JP2013131552A - Manufacturing method of electronic circuit module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic circuit module component for suppressing resin flow in which the need for a mold according to the shape of an aggregate substrate is eliminated.SOLUTION: The manufacturing method of an electronic circuit module component includes: a wall member arranging step for preparing an aggregate substrate including an electronic circuit module region which includes a plurality of electronic components, and a peripheral region on the outline of the electronic circuit module region, and arranging a resin flow suppression wall member of an elastic body on the surface of the peripheral region of the electronic circuit module region of the aggregate substrate; a resin mounting step for mounting an insulation resin in the electronic circuit module region; and a press step for applying a molding press to the aggregate substrate, the insulation resin and the resin flow suppression wall member.

Description

  The present invention relates to a method for manufacturing an electronic circuit module component including an insulating resin covering an electronic component.

  Electronic circuit module parts are a group of electronic parts that have one or more functions by mounting multiple electronic parts, for example, passive elements, active elements, or ICs (Integrated Circuits) on a substrate. It is. The electronic circuit module component is resin-sealed with an insulating resin that covers the electronic component.

  For example, in Patent Document 1, in a method for manufacturing a semiconductor device in which a substrate on which a semiconductor element is mounted is sealed using a resin sheet, the substrate is separated from the substrate on which the semiconductor element is mounted, and corresponds to the dimensions of the semiconductor element. An arrangement step of disposing a mold having a concave cavity formed in a predetermined dimension, disposing the resin sheet between the semiconductor element and the mold, and the substrate while heating and melting the resin sheet A method for manufacturing a semiconductor device is described, which includes a melting step in which the molds are stacked and pressed, and a curing step in which the melted resin sheet is cured.

  Patent Document 2 discloses a step of mounting a semiconductor element on a substrate having a wiring circuit with its main surface facing the substrate in a face-down manner, a substrate on which the semiconductor element is mounted, and a sealing resin. Placing the sealing resin in a gap between the semiconductor element and the substrate, placing the sealing resin on the side surface of the semiconductor element and the back surface of the semiconductor element by applying pressure to the sealing resin, and sealing the resin A method for manufacturing a resin-encapsulated semiconductor device comprising:

  Further, Patent Document 3 discloses a step of attaching a lower plate to the bottom surface of a multi-chip substrate of a semiconductor element on which a large number of semiconductor elements are mounted, and an elastic material surrounding the periphery of the substrate on the lower plate. A step of forming a weir, a step of injecting a sealing liquid resin into the weir to embed the element in the resin, and covering the liquid surface of the injected resin with an upper plate and pressurizing the weir Elastically deforming and overflowing excess resin, fixing the upper plate, the substrate, the weir, and the lower plate integrally, reversing and curing the resin, and after curing, the upper plate In a method for sealing a semiconductor element comprising a step of disassembling a substrate, a weir, and a lower plate, and a step of dividing individual elements from the substrate after disassembly, the height of the weir is on the side where the resin overflows A method for sealing a semiconductor element having a height lower than other parts is described. That.

JP 2006-237275 A JP-A-10-275818 JP 2002-124528 A

  The technique described in Patent Document 1 and Patent Document 2 needs to have a shape corresponding to a target substrate size to be sealed with a mold that applies pressure to the resin. For this reason, the techniques described in Patent Document 1 and Patent Document 2 require that the mold be changed whenever the size or shape of the substrate to be sealed changes. Further, the technique described in Patent Document 3 is based on the premise that the sealing liquid resin overflows the weir made of an elastic material surrounding the periphery of the substrate on the lower plate. There is a risk of problems in the subsequent processes.

  The present invention has been made in view of the above, and an object of the present invention is to provide a method of manufacturing an electronic circuit module component that does not require a mold according to the shape of the collective substrate and suppresses the flow of insulating resin. .

  In order to solve the above-described problems and achieve the object, an electronic circuit module manufacturing method provides an assembly board including an electronic circuit module region including a plurality of electronic components and a peripheral region outside the electronic circuit module region. A wall member disposing step of disposing an elastic resin flow suppression wall member in a peripheral region of the electronic circuit module region of the collective substrate, and a resin mounting step of disposing an insulating resin in the electronic circuit module region And a pressing step of applying a molding pressure to the aggregate substrate, the insulating resin, and the resin flow suppression wall member.

  With this method of manufacturing an electronic circuit module, it is possible to suppress the replacement of the mold corresponding to the collective substrate. Moreover, the manufacturing method of an electronic circuit module can suppress the flow of insulating resin by the resin flow suppression wall member of an elastic body. The resin flow suppression wall member of the elastic body can contain the molding pressure and improve the resin filling property in the space between the resin flow suppression wall member and the electronic component, between the electronic components, or under the electronic component.

  Since the resin flow suppression wall member is directly formed on the surface of the collective substrate by the method for manufacturing the electronic circuit module, even if the collective substrate is warped, the warpage of the collective substrate is corrected simultaneously with the pressing step. For this reason, the press apparatus eliminates the need for a warp correction jig, reduces the cost of manufacturing the electronic circuit module component, and reduces the manufacturing effort. And the manufacturing method of the said electronic circuit module can improve the quality of electronic circuit module components.

  In the pressing step of the electronic circuit module manufacturing method, when the interval between the press upper plate and the press lower plate of the press device is controlled, the predetermined thickness of the insulating resin on the electronic circuit module region can be easily obtained.

  As a desirable aspect of the present invention, in the resin placing step, the insulating resin is preferably in the form of a sheet having a predetermined thickness.

  Since the insulating resin has a fixed shape, the amount of the insulating resin can be specified in advance. For this reason, even if there is warping in the aggregate substrate, it is possible to suppress variation in the amount of resin in the aggregate substrate surface due to warpage of the aggregate substrate, as compared with liquid resin or powder resin. For example, by using a sheet-like resin as the insulating resin, the insulating resin can be easily placed inside the resin flow suppression wall member.

  As a desirable mode of the present invention, the electronic circuit module region is polygonal in a plan view, and the resin flow suppression wall member is a periphery of the electronic circuit module region where each side of the outline of the electronic circuit module region intersects It is preferable that the corners of the region are discontinuous.

  The insulating resin applied with pressure from the center to the outside of the collective substrate tends not to flow easily at the corners of the collective substrate. By making the resin flow suppression wall member discontinuous at the corners of the peripheral region, the outline of the electronic circuit module region is divided into a portion with the resin flow suppression wall member and a portion without the resin flow suppression wall member. In the portion without the resin flow suppression wall member, the softened insulating resin is induced and flows in the pressing step of the electronic circuit module manufacturing method. Moreover, since the resin flow suppression wall member is discontinuous at the corners of the peripheral region of the aggregate substrate, there is no resin flow suppression wall member. For this reason, since the softened insulating resin is induced to flow into the corner portion, the electronic circuit module manufacturing method can improve the resin filling property of the electronic circuit module region close to the corner portion.

  As a desirable aspect of the present invention, in the wall member disposing step, the liquid discharge device discharges a liquid raw material that becomes the elastic body to a peripheral region of the electronic circuit module region, and the resin flow suppression wall member is used as the collective substrate. It is preferable to arrange on the surface.

  Thereby, the freedom degree of the shape of the resin flow suppression wall member can be increased. The liquid ejection device can easily and inexpensively make the shape of the resin flow suppression wall member according to the size or shape of the aggregate substrate.

  As a desirable aspect of the present invention, in the wall member disposing step, it is preferable to dispose the resin flow suppression wall member in which the elastic body is formed into a frame shape in advance on the surface of the collective substrate.

  Thereby, since the resin flow suppression wall member can be manufactured in advance, the efficiency of disposing the resin flow suppression wall member on the surface of the collective substrate can be increased. As a result, the time required for the wall member arranging step can be shortened.

  As a desirable aspect of the present invention, in the pressing step, it is preferable that a molding pressure regulating member regulates an interval at which a molding pressure is applied to the insulating resin and the resin flow suppression wall member.

  Thereby, in a press process, the height of an electronic circuit module component can be controlled. For this reason, the simple press apparatus which excluded the control apparatus which controls the space | interval of a press upper board and a press lower board can be used.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the electronic circuit module component which makes the metal mold | die according to the shape of an aggregate substrate unnecessary, and suppresses the flow of insulating resin can be provided.

FIG. 1 is a flowchart showing a method for manufacturing an electronic circuit module component according to this embodiment. FIG. 2 is an assembly board of electronic circuit module components according to the first embodiment. FIG. 3 is an explanatory view illustrating an example in which a resin flow suppression wall member is disposed on the surface of the collective substrate of the electronic circuit module component according to the first embodiment. FIG. 4 is a schematic configuration diagram illustrating a state in which the assembly board of electronic circuit module components according to the first embodiment is disposed between the press upper board and the press lower board. FIG. 5 is a schematic configuration diagram illustrating a state in which the collective substrate of the electronic circuit module component according to the first embodiment is pressed. FIG. 6 is an explanatory view for explaining the flow state of the resin when there is no resin flow suppression wall member. FIG. 7 is an explanatory diagram for explaining a resin flow state by the resin flow suppression wall member according to the first embodiment. FIG. 8 is an explanatory view illustrating a first modification in which a resin flow suppression wall member is disposed on the surface of the collective substrate of the electronic circuit module component according to the first embodiment. FIG. 9 is an explanatory view illustrating a second modification example in which a resin flow suppression wall member is disposed on the surface of an assembly board of electronic circuit module components. FIG. 10 is an explanatory view illustrating a second modification of the resin flow suppression wall member according to the first embodiment. FIG. 11 is a schematic configuration diagram illustrating a state in which the electronic circuit module component assembly board according to the first embodiment is disposed between the press upper board and the press lower board. FIG. 12 is a schematic configuration diagram illustrating a state in which the electronic circuit module component assembly board according to the first embodiment is pressed.

  DESCRIPTION OF EMBODIMENTS Hereinafter, modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The following embodiments do not limit the present invention. The constituent elements described in the following embodiments include those that can be easily assumed by those skilled in the art, those that are substantially the same, and those that are so-called equivalent ranges. Furthermore, the components described in the following embodiments can be combined as appropriate.

(Embodiment 1)
FIG. 1 is a flowchart showing a method for manufacturing an electronic circuit module component according to this embodiment. FIG. 2 is an assembly board of electronic circuit module components according to the first embodiment. First, a collective substrate 1 for electronic circuit modules shown in FIG. 2 is prepared (step S1).

  As shown in FIG. 2, the collective substrate 1 of the electronic circuit module is an electronic circuit in which a plurality of electronic components are mounted on the collective substrate 1 to form an electronic component having a single function or a plurality of functions. An electronic circuit module area 1a for mounting the module and a peripheral area 1b outside the electronic circuit module area 1a are included.

  The electronic circuit module region 1a is a rectangle such as a rectangle or a square in plan view. Along the respective sides of the electronic circuit module region 1a, the peripheral region 1b outside the electronic circuit module region 1a is also a rectangle such as a rectangle or a square in plan view. The electronic circuit module region 1a may be polygonal in plan view, and may be pentagonal or hexagonal. Along the respective sides of the electronic circuit module region 1a, the peripheral region 1b outside the electronic circuit module region 1a is similar in plan view. The peripheral region 1b is a frame-shaped region that surrounds the electronic circuit module region 1a between the outline of the electronic circuit module region 1a and the outer shape (edge) of the collective substrate 1.

  In the subsequent process of the method for manufacturing the electronic circuit module component according to the present embodiment, the electronic circuit module region 1a can be individually cut by the dicing line 1c to be an individual electronic circuit module component. In the electronic circuit module region 1 a, electronic components are mounted on the surface of the collective substrate 1 or mounted inside the collective substrate 1. In the present embodiment, examples of the electronic component constituting the electronic circuit module region 1a include a passive element such as a coil or a capacitor or a resistor, an active element such as a diode or a transistor, or an IC (Integrated Circuit). The electronic component is not limited to these.

  The peripheral region 1b preferably includes a dicing line marker 1m on an extension line of the dicing line 1c.

  Next, as shown in FIG. 1, when the collective substrate 1 is prepared, the process proceeds to a wall member disposing step (step S2) in which the resin flow suppression wall member 11 is disposed on the peripheral region 1b of the collective substrate 1 with an elastic body. . The resin flow suppression wall member 11 shown in FIG. 2 is a weir formed continuously along the peripheral region 1b side of the electronic circuit module region 1a and between the corners 11A of the peripheral region 1b. The corner portion 11A is a region where the sides of the outline of the electronic circuit module region 1a intersect. The resin flow suppression wall member 11 is preferably an elastic body that exhibits elasticity, such as a silicone resin or a urethane resin. Next, a wall member arrangement | positioning process is demonstrated using FIG.

  FIG. 3 is an explanatory view illustrating an example in which a resin flow suppression wall member is disposed on the surface of the collective substrate of the electronic circuit module component according to the first embodiment. As shown in FIG. 3, the liquid ejection device 31 such as a dispenser ejects the raw material of the resin flow suppression wall member 11 serving as an elastic body onto the surface of the collective substrate 1, for example, in the direction of the arrow. As shown in FIG. 2, the raw material of the resin flow suppression wall member 11 is continuously discharged and drawn, but the resin flow suppression wall member 11 is discontinuous at the corner portion 11A of the peripheral region 1b.

  The resin flow suppression wall member 11 is preferably subjected to a curing process after being fixed to the collective substrate 1. By the curing process, the resin flow suppression wall member 11 becomes an elastic body and can be fixed in shape. The curing process varies depending on the material of the resin flow suppression wall member 11. For example, the curing process may be any of a thermal curing process, a photo curing process, and a moisture curing process.

  More preferably, the resin flow suppression wall member 11 is drawn so as not to overlap the dicing line marker 1m in the peripheral region 1b of the collective substrate 1. Since the dicing line marker 1m is located on the edge side of the collective substrate 1 with respect to the resin flow suppression wall member 11, it is possible to reduce the possibility of being covered with an insulating resin described later.

  Next, as shown in FIG. 1, after the wall member disposing step (step S2), a resin placing step (step S3) for placing an insulating resin on the collective substrate 1 so as to overlap the electronic circuit module region 1a. Proceed to FIG. 4 is a schematic configuration diagram illustrating a state in which the assembly board of electronic circuit module components according to the first embodiment is disposed between the press upper board and the press lower board. As shown in FIG. 4, the press device 20 includes a press upper board 21 and a press lower board 22, and by reducing the interval between the press upper board 21 and the press lower board 22, the press upper board 21 and the press lower board. The workpiece can be sandwiched between 22 and pressure can be applied.

  In the resin placing step (step S3), the insulating resin 2 is placed on the surface of the collective substrate 1 described above as a workpiece. Here, the insulating resin 2 may be a liquid resin or a powder resin, but is more preferably a sheet. The sheet-like insulating resin 2 has a shape determined at room temperature (25 ° C.). For this reason, the insulating resin 2 is placed on the surface of the collective substrate 1 with a predetermined thickness secured.

  Since the insulating resin 2 has a fixed shape, the amount of the insulating resin can be defined in advance. For this reason, even if the collective substrate 1 is warped, variation in the amount of resin in the collective substrate 1 surface due to the warp of the collective substrate 1 can be suppressed as compared with a liquid resin or a powdery resin. For example, by using a sheet-like resin for the insulating resin 2, the insulating resin 2 can be easily placed inside the resin flow suppression wall member 11.

  The insulating resin 2 is an insulating resin having electrical insulating properties and has a function of sealing the electronic components in the electronic circuit module region 1 a on the collective substrate 1. The insulating resin 2 is, for example, a thermosetting resin (for example, an epoxy resin, but is not limited thereto). Alternatively, the insulating resin 2 may contain a filler (for example, silica or alumina).

  In the resin placing step (step S3), the press device 20 receives the collective substrate 1 on which the insulating resin 2 is placed on the press lower platen 22, and the insulating resin 2 and the resin flow suppression wall member 11 are interposed via the peeling member 23. The press upper board 21 is in a state of being positioned.

  After the resin placement step (step S3) shown in FIG. 1, the process proceeds to a pressing step (step S4) in which pressure is applied to the collective substrate 1, the insulating resin 2, and the resin flow suppression wall member 11. FIG. 5 is a schematic configuration diagram illustrating a state in which the collective substrate of the electronic circuit module component according to the first embodiment is pressed. As shown in FIG. 5, the press device 20 sandwiches the aggregate substrate 1, the insulating resin 2, and the resin flow suppression wall member 11 between the press upper plate 21 and the press lower plate 22 and applies pressure. In the pressing step (step S4), it is more preferable to increase the temperature together with the pressure. Thereby, the insulating resin 2 is softened and easily deformed.

  Next, the pressure applied to the insulating resin 2 will be described with reference to FIGS. 6 and 7. FIG. 6 is an explanatory view for explaining the flow state of the resin when there is no resin flow suppression wall member. FIG. 7 is an explanatory diagram for explaining a resin flow state by the resin flow suppression wall member according to the first embodiment. As shown in FIG. 6, when there is no resin flow suppression wall member, the pressure applied to the insulating resin 2 in the vertical direction is the pressures P1 and P2 in the horizontal direction. For this reason, the insulating resin 2 flows out according to the pressure P3 directed to the outside of the collective substrate 1 in the peripheral region 1b, and the thickness of the insulating resin 2 on the electronic circuit module region 1a may be insufficient.

  As shown in FIG. 7, the resin flow suppression wall member 11 reverses the pressure P4 directed toward the inside of the collective substrate 1 even when the pressure on the insulating resin 2 in the vertical direction becomes the pressures P1 and P2 in the horizontal direction. be able to. Thereby, the thickness of the insulating resin 2 on the electronic circuit module region 1a can be secured, and the resin filling property between the electronic components or under the electronic components can be improved. As a result, the electronic circuit module component manufacturing method of the present embodiment can reduce the voids inside the insulating resin.

  As described above, the resin flow suppression wall member 11 of the present embodiment is discontinuous at the corner portion 11A of the peripheral region 1b. Therefore, the corner portion 11A induces the flow of the insulating resin 2 and concentrates the excess insulating resin 2 in the peripheral region 1b of the corner portion 11A. And the corner | angular part 11A can reduce a possibility that the resin flow suppression wall member 11 may overflow. As a result, the overflowing insulating resin 2 does not hide the dicing line marker 1m, and the electronic circuit module component manufacturing method according to the present embodiment can effectively utilize the peripheral region 1b in a subsequent process.

  As described above, the press device 20 sandwiches the aggregate substrate 1, the insulating resin 2, and the resin flow suppression wall member 11 between the press upper plate 21 and the press lower plate 22 and applies pressure. And since the resin flow suppression wall member 11 is an elastic body as shown in FIG. 5, it can deform | transform with the applied pressure. For this reason, the resin flow suppression wall member 11 is not likely to be an obstacle to the predetermined thickness of the insulating resin 2 on the electronic circuit module region 1a. The press device 20 may be controlled to stop between the press upper board 21 and the press lower board 22 at a position where the insulating resin 2 has a predetermined thickness on the electronic circuit module region 1a.

  After completion of the pressing step (step S4), resin sealing of the collective substrate 1 is completed, and the electronic components in the electronic circuit module region 1a can be covered with the insulating resin 2. As a subsequent step of the method for manufacturing the electronic circuit module component according to the present embodiment, the cutting device cuts the dicing line 1c using the dicing line marker 1m described above as a mark. Moreover, it cut | disconnects so that the resin flow suppression wall member 11 may be cut off using the resin flow suppression wall member 11 as a mark. As a result, each electronic circuit module region 1a becomes an electronic circuit module component, and the electronic circuit module component can be manufactured.

  As described above, the electronic circuit module component manufacturing method according to the first embodiment includes the collective substrate 1 including the electronic circuit module region 1a including a plurality of electronic components and the peripheral region 1b outside the electronic circuit module region 1a. (Step S1), a wall member disposing step (step S2) of disposing the elastic resin flow suppression wall member 11 in the peripheral region 1b of the collective substrate 1, and the insulating resin 2 in the electronic circuit module region 1a. A resin placing step (step S3) to be placed, and a pressing step (step S4) for applying a molding pressure to the collective substrate 1, the insulating resin 2, and the resin flow suppression wall member 11 are included.

  In the conventional method of manufacturing an electronic circuit module, the press device 20 uses a press upper plate 21 or a press lower plate 22 as a mold corresponding to the size or shape of the collective substrate 1, and a plurality of molds for each type of the collective substrate 1. The mold had to be manufactured and prepared. In addition, the cost of manufacturing the mold is very high, and the maintenance cost of the mold is required continuously.

  The manufacturing method of the electronic circuit module according to the first embodiment can eliminate the use of a mold corresponding to the size or shape of the collective substrate 1. Moreover, the manufacturing method of an electronic circuit module can suppress the flow of the insulating resin 2 by the elastic resin flow suppression wall member 11. Thereby, the possibility that the insulating resin 2 overflowing the resin flow suppression wall member 11 becomes a problem in a subsequent process can be suppressed. Moreover, the resin flow suppression wall member 11 of an elastic body can contain the molding pressure and improve the resin filling property in the space between the resin flow suppression wall member 11 and the electronic component, between the electronic components, or under the electronic component. Can do.

  Further, since the resin flow suppression wall member 11 is directly formed on the collective substrate 1, even if the collective substrate 1 is warped, the warp of the collective substrate 1 is corrected simultaneously with the pressing step (step S4). For this reason, the press device 20 eliminates the need for a warp correction jig, reduces the cost of manufacturing the electronic circuit module component, and reduces the manufacturing effort. And the manufacturing method of the said electronic circuit module can improve the quality of electronic circuit module components.

(First modification)
FIG. 8 is an explanatory view illustrating a first modification in which a resin flow suppression wall member is disposed on the surface of the collective substrate of the electronic circuit module component according to the first embodiment. In the following description, the same components as those in the above-described embodiment are denoted by the same reference numerals, and redundant description is omitted.

  As shown in FIG. 8, the resin flow suppression wall member 12 is drawn by the liquid ejection device 31 such as a dispenser shown in FIG. 3 so as not to overlap the dicing line marker 1 m in the peripheral region 1 b of the collective substrate 1. . The resin flow suppression wall member 12 is disposed on the peripheral region 1b and is discontinuous at the corner 12A of the peripheral region 1b. The corner portion 12A is an area where the sides of the outline of the electronic circuit module area 1a intersect.

  The resin flow suppression wall member 12 includes a wall portion 12a that is drawn linearly, and a restriction portion 12b that restricts the flow direction of the insulating resin 2 described above at the corner portion 12A. The wall portion 12a is a weir formed continuously along the peripheral region 1b side of the electronic circuit module region 1a and between the corner portions 12A of the peripheral region 1b. The restricting portion 12b is a weir connected to the end portion of the wall portion 12a that is bent in the direction different from the extending direction of the wall portion 12a and to the outside of the collective substrate.

  In the pressing step (step S4) shown in FIG. 1, the corner portion 12A in FIG. 8 induces the flow of the insulating resin 2 along the flow path between the restricting portions 12b, and the excess insulating resin 2 is moved around the corner portion 12A. Concentrate on region 1b. And the corner | angular part 12A can reduce a possibility that the wall part 12a of the resin flow suppression wall member 12 may overflow. As a result, the overflowing insulating resin 2 does not hide the dicing line marker 1m, and the electronic circuit module component manufacturing method according to the present embodiment can effectively utilize the peripheral region 1b in a subsequent process. Further, the restricting portion 12b can restrict the flow of the surplus insulating resin 2 around the peripheral region 1b.

  Thereby, the outline of the electronic circuit module region 1a is divided into a portion where the resin flow suppression wall member 12 is present and a portion where the resin flow suppression wall member 12 is not present (corner portion 12A). In the portion (corner portion 12A) where there is no resin flow suppression wall member, the softened insulating resin 2 is induced and flows in the pressing step (step S4) of the method for manufacturing the electronic circuit module. The insulating resin 2 applied with pressure from the center of the collective substrate 1 to the outside tends to hardly flow to the corner portion 12A of the collective substrate 1. Further, since the resin flow suppression wall member 12 is discontinuous at the corner 12A of the peripheral region 1b of the collective substrate 1, there is no resin flow suppression wall member 12. For this reason, since the softened insulating resin 2 is guided and flows into the corner portion 12A, the resin filling property of the electronic circuit module region 1a close to the corner portion 12A is improved.

(Second modification)
FIG. 9 is an explanatory view illustrating a second modification example in which a resin flow suppression wall member is disposed on the surface of an assembly board of electronic circuit module components. FIG. 10 is an explanatory view illustrating a second modification of the resin flow suppression wall member according to the first embodiment. In the following description, the same components as those in the above-described embodiment are denoted by the same reference numerals, and redundant description is omitted.

  As shown in FIG. 9, the resin flow suppression wall member 13 is disposed on the peripheral region 1b and is a continuous weir so as to surround the electronic circuit module region 1a. In the wall member disposing step (step S2), drawing is performed by the liquid ejection device 31 such as a dispenser shown in FIG. 3 so as not to overlap the dicing line marker 1m in the peripheral region 1b of the collective substrate 1.

  Or in a wall member arrangement | positioning process (step S2), a shaping | molding apparatus shape | molds and prepares an elastic body in frame shape like the resin flow suppression wall member 13 shown in FIG. And in a wall member arrangement | positioning process (step S2), the frame mentioned above is fixed to the aggregate substrate 1 via an adhesive agent or an adhesive. The material of the frame is not particularly limited, but silicone rubber, urethane rubber and the like are preferable. The above-described frame body is manufactured by punching the elastic sheet by the molding apparatus. The adhesive or pressure-sensitive adhesive is not particularly limited, but it is preferable to use a reactive curable resin that is cured by heat or moisture.

  As described above, in the wall member disposing step (step S2), the resin flow suppression wall member 13 in which an elastic body is previously formed into a frame shape is disposed on the collective substrate 1. For this reason, since the resin flow suppression wall member 13 having the same shape can be manufactured in advance, the efficiency of disposing the resin flow suppression wall member 13 on the surface of the collective substrate 1 can be increased. As a result, the time required for the wall member disposing step (step S2) can be shortened.

(Embodiment 2)
FIG. 11 is a schematic configuration diagram illustrating a state in which the electronic circuit module component assembly board according to the first embodiment is disposed between the press upper board and the press lower board. FIG. 12 is a schematic configuration diagram illustrating a state in which the electronic circuit module component assembly board according to the first embodiment is pressed. In the following description, the same components as those in the above-described embodiment are denoted by the same reference numerals, and redundant description is omitted.

  As shown in FIG. 11, the press device 20 includes a press upper board 21 and a press lower board 22, and by reducing the interval between the press upper board 21 and the press lower board 22, The workpiece can be sandwiched between 22 and pressure can be applied. The press device 20 further includes a molding pressure regulating member 24 that regulates the distance between the press upper plate 21 and the press lower plate 22 on at least one of the press upper plate 21 and the press lower plate 22. The molding pressure regulating member 24 is a so-called spacer, and is a rigid body that does not deform even when it is sandwiched between the press upper panel 21 and the press lower panel 22.

  As shown in FIG. 11, the molding pressure regulating member 24 is in a position that does not overlap the collective substrate 1. In the resin placing step (step S3) shown in FIG. 1, the press device 20 shown in FIG. 11 receives the aggregate substrate 1 on which the insulating resin 2 is placed on the press lower plate 22, and receives the insulating resin 2 and the resin flow suppression. The press upper board 21 is positioned on the wall member 11 via the peeling member 23.

  After the resin placement step (step S3), the process proceeds to a pressing step (step S4) in which pressure is applied to the collective substrate 1, the insulating resin 2, and the resin flow suppression wall member 11. As shown in FIG. 12, the press device 20 sandwiches the aggregate substrate 1, the insulating resin 2, and the resin flow suppression wall member 11 between the press upper plate 21 and the press lower plate 22 and applies pressure. In the pressing step (step S4), the molding pressure regulating member 24 regulates the interval at which the molding pressure is applied to the insulating resin 2 and the resin flow suppression wall member 11. For this reason, it is not necessary for the press device 20 to precisely control the interval between the press upper plate 21 and the press lower plate 22, and a simple press device in which the control device for controlling the interval is omitted can be used.

  The height of the molding pressure regulating member 24 is preferably determined in consideration of a predetermined thickness of the insulating resin 2 on the electronic circuit module region 1a. In addition, overflow of the insulating resin 2 in a press process (step S4) can be suppressed by making the height of the resin flow suppression wall member 13 higher than the height of the molding pressure regulating member 24. In the method of manufacturing an electronic circuit module component according to the present embodiment, the press upper board 21 and the press lower board 22 can have a simple flat structure. And the manufacturing method of the electronic circuit module component which concerns on this embodiment does not prepare the metal mold | die match | combined with the magnitude | size or the shape of the collective substrate 1, and the height of the shaping pressure control member 24 which is an inexpensive jig | tool is made. By changing, the predetermined thickness of the insulating resin 2 on the electronic circuit module region 1a can be obtained.

DESCRIPTION OF SYMBOLS 1 Collective board 1a Electronic circuit module area | region 1b Peripheral area | region 1c Dicing line 1m Dicing line marker 2 Insulating resin 11, 12, 13 Resin flow suppression wall member 11A, 12A Corner | angular part 12a Wall part 12b Control part 20 Press apparatus 21 Press upper board 22 Press lower plate 23 Peeling member 24 Molding pressure regulating member 31 Liquid discharge device

Claims (6)

A collective substrate including an electronic circuit module region including a plurality of electronic components and an outer peripheral region of the electronic circuit module region is prepared, and a resin flow suppression wall member of an elastic body is provided in the electronic circuit module region of the collective substrate. A wall member disposing step disposed in the peripheral region;
A resin placing step of placing an insulating resin in the electronic circuit module region;
A pressing step of applying a molding pressure to the aggregate substrate, the insulating resin, and the resin flow suppression wall member;
The manufacturing method of the electronic circuit module characterized by the above-mentioned.   2. The method of manufacturing an electronic circuit module according to claim 1, wherein, in the resin placing step, the insulating resin is in a sheet shape having a predetermined thickness. The electronic circuit module region is polygonal in plan view,
The said resin flow suppression wall member is discontinuous in the corner | angular part of the peripheral region of the said electronic circuit module area | region where each edge | side of the outline of the said electronic circuit module area | region cross | intersects. 3. A method for producing an electronic circuit module according to 2.   In the wall member disposing step, the liquid ejecting apparatus ejects a liquid raw material serving as the elastic body to a peripheral region of the electronic circuit module region, and disposing the resin flow suppressing wall member on the surface of the collective substrate. The method for manufacturing an electronic circuit module according to any one of claims 1 to 3, wherein:   3. The electron according to claim 1, wherein, in the wall member disposing step, the resin flow suppression wall member in which the elastic body is formed in a frame shape in advance is disposed on the surface of the collective substrate. Circuit module manufacturing method.   6. The electron according to claim 1, wherein in the pressing step, a molding pressure regulating member regulates an interval at which a molding pressure is applied to the insulating resin and the resin flow suppression wall member. Circuit module manufacturing method.

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