CN204036735U - Press device - Google Patents

Press device Download PDF

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Publication number
CN204036735U
CN204036735U CN201420430514.6U CN201420430514U CN204036735U CN 204036735 U CN204036735 U CN 204036735U CN 201420430514 U CN201420430514 U CN 201420430514U CN 204036735 U CN204036735 U CN 204036735U
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CN
China
Prior art keywords
duplexer
mentioned
distance piece
plate
press device
Prior art date
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Expired - Fee Related
Application number
CN201420430514.6U
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Chinese (zh)
Inventor
北山善彦
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Nitto Denko Corp
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Nitto Denko Corp
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C2043/366—Moulds for making articles of definite length, i.e. discrete articles plates pressurized by an actuator, e.g. ram drive, screw, vulcanizing presses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Presses And Accessory Devices Thereof (AREA)
  • Press Drives And Press Lines (AREA)

Abstract

The utility model provides press device, and this press device suitably can press duplexer and can guarantee that resin sheet is adjacent to relative to optical semiconductor and substrate when suppressing the distortion of duplexer.Press device is for pressing duplexer, and this duplexer comprises: substrate; Optical semiconductor, it is installed on substrate; Resin sheet, it is formed on substrate in the mode covering optical semiconductor by thermosetting resin; And stripping film, it is configured on resin sheet.Press device comprises: lower plate, its with substrate in downside and stripping film loads duplexer in the mode of upside; Upper plate, consists of and presses duplexer downwards from the top of duplexer; And the 1st distance piece, consist of between lower plate and upper plate.1st distance piece is configured to its upper end in the vertical direction and is positioned at position on the lower, upper end than the stripping film of duplexer.

Description

Press device
Technical field
The utility model relates to the press device for pressing duplexer.
Background technology
In the manufacture etc. of printed circuit base material, prepare the substrate being provided with electronic component, heat cured resin material is configured on this substrate in the mode of overlay electronic part and forms duplexer.Afterwards, by heating duplexer, resin material is solidified.In addition, when the heat cure of resin material, with constant pressure, (such as with reference to patent document 1) is pressurizeed to resin material.
In patent document 1, prepare the duplexer comprising base material and resins in film form material, this base material has electronic component and substrate, and this resins in film form material is configured on substrate in the mode of overlay electronic part, utilizes flat die device pressurize to duplexer and heat duplexer.Now, duplexer is pressurized in the mode of being held by pair of metal plate holder.
Patent document 1: Japanese Unexamined Patent Publication 2008-12918 publication
Utility model content
The problem that utility model will solve
But, when pressurizeing to duplexer with pressure more than constant basis, the unfavorable condition that the distortion of more than the required deflection of resins in film form material generation is such can be produced.On the other hand, when pressurizeing insufficient, resins in film form material becomes insufficient relative to electronic component and being adjacent to of substrate.In addition, because the suitable pressure when pressurizeing to duplexer can change according to the difference of the resin material of formation duplexer, therefore, being difficult to the difference according to duplexer and with suitable pressure, duplexer being pressurizeed all the time.
Therefore, the purpose of this utility model is, provides and suitably can press duplexer and the curing can guaranteeing the press device that resin sheet is adjacent to relative to optical semiconductor and substrate and the resin sheet that uses this press device when suppressing the distortion of duplexer.
For the scheme of dealing with problems
The utility model provides a kind of press device, and it is for pressing duplexer, and this duplexer comprises: substrate; Optical semiconductor, it is installed on substrate; Resin sheet, it is formed on substrate in the mode covering optical semiconductor by thermosetting resin; And stripping film, it is configured on resin sheet, it is characterized in that, this press device comprises: lower plate, its with substrate in downside and stripping film loads duplexer in the mode of upside; Upper plate, consists of and presses duplexer downwards from the top of duplexer; And the 1st distance piece, consist of between lower plate and upper plate, the 1st distance piece is configured to its upper end in the vertical direction and is positioned at position on the lower, upper end than the stripping film of duplexer.
Adopt such press device, the upper end of the 1st distance piece is positioned at the position on the lower, upper end than the stripping film of duplexer.Therefore, it is possible in the vertical direction, the constant distance that is provided as the pressing quantity of duplexer between the upper end of the 1st distance piece and the upper end of stripping film.Its result, can utilize upper plate suitably to press duplexer downwards from top, thus resin sheet can be made to be closely attached on substrate photoreactive semiconductor element.
In addition, when utilizing upper plate to press duplexer, the upper end of the 1st distance piece and the lower end of upper plate abut against, thus can limit upper plate and move downwards.Its result, can suppress duplexer that a certain amount of above distortion occurs.
In addition, in press device, preferably, the 1st distance piece is configured to resin sheet is exposed upward and the 1st distance piece is positioned on substrate, and the 1st distance piece has the thickness identical with the thickness of resin sheet.
Adopt such press device, because the 1st distance piece has the thickness identical with resin sheet, therefore, when the 1st distance piece is positioned on substrate, can in the vertical direction, distance that the thickness being equivalent to stripping film is set between the upper end of the 1st distance piece and the upper end of stripping film.That is, the thickness of stripping film can be utilized to regulate the pressing quantity of duplexer.Its result, can utilize upper plate suitably to press duplexer further.
In addition, in press device, preferably, in order to press multiple duplexer, this press device also comprises: at least 1 intermediate plate, consists of at spaced intervals between lower plate and upper plate; And at least 1 the 2nd distance piece, it is positioned at the top of intermediate plate, intermediate plate is configured to substrate in downside and stripping film loads duplexer in the mode of upside, 2nd distance piece is configured to its upper end in the vertical direction and is positioned at position on the lower, upper end than the stripping film of the duplexer being placed in intermediate plate, and the duplexer that upper plate is configured to being placed in intermediate plate presses downwards from the top of this duplexer.
Adopt such press device, upper plate can be utilized downwards to press from top and be placed in the duplexer of lower plate and be placed in the duplexer of intermediate plate.Therefore, it is possible to utilize upper plate once to press multiple duplexer, thus effectively can press multiple duplexer and in multiple duplexer, resin sheet can be made respectively to be closely attached on substrate photoreactive semiconductor element.
In addition, when utilizing upper plate to press duplexer, the upper end of the 1st distance piece and the lower end of intermediate plate abut against, and the upper end of the 2nd distance piece and the lower end of intermediate plate or upper plate abut against, thus can limit upper plate and intermediate plate moves downwards.Its result, can suppress multiple duplexer that a certain amount of above distortion occurs.
In addition, in press device, preferably, the 2nd distance piece is configured to resin sheet is exposed upward and the 2nd distance piece is positioned in and is placed on the substrate of the duplexer of intermediate plate, and the 2nd distance piece has the thickness identical with the thickness of resin sheet.
Adopt such press device, because the 2nd distance piece has the thickness identical with resin sheet, therefore, when the 2nd distance piece is positioned on substrate, can in the vertical direction, distance that the thickness being equivalent to stripping film is set between the upper end of the 2nd distance piece and the upper end of stripping film.That is, the thickness of stripping film can be utilized to regulate the pressing quantity of duplexer.Its result, can utilize upper plate suitably to press duplexer further.
In addition, in press device, preferably, this press device also comprises the locating guide for multiple duplexer, the 1st distance piece, intermediate plate, the 2nd distance piece and upper plate being located relative to lower plate.
Adopt such press device, locating guide can be utilized multiple duplexer, the 1st distance piece, intermediate plate, the 2nd distance piece and upper plate to be located relative to lower plate.Therefore, it is possible to precision presses multiple duplexer well.
In addition, the utility model provides a kind of curing of resin sheet, and it solidifies for making the resin sheet of duplexer, and this duplexer comprises: substrate; Optical semiconductor, it is installed on substrate; Resin sheet, it is formed on substrate in the mode covering optical semiconductor by thermosetting resin; And stripping film, it is configured on resin sheet, the feature of the curing of this resin sheet is, the curing of this resin sheet comprises following operation: prepare lower plate, upper plate and have the preparatory process of the 1st distance piece of the thickness identical with the thickness of resin sheet; By duplexer with substrate in downside and stripping film is positioned in the operation on lower plate in the mode of upside; 1st distance piece is positioned in operation on substrate in the mode making resin sheet expose upward; And utilize upper plate to press from the top of duplexer duplexer downwards while the curing process that heats resin sheet and make it solidify.
Adopt such method, owing to having prepared the 1st distance piece with the thickness identical with resin sheet, therefore, when the 1st distance piece is positioned on substrate, can in the vertical direction, distance that the thickness being equivalent to stripping film is set between the upper end of the 1st distance piece and the upper end of stripping film.That is, the thickness of stripping film can be utilized to regulate the pressing quantity of duplexer.Its result, can utilize upper plate suitably to press duplexer.
In addition, when utilizing upper plate suitably to press duplexer, the upper end of the 1st distance piece and the lower end of upper plate abut against, thus can limit upper plate and move downwards.Its result, can suppress duplexer that a certain amount of above distortion occurs.
In addition, in the curing of resin sheet, preferably, in order to press multiple duplexer, preparatory process comprises preparation at least 1 intermediate plate and the operation of at least 1 the 2nd distance piece with the thickness identical with the thickness of resin sheet, and the curing of this resin sheet also comprises following operation: the operation making intermediate plate between lower plate and upper plate; By duplexer with substrate in downside and stripping film is positioned in the operation on intermediate plate in the mode of upside; And the 2nd distance piece is positioned in by the operation be placed on the substrate of the duplexer of intermediate plate in the mode making resin sheet expose upward, in curing process, while utilize upper plate to be pressed the top of multiple duplexer from multiple duplexer downwards, multiple resin sheet is heated and makes it solidify.
Adopt such method, intermediate plate can be utilized downwards to press from top and be placed in the duplexer of lower plate.In addition, upper plate can be utilized downwards to press from top and to be placed in the duplexer of intermediate plate.Therefore, it is possible to utilize upper plate or intermediate plate once to press multiple duplexer, thus can effectively press multiple duplexer.
In addition, owing to having prepared the 2nd distance piece with the thickness identical with resin sheet, therefore, when the 2nd distance piece is positioned on substrate, can in the vertical direction, distance that the thickness being equivalent to stripping film is set between the upper end of the 2nd distance piece and the upper end of stripping film.That is, the thickness of stripping film can be utilized to regulate the pressing quantity of duplexer.Its result, can utilize upper plate suitably to press duplexer further.
In addition, when utilizing upper plate to press duplexer, the upper end of the 1st distance piece and the lower end of intermediate plate abut against, and the upper end of the 2nd distance piece and the lower end of upper plate or intermediate plate abut against, therefore, it is possible to restriction upper plate and intermediate plate move downwards.Its result, can suppress multiple duplexer that a certain amount of above distortion occurs.
The effect of utility model
Adopt the curing of the resin sheet of press device of the present utility model and this press device of use, suitably can press duplexer and can guarantee that resin sheet is adjacent to relative to optical semiconductor and substrate when suppressing the distortion of duplexer.
Accompanying drawing explanation
Fig. 1 is the top view representing press device of the present utility model, is the top view of the press device represented before pressing duplexer.
Fig. 2 is the A-A sectional view of the press device shown in Fig. 1.
Fig. 3 is the top view of the base component representing the press device shown in Fig. 1.
Fig. 4 is the side view of the base component shown in Fig. 3.
Fig. 5 A-Fig. 5 B is the distance piece representing the press device shown in Fig. 1, and Fig. 5 A is the top view of distance piece, and Fig. 5 B is the side view of distance piece.
Fig. 6 A-Fig. 6 B represents the intermediate plate of the press device shown in Fig. 1, and Fig. 6 A is the top view of intermediate plate, and Fig. 6 B is the side view of intermediate plate.
Fig. 7 A-Fig. 7 B represents the upper plate of the press device shown in Fig. 1, and Fig. 7 A is the top view of upper plate, and Fig. 7 B is the side view of upper plate.
Fig. 8 A-Fig. 8 B represents the weighted plate of the press device shown in Fig. 1, and Fig. 8 A is the top view of weighted plate, and Fig. 8 B is the side view of weighted plate.
Fig. 9 A-Fig. 9 B represents that Fig. 9 A is the top view of duplexer, and Fig. 9 B is the side view of duplexer by the duplexer of the press device pressing shown in Fig. 1.
Figure 10 is the top view of the base component under the state being placed with duplexer.
Figure 11 is the side view of the base component shown in Figure 10.
Figure 12 is the top view representing state distance piece being placed in the base component shown in Figure 10.
Figure 13 is the B-B sectional view of the base component shown in Figure 12.
Figure 14 is the top view representing state intermediate plate being placed in the base component shown in Figure 10.
Figure 15 is the C-C sectional view of the base component shown in Figure 14.
Figure 16 is the side view representing the press device after pressing duplexer.
Figure 17 is the sectional view of the press device representing variation of the present utility model, is the sectional view representing the press device before pressing duplexer.
Figure 18 is the sectional view of the press device shown in Figure 17 after pressing duplexer.
Figure 19 is the top view of the variation representing the distance piece shown in Fig. 5 A-Fig. 5 B.
Description of reference numerals
1, press device; 3a, the 1st distance piece; 3b, the 2nd distance piece; 5, intermediate plate; 9, duplexer; 10, circuit substrate; 11, light-emitting diode; 12, resin sheet; 13, stripping film; 21, base plate; 22, the 1st directing pin; 23, the 2nd directing pin; 24, the 3rd directing pin; 61, upper plate.
Detailed description of the invention
1. press device
As depicted in figs. 1 and 2, press device 1 is the device for pressing multiple duplexer 9 described later, and it comprises base component 2, multiple (3) distance piece 3, multiple (two) intermediate plate 5 and lid component 6.
In addition, in the following description, when mentioning the direction of press device 1, with the state that press device 1 level is loaded for benchmark.That is, the thick direction of the paper of Fig. 1 nearby side be top, depth side, paper thick direction is below.In addition, the paper left and right directions of Fig. 1 is laterally, and the paper above-below direction of Fig. 1 is longitudinally.In addition, being horizontal side on the left of the paper of Fig. 1, is horizontal opposite side on the right side of the paper of Fig. 1.In addition, being longitudinal side on the upside of the paper of Fig. 1, is longitudinal opposite side on the downside of the paper of Fig. 1.
(1) base component
As shown in Figure 2, base component 2 has base plate 21 as lower plate and directing pin 22,23,24.
(1-2) base plate
As shown in Figure 3, base plate 21 is made up of metals such as stainless steels and is formed as overlooking the writing board shape with constant thickness of rectangular shape.On upper surface near 4 angles of base plate 21, be formed with multiple grooves, i.e. 1 the particle size groove and 3 thin footpath grooves that cave in respectively downwards like that as shown with a dotted line in fig. 2.
(1-3) directing pin
As shown in Figure 2, directing pin 22,23,24 is categorized into the 1st directing pin 22, the 2nd directing pin 23 and the 3rd directing pin 24 respectively.
1st directing pin 22 is made up of metals such as stainless steels and is formed as the substantial cylindrical shape that extends along the vertical direction.1st directing pin 22 is chimeric with the particle size groove of base plate 21 and erect and be arranged at base plate 21 by its lower end.
As shown in figures 1 and 3, the 1st directing pin 22 near the transverse ends edge of base plate 21 mutually in the vertical spaced apart be provided with two, namely add up to and be provided with 4.Specifically, the 1st directing pin 22 of horizontal side is relative in the horizontal with the 1st directing pin 22 of horizontal opposite side, and the 1st directing pin 22 of longitudinal side is relative in the vertical with the 1st directing pin 22 of longitudinal opposite side.In addition, when projecting along the vertical direction, between the 1st directing pin 22 and the 1st directing pin 22 of horizontal opposite side of horizontal side, be folded with duplexer 9 described later, distance piece 3, intermediate plate 5, upper plate 61 and weighted plate 6.Further, the 1st directing pin 22 fastens with the notch part 62c of weighted plate 62 described later.Thus, weighted plate 62 is located relative to base plate 21 by the 1st directing pin 22.
As shown in Figure 2, the 2nd directing pin 23 is made up of metals such as stainless steels and the substantial cylindrical shape that to be formed as diameter less than the diameter of the 1st directing pin 22 extended along the vertical direction.2nd directing pin 23 is chimeric with the thin footpath groove of base plate 21 and erect and be arranged at base plate 21 by its lower end.
As shown in figures 1 and 3, the 2nd directing pin 23 be respectively equipped with near 4 angles of base plate 21 1, that is add up to be provided with 4.Specifically, 2nd directing pin 23 of horizontal side and the 2nd directing pin 23 of horizontal opposite side in the horizontal, than relative on horizontal side the 1st directing pin 22 and the 1st directing pin 22 position all in the inner part of horizontal opposite side, the 2nd directing pin 23 of longitudinal side and the 2nd directing pin 23 of longitudinal opposite side in the vertical, than relative in the 1st directing pin 22 of longitudinal side and the 1st directing pin 22 position all in the inner part of longitudinal opposite side.
In addition, the 2nd directing pin 23 of horizontal side and the 2nd directing pin 23 of horizontal opposite side run through the transverse ends portion of distance piece 3 described later, intermediate plate 5, upper plate 61 and weighted plate 62 along the vertical direction respectively in the mode being folded with duplexer 9 when projecting along the vertical direction between the 2nd directing pin 23 of horizontal side and the 2nd directing pin 23 of horizontal opposite side.Thus, distance piece 3 described later, intermediate plate 5, upper plate 61 and weighted plate 62 are located relative to base plate 21 by the 2nd directing pin 23.
As shown in Figure 2, the 3rd directing pin 24 is made up of metals such as stainless steels and to be formed as diameter less than the diameter of the 1st directing pin 22 extended along the vertical direction and the substantial cylindrical shape that diameter is identical with the diameter of the 2nd directing pin 23.Directing pin 24 is chimeric with the thin footpath groove of base plate 21 and erect and be arranged at base plate 21 by its lower end.
As shown in figures 1 and 3, the 3rd directing pin 24 be respectively equipped with near 4 angles of base plate 21 two, namely add up to be provided with 8.
At each angle place, the mode that when two the 3rd directing pin 24 are to project along the vertical direction and each angle of circuit substrate 10 abuts against configures, specifically, two the 3rd directing pin 24 are configured to, and the lateral end edges in each angle of the 3rd directing pin 24 and circuit substrate 10 abuts against and another the 3rd directing pin 24 abuts against with the longitudinal ora terminalis in each angle of circuit substrate 10.Thus, circuit substrate 10 and then duplexer 9 are located relative to base plate 21 by the 3rd directing pin 24.
In addition, the 3rd directing pin 24 of horizontal side and the 3rd directing pin 24 of horizontal opposite side run through the transverse ends portion of distance piece 3 described later, intermediate plate 5, upper plate 61 and weighted plate 62 along the vertical direction respectively in the mode being folded with duplexer 9 when projecting along the vertical direction between the 3rd directing pin 24 of horizontal side and the 3rd directing pin 24 of horizontal opposite side.Thus, distance piece 3 described later, intermediate plate 5, upper plate 61 and weighted plate 62 are located relative to base plate 21 by the 3rd directing pin 24.
(2) distance piece
As shown in Fig. 2, Fig. 5 A and Fig. 5 B, distance piece 3 is made up of metals such as stainless steels and is formed as overlooking the writing board shape with constant thickness of roughly shaped as frame shape.Distance piece 3 have be integrally constituted, frame portion 31 and multiple (4) separating part 32.Distance piece 3 has the thickness identical with resin sheet 12 described later.
Frame portion 31 is formed as overlooking substantially rectangular shaped as frame shape, and it is formed by the pair of plate-shaped part extended along the longitudinal with along laterally extending pair of plate-shaped part.Frame portion 31 is formed multiple (12) distance piece through hole 31a that through-thickness runs through frame portion 31.
Distance piece through hole 31a be respectively equipped with near 4 angles in frame portion 31 3, namely add up to be provided with 12.Specifically, be formed at each angle place in frame portion 31 respectively for 3 distance piece through hole 31a that 1 the 2nd directing pin 23 and two the 3rd directing pin 24 run through.
When projecting along the vertical direction, the pair of plate-shaped part extended longitudinally in frame portion 31 is overlapping with the both ends of the transverse direction of circuit substrate 10 described later, between the pair of plate-shaped part extended transversely in frame portion 31, be folded with circuit substrate 10 described later.
Separating part 32 is writing board shapes that the master extended longitudinally looks rectangular shape, and it is projected into about 1/4th of the longitudinal length in frame portion 31 from the pair of plate-shaped part extended transversely in frame portion 31 towards longitudinal medial.
Separating part 32 is to separate opening (inner space) decile (trisection) in frame portion 31 and the mode making separating part 32 relative with another separating part 32 is in the vertical configured with multiple (4) at spaced intervals in the horizontal.The interval of separating part 32 adjacent one another are is in the horizontal slightly larger than the lateral length of stripping film 13 described later, and the lateral length of each separating part 32 is shorter than the lateral length of stripping film 13 described later.
In addition, distance piece 3 is configured with 3 in the vertical direction at spaced intervals, and the distance piece 3 of bottom is the 1st distance piece 3a, and the distance piece 3 beyond the distance piece 3 of bottom is the 2nd distance piece 3b.
(3) intermediate plate
As shown in Fig. 2, Fig. 6 A and Fig. 6 B, intermediate plate 5 is made up of metals such as stainless steels and is formed as overlooking the writing board shape with constant thickness of rectangular shape.Intermediate plate 5 is formed as, and its longitudinal length is identical with the longitudinal length of base plate 2, and its lateral length is shorter than the lateral length of base plate 2.Intermediate plate 5 is formed multiple (12) intermediate plate through hole 5a that through-thickness runs through intermediate plate 5.
Intermediate plate through hole 5a be respectively equipped with near 4 angles of intermediate plate 53, namely add up to be provided with 12.Specifically, be formed at each angle place of intermediate plate 5 respectively for 3 intermediate plate through hole 5a that 1 the 2nd directing pin 23 and two the 3rd directing pin 24 run through.
In addition, to be configured to two intermediate plates 5 spaced apart in the vertical direction for intermediate plate 5.
(4) lid component
Lid component 6 has upper plate 61 and weighted plate 62.
(4-1) upper plate
Upper plate 61 has the shape and size identical with intermediate plate 5.That is, as shown in Fig. 2, Fig. 7 A and Fig. 7 B, upper plate 61 is made up of metals such as stainless steels and is formed as overlooking the writing board shape with constant thickness of rectangular shape.Upper plate 61 is formed as, and its longitudinal length is identical with the longitudinal length of base plate 2, and its lateral length is shorter than the lateral length of base plate 2.Upper plate 61 is formed multiple (12) upper plate through hole 61a that through-thickness runs through upper plate 61.
Upper plate through hole 61a be respectively equipped with near 4 angles of upper plate 61 3, namely add up to be provided with 12.Specifically, be formed at each angle place of upper plate 61 respectively for 3 upper plate through hole 61a that 1 the 2nd directing pin 23 and two the 3rd directing pin 24 run through.
In addition, upper plate 61 is configured at the top of the intermediate plate 5 that this is positioned at the top in the mode spaced apart with the intermediate plate 5 being positioned at the top.
(4-2) weighted plate
As shown in Fig. 2, Fig. 8 A and Fig. 8 B, weighted plate 62 is made up of metals such as stainless steels and is formed as overlooking the writing board shape with constant thickness of rectangular shape.Weighted plate 62 is formed as, and its longitudinal length is identical with the longitudinal length of base plate 2, and its lateral length is identical with the lateral length of base plate 2.Weighted plate 62 is formed multiple (12) weighted plate through hole 62a, recess 62b and multiple (4) notch part 62c that through-thickness runs through weighted plate 62.
Weighted plate through hole 62a be respectively equipped with near 4 angles of weighted plate 62 3, namely add up to be provided with 12.Specifically, be formed at each angle place of weighted plate 62 respectively for 3 weighted plate through hole 62a that 1 the 2nd directing pin 23 and two the 3rd directing pin 24 run through.
Recess 62b in overlooking rectangular shape, and is formed at the middle body of the upper surface of weighted plate 62 in the mode caved in downward.The degree of depth of recess 62b is about the roughly half of the thickness of weighted plate 62.
Notch part 62c the transverse ends edge of weighted plate 62 be respectively equipped with two, namely add up to be provided with 4.Specifically, notch part 62c has the shape of to go in roughly U-shaped excision towards inner side from the lateral end edges of weighted plate 5 respectively near 4 angles of weighted plate 62.When projecting along the vertical direction, notch part 62c is overlapping with directing pin 22.
In addition, weighted plate 62 is positioned at the top of upper plate 61.
2. duplexer c
As shown in Fig. 2, Fig. 9 A and Fig. 9 B, duplexer 9 comprises: circuit substrate 10; Multiple (12) light-emitting diode 11, the plurality of light-emitting diode 11 is supported on circuit substrate 10 as optical semiconductor; Multiple (12) resin sheet 12, the plurality of resin sheet 12 sealed light emitting diode element 11 on circuit substrate 10; And multiple (3) stripping film 13, the plurality of stripping film 13 is positioned on resin sheet 12.
(1) circuit substrate
Circuit substrate 10 is the roughly writing board shapes with constant thickness overlooking rectangular shape, the resin substrates such as the ceramic substrates such as it is made up of the substrate being usually applied to optical semiconductor device, such as aluminium oxide, such as polyimides, core body employ the metallic core substrate etc. of metallic plate.
Circuit substrate 10 thereon surface comprises conductive pattern 17, and this conductive pattern 17 has: pair of external electrodes 15, and it is connected with outside power supply (not shown); Distribution 16; And internal electrode (not shown), it is electrically connected with light-emitting diode 11.
On circuit substrate 10, conductive pattern 17 is arranged in parallel with multiple (4) in the vertical spaced apart from each other, and to be arranged in parallel with spaced apart from each other in the horizontal multiple (3), namely to add up to and be arranged 12.
The outside that outer electrode 15 is being layered on circuit substrate 10 1 resin sheet 12 is provided with a pair, and to be oppositely disposed across the mode of resin sheet 12.
Distribution 16 is by outer electrode 15 and internal electrode (not shown) electrical connection.
Further, the electric power from power supply supplies via outer electrode 15, and this electric power is supplied to internal electrode (not shown) via distribution 16.
(2) light-emitting diode
Light-emitting diode 11 is formed as overlooking roughly circular plate shape, on the upper surface of circuit substrate 10, light-emitting diode 11 is arranged in parallel with multiple (4) in the vertical spaced apart from each other, and to be arranged in parallel with spaced apart from each other in the horizontal multiple (3), namely to add up to and be arranged 12.Light-emitting diode 11 is configured with 1 accordingly with each conductive pattern 17, and specifically, each light-emitting diode 11 is configured between corresponding pair of external electrodes 15.
Such light-emitting diode 11 to be connected (not shown) in the mode of wire-bonded or to install (not shown) in internal electrode (not shown) with upside-down method of hull-section construction (flip chip) with internal electrode (not shown), thus, light-emitting diode 11 is supplied to electric power from internal electrode (not shown) and luminous.
The diameter of light-emitting diode 11 is such as 0.2mm ~ 5mm.The thickness of light-emitting diode 11 is as being 100 μm ~ 1000 μm.
The interval in the vertical and transversely of light-emitting diode 11 is such as more than 0.5mm, is preferably more than 1mm, and is such as below 10mm, is preferably below 5mm.
Light-emitting diode 11 is such as the optical semiconductor (specifically, blue LED element) that can send blue light.
(3) resin sheet
Resin sheet 12 is diameter overlook circular shape and be formed as have the sheet of constant thickness larger than the diameter of light-emitting diode 11.
Resin sheet 12 is formed by the sealing resin composition comprising sealing resin.
As sealing resin, the thermosetting resin such as solidified by heating can be listed.
As thermosetting resin, such as organic siliconresin, epoxy resin, polyimide resin, phenolic resins, urea resin, melmac, unsaturated polyester resin etc. can be listed.
As above-mentioned sealing resin, preferably can list thermosetting resin, more preferably list organic siliconresin.
In addition, as comprising the sealing resin composition of organic siliconresin as sealing resin, include, for example out the thermosetting silicone resin composition etc. such as 2 stage solidification type organosilicon resin compositions, 1 stage solidification type organosilicon resin composition.
2 stage solidification type organosilicon resin compositions refer to have the reaction mechanism in 2 stages, in the reaction in the 1st stage B rank (semi-solid preparation), and the thermosetting silicone resin composition of C rank (finally solidify) in the reaction in the 2nd stage.
In addition, B rank are states that sealing resin composition dissolves between the A rank of solvent and the C rank of finally solidify, be solidification and gelation only carry out a little, swelling in a solvent but do not dissolve completely, soften but the state of not melting when heating.
As 2 stage solidification type organosilicon resin compositions, include, for example out condensation reaction addition reaction curing type silicone resin combination.
In addition, as required can in the proper ratio containing fluorophor, filler in sealing resin composition.
As fluorophor, the yellow fluorophor etc. that such as blue light can be converted to sodium yellow can be listed.As such fluorophor, such as adulterate in composite metal oxide, metal sulfide etc. the such as metallic atom such as cerium (Ce), europium (Eu) and the fluorophor obtained can be listed.
Specifically, as fluorophor, such as Y can be listed 3al 5o 12: Ce (YAG (yttrium-aluminium-garnet): Ce) etc.
Resin sheet 12 is preferably B rank, and the hardness of resin sheet 12 is that its modulus of elasticity in comperssion becomes the such hardness of such as 0.025Mpa ~ 0.15Mpa.
In addition, when projecting along the vertical direction, resin sheet 12 is overlapping in concentric circles with light-emitting diode 11, and the diameter of resin sheet 12 is such as 10mm ~ 100mm.
In addition, the thickness of resin sheet 12 is not particularly limited, but is such as more than 100 μm, preferably more than 800 μm, and is such as less than 1000 μm.
(4) stripping film
Stripping film 13 is formed as the sheet of overlooking rectangular shape extended longitudinally.
Stripping film 13 is formed by such as following resin film: pet film, polystyrene film, polypropylene film, polycarbonate film, acrylic film, organic siliconresin film, styrene resin film, fluorine resin film etc.It should be noted that, the surface of stripping film 13 also can be subjected to release process.
The longitudinal length of stripping film 13 is longer than the longitudinal length of circuit substrate 10, and the lateral length of stripping film 13 is the length that can cover pair of external electrodes 15.
The thickness of stripping film 13 is such as 50 μm ~ 100 μm.If the thickness of stripping film 13 is in above-mentioned scope, then can restrains the increase of cost and realize good treatability (treatability when being peeled off from resin sheet 12 by stripping film 13).
Stripping film 13 is configured in the vertical on 4 resin sheets 12 configured arranged side by side in the mode contacted continuously with 4 resin sheets 12 configure side by side in the vertical.In addition, longitudinal direction two ora terminalis of stripping film 13 are configured at the longitudinally two ora terminalis position in the outer part than circuit substrate 10.Stripping film 13 is arranged in parallel with multiple (3) in the horizontal spaced apart from each other.
3. utilize press device to press duplexer
Below, the curing of pressing method and the resin sheet 12 utilizing press device 1 pair of duplexer 9 to press is described with reference to Figure 10 ~ Figure 16.
In the method, first, base component 2, the 1st distance piece 3a, two the 2nd distance piece 3b, two intermediate plates 5 and lid components 6 are prepared.Then, as shown in Figure 10 and Figure 11, the base plate 21 of base component 2 is configured in the horizontal plane.Afterwards, 1st directing pin 22 is embedded in the particle size groove of base plate 21, and the 2nd directing pin 23 and the 3rd directing pin 24 are embedded in the thin footpath groove of base plate 21, thus the setting of above-mentioned 1st directing pin 22, the 2nd directing pin 23 and the 3rd directing pin 24 is made to be arranged at base plate 21.
Then, by duplexer 9 with circuit substrate 10 in downside and stripping film 13 is placed in the central authorities on base plate 21 in the mode of upside.Now, the 3rd directing pin 24 in each angle of base plate 21 abuts against with the lateral end edges in each angle of circuit substrate 10, and another the 3rd directing pin 24 abuts against with the longitudinal ora terminalis in each angle of circuit substrate 10.
Then, as shown in Figure 12 and Figure 13, by this way the 1st distance piece 3a is positioned on circuit substrate 10: the 2nd directing pin 23 and the 3rd directing pin 24 run through distance piece through hole 31a, and resin sheet 12 and stripping film 13 are exposed up.
Now, frame portion 31 inner space, by 4 light-emitting diodes 11 accommodating stripping film 13 in the space of separating part 32 trisection respectively and longitudinally arrange.In addition, in the vertical direction, the upper end of the 1st distance piece 3a is positioned at the position on the lower, upper end of the stripping film 13 than duplexer 9.Specifically, between the upper end and the upper end of stripping film 13 of the 1st distance piece 3a, be provided with the distance L (with reference to Fig. 2) of the thickness being equivalent to stripping film 13.
Afterwards, as shown in Figure 14 and Figure 15, intermediate plate 5 to be positioned on duplexer 9 in the mode that the 2nd directing pin 23 and the 3rd directing pin 24 run through intermediate plate through hole 5a, namely on 3 stripping films 13.Now, between the lower end of intermediate plate 5 and the upper end of the 1st distance piece 3a, be provided with the distance L (with reference to Fig. 2) of the thickness being equivalent to stripping film 13.
Then, similarly, duplexer 9, the 2nd distance piece 3b, intermediate plate 5, duplexer 9 and the 2nd distance piece 3b is loaded successively.
That is, by duplexer 9 with circuit substrate 10 in downside and stripping film 13 is placed in the central authorities on intermediate plate 5 in the mode of upside.
Then, by this way the 2nd distance piece 3b is positioned on the circuit substrate 10 on intermediate plate 5: the 2nd directing pin 23 and the 3rd directing pin 24 run through distance piece through hole 31a, and resin sheet 12 and stripping film 13 are exposed up.
Afterwards, on 3 stripping films 13 intermediate plate 5 is positioned on the duplexer 9 on the intermediate plate 5 being positioned at below in the mode that the 2nd directing pin 23 and the 3rd directing pin 24 run through intermediate plate through hole 5a, being namely positioned on the intermediate plate 5 of below.
In addition, by duplexer 9 with circuit substrate 10 in downside and stripping film 13 is placed in the central authorities be positioned on the intermediate plate 5 of the top in the mode of upside.
Then, by this way the 2nd distance piece 3b is positioned on the circuit substrate 10 on intermediate plate 5: the 2nd directing pin 23 and the 3rd directing pin 24 run through distance piece through hole 31a, and resin sheet 12 and stripping film 13 are exposed up.
Now, the 3rd directing pin 24 in each angle of base plate 21 abuts against with the lateral end edges in each angle of all circuit substrates 10, and another the 3rd directing pin 24 in each angle of base plate 21 abuts against with the longitudinal ora terminalis in each angle of all circuit substrates 10.
In addition, in the inner space in the frame portion 31 of the 2nd distance piece 3b, accommodated the stripping film 13 be positioned on intermediate plate 3 and 4 light-emitting diodes 11 longitudinally arranged in the space of separating part 32 trisection respectively.In the vertical direction, the upper end of the 2nd distance piece 3b is positioned at the position on the lower, upper end of the stripping film 13 than duplexer 9.Specifically, between the upper end and the upper end of stripping film 13 of the 2nd distance piece 3a, be provided with the distance L (with reference to Fig. 2) of the thickness being equivalent to stripping film 13.The distance L (with reference to Fig. 2) of the thickness being equivalent to stripping film 13 is provided with between the lower end of intermediate plate 5 and the upper end of the 2nd distance piece 3b.
Then, on 3 stripping films 13 upper plate 61 is positioned on the duplexer 9 be positioned on the intermediate plate 5 of the top in the mode that the 2nd directing pin 23 and the 3rd directing pin 24 run through upper plate through hole 61a, being namely positioned on the intermediate plate 5 of the top.Now, at the lower end of upper plate 61 and the distance L (with reference to Fig. 2) being provided with the thickness being equivalent to stripping film 13 between the upper end of the 2nd distance piece 3b of the top.
Then, as depicted in figs. 1 and 2, by weighted plate 62 to make the 1st directing pin 22 of base component 2 be positioned at the inner side of notch part 62c and the mode that the 2nd directing pin 23 of base component 2 and the 3rd directing pin 24 run through weighted plate through hole 62a is positioned on upper plate 61.
Now, by the 1st directing pin 22 is fastened with notch part 62c, thus weighted plate 62 is located relative to base plate 21.
2nd directing pin 23 runs through the 1st distance piece 3a, the 2nd distance piece 3b, intermediate plate 5, upper plate 61 and weighted plate 62 along the vertical direction.Thus, the 1st distance piece 3a, the 2nd distance piece 3b, intermediate plate 5, upper plate 61 and weighted plate 62 are located relative to base plate 21 by the 2nd directing pin 23.
Lateral end edges or longitudinal ora terminalis of the 3rd directing pin 24 and all circuit substrates 10 abut against and all circuit substrates 10 and then all duplexers 9 are located relative to base plate 21.In addition, the 3rd directing pin 24 runs through the 1st distance piece 3a, the 2nd distance piece 3b, intermediate plate 5, upper plate 61 and weighted plate 62 along the vertical direction.Thus, the 1st distance piece 3a, the 2nd distance piece 3b, intermediate plate 5, upper plate 61 and weighted plate 62 are located relative to base plate 21 by the 3rd directing pin 24.
Afterwards, weight W be placed in the recess 62b of weighted plate 62 and utilize upper plate 61 to press duplexer 9 downwards from top, now, as shown in figure 16, the lower end of intermediate plate 5 and the upper end of the 1st distance piece 3a abut against, and the upper end of the lower end of intermediate plate 3a or upper plate 61 and the 2nd distance piece 3b abuts against.Thus, restriction upper plate 61 and intermediate plate 5 move downwards.Further, the resin sheet 12 of duplexer 9 shrinks the amount being equivalent to the thickness of stripping film 13 downwards.
Then, press device 1 is arranged on (not shown) in stove, and duplexer 9 i.e. resin sheet 12 is pressurizeed, while heat resin sheet 12 and make it solidify.
Now, condition of cure is that the heat-curing resin of above-mentioned resin sheet 12 reaches completely crued condition, when resin sheet 12 is B rank, heating-up temperature is such as 80 DEG C ~ 200 DEG C, preferably 100 DEG C ~ 180 DEG C, the heat time is such as 0.1 hour ~ 20 hours, preferably 1 hour ~ 10 hours.
Then, after the solidification completing resin sheet 12, press device 1 (not shown) in stove is taken out.
4. action effect
Adopt this press device 1 and utilize the curing of resin sheet 12 of press device 1, as shown in Figure 2, the upper end of the 1st distance piece 3a and the upper end of the 2nd distance piece 3b are positioned at the position on the lower, upper end of the stripping film 13 than duplexer 9.Therefore, it is possible in the vertical direction, between the upper end of the 1st distance piece 3a and the upper end of stripping film 13 and be provided as the constant distance L of the pressing quantity of duplexer 9 between the upper end of the 2nd distance piece 3b and the upper end of stripping film 13.Its result, can utilize upper plate 61 suitably to press duplexer 9 downwards from top, thus resin sheet 12 can be made to be closely attached on circuit substrate 10 and light-emitting diode 11.
In addition, as shown in figure 16, when utilizing upper plate 61 to press duplexer 9, the upper end of the 1st distance piece 3a and the lower end of intermediate plate 5 abut against, and the upper end of the 2nd distance piece 3b and the lower end of intermediate plate 3a or upper plate 61 abut against, therefore, it is possible to restriction upper plate 61 and intermediate plate 5 move downwards.Its result, can suppress multiple duplexer 9, i.e. multiple resin sheet 12 that a certain amount of above distortion occurs.
In addition, as shown in Figure 2, because the 1st distance piece 3a has the thickness identical with resin sheet 12 with the 2nd distance piece 3b, therefore, when the 1st distance piece 3a and the 2nd distance piece 3b is positioned on circuit substrate 10, can in the vertical direction, between the upper end of the 1st distance piece 3a and the upper end of stripping film 13 and the distance L of the thickness being equivalent to stripping film 13 is set between the upper end of the 2nd distance piece 3b and the upper end of stripping film 13.That is, the thickness of stripping film 13 can be utilized to regulate the pressing quantity of duplexer 9.Its result, can utilize upper plate 61 suitably to press duplexer further.
In addition, as shown in Figure 2, upper plate 61 can be utilized from top to press the duplexer 9 being placed in the duplexer 9 of base plate 21 and being placed in intermediate plate 5 downwards.Therefore, it is possible to utilize upper plate 61 once to press multiple duplexer 9, thus effectively can press multiple duplexer 9 and can in multiple duplexer 9, make resin sheet 12 be closely attached on circuit substrate 10 and light-emitting diode 11 respectively.
In addition, as shown in Figure 2, in press device 1, the 1st directing pin 22, the 2nd directing pin 23 and the 3rd directing pin 24 is utilized multiple duplexer 9, the 1st distance piece 3a, intermediate plate 5, the 2nd distance piece 3b, upper plate 61 and weighted plate 62 to be located relative to base plate 21.Therefore, it is possible to precision presses multiple duplexer 9 well.
Specifically, as depicted in figs. 1 and 2, because the 1st directing pin 22 fastens, therefore, it is possible to weighted plate 62 located relative to base plate 21 with notch part 62c.
In addition, as depicted in figs. 1 and 2, because the 2nd directing pin 23 runs through the 1st distance piece 3a, the 2nd distance piece 3b, intermediate plate 5, upper plate 61 and weighted plate 62 along the vertical direction, therefore, it is possible to above-mentioned 1st distance piece 3a, the 2nd distance piece 3b, intermediate plate 5, upper plate 61 and weighted plate 62 are located relative to base plate 21.
In addition, as depicted in figs. 1 and 2, because the lateral end edges of the 3rd directing pin 24 and all circuit substrates 10 or longitudinal ora terminalis abut against, therefore, it is possible to all circuit substrates 10 and then all duplexers 9 are located relative to base plate 21.And, because the 3rd directing pin 24 runs through the 1st distance piece 3a, the 2nd distance piece 3b, intermediate plate 5, upper plate 61 and weighted plate 62 along the vertical direction, therefore, it is possible to above-mentioned 1st distance piece 3a, the 2nd distance piece 3b, intermediate plate 5, upper plate 61 and weighted plate 62 are located relative to base plate 21.
5. the variation 1 of press device
Figure 17 and Figure 18 is the sectional view of the variation representing above-mentioned press device 1.In Figure 17 and Figure 18, for the component identical with above-mentioned press device 1, mark identical Reference numeral and the description thereof will be omitted.In addition, in the pressing method and curing of following explanation, for operation same as described above, the description thereof will be omitted.
In the above description, in press device 1, intermediate plate 5 is located between base plate 21 and upper plate 61 in the vertical direction, but also can when sandwiched intermediate plate 5, upper plate 61 be configured at above base plate 21 above base plate 21.
Namely, as shown in figure 17, in the method, the base plate 21 of base component 2 is made to be positioned on horizontal plane, and duplexer 9 and the 1st distance piece 3a are loaded on a base plate 21, afterwards, upper plate 61 is loaded on upper, 3 stripping films 13 namely on base plate 21 of duplexer 9 on a base plate 21 in the mode that the 2nd directing pin 23 and the 3rd directing pin 24 run through upper plate through hole 62a.Afterwards, weighted plate 62 is positioned on upper plate 61.Then, as shown in figure 18, weight W be placed in weighted plate 62 and utilize upper plate 61 to press duplexer 9 downwards from top.
Adopt this press device 1 and utilize the curing of resin sheet 12 of press device 1, although be simple structure and method, upper plate 61 can be utilized suitably to press duplexer 9.
6. the variation 2 of press device
Figure 19 is the top view of the variation representing the distance piece 3 used in above-mentioned press device 1.In Figure 19, for the component identical with above-mentioned press device 1, mark identical Reference numeral and the description thereof will be omitted.In addition, in the pressing method and curing of following explanation, for operation same as described above, the description thereof will be omitted.
In the above description, distance piece 3 overlooks substantially rectangular shaped as frame shape, and comprise frame portion 31 and separating part 32, but distance piece 3 also can comprise multiple distance pieces of roughly flat rubber belting shape.
That is, as shown in figure 19, distance piece 90 comprises the 3rd distance piece 91 and the 4th distance piece 92.
3rd distance piece 91 be overlook rectangular shape roughly flat rubber belting shape and there is the thickness identical with resin sheet 12.3rd distance piece 91 is formed multiple (two) distance piece through hole 91a that through-thickness runs through the 3rd distance piece 91.
Distance piece through hole 91a be respectively equipped with at the both ends of the 3rd distance piece 91 1, namely add up to be provided with two.
4th distance piece 92 has the shape identical with the 3rd distance piece 91.That is, the 4th distance piece 92 be overlook rectangular shape roughly flat rubber belting shape and there is the thickness identical with resin sheet 12.4th distance piece 92 is formed multiple (two) distance piece through hole 92a that through-thickness runs through the 4th distance piece 92.
Distance piece through hole 92a be respectively equipped with at the both ends of the 4th distance piece 92 1, namely add up to be provided with two.
2nd directing pin 23 be respectively equipped with near 4 angles of base plate 21 1, that is add up to be provided with 4, this is not illustrated.Specifically, 2nd directing pin 23 of horizontal side and the 2nd directing pin 23 of horizontal opposite side in the horizontal, more relative with the 1st directing pin 22 position all in the inner part of horizontal opposite side than horizontal side the 1st directing pin 22, the 2nd directing pin 23 of longitudinal side and the 2nd directing pin 23 of longitudinal opposite side in the vertical, the 1st directing pin 22 of longitudinal side is neighbouring relative with the 1st directing pin 22 of longitudinal opposite side.
When press device 1 will be utilized to press duplexer 9, after duplexer 9 is placed in base plate 21, the 3rd distance piece 91 is positioned on a longitudinally side end of circuit substrate 10 by the mode running through two distance piece through hole 91a of the 3rd distance piece 91 with two of longitudinal side of base plate 21 the 2nd directing pin 23.In addition, on the longitudinal end side in the mode running through two distance piece through hole 92a of the 4th distance piece 92 with two of longitudinal opposite side of base plate 21 the 2nd directing pin 23 the 4th distance piece 92 being positioned in circuit substrate 10.Afterwards, load intermediate plate 5, duplexer 9, distance piece 90, intermediate plate 5, duplexer 9 and distance piece 90 successively, then load upper plate 61 and weighted plate 62 and utilize upper plate 61 to press duplexer 9 downwards from top.
Adopt this press device 1 and utilize the curing of resin sheet 12 of press device 1, although be more simple structure and method, upper plate 61 can be utilized suitably to press duplexer 9.
In addition, although provide above-mentioned utility model as illustrated embodiment of the present utility model, this is only illustrate, and should not do limited explanation.Those skilled in the art know that variation of the present utility model is included in claims of the present utility model.
Utilizability in industry
The curing of the resin sheet that the curing of press device of the present utility model and resin sheet can have as the device for pressing multiple duplexer and this duplexer and using.Such as, resin sheet is suitable for the sealing of optical semiconductor, and duplexer preferably includes such resin sheet.

Claims (5)

1. a press device, it is for pressing duplexer, and this duplexer comprises: substrate; Optical semiconductor, it is installed on aforesaid substrate; Resin sheet, it is formed on aforesaid substrate in the mode covering above-mentioned optical semiconductor by thermosetting resin; And stripping film, it is configured on above-mentioned resin sheet, and the feature of this press device is,
This press device comprises:
Lower plate, its with aforesaid substrate in downside and above-mentioned stripping film loads above-mentioned duplexer in the mode of upside;
Upper plate, consists of and presses above-mentioned duplexer downwards from the top of above-mentioned duplexer; And
1st distance piece, consists of between above-mentioned lower plate and above-mentioned upper plate,
Above-mentioned 1st distance piece is configured to the position on the lower, upper end that its upper end is in the vertical direction positioned at the above-mentioned stripping film than above-mentioned duplexer.
2. press device according to claim 1, is characterized in that,
Above-mentioned 1st distance piece is configured to above-mentioned resin sheet is exposed upward and the 1st distance piece is positioned on aforesaid substrate,
Above-mentioned 1st distance piece has the thickness identical with the thickness of above-mentioned resin sheet.
3. press device according to claim 1, is characterized in that,
In order to press multiple above-mentioned duplexer,
This press device also comprises:
Intermediate plate, it is at least 1, is configured at spaced intervals between above-mentioned lower plate and above-mentioned upper plate; And
2nd distance piece, it is at least 1, is positioned at the top of above-mentioned intermediate plate,
Above-mentioned intermediate plate is configured to aforesaid substrate in downside and above-mentioned stripping film loads above-mentioned duplexer in the mode of upside,
Above-mentioned 2nd distance piece is configured to the position on the lower, upper end that its upper end is in the vertical direction positioned at the above-mentioned stripping film than the above-mentioned duplexer being placed in above-mentioned intermediate plate,
The above-mentioned duplexer that above-mentioned upper plate is configured to being placed in above-mentioned intermediate plate presses downwards from the top of this duplexer.
4. press device according to claim 3, is characterized in that,
Above-mentioned 2nd distance piece is configured to above-mentioned resin sheet is exposed upward and the 2nd distance piece is positioned in and is placed on the aforesaid substrate of above-mentioned duplexer of above-mentioned intermediate plate,
Above-mentioned 2nd distance piece has the thickness identical with the thickness of above-mentioned resin sheet.
5. press device according to claim 3, is characterized in that,
This press device also comprises the locating guide for multiple above-mentioned duplexer, above-mentioned 1st distance piece, above-mentioned intermediate plate, above-mentioned 2nd distance piece and above-mentioned upper plate being located relative to above-mentioned lower plate.
CN201420430514.6U 2013-07-31 2014-07-31 Press device Expired - Fee Related CN204036735U (en)

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KR20240026543A (en) 2022-08-22 2024-02-29 주식회사 한국카본 Manufacturing apparatus of composite sheet and manufacturing method and composite sheet thereof

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CN111149161A (en) * 2018-03-09 2020-05-12 Hoya株式会社 Spacer, laminated body of substrate, method for manufacturing substrate, and method for manufacturing substrate for magnetic disk
CN111149161B (en) * 2018-03-09 2021-10-22 Hoya株式会社 Spacer, laminated body of substrate, method for manufacturing substrate, and method for manufacturing substrate for magnetic disk
US11471993B2 (en) 2018-03-09 2022-10-18 Hoya Corporation Spacer, laminate of substrates, method for manufacturing substrate, and method for manufacturing substrate for magnetic disk
US11839950B2 (en) 2018-03-09 2023-12-12 Hoya Corporation Spacer and laminate

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