CN204859778U - Paste and cover membrane tool - Google Patents
Paste and cover membrane tool Download PDFInfo
- Publication number
- CN204859778U CN204859778U CN201520470746.9U CN201520470746U CN204859778U CN 204859778 U CN204859778 U CN 204859778U CN 201520470746 U CN201520470746 U CN 201520470746U CN 204859778 U CN204859778 U CN 204859778U
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- lifter plate
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- tool
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- epiphragma
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Abstract
The utility model relates to a paste and cover membrane tool. This paste and cover membrane tool for cover the membrane at the flexible circuit board facing, include: the tool platform, which comprises a substrate, the lifter plate, the pilot pin, apron and locating piece, the lifter plate is located on the base plate, lifter plate and base plate interval, and the spacing distance between lifter plate and the base plate is adjustable, the pilot pin is located on the lifter plate, the pilot pin is used for passing to be seted up the first through -hole on the flexible circuit board and sets up in covering epimembranal second through -hole, the apron is worn to locate in the pilot pin, and can dismantle with the lifter plate and be connected, the apron is used for the suppression to locate the flexible circuit board on the lifter plate and cover the membrane, the locating piece is located on the base plate, the base plate is used for at the lifter plate when moving, with the lifter plate butt, in order to confirm the minimum distance between lifter plate and the base plate, the warm table is with one side pin joint of base plate to one side pressurization heating of lifter plate is kept away from the apron. This paste and cover membrane tool operating efficiency is higher, and the qualification rate is also higher.
Description
Technical field
The utility model relates to flexible PCB manufacture technology field, particularly relates to one and pastes epiphragma tool.
Background technology
In the process making flexible PCB, after form conducting wire on substrate, need on conducting wire, to paste epiphragma to protect conducting wire, and some elements on substrate, as pad needs to expose, epiphragma can not be coated to and cover.Existing, mainly rely on manual visual contraposition when pasting epiphragma, easy like this causing pastes inclined coverlay, exceeds customer requirement scope, causes to do over again many, and efficiency is low; And pasting the experience that epiphragma also needs to rely on employee by hand, the new employee pasting epiphragma is for the first time difficult to reach required precision and efficiency, if just find after pressing that aligning accuracy is defective will cause product rejection, quality also exists certain hidden danger.
Utility model content
Based on this, be necessary to provide a kind of operating efficiency higher and qualification rate higher paste epiphragma tool.
One pastes epiphragma tool, for pasting epiphragma on flexible PCB, comprising:
Tool platform, comprise substrate, lifter plate, pilot pin, cover plate and locating piece, described lifter plate is located on described substrate, described lifter plate and described substrate interval, and spacing distance between described lifter plate and described substrate is adjustable, described pilot pin is located on described lifter plate, described pilot pin is for through the first through hole be opened on flexible PCB and the second through hole be opened on coverlay, described cover plate is arranged in described pilot pin, and removably connect with described lifter plate, described cover plate is located at flexible PCB on described lifter plate and coverlay for suppressing, described locating piece is located on described substrate, for when described lifter plate is towards described substrate motion, abut with described lifter plate, to determine the minimum spacing between described lifter plate and described substrate, and
Heating station, with the side pivot joint of described substrate, with to the side pressurized, heated of described cover plate away from described lifter plate.
Use above-mentioned when pasting epiphragma tool, first in pilot pin, wear flexible PCB and coverlay, flexible PCB and coverlay are stacked on lifter plate, then cover plate is arranged in pilot pin, to suppress flexible PCB and coverlay.Pull heating station again, make heating station be pressed on cover plate away from the side of lifter plate, lifter plate is towards substrate motion simultaneously, until and after abutting with locating piece, lifter plate stops super lower motion.Now, heating station is to cover plate pressurized, heated, also namely indirect for flexible PCB and coverlay pressurized, heated, thus coverlay is fitted on flexible PCB.After this, then pull heating station, heating station is separated with cover plate, then take off cover plate and product (posting the flexible PCB of coverlay)
The above-mentioned epiphragma tool that pastes is adopted to carry out pad pasting, owing to being provided with pilot pin, thus make the contraposition of coverlay and flexible PCB very simple, only need coverlay and flexible PCB be inserted in pilot pin, contraposition needs the time of cost few, and not only operating efficiency is higher and qualification rate is also higher.
Wherein in an embodiment, described tool platform also comprises lifting assembly, and described lifting assembly comprises elastic supporting member for supporting optical member, and the two ends of described elastic supporting member for supporting optical member are connected with described substrate and described lifter plate.
Wherein in an embodiment, described elastic supporting member for supporting optical member comprises guide pillar, cylinder portion and spring, described guide pillar one end is located on described substrate, the other end is provided with installing hole, and described cylinder portion is located on described lifter plate, and described spring one end is placed in described installing hole, and abut with the bottom of described installing hole, the other end is placed in described cylinder portion, and abuts with described lifter plate, and described guide pillar is placed in described cylinder portion near one end of described lifter plate.
Wherein in an embodiment, described tool platform also comprises needle plate, and described needle plate between described lifter plate and described cover plate, and is connected with described lifter plate, and described pilot pin is located on the side of described needle plate away from described lifter plate.
Wherein in an embodiment, described heating station comprises plate body and is built in the heating plate in described plate body, and described plate body is provided with interface, and described interface is used for the joint of accommodating external power supply, is electrically connected with described heating plate to make joint.
Wherein in an embodiment, the described epiphragma tool that pastes also comprises installed part, and described installed part comprises erection column and mounting panel, and described erection column is located on described substrate, described mounting panel is located on described erection column one end away from described substrate, described heating station and described mounting panel pivot joint.
Wherein in an embodiment, described heating station and described mounting panel are by hinge pivot joint.
Wherein in an embodiment, described installed part also comprises guide vane end stop, and described guide vane end stop is located on described mounting panel, for limiting the amplitude that described heating station moves towards the direction away from described cover plate.
Wherein in an embodiment, described guide vane end stop is side, inclined-plane near the side of described heating station, described guide vane end stop is first end away from one end of described mounting panel, the other end is the second end, from described first end to described second end direction on, the spacing between side corresponding thereto, side, described inclined-plane reduces gradually.
Wherein in an embodiment, described installed part also comprises backstay, and described backstay one end is connected with described substrate rotating, and the other end and described heating station are rotationally connected;
And/or described heating station is provided with handle away from the side of described tool platform;
And/or described heating station is provided with thermal insulation layer away from the side of described cover plate.
Accompanying drawing explanation
Fig. 1 is the structural representation pasting epiphragma tool of an execution mode;
Fig. 2 is the structural representation of the heating station in Fig. 1.
Embodiment
Be described further pasting epiphragma tool below in conjunction with drawings and the specific embodiments.
As shown in Figures 1 and 2, an execution mode paste epiphragma tool 10, comprise tool platform 100, heating station 200 and installed part 300.
Tool platform 100 comprises substrate 110, lifter plate 120, pilot pin 130, cover plate 140 and locating piece 150.Lifter plate 120 is located on substrate 110.Lifter plate 120 and substrate 110 interval, and spacing distance between lifter plate 120 and substrate 110 is adjustable.Pilot pin 130 is located on lifter plate 120, and pilot pin 130 is for through the first through hole be opened on flexible PCB and the second through hole be opened on coverlay.Cover plate 140 is arranged in pilot pin 130, and removably connects with lifter plate 120.Cover plate 140 is located at flexible PCB on lifter plate 120 and coverlay for suppressing.Locating piece 150 is located on substrate 110, for when lifter plate 120 moves towards substrate 110, abuts with lifter plate 120, to determine the minimum spacing between lifter plate 120 and substrate 110.
The side pivot joint of heating station 200 and substrate 110, with to the side pressurized, heated of cover plate 140 away from lifter plate 120.
Use above-mentioned when pasting epiphragma tool 10, first in pilot pin 130, wear flexible PCB and coverlay, flexible PCB and coverlay are stacked on lifter plate 120, then cover plate 140 is arranged in pilot pin 130, to suppress flexible PCB and coverlay.Pull heating station 200 again, make heating station 200 be pressed on the side of cover plate 140 away from lifter plate 120, lifter plate 120 moves towards substrate 110, until and after abutting with locating piece 150, lifter plate 120 stops moving down simultaneously.Now, heating station 200 pairs of cover plate 140 pressurized, heated, also namely indirect for flexible PCB and coverlay pressurized, heated, thus coverlay is fitted on flexible PCB.After this, then pull heating station 200, heating station 200 is separated with cover plate 140, then take off cover plate 140 and product (posting the flexible PCB of coverlay)
The above-mentioned epiphragma tool 10 that pastes is adopted to carry out pad pasting, owing to being provided with pilot pin 130, thus make the contraposition of coverlay and flexible PCB very simple, only need coverlay and flexible PCB be inserted in pilot pin 130, contraposition needs the time of cost few, and not only operating efficiency is higher and qualification rate is also higher.
Further, in the present embodiment, tool platform 100 also comprises lifting assembly 160.Lifting assembly 160 comprises elastic supporting member for supporting optical member 162, and the two ends of elastic supporting member for supporting optical member 162 are connected with substrate 110 and lifter plate 120.
Further, in the present embodiment, elastic supporting member for supporting optical member 162 comprises guide pillar 1622, cylinder portion 1624 and spring (not shown).Guide pillar 1622 one end is located on substrate 110, and the other end is provided with installing hole (not shown).Cylinder portion 1624 is located on lifter plate 120.Spring one end is placed in installing hole, and abuts with the bottom of installing hole, and the other end is placed in a portion 1624, and abuts with lifter plate 120.And guide pillar 1622 is placed in a portion 1624 near one end of lifter plate 120.
Further, in the present embodiment, tool platform 100 also comprises needle plate 170.Needle plate 170 between lifter plate 120 and cover plate 140, and is connected with lifter plate 120.Pilot pin 130 is located on the side of needle plate 170 away from lifter plate 120.
Heating station 200 comprises plate body 210 and is built in the heating plate 220 in plate body 210.And plate body 210 is provided with interface 230, interface 230, for the joint of accommodating external power supply, is electrically connected with heating plate 220 to make joint.
Further, in the present embodiment, heating station 200 is provided with handle 240 away from the side of tool platform 100.
Further, in the present embodiment, heating station 200 is provided with thermal insulation layer 250 away from the side of cover plate 140.
In the present embodiment, heating station 200 is by installed part 300 and tool platform 100 pivot joint.
Installed part 300 comprises erection column 310 and mounting panel 320.Erection column 310 is located on substrate 110, and mounting panel 320 is located on erection column 310 one end away from substrate 110.Heating station 200 and mounting panel 320 pivot joint.Concrete, in the present embodiment, heating station 200 and mounting panel 320 are by hinge 330 pivot joint.
Installed part 300 also comprises guide vane end stop 340.Guide vane end stop 340 is located on mounting panel 320, for limiting the amplitude that heating station 200 moves towards the direction away from cover plate 140.
Further, in the present embodiment, guide vane end stop 340 is side, inclined-plane 342 near the side of heating station 200.Guide vane end stop 340 is first end 344 away from one end of mounting panel 320, and the other end is the second end 346, and on the direction from first end 344 to the second end 346, the spacing between side corresponding thereto, side, inclined-plane 342 reduces gradually.
Further, in the present embodiment, installed part 300 also comprises backstay 350.Backstay 350 one end and substrate 110 are rotationally connected, and the other end and heating station 200 are rotationally connected.
Each technical characteristic of the above embodiment can combine arbitrarily, for making description succinct, the all possible combination of each technical characteristic in above-described embodiment is not all described, but, as long as the combination of these technical characteristics does not exist contradiction, be all considered to be the scope that this specification is recorded.
The above embodiment only have expressed several execution mode of the present utility model, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to utility model patent scope.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection range of the present utility model.Therefore, the protection range of the utility model patent should be as the criterion with claims.
Claims (10)
1. paste an epiphragma tool, for pasting epiphragma on flexible PCB, it is characterized in that, comprising:
Tool platform, comprise substrate, lifter plate, pilot pin, cover plate and locating piece, described lifter plate is located on described substrate, described lifter plate and described substrate interval, and spacing distance between described lifter plate and described substrate is adjustable, described pilot pin is located on described lifter plate, described pilot pin is for through the first through hole be opened on flexible PCB and the second through hole be opened on coverlay, described cover plate is arranged in described pilot pin, and removably connect with described lifter plate, described cover plate is located at flexible PCB on described lifter plate and coverlay for suppressing, described locating piece is located on described substrate, for when described lifter plate is towards described substrate motion, abut with described lifter plate, to determine the minimum spacing between described lifter plate and described substrate, and
Heating station, with the side pivot joint of described substrate, with to the side pressurized, heated of described cover plate away from described lifter plate.
2. according to claim 1ly paste epiphragma tool, it is characterized in that, described tool platform also comprises lifting assembly, and described lifting assembly comprises elastic supporting member for supporting optical member, and the two ends of described elastic supporting member for supporting optical member are connected with described substrate and described lifter plate.
3. according to claim 2ly paste epiphragma tool, it is characterized in that, described elastic supporting member for supporting optical member comprises guide pillar, cylinder portion and spring, and described guide pillar one end is located on described substrate, and the other end is provided with installing hole, described cylinder portion is located on described lifter plate, described spring one end is placed in described installing hole, and abuts with the bottom of described installing hole, and the other end is placed in described cylinder portion, and abut with described lifter plate, and described guide pillar is placed in described cylinder portion near one end of described lifter plate.
4. according to claim 1ly paste epiphragma tool, it is characterized in that, described tool platform also comprises needle plate, and described needle plate is between described lifter plate and described cover plate, and be connected with described lifter plate, described pilot pin is located on the side of described needle plate away from described lifter plate.
5. according to claim 1ly paste epiphragma tool, it is characterized in that, described heating station comprises plate body and is built in the heating plate in described plate body, and described plate body is provided with interface, described interface is used for the joint of accommodating external power supply, is electrically connected with described heating plate to make joint.
6. according to claim 1ly paste epiphragma tool, it is characterized in that, the described epiphragma tool that pastes also comprises installed part, described installed part comprises erection column and mounting panel, described erection column is located on described substrate, described mounting panel is located on described erection column one end away from described substrate, described heating station and described mounting panel pivot joint.
7. according to claim 6ly paste epiphragma tool, it is characterized in that, described heating station and described mounting panel are by hinge pivot joint.
8. according to claim 6ly paste epiphragma tool, it is characterized in that, described installed part also comprises guide vane end stop, and described guide vane end stop is located on described mounting panel, for limiting the amplitude that described heating station moves towards the direction away from described cover plate.
9. according to claim 8ly paste epiphragma tool, it is characterized in that, described guide vane end stop is side, inclined-plane near the side of described heating station, described guide vane end stop is first end away from one end of described mounting panel, the other end is the second end, from described first end to described second end direction on, the spacing between side corresponding thereto, side, described inclined-plane reduces gradually.
10. according to claim 8ly paste epiphragma tool, it is characterized in that, described installed part also comprises backstay, and described backstay one end is connected with described substrate rotating, and the other end and described heating station are rotationally connected;
And/or described heating station is provided with handle away from the side of described tool platform;
And/or described heating station is provided with thermal insulation layer away from the side of described cover plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520470746.9U CN204859778U (en) | 2015-07-02 | 2015-07-02 | Paste and cover membrane tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520470746.9U CN204859778U (en) | 2015-07-02 | 2015-07-02 | Paste and cover membrane tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204859778U true CN204859778U (en) | 2015-12-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520470746.9U Active CN204859778U (en) | 2015-07-02 | 2015-07-02 | Paste and cover membrane tool |
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| CN (1) | CN204859778U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106102327A (en) * | 2016-08-12 | 2016-11-09 | 中国航空工业集团公司西安飞行自动控制研究所 | A kind of adhering method of glued membrane |
-
2015
- 2015-07-02 CN CN201520470746.9U patent/CN204859778U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106102327A (en) * | 2016-08-12 | 2016-11-09 | 中国航空工业集团公司西安飞行自动控制研究所 | A kind of adhering method of glued membrane |
| CN106102327B (en) * | 2016-08-12 | 2019-01-01 | 中国航空工业集团公司西安飞行自动控制研究所 | A kind of adhering method of glue film |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518000, Guangdong, Baoan District, Shenzhen manhole street, Whampoa community, South Ring Road, Whampoa embellish and Industrial Park, A building, 1-4 floor, D building, 2-3 floor Patentee after: Shangda electronic (Shenzhen) Limited by Share Ltd Address before: 518000, Guangdong, Baoan District, Shenzhen manhole street, Whampoa community, South Ring Road, Whampoa embellish and Industrial Park, A building, 1-4 floor, D building, 2-3 floor Patentee before: Leader-Tech Electronic (Shenzhen) Co., Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220112 Address after: 435003 No. 91, Sike Avenue East, Jinshan street, Huangshi economic and Technological Development Zone, Huangshi City, Hubei Province Patentee after: LEADER-TECH (HUANGSHI) Inc. Address before: 518000 floors 1-4, 2-3, building a, Huangpu Runhe Industrial Park, South Ring Road, Huangpu Community, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: LEADER-TECH ELECTRONICS (SHENZHEN) Inc. |