CN202534696U - Heat dissipation substrate of LED light source - Google Patents
Heat dissipation substrate of LED light source Download PDFInfo
- Publication number
- CN202534696U CN202534696U CN2012201976722U CN201220197672U CN202534696U CN 202534696 U CN202534696 U CN 202534696U CN 2012201976722 U CN2012201976722 U CN 2012201976722U CN 201220197672 U CN201220197672 U CN 201220197672U CN 202534696 U CN202534696 U CN 202534696U
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- Prior art keywords
- insulating barrier
- light source
- heat
- led light
- substrate
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Abstract
The utility model provides a heat dissipation substrate of an LED light source. The heat dissipation substrate is provided with a metal substrate (10) having a plurality of convex stages; a first insulating layer (20) which is provided with a plurality of first penetration holes (201); and a second insulating layer (30) which is provided with a plurality of second penetration holes (302) and are embedded with a plurality of pads (31) and a plurality of electrodes (32), the first insulating layer (20) and the second insulating layer (30) being arranged on the metal substrate (10) successively. The pads (31) and the electrodes (32) at least penetrate through the second insulating layer (30) and do not penetrate through the first insulating layer (20); and the pads (31) and the electrodes (32) are separated from the metal substrate (10) and the convex stages (101) through the first insulating layer (20). By adopting the above structure, the heat dissipation effect of the heat dissipation substrate of the LED light source can be effectively improved, thereby prolonging the service life of the light source LED.
Description
Technical field
The utility model relates to a kind of heat-radiating substrate, relates in particular to the heat-radiating substrate that is used for surface-pasted a kind of led light source.
Background technology
As everyone knows, make the light fixture of light source with surface mount LED, heat-radiating substrate is selected the aluminium base preferably copper-clad plate of heat conductivility usually for use.As the printed circuit plate substrate of fixed L ED, led light source is fixed on aluminium base copper-clad plate surface through the mode of pin welding simultaneously in this aluminium base copper-clad plate.
Join shown in Figure 1ly, Fig. 1 is the generalized section of the heat-radiating substrate of led light source in the prior art.This heat-radiating substrate that is used for the surface mount led light source mainly comprises: printed circuit board 2, insulating barrier 3, aluminium base 1.The heat that led light source 5 produces is delivered to printed circuit board 2, insulating barrier 3 and aluminium base 1 successively through heat sink 51 of its bottom setting.Cooperation is with reference to Fig. 2 and shown in Figure 3, and led light source 5 electrically connects through the pad (not shown) on leg 52 and the printed circuit board 2.
Insulating barrier 30 is for example ceramic by insulating material, a pantostrat of being formed but in the prior art.Because the conductive coefficient of insulating material is low more than the conductive coefficient of aluminium or copper.So the heat-radiating substrate ubiquity of led light source of the prior art the not good defective of radiating effect.If the radiating effect of heat-radiating substrate is not good, can seriously influence causing the useful life of led light source.
In view of this, be necessary the heat-radiating substrate of led light source of the prior art is improved, to address the above problem.
The utility model content
The purpose of the utility model is to provide a kind of heat-radiating substrate of led light source, and it can improve the radiating effect of the heat-radiating substrate of led light source effectively, and prolongs the useful life of led light source.
For realizing above-mentioned purpose, the utility model provides a kind of heat-radiating substrate of led light source, comprising:
Be provided with the metal substrate of some boss;
Be set in turn in first insulating barrier on the said metal substrate, it is provided with some first through holes; And
Second insulating barrier, it is provided with some second through holes, and said second insulating barrier is embedded with some pads and some electrodes;
Said pad and electrode extend into said second insulating barrier at least, and do not run through said first insulating barrier, and it is isolated to pass through said first insulating barrier and metal substrate and boss.
As the further improvement of the utility model, said first through hole and second through hole are circular.
As the further improvement of the utility model, the equal diameters of said first through hole and said second through hole.
As the further improvement of the utility model, said boss comprises rectangle or circular.
As the further improvement of the utility model, also be provided with some copper conductors between said first insulating barrier and second insulating barrier.
As the further improvement of the utility model, said copper conductor electrically connects said pad and electrode.
As the further improvement of the utility model, said metal substrate and boss are an overall structure.
As the further improvement of the utility model, said boss flushes with said second insulating barrier.
As the further improvement of the utility model, said first insulating barrier and said second insulating barrier are fiberglass reinforced plastics.
Compared with prior art, the beneficial effect of the utility model is: through this structure, can improve the radiating effect of the heat-radiating substrate of led light source effectively, prolong the useful life of led light source.
Description of drawings
Fig. 1 is the generalized section of the heat-radiating substrate of led light source in the prior art;
Fig. 2 is the schematic perspective view that is mounted on a kind of led light source of the utility model heat-radiating substrate;
Fig. 3 is the upward view of the led light source shown in Fig. 2;
Fig. 4 is the perspective exploded view of the heat-radiating substrate of a kind of led light source of the utility model;
Fig. 5 is the vertical view of second insulating barrier shown in Fig. 4;
Fig. 6 is the vertical view of the pad shown in Fig. 4, electrode and copper conductor;
Fig. 7 is the vertical view of the heat-radiating substrate surface mount led light source of a kind of led light source shown in Fig. 4;
Fig. 8 is along the cutaway view of A-A line among Fig. 7;
Fig. 9 is the local amplification view of surface mount led light source in first kind of embodiment of heat-radiating substrate of a kind of led light source of the utility model;
Figure 10 is the local amplification view of surface mount led light source in second kind of embodiment of heat-radiating substrate of a kind of led light source of the utility model;
Figure 11 is the local amplification view of surface mount led light source in the third embodiment of heat-radiating substrate of a kind of led light source of the utility model.
Embodiment
Below in conjunction with each execution mode shown in the drawings the utility model is elaborated; But should be noted that; These execution modes are not the restriction to the utility model; The function that those of ordinary skills do according to these execution modes, method, or structural equivalent transformation or substitute all belong within the protection range of the utility model.
Please join shown in Figure 4ly, Fig. 4 is the perspective exploded view of the heat-radiating substrate of a kind of led light source of the utility model.A kind of heat-radiating substrate 100 of led light source 5 comprises: the metal substrate 10 that is provided with some boss 101; Be set in turn in first insulating barrier 20 on the said metal substrate 10, it is provided with some first through holes 201; And second insulating barrier 30, it is provided with some second through hole, 302, the second insulating barriers 30 and is embedded with some pads 31 and some electrodes 32; Pad 31 extends into said second insulating barrier 30 at least with electrode 32, and does not run through said first insulating barrier 20, and isolated with metal substrate 10 and boss 101 through said first insulating barrier 20.
First kind of embodiment of the heat-radiating substrate of ginseng Fig. 4 to Fig. 7 and a kind of led light source of the utility model shown in Figure 9.Wherein, Fig. 9 is the local amplification view of surface mount led light source in first kind of embodiment of heat-radiating substrate of a kind of led light source of the utility model.
In this execution mode, a kind of heat-radiating substrate 100 of led light source 5 comprises: the metal substrate 10 that is provided with some boss 101; Be set in turn in first insulating barrier 20 on the said metal substrate 10, it is provided with some first through holes 201; And second insulating barrier 30, it is provided with some second through hole, 302, the second insulating barriers 30 and is embedded with some pads 31 and some electrodes 32; Pad 31 extends into said second insulating barrier 30 at least with electrode 32, and does not run through said first insulating barrier 20, and isolated with metal substrate 10 and boss 101 through said first insulating barrier 20.
Cooperate with reference to shown in Figure 5, this first through hole 201 and second through hole 302 are circular, and the equal diameters of said first through hole 201 and second through hole 302.In this execution mode, this boss 101 can be rectangle, also can be circle or oval or other shapes.As long as guarantee the area of the area of this boss 101 greater than first through hole 201 or second through hole 302.
Again with reference to shown in Figure 3, the leg 52 of this led light source 5 can electrically connect with pad 31.In conjunction with Fig. 6, shown in Figure 7, also be provided with some copper conductors 311 between this first insulating barrier 20 and second insulating barrier 30.This copper conductor 311 can electrically connect pad 31 and electrode 32.Leg 52 with led light source 5 welds with pad 31 simultaneously, to realize the electric connection of heat-radiating substrate 100 and this led light source 5.
This copper conductor 311 can form cascaded structure with surface mount all led light sources 5 on this heat-radiating substrate 100.Simultaneously through electrode 32 source of welding current lines (not shown), for all led light sources 5 on the entire heat dissipation substrate 100 provide power supply.
In this execution mode, pad 31 is embedded in the pad hole 303 of second insulating barrier 30, and the bottom surface 310 of extend through second insulating barrier 30, and extends partially in first insulating barrier 10.This pad 31 contacting metal substrate 10 not simultaneously, and, guarantee pad 31 not contacting metal substrate 10 and boss 101 through first insulating barrier 20.
In this execution mode, this metal substrate 10 is an overall structure with boss 101.Boss 101 flushes with this second insulating barrier 30.Like this, the heat that the time distributes in work of led light source 5 will through its bottom be provided with heat sink 51 through this boss 101 directly with heat transferred in metal substrate 10.Because the area of boss 101 heat sink 51 area in the led light source 5 is so can greatly improve the radiating efficiency of this heat-radiating substrate 100.
Join shown in Figure 5ly, this second insulating barrier 30 also is provided with several electrode holes 304.In like manner, electrode 32 also can be embedded in this electrode hole 304, said second insulating barrier 30 of its extensible mistake, and extend partially in first insulating barrier 10.This electrode 32 contacting metal substrate 10 not simultaneously, and, guarantee electrode 32 not contacting metal substrate 10 and boss 101 through first insulating barrier 20.
In conjunction with Fig. 6, shown in Figure 7, this copper conductor 311 can form cascaded structure with surface mount all led light sources 5 on this heat-radiating substrate 100.Simultaneously through electrode 32 source of welding current lines (not shown), for all led light sources 5 on the entire heat dissipation substrate 100 provide power supply.
A plurality of breach 305 that also have been periphery on a plurality of through hole 202, the second insulating barriers 30 edges also have been periphery on these metal substrate 10 edges also have been periphery a plurality of through hole 102, the first insulating barriers 20 edges.After first insulating barrier 20, second insulating barrier 30 and metal substrate 10 assembled; Can use screw (not shown) to pass the through hole 202 that these first insulating barrier, 20 edges are periphery; And the through hole 102 at metal substrate 10 edges; And entire heat dissipation substrate 100 is installed in the water cooling plant (not shown), through the circulation of conductive fluid or distilled water, improve the radiating effect of this heat-radiating substrate 100 further.
In this execution mode, this first insulating barrier 20 and second insulating barrier 30 are fiberglass reinforced plastics.This metal substrate 10 can be money base plate, copper base or aluminium base, and preferably adopts copper base.
In conjunction with shown in Figure 8, can per five led light sources 5 be constituted one group of luminescence unit.This led light source comprises that high power ultraviolet LED lamp or other have high-power led light source simultaneously.
Second kind of embodiment of the heat-radiating substrate 100 of ginseng Fig. 4 to Fig. 7 and a kind of led light source 5 of the utility model shown in Figure 10.Wherein, Figure 10 is the local amplification view of surface mount led light source in second kind of embodiment of heat-radiating substrate of a kind of led light source of the utility model.
This execution mode is that with the main distinction of first kind of execution mode pad 31 is embedded in the pad hole 303 of second insulating barrier 30, and extends to the bottom surface 310 of second insulating barrier 30, and does not extend into first insulating barrier 10.This pad 31 contacting metal substrate 10 not simultaneously, and, guarantee pad 31 not contacting metal substrate 10 and boss 101 through first insulating barrier 20.
In like manner, this electrode 32 also can be embedded in this electrode hole 304, and extends to the bottom surface 310 of this second insulating barrier 30, and does not extend in first insulating barrier 10.Through such structure, guarantee not contacting metal substrate 10 of this electrode 32, and, guarantee electrode 32 not contacting metal substrate 10 and boss 101 through first insulating barrier 20.
In this execution mode, this first insulating barrier 20 and second insulating barrier 30 are fiberglass reinforced plastics.This metal substrate 10 can be money base plate, copper base or aluminium base, and preferably adopts copper base.
The third embodiment of the heat-radiating substrate 100 of ginseng Fig. 4 to 7 and a kind of led light source 5 of the utility model shown in Figure 11.Wherein, Figure 11 is the local amplification view of surface mount led light source in the third embodiment of heat-radiating substrate of a kind of led light source of the utility model.
This execution mode is that with the main distinction of preceding two kinds of execution modes 31 of pads are embedded in the pad hole 303 of second insulating barrier 30, and this pad hole 303 is a blind hole.So 31 of pads are embedded in second insulating barrier 30, and do not touch the bottom surface 310 of second insulating barrier 30.Thereby guarantee that pad 31 can contacting metal substrate 10 and boss 101.
In like manner, this electrode 32 also can only be embedded in this electrode hole 304, and this electrode hole 304 is a blind hole.So 32 at electrode is embedded in second insulating barrier 30, and do not touch the bottom surface 310 of second insulating barrier 30.Thereby guarantee electrode 32 not contacting metal substrate 10 and boss 101.
In this execution mode, this first insulating barrier 20 and second insulating barrier 30 are fiberglass reinforced plastics.This metal substrate 10 can be money base plate, copper base or aluminium base, and preferably adopts copper base.
The listed a series of detailed description of preceding text only is specifying to the feasibility execution mode of the utility model; They are not the protection range in order to restriction the utility model, allly do not break away from equivalent execution mode or the change that the utility model skill spirit done and all should be included within the protection range of the utility model.
To those skilled in the art, obviously the utility model is not limited to the details of above-mentioned example embodiment, and under the situation of spirit that does not deviate from the utility model or essential characteristic, can realize the utility model with other concrete form.Therefore; No matter from which point; All should regard embodiment as exemplary; And be nonrestrictive, the scope of the utility model is limited accompanying claims rather than above-mentioned explanation, therefore is intended to the implication of the equivalents that drops on claim and all changes in the scope are included in the utility model.Should any Reference numeral in the claim be regarded as limit related claim.
In addition; Describing according to execution mode though should be appreciated that this specification, is not that each execution mode only comprises an independently technical scheme; This narrating mode of specification only is for clarity sake; Those skilled in the art should make specification as a whole, and the technical scheme among each embodiment also can form other execution modes that it will be appreciated by those skilled in the art that through appropriate combination.
Claims (9)
1. the heat-radiating substrate (100) of a led light source (5) comprising:
Be provided with the metal substrate (10) of some boss (101);
Be set in turn in first insulating barrier (20) on the said metal substrate (10), it is provided with some first through holes (201); And
Second insulating barrier (30), it is provided with some second through holes (302), and said second insulating barrier (30) is embedded with some pads (31) and some electrodes (32);
It is characterized in that; Said pad (31) extends into said second insulating barrier (30) at least with electrode (32); And it is do not run through said first insulating barrier (20), and isolated with metal substrate (10) and boss (101) through said first insulating barrier (20).
2. according to the said heat-radiating substrate of claim 1 (100), it is characterized in that said first through hole (201) is circular with second through hole (302).
3. according to any said heat-radiating substrate (100) in claim 1 or 2, it is characterized in that the equal diameters of said first through hole (201) and said second through hole (302).
4. according to the said heat-radiating substrate of claim 1 (100), it is characterized in that said boss (101) comprises rectangle or circular.
5. according to the said heat-radiating substrate of claim 1 (100), it is characterized in that, also be provided with some copper conductors (311) between said first insulating barrier (20) and second insulating barrier (30).
6. heat-radiating substrate according to claim 5 (100) is characterized in that, said copper conductor (311) electrically connects said pad (31) and electrode (32).
7. heat-radiating substrate according to claim 1 (100) is characterized in that, said metal substrate (10) is an overall structure with boss (101).
8. according to any described heat-radiating substrate (100) in claim 1 or 7, it is characterized in that said boss (101) flushes with said second insulating barrier (30).
9. according to the said heat-radiating substrate of claim 1 (100), it is characterized in that said first insulating barrier (20) is a fiberglass reinforced plastics with said second insulating barrier (30).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201976722U CN202534696U (en) | 2012-05-04 | 2012-05-04 | Heat dissipation substrate of LED light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201976722U CN202534696U (en) | 2012-05-04 | 2012-05-04 | Heat dissipation substrate of LED light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202534696U true CN202534696U (en) | 2012-11-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012201976722U Expired - Fee Related CN202534696U (en) | 2012-05-04 | 2012-05-04 | Heat dissipation substrate of LED light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202534696U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106931318A (en) * | 2015-12-31 | 2017-07-07 | 绿点高新科技股份有限公司 | Light emitting assembly and manufacturing method thereof |
-
2012
- 2012-05-04 CN CN2012201976722U patent/CN202534696U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106931318A (en) * | 2015-12-31 | 2017-07-07 | 绿点高新科技股份有限公司 | Light emitting assembly and manufacturing method thereof |
| CN106931318B (en) * | 2015-12-31 | 2019-12-17 | 绿点高新科技股份有限公司 | Light emitting assembly and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121114 Termination date: 20150504 |
|
| EXPY | Termination of patent right or utility model |