CN201894000U - Reinforcement fitting device of circuit board - Google Patents
Reinforcement fitting device of circuit board Download PDFInfo
- Publication number
- CN201894000U CN201894000U CN2010206458665U CN201020645866U CN201894000U CN 201894000 U CN201894000 U CN 201894000U CN 2010206458665 U CN2010206458665 U CN 2010206458665U CN 201020645866 U CN201020645866 U CN 201020645866U CN 201894000 U CN201894000 U CN 201894000U
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- Prior art keywords
- plate
- circuit board
- pilot pin
- location
- reinforcement
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Abstract
The utility model discloses a reinforcement fitting device of a circuit board, which comprises an iron board and a fitting jig; the fitting jig comprises a base, a table surface, a spring, a positioning pin, a positioning plate and an attached panel; the iron board is an electric heating plate with a built-in heating wire; the heating surface of the iron board is adapted to the surface of the attached panel; the base is fixedly connected with the table surface, the positioning plate is connected with the base through the spring, and the attached panel is fixedly connected with the table surface through a fixed shaft; the positioning plate is provided with a slide hole and the positioning pin, the slide hole is adapted to the fixed shaft, and the positioning plate can slide relative to the table surface; and the attached panel is provided with a positioning hole, the positioning hole is adapted to the positioning pin, and when the spring is not compressed, the positioning pin passes through the positioning hole and is protruded out of the surface of the attached panel. The reinforcement fitting jig of the circuit board can significantly improve the reinforcement precision of the circuit board through the precise positioning of the positioning pin, and the production efficiency is significantly improved.
Description
Technical field
The utility model relates to the printed substrate field, relates in particular to a kind of reinforcement laminating apparatus of circuit board.
Background technology
Often want reinforcing (FR4, PI, AD, PET) in the board structure of circuit, and all adopt artificial the applying.Wherein, FR4 is the glass epoxy plate, and PI is polyimides engineering plastics plates, and AD is the Halogen stiffening plate, and PET is PETG engineering plastics plates.
Above-mentioned stiffening plate has plenty of hot pressing glue when reinforcement, have plenty of cold pressing glue, and hot pressing glue can't be fitted firmly at normal temperatures, easily slides, and causes off normal; And the aligning accuracy that some reinforcement requires is high, and artificial applying can't reach required precision, influences the development of circuit board, and artificial operating efficiency of fitting is low, can't satisfy the raising of production efficiency, influences the efficient of integral production line.
The utility model content
The technical problem that the utility model mainly solves provides a kind of reinforcement laminating apparatus of circuit board of fit precision height and raising reinforcement productivity ratio.
For solving the problems of the technologies described above, the technical scheme that the utility model adopts is: the reinforcement laminating apparatus that a kind of circuit board is provided, comprise and scald plate and joint tool, described joint tool comprises base, table top, spring, pilot pin, location-plate and pasting panel; Described boiling hot plate is the electric boiling plate of built-in heating silk, and the heating face of boiling hot plate is surperficial suitable with described pasting panel; Described base is fixedlyed connected with table top, and described location-plate is connected with base by described spring, and described pasting panel is fixedlyed connected with table top by fixed axis; Described location-plate is provided with sliding eye and pilot pin, and sliding eye and fixed axis are suitable, and the relative table top of location-plate slidably; Described pasting panel is provided with location hole, and location hole and pilot pin are suitable, and spring pilot pin under non-compressed state is passed location hole and protruded the pasting panel surface.
Wherein, described location-plate is removable aluminium alloy plate, and the layout of the pilot pin of this location-plate and circuit board need the position of stiffening plate of reinforcement suitable; Described pasting panel is removable aluminium alloy plate, and the location hole on this pasting panel and the position of the pilot pin on the location-plate are suitable.
Wherein, described pilot pin is divided into circuit board pilot pin and stiffening plate pilot pin, and the quantity of described circuit board pilot pin is 3 or 4, and the quantity of described stiffening plate pilot pin is 3 or 4 multiple.
Wherein, the material of described substrate and table top is a bakelite plate.
Wherein, the positioning accuracy between the described pilot pin is more than or equal to ± 0.1mm.
Wherein, the heating temp of described boiling hot plate is up to 110 ℃.
Wherein, the protrusion height of described pilot pin is smaller or equal to the thickness of circuit board.
The beneficial effects of the utility model are: the defective that manual reinforcement precision is not high and production efficiency is low that is different from prior art, circuit board reinforcement joint tool of the present utility model, can significantly improve the reinforcement precision of circuit board by the accurate positioning action of pilot pin, and significantly improve production efficiency.
Description of drawings
Fig. 1 is the structural representation of the utility model circuit board reinforcement joint tool embodiment.
Embodiment
By describing technology contents of the present utility model, structural feature in detail, realized purpose and effect, give explanation below in conjunction with execution mode and conjunction with figs. are detailed.
See also Fig. 1, the reinforcement laminating apparatus of circuit board of the present utility model comprises and scalds plate (not shown) and joint tool that described joint tool comprises base 10, table top 11, spring 14, pilot pin 15, location-plate 12 and pasting panel 13; The electric boiling plate that described boiling hot plate (not shown) is the built-in heating silk, the heating face of boiling hot plate (not shown) is surperficial suitable with described pasting panel 13; Described base 10 is fixedlyed connected with table top 11, and described location-plate 12 is connected with base 10 by described spring 14, and described pasting panel 13 is fixedlyed connected with table top 11 by fixed axis 16; Described location-plate 12 is provided with sliding eye 17 and pilot pin 15, and sliding eye 17 is suitable with fixed axis 16, and location-plate 12 relative table tops 11 slidably; Described pasting panel 13 is provided with location hole 18, and location hole 18 is suitable with pilot pin 15, and spring 14 pilot pin 15 under non-compressed state is passed location hole 18 and protruded pasting panel 13 surfaces.
Be different from the defective that manual reinforcement precision is not high and production efficiency is low of prior art, circuit board reinforcement joint tool of the present utility model can significantly improve the reinforcement precision of circuit board by the accurate positioning action of pilot pin, and significantly improve production efficiency.
In one embodiment, described location-plate is removable aluminium alloy plate, and the layout of the pilot pin of this location-plate and circuit board need the position of stiffening plate of reinforcement suitable; Described pasting panel is removable aluminium alloy plate, and the location hole on this pasting panel and the position of the pilot pin on the location-plate are suitable.
In one embodiment, described pilot pin is divided into circuit board pilot pin and stiffening plate pilot pin, and the quantity of described circuit board pilot pin is 3 or 4, and the quantity of described stiffening plate pilot pin is 3 or 4 multiple.
In one embodiment, the material of described substrate and table top is a bakelite plate.
In one embodiment, the positioning accuracy between the described pilot pin is more than or equal to ± 0.1mm.The positioning accuracy of pilot pin has determined the reinforcement precision of reinforcement.
In one embodiment, the heating temp of described boiling hot plate is up to 110 ℃.The heating of scalding plate can allow the applying better effects if of PUR.
In one embodiment, the protrusion height of pilot pin is smaller or equal to the thickness of circuit board.
In one embodiment, described joint tool also comprises a handle of being convenient to operate 19.
Joint tool of the present utility model can make the hot pressing sticker close the precision that firmly can reach applying again, satisfies the demand of circuit board, also can enhance productivity greatly.Wherein, the boiling hot plate in this joint tool is a metal material, and surfacing is beneficial to reinforcing on circuit board, heating wire is arranged in it, and heating temp reaches as high as 110 ℃, at high temperature, hot pressing glue begins toughness, has strengthened the adhesion of reinforcement and plate, has improved slip, off normal problem.Joint tool is to comprise parts such as common-base bakelite plate, shared table top bakelite plate, location-plate aluminium alloy and pasting panel aluminium alloy.The precision of general manual assembly can only reach ± 0.3mm, and can reach ± 0.1mm with this tool its precision of fitting.
The utility model only needs to change location-plate and pasting panel according to different soft boards, and base and table top can be shared.Concrete laminating type is: soft board is hung on the location-plate, then stiffening plate is hung on can about on the movable pilot pin, cover pasting panel, scald with flatiron and can take out soft board in 3 seconds.
The above only is embodiment of the present utility model; be not so limit claim of the present utility model; every equivalent structure or equivalent flow process conversion that utilizes the utility model specification and accompanying drawing content to be done; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present utility model.
Claims (7)
1. the reinforcement laminating apparatus of a circuit board is characterized in that: comprise and scald plate and joint tool, described joint tool comprises base, table top, spring, pilot pin, location-plate and pasting panel;
Described boiling hot plate is the electric boiling plate of built-in heating silk, and the heating face of boiling hot plate is surperficial suitable with described pasting panel;
Described base is fixedlyed connected with table top, and described location-plate is connected with base by described spring, and described pasting panel is fixedlyed connected with table top by fixed axis;
Described location-plate is provided with sliding eye and pilot pin, and sliding eye and fixed axis are suitable, and the relative table top of location-plate slidably;
Described pasting panel is provided with location hole, and location hole and pilot pin are suitable, and spring pilot pin under non-compressed state is passed location hole and protruded the pasting panel surface.
2. the reinforcement laminating apparatus of circuit board according to claim 1, it is characterized in that: described location-plate is removable aluminium alloy plate, the layout of the pilot pin of this location-plate and circuit board need the position of stiffening plate of reinforcement suitable; Described pasting panel is removable aluminium alloy plate, and the location hole on this pasting panel and the position of the pilot pin on the location-plate are suitable.
3. the reinforcement laminating apparatus of circuit board according to claim 2, it is characterized in that: described pilot pin is divided into circuit board pilot pin and stiffening plate pilot pin, the quantity of described circuit board pilot pin is 3 or 4, and the quantity of described stiffening plate pilot pin is 3 or 4 multiple.
4. the reinforcement laminating apparatus of circuit board according to claim 3, it is characterized in that: the material of described substrate and table top is a bakelite plate.
5. the reinforcement laminating apparatus of circuit board according to claim 4 is characterized in that: the positioning accuracy between the described pilot pin is more than or equal to ± 0.1mm.
6. the reinforcement laminating apparatus of circuit board according to claim 5, it is characterized in that: the heating temp of described boiling hot plate is up to 110 ℃.
7. the reinforcement laminating apparatus of circuit board according to claim 6, it is characterized in that: the protrusion height of described pilot pin is smaller or equal to the thickness of circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206458665U CN201894000U (en) | 2010-12-07 | 2010-12-07 | Reinforcement fitting device of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206458665U CN201894000U (en) | 2010-12-07 | 2010-12-07 | Reinforcement fitting device of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201894000U true CN201894000U (en) | 2011-07-06 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206458665U Expired - Fee Related CN201894000U (en) | 2010-12-07 | 2010-12-07 | Reinforcement fitting device of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201894000U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102837482A (en) * | 2012-09-05 | 2012-12-26 | 无锡力合光电传感技术有限公司 | Shielded wire pressing mechanism for capacitive touch screen |
| CN103402329A (en) * | 2013-07-31 | 2013-11-20 | 无锡市伟丰印刷机械厂 | Elastic force printing chassis structure |
| CN103395508A (en) * | 2013-08-15 | 2013-11-20 | 友达光电（苏州）有限公司 | Adhesive tape sticking jig |
| CN106102327A (en) * | 2016-08-12 | 2016-11-09 | 中国航空工业集团公司西安飞行自动控制研究所 | A kind of adhering method of glued membrane |
-
2010
- 2010-12-07 CN CN2010206458665U patent/CN201894000U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102837482A (en) * | 2012-09-05 | 2012-12-26 | 无锡力合光电传感技术有限公司 | Shielded wire pressing mechanism for capacitive touch screen |
| CN103402329A (en) * | 2013-07-31 | 2013-11-20 | 无锡市伟丰印刷机械厂 | Elastic force printing chassis structure |
| CN103395508A (en) * | 2013-08-15 | 2013-11-20 | 友达光电（苏州）有限公司 | Adhesive tape sticking jig |
| TWI501001B (en) * | 2013-08-15 | 2015-09-21 | Au Optronics Suzhou Corp Ltd | Tape adhering tool for display panel |
| CN106102327A (en) * | 2016-08-12 | 2016-11-09 | 中国航空工业集团公司西安飞行自动控制研究所 | A kind of adhering method of glued membrane |
| CN106102327B (en) * | 2016-08-12 | 2019-01-01 | 中国航空工业集团公司西安飞行自动控制研究所 | A kind of adhering method of glue film |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: SHENZHEN JINGCHENGDA ELECTRIC CIRCUIT CO., LTD. Free format text: FORMER NAME: SHENZHEN JINGCHENGDA CIRCUIT CO., LTD. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: 518000 Guangdong city of Shenzhen province Baoan District Shajing Town Xin Yangcun West Industrial Zone B building Patentee after: Shenzhen Jingchengda Circuit Technology Co., Ltd. Address before: 518000 Guangdong city of Shenzhen province Baoan District Shajing Town Xin Yangcun West Industrial Zone B building Patentee before: Shenzhen Jingchengda Electric Circuit Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110706 Termination date: 20161207 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |