CN103107277A - Light source heat radiation structure - Google Patents
Light source heat radiation structure Download PDFInfo
- Publication number
- CN103107277A CN103107277A CN2013100577457A CN201310057745A CN103107277A CN 103107277 A CN103107277 A CN 103107277A CN 2013100577457 A CN2013100577457 A CN 2013100577457A CN 201310057745 A CN201310057745 A CN 201310057745A CN 103107277 A CN103107277 A CN 103107277A
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- Prior art keywords
- heat
- light source
- layout
- radiation
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000005855 radiation Effects 0.000 title claims description 104
- 239000000758 substrate Substances 0.000 claims abstract description 50
- 238000009792 diffusion process Methods 0.000 claims abstract description 38
- 230000017525 heat dissipation Effects 0.000 claims abstract description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000011248 coating agent Substances 0.000 claims description 44
- 238000000576 coating method Methods 0.000 claims description 44
- 230000004888 barrier function Effects 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 15
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052755 nonmetal Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 239000011135 tin Substances 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 4
- 238000005530 etching Methods 0.000 abstract description 2
- 239000002699 waste material Substances 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention relates to a light source heat dissipation structure. The light source heat dissipation structure comprises a light source, a heat dissipation substrate and a heat dissipation substrate, wherein the light source is provided with an electrical contact and a heat dissipation contact; a layout layer formed on one side of the heat dissipation substrate, the layout layer having an electrical layout circuit and a heat dissipation layout circuit, the electrical layout circuit being connected to the electrical contact, the heat dissipation layout circuit being connected to the heat dissipation contact, wherein no electrical connection is formed between the electrical layout circuit and the heat dissipation layout circuit; and a heat dissipation diffusion layer formed on the heat dissipation layout circuit, the heat dissipation diffusion layer having a thickness. The invention not only can reduce the waste of the copper foil in the layout etching process, but also can accelerate the removal of heat energy by increasing the heat dissipation sectional area for dissipating heat energy.
Description
Technical field
The present invention relates to a kind of light source radiation structure, referring to especially a kind ofly provides the high heat energy that light source produces to distribute rapidly, and reaches the light source radiation structure of the useful life of keeping this light source and the optical attenuation that reduces this light source.
Background technology
In prior art, because light-emitting diode has advantages of high useful life, light-emitting diode has replaced old traditional light sources such as osram lamp, in order to reach the effect of carbon reduction.
Yet in the process that drives light-emitting diode, light-emitting diode can produce high heat energy, and this heat energy has influence on light-emitting diode useful life except meeting, more can have influence on luminous efficient, makes this light-emitting diode have the generation of light decay phenomenon.
For solving above-mentioned defective, the radiator structure of the heat energy that this light-emitting diode of many eliminatings produces has been proposed in traditional method, but above-mentioned radiator structure only can allow the light-emitting diode of lower-wattage obtain better heat radiation, if use high-power light-emitting diode, have still to have traditional defective.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of light source radiation structure, to increase the heat radiation sectional area, reaches the effect of dispelling the heat rapidly in order to the heat energy that light source produces to be provided; Also can be side by side form electrical layout circuit and radiating layout circuit on the layout layer, in order to the waste of minimizing Copper Foil in layout etching process for example; Also can utilize the heat-radiation coating coating to be covered in heat-radiating substrate and layout layer, in order to reach the eliminating of accelerating this heat energy; Also can side by side apply in two sides of heat-radiating substrate this heat-radiation coating coating, use so that this heat energy can be conducted to by this heat-radiation coating coating the outside of this light source radiation structure.
For solving the problems of the technologies described above, the technical solution used in the present invention is:
A kind of light source radiation structure comprises light source, and described light source has electrical contact and heat radiation contact, and described light source radiation structure comprises:
Heat-radiating substrate;
The layout layer, be formed on a side of described heat-radiating substrate, described layout layer has electrical layout circuit and radiating layout circuit, described electrical layout circuit is for being connected with described electrical contact, described radiating layout circuit wherein forms electric connection for being connected with described heat radiation contact between described electrical layout circuit and described radiating layout circuit; And
The heat radiation diffusion layer is formed on described radiating layout circuit, and described heat radiation diffusion layer has thickness, in order to increase the heat radiation sectional area of this radiating layout circuit;
Wherein the heat energy of light source generation is to see through described layout layer, heat radiation diffusion layer and this heat-radiating substrate to be dispersed into simultaneously in air and the outside that is distributed to this light source radiation structure.
Further, for intercepting the electrical conduction between this heat-radiating substrate and this layout layer, more comprise insulating barrier, described insulating barrier is formed between heat-radiating substrate and layout layer.
Further, for accelerating the conduction of heat energy, more comprise the heat-radiation coating coating, described heat-radiation coating coating is formed on the surface of a side of layout layer and heat radiation diffusion layer, and described heat-radiation coating coating coats the layout layer and heat radiation diffusion layer of at least one part.
Described heat-radiation coating coating can also be formed on the surface of the opposite side of heat-radiating substrate.
Further, described heat-radiation coating coating material therefor is high heat radiation coating or heat loss through radiation coating.
Further, distribute the area of this heat energy for increase, described radiating layout configuration becomes to have the heat dissipation region of certain area.
Further, described electrical layout circuit comprises anodal circuit and negative pole circuit, and the electrical contact of described light source comprises positive terminal and negative pole end, and wherein anodal circuit is connected with the positive terminal of electrical contact, and the negative pole circuit is connected with the negative pole end of electrical contact.
Further, when the negative pole end of electrical contact was connected with the heat radiation contact, negative pole end and the radiating layout connection of electrical contact crossed by negative line Reuter.
Further, in order to speed radiating rate, more comprise hole, described hole is formed on heat-radiating substrate and insulating barrier.
Described hole is at least a in air-vent, wire hole and fixing hole.
Further, the material of described heat radiation diffusion layer and heat-radiating substrate be have high thermal conductivity coefficient metal and nonmetal at least a.
Further, described heat radiation diffusion layer material be tin, silver and copper at least a; The material of described heat radiation diffusion layer is at least a in carbon element, carbonado and pottery.
Further, more comprising can accommodating described heat-radiating substrate, the housing (28) of layout layer and heat radiation diffusion layer.
A kind of light source radiation structure comprises single or plural light source, and described light source has respectively electrical contact and heat radiation contact, and this light source radiation structure comprises:
Heat-radiating substrate;
The layout layer, be formed on a side of heat-radiating substrate, described layout layer has electrical layout circuit and plural radiating layout circuit, described radiating layout circuit forms plural heat dissipation region, described electrical layout circuit is connected with electrical contact, described heat dissipation region is for being connected with the heat radiation contact of each light source, and wherein each heat dissipation region does not form each other and is electrically connected; And
The heat radiation diffusion layer is formed on each heat dissipation region, and described heat radiation diffusion layer has a thickness.
Further, more comprise insulating barrier, described insulating barrier is formed between heat-radiating substrate and layout layer, in order to intercept the electrical conduction between described heat-radiating substrate and layout layer.
The present invention has following beneficial effect:
(1) the present invention except layout on heat-radiating substrate for should light source power required electrical layout circuit, the discarded layout of not using beyond this electrical layout circuit in prior art is partly re-started layout to form the radiating layout circuit, and this layout is used for this heat energy of guiding, the path of distributing this heat energy in order to increase.
(2) the present invention forms again the heat radiation diffusion layer with thickness on the radiating layout circuit, can increase the heat radiation sectional area that distributes heat energy.
(3) the present invention also has the heat-radiation coating coating, in order to rapidly heat energy is distributed, may reduce heat energy to the impact of light source, and then keep light source original useful life, and avoid heat energy to cause the luminous efficiency (or claim to reduce luminous efficiency decay) of light source.
Description of drawings
Accompanying drawing 1 is the schematic layout pattern of the embodiment of the present invention one light source radiation structure.
Accompanying drawing 2 is the side schematic view of light source radiation structure in accompanying drawing 1.
Accompanying drawing 3 is the schematic layout pattern of the embodiment of the present invention two light source radiation structures.
Accompanying drawing 4 is the side schematic view of light source radiation structure in accompanying drawing 3.
Accompanying drawing 5 is the schematic layout pattern of the embodiment of the present invention three light source radiation structures.
Embodiment
For the ease of it will be appreciated by those skilled in the art that below in conjunction with accompanying drawing and embodiment, the present invention is explained in further detail.
Embodiment 1
Fig. 1 is the schematic layout pattern of the embodiment of the present invention 1 light source radiation structure.The heat energy that produces when as shown in Figure 1, this light source radiation structure 10 can be luminous to light source 2 (for example light-emitting diode) dispels the heat.Wherein, the bottom of this light source 2 generally has positive terminal 222 and negative pole end 224 electrical contact 22 of one at least, and heat radiation contact 24.This electrical contact 22 can obtain to drive this light source 2 from transformer, civil power, primary cell or secondary cell and carry out luminous required supply power supply PW.In an other embodiment, the negative pole end 224 of this light source 2 might replace this heat radiation contact 24, makes this light source that positive terminal 222 and negative pole end 224 only be arranged.
This light source radiation structure 10 comprises heat-radiating substrate 12, layout layer 14 and heat radiation diffusion layer 16.
Wherein, this heat-radiating substrate 12 has two sides, and the material of this heat-radiating substrate 12 can be metal with high thermal conductivity coefficient and nonmetal at least a.For example, the material of this heat-radiating substrate 12 is the metal materials such as aluminium or copper, also can be the nonmetallic materials such as carbon element and pottery.
This layout layer 14 is formed on a wherein side of this heat-radiating substrate 12.This layout layer 14 has electrical layout circuit 142 and radiating layout circuit 144.Wherein, an end of this electrical layout circuit 142 is used for being connected with this electrical contact 22, and the other end of this electrical layout circuit 142 is used for receiving this supply power supply PW; This radiating layout circuit 144 is used for being connected with this heat radiation contact 24.
In the present embodiment, form electric connection between this electrical layout circuit 142 and this radiating layout circuit 144, this supply power supply PW that namely is positioned at this electrical layout circuit 142 can not be passed to this radiating layout circuit 144, and both layout circuits are independently.Moreover in the present embodiment, this radiating layout circuit 144 hot side that to be the layout heat dissipation region that becomes to have certain area distribute this heat energy with increase is long-pending.
In addition, this electrical layout circuit 142 and this radiating layout circuit 144 be by in advance in the enterprising line of for example copper foil circuit board road layout, and form the layout circuit after chemical etching.Compared to layout type of the prior art, can reduce significantly the area of etched Copper Foil, and then reach that can effectively utilize originally in the prior art can the etched and discarded Copper Foil that uses.
Moreover in the present embodiment, this electrical layout circuit 142 more comprises anodal circuit 1422 and negative pole circuit 1424.This positive pole circuit 1422 is connected to the positive terminal 222 of this electrical contact 22, and this negative pole circuit 1424 is connected to the negative pole end 224 of this electrical contact 22.
This heat radiation diffusion layer 16 is formed on this radiating layout circuit 14.Wherein, this heat radiation diffusion layer 16 has a thickness d, in order to increase the heat radiation sectional area of this radiating layout circuit 144, can be in the lump with reference to figure 2, and Fig. 2 is the side schematic view of this light source radiation structure 10 in Fig. 1.Wherein, the material of this heat radiation diffusion layer 16 is also for having the metal of high thermal conductivity coefficient and nonmetallic at least a, for example the material of this heat radiation diffusion layer 16 can be high conduction heat energy material, metal materials such as tin, silver and copper, or the nonmetallic materials such as carbon element, carbonado and Tao Ci.
Light source radiation structure 10 of the present invention, can make heat energy see through the outside that layout layer 14, heat radiation diffusion layer 16 and heat-radiating substrate 12 are distributed to light source radiation structure 10, in order to reduce heat energy to the impact of light source 2, not only can keep the luminescent lifetime of light source 2, also can reduce the decay of light source.
Embodiment 2
Fig. 3 is the schematic layout pattern of the embodiment of the present invention 2 light source radiation structures.In Fig. 3, the heat energy that this light source radiation structure 10 ' produces in the time of equally can be luminous to light source 2 dispels the heat, and this light source radiation structure 10 ' heat-radiating substrate 12, layout layer 14 and this heat radiation diffusion layer 16 in comprising embodiment 1, also comprise insulating barrier 18, heat-radiation coating coating 20 and hole 26.
Wherein, insulating barrier 18 is formed between heat-radiating substrate 12 and layout layer 14, in order to intercept the electrical conduction between heat-radiating substrate 12 and layout layer 14.It should be noted that this insulating barrier 18 is not the part for necessity.This heat-radiating substrate 12 for example, if when this heat-radiating substrate 12 is non-metallic material, do not need this insulating barrier 18, because itself can reach the effect of electrically conducting as this insulator separation very much.
Heat-radiation coating coating 20 is formed on layout layer 14 with the surperficial of heat radiation diffusion layer 16 and coats the layout layer 14 of at least one part and the diffusion layer 16 that dispels the heat, and is used for making heat energy to conduct to heat-radiation coating coating 20 from its one at least of dispel the heat diffusion layer 16 and layout layer 14.In an other embodiment, this heat-radiation coating coating 20 also can be formed on the surface of the opposite side of this heat-radiating substrate 12, makes this heat energy to see through heat-radiating substrate 12 again and distributes.
With reference to figure 4, Fig. 4 is the side schematic view of this light source radiation structure 10 ' in Fig. 3 in the lump.
Again in an other embodiment, in the lump can be with reference to the 5th figure, this light source radiation structure 10 ' more can comprise housing 28, housing 28 forms a holding space for holding heat-radiating substrate 12, layout layer 14 and heat radiation diffusion layer 16, the heat energy that distributes in order to get rid of heat-radiating substrate 12, layout layer 14 and the diffusion layer 16 that dispels the heat.
Therefore light source radiation structure of the present invention can be got rid of the heat energy of light source rapidly.Wherein, this structure except layout on heat-radiating substrate for should light source power required electrical layout circuit, the discarded layout of not using beyond this electrical layout circuit in prior art is partly re-started layout to form the radiating layout circuit, and this layout is used for this heat energy of guiding, the path of distributing this heat energy in order to increase.
In addition, form again the heat radiation diffusion layer with thickness on the radiating layout circuit, distribute the heat radiation sectional area of heat energy in order to increase.
Moreover, this structure more can be coated on the heat-radiation coating coating layout layer, and a side of this heat-radiating substrate or two sides, in order to rapidly heat energy is distributed, and can reduce heat energy to the impact of light source, and then keep light source original useful life, and avoid heat energy to cause the luminous efficiency (or claim to reduce luminous efficiency decay) of light source.
Above-described embodiment is only better execution mode of the present invention, and in addition, the present invention can also have other implementations.That is to say, under the prerequisite that does not break away from inventive concept of the present invention, within any apparent replacement all should fall into protection scope of the present invention.
Claims (15)
1. a light source radiation structure, comprise light source (2), and described light source has electrical contact (22) and heat radiation contact (24), and described light source radiation structure comprises:
Heat-radiating substrate (12);
Layout layer (14), be formed on a side of described heat-radiating substrate, described layout layer has electrical layout circuit (142) and radiating layout circuit (144), described electrical layout circuit is for being connected with described electrical contact, described radiating layout circuit wherein forms electric connection for being connected with described heat radiation contact between described electrical layout circuit and described radiating layout circuit; And
Heat radiation diffusion layer (16) is formed on described radiating layout circuit, and described heat radiation diffusion layer has thickness in order to increase the heat radiation sectional area of this radiating layout circuit;
Wherein the heat energy of light source generation is to see through described layout layer, heat radiation diffusion layer and this heat-radiating substrate to be dispersed into simultaneously in air and the outside that is distributed to this light source radiation structure.
2. light source radiation structure according to claim 1, it is characterized in that: more comprise insulating barrier (18), described insulating barrier is formed between heat-radiating substrate and layout layer in order to intercept the electrical conduction between described heat-radiating substrate and layout layer.
3. light source radiation structure according to claim 1, it is characterized in that: more comprise heat-radiation coating coating (20), described heat-radiation coating coating is formed on the surface of a side of layout layer and heat radiation diffusion layer, and described heat-radiation coating coating coats the layout layer and heat radiation diffusion layer of at least one part.
4. light source radiation structure according to claim 1, it is characterized in that: more comprise the heat-radiation coating coating, described heat-radiation coating coating is formed on the surface of the opposite side of heat-radiating substrate.
5. according to claim 3 or 4 described light source radiation structures, it is characterized in that: described heat-radiation coating coating material therefor is high heat radiation coating or heat loss through radiation coating.
6. light source radiation structure according to claim 1 is characterized in that: described radiating layout configuration becomes heat dissipation region to increase area of dissipation.
7. light source radiation structure according to claim 1, it is characterized in that: described electrical layout circuit comprises anodal circuit (1422) and negative pole circuit (1424), the electrical contact of described light source comprises positive terminal (222) and negative pole end (224), wherein anodal circuit is connected with the positive terminal of electrical contact, and the negative pole circuit is connected with the negative pole end of electrical contact.
8. light source radiation structure according to claim 7 is characterized in that: when the negative pole end of electrical contact was connected with the heat radiation contact, negative pole end and the radiating layout connection of electrical contact crossed by negative line Reuter.
9. light source radiation structure according to claim 1, it is characterized in that: more comprise hole (26), described hole is formed on heat-radiating substrate and insulating barrier.
10. light source radiation structure according to claim 9 is characterized in that: described hole is at least a in air-vent, wire hole and fixing hole.
11. light source radiation structure according to claim 1 is characterized in that: the material of described heat radiation diffusion layer and heat-radiating substrate be have high thermal conductivity coefficient metal and nonmetal at least a.
12. light source radiation structure according to claim 11 is characterized in that: described heat radiation diffusion layer material be tin, silver and copper at least a; The material of described heat radiation diffusion layer is at least a in carbon element, carbonado and pottery.
13. light source radiation structure according to claim 1 is characterized in that: more comprising can accommodating described heat-radiating substrate, the housing (28) of layout layer and heat radiation diffusion layer.
14. light source radiation structure according to claim 8 is characterized in that:
A kind of light source radiation structure comprises single or plural light source, and described light source has respectively electrical contact and heat radiation contact, and this light source radiation structure comprises:
Heat-radiating substrate;
The layout layer, be formed on a side of heat-radiating substrate, described layout layer has electrical layout circuit and plural radiating layout circuit, described radiating layout circuit forms plural heat dissipation region, described electrical layout circuit is connected with electrical contact, described heat dissipation region is for being connected with the heat radiation contact of each light source, and wherein each heat dissipation region does not form each other and is electrically connected; And
The heat radiation diffusion layer is formed on each heat dissipation region, and described heat radiation diffusion layer has a thickness.
15. light source radiation structure according to claim 14 is characterized in that: more comprise insulating barrier, described insulating barrier is formed between heat-radiating substrate and layout layer, in order to intercept the electrical conduction between described heat-radiating substrate and layout layer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101129833 | 2012-08-17 | ||
| TW101129833A TW201408934A (en) | 2012-08-17 | 2012-08-17 | Heat radiating structure of light source |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103107277A true CN103107277A (en) | 2013-05-15 |
| CN103107277B CN103107277B (en) | 2016-05-25 |
Family
ID=48314977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310057745.7A Expired - Fee Related CN103107277B (en) | 2012-08-17 | 2013-02-25 | Light source heat radiation structure |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103107277B (en) |
| TW (1) | TW201408934A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060267183A1 (en) * | 2005-04-22 | 2006-11-30 | International Rectifier Corporation | Use of solder paste for heat dissipation |
| CN101707234A (en) * | 2009-11-18 | 2010-05-12 | 珠海晟源同泰电子有限公司 | LED luminescence module and manufacture method thereof |
| CN101709858A (en) * | 2009-09-27 | 2010-05-19 | 广州南科集成电子有限公司 | LED lighting high-efficiency heat-radiating aluminum baseplate, LED light source and making methods thereof |
| CN102130018A (en) * | 2010-12-08 | 2011-07-20 | 华为终端有限公司 | Chip radiation method, and related device and system |
| CN102315364A (en) * | 2010-07-01 | 2012-01-11 | 日立电线株式会社 | LED module, LED package, and wiring substrate and method of making same |
| CN102544342A (en) * | 2011-12-09 | 2012-07-04 | 陕西科技大学 | Heat radiator and electrode integrated heat radiating device and manufacturing method thereof |
-
2012
- 2012-08-17 TW TW101129833A patent/TW201408934A/en unknown
-
2013
- 2013-02-25 CN CN201310057745.7A patent/CN103107277B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060267183A1 (en) * | 2005-04-22 | 2006-11-30 | International Rectifier Corporation | Use of solder paste for heat dissipation |
| CN101709858A (en) * | 2009-09-27 | 2010-05-19 | 广州南科集成电子有限公司 | LED lighting high-efficiency heat-radiating aluminum baseplate, LED light source and making methods thereof |
| CN101707234A (en) * | 2009-11-18 | 2010-05-12 | 珠海晟源同泰电子有限公司 | LED luminescence module and manufacture method thereof |
| CN102315364A (en) * | 2010-07-01 | 2012-01-11 | 日立电线株式会社 | LED module, LED package, and wiring substrate and method of making same |
| CN102130018A (en) * | 2010-12-08 | 2011-07-20 | 华为终端有限公司 | Chip radiation method, and related device and system |
| CN102544342A (en) * | 2011-12-09 | 2012-07-04 | 陕西科技大学 | Heat radiator and electrode integrated heat radiating device and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201408934A (en) | 2014-03-01 |
| CN103107277B (en) | 2016-05-25 |
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Granted publication date: 20160525 Termination date: 20180225 |