling PCB sheet |
| CN100341391C (en) * | 2001-04-18 | 2007-10-03 | 日东电工株式会社 | Method for mounting electronic part on flexible printed wiring board and adhesive sheet for fixing flexible printed wiring board |
| CN201894000U (en) * | 2010-12-07 | 2011-07-06 | 深圳市精诚达电路有限公司 | Reinforcement fitting device of circuit board |
| CN203523160U (en) * | 2013-11-06 | 2014-04-02 | 博敏电子股份有限公司 | Combined flexible printed circuit board assistant material gluing fixture |
| CN204046923U (en) * | 2014-08-19 | 2014-12-24 | 常州安泰诺特种印制板有限公司 | Heat radiation pcb board |
| CN204859778U (en) * | 2015-07-02 | 2015-12-09 | 上达电子(深圳)有限公司 | Paste and cover membrane tool |
-
2016
- 2016-08-12 CN CN201610664310.2A patent/CN106102327B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020152609A1 (en) * | 1999-02-23 | 2002-10-24 | Samsung Electro-Mechanics Co., Ltd. | Method and device for coupling PCB sheet |
| CN100341391C (en) * | 2001-04-18 | 2007-10-03 | 日东电工株式会社 | Method for mounting electronic part on flexible printed wiring board and adhesive sheet for fixing flexible printed wiring board |
| CN201894000U (en) * | 2010-12-07 | 2011-07-06 | 深圳市精诚达电路有限公司 | Reinforcement fitting device of circuit board |
| CN203523160U (en) * | 2013-11-06 | 2014-04-02 | 博敏电子股份有限公司 | Combined flexible printed circuit board assistant material gluing fixture |
| CN204046923U (en) * | 2014-08-19 | 2014-12-24 | 常州安泰诺特种印制板有限公司 | Heat radiation pcb board |
| CN204859778U (en) * | 2015-07-02 | 2015-12-09 | 上达电子(深圳)有限公司 | Paste and cover membrane tool |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114891449A (en) * | 2022-04-25 | 2022-08-12 | 歌尔股份有限公司 | Laser adhesive film bonding process method and smart watch |
| CN114891449B (en) * | 2022-04-25 | 2024-02-02 | 歌尔股份有限公司 | Laser adhesive film bonding process method and intelligent watch |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106102327B (en) | 2019-01-01 |
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