CN106130575A - The radiator structure of transmitter - Google Patents
The radiator structure of transmitter Download PDFInfo
- Publication number
- CN106130575A CN106130575A CN201610554617.7A CN201610554617A CN106130575A CN 106130575 A CN106130575 A CN 106130575A CN 201610554617 A CN201610554617 A CN 201610554617A CN 106130575 A CN106130575 A CN 106130575A
- Authority
- CN
- China
- Prior art keywords
- integrated circuit
- radiator
- mounted integrated
- transmitter
- radiator structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/02—Transmitters
- H04B1/03—Constructional details, e.g. casings, housings
- H04B1/036—Cooling arrangements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/02—Transmitters
- H04B1/04—Circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/02—Transmitters
- H04B1/04—Circuits
- H04B2001/0408—Circuits with power amplifiers
Landscapes
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention reside in the radiator structure of the transmitter that a kind of simple in construction, good heat dissipation effect are provided, including surface-mounted integrated circuit, the front of surface-mounted integrated circuit is provided with power amplifier, radio frequency chip and power supply chip, the back side of surface-mounted integrated circuit is equipped with metal forming, the duct of the bottom connection metal forming supplying power amplifier, radio frequency chip, power supply chip is offered respectively on surface-mounted integrated circuit, being filled with heat conduction alite paste in each duct, the back side of surface-mounted integrated circuit is fixed with radiator by connector and Aluminium Radiator is close to metal forming.
Description
Technical field
The present invention relates to shell or the structural elements of a kind of electricity equipment, particularly relate to the radiator structure of a kind of transmitter.
Background technology
Wireless image-sound transmission system is to have wireless transmit and receive image, the transceiver of audio function, mainly includes sending out
Penetrate machine (Tx) and receiver (Rx), verification frequency under by antenna launch, receive, shared public frequency have 2.4GHz and
5.8GHz frequency range.Wherein, transmitter (Tx) is by radio-frequency module, and power module forms and in stepped construction, and radio-frequency module includes
Radio frequency circuit board (PCB) and the radio frequency chip being arranged on radio frequency circuit board (PCB), due to general radio frequency chip output
Ratio relatively low (such as 10Mw), it is impossible to meet properties of product requirement, so generally loading power amplifier (PA) to make radio frequency chip power
Increase, but power amplifier (PA) heating is fast especially, and there will be burn when its temperature rises to more than 100 DEG C (civil)
Fault, therefore the temperature of power amplifier (PA) directly affects quality and the length in life-span of transmitter (Tx) performance.
The most common a kind of transmitter (Tx) machine A: as whole in Fig. 1 and 2, power module 11 and radio frequency circuit board (PCB) 12
Being combined into stepped construction, radio frequency circuit board (PCB) 12 has also mounted electronic device because of back, so unsettled screening cover 13 need to be arranged on
In and seal with a large amount of scolding tin so that its consolidate, be provided with, bottom power amplifier (PA) 14, the radio circuit penetrating 1.6mm thickness
The aperture of plate (PCB) 12, but because aperture is meticulous, machine welding termination process easily forms rosin joint (even if manual repair welding is the most tired
Difficult)；Heat-conducting silica gel sheet 15 is connected to radio frequency circuit board (PCB) 12 back side (power amplifier (PA) 14 is just to position) and screening cover
Between 13, radiator 16 is mounted on above screening cover 13, and radiator 16 is mounted on the gap filling thermal conductive silicon between screening cover 13
Fat 15, the power amplifier (PA) that power is slightly bigger, need that fan 17 is installed on radiator 16 and accelerate heat radiation.Tx machine A
Heat dissipation path risk analysis: one, owing to there being the Small Holes penetrating PCB bottom PA, but pcb board is the thickest causes the path of aperture too
Long, in machine welding termination process, it is difficult to Small Holes to fill scolding tin, in the middle of aperture, is readily formed bubble, run the heat produced
Amount is difficult to quickly be transmitted to pcb board back by scolding tin；Two, heat conductive silica gel: its heat conductivity is relatively low, and have with its thickness
Closing, the biggest heat conductivility of thickness is the lowest, and heat conductivity is low causes heat cannot conduct as early as possible and form accumulation, makes PA temperature
More and more higher and affect its performance and life-span；Three, heat-conducting silicone grease: the most common and good heat conductivility, but lead relative to aluminum
For hot coefficient the lowest, present situation is that the heat-conducting silicone grease smeared is the thickest, causes Aluminium Radiator to there is no directly
Connect and contact with screening cover (or contact little), slow down the heat on screening cover and be quickly transmitted to the process of radiator；Four, dissipate
Hot device: front is stopped by power module and fan, do not have greater area of exposed outside, need from radiator two sides dispel the heat,
Its radiating effect is made to have a greatly reduced quality；Five, fan: the stability of vibration influence carrier aircraft, power consumption during work increase the weight of greatly power supply unit
Burden, the fan short remote-effects Tx life-span.
The most common another kind of transmitter (Tx) machine B: such as Fig. 3 and 4, radio frequency circuit board (PCB) 22 reverse side and power supply mould
Block 21 reverse side welds with several junction points, and stacking is fixed, and power module 21 front is exposed outside, is given by connecting line or pad
Radio frequency circuit board (PCB) 22 power supply or other derivation functions, screening cover 23 (ferrum heat conductivity: 80W/m K) is mounted on thickness
On the radio frequency circuit board (PCB) 22 of 1.6mm, by heat conduction between top and the screening cover 23 of main pyrotoxin power amplifier (PA) 25
Silica gel piece 26 is filled and is connected, and the heat of main pyrotoxin power amplifier (PA) 25 passes through heat-conducting silica gel sheet 26, is transmitted to screening cover
Dispel the heat on 23, as power is somewhat a little bigger, on screening cover 23, just install radiator, even fan again additional.The heat dissipation path wind of Tx machine B
Danger is analyzed: one, install fan additional, increases to carrier aircraft that weight, fan are short makes the Tx lost of life, vibrations make carrier aircraft not indirectly
Surely, the electric current consumed directly results in power supply unit and uses time shortening；Two, only dispelling the heat PA chip, radio frequency chip is also
It is heater and ignores, cause radio frequency chip at high temperature to affect performance.
In sum, a kind of good heat dissipation effect is needed badly to ensure the transmitter of stable performance.
Summary of the invention
For the deficiencies in the prior art, the invention reside in the dissipating of transmitter that a kind of simple in construction, good heat dissipation effect are provided
Heat structure.
In order to solve the problems referred to above, the present invention is achieved by the following technical solutions:
The radiator structure of the transmitter of the present invention, including surface-mounted integrated circuit, the front of described surface-mounted integrated circuit is provided with power
Amplifier, radio frequency chip and power supply chip, the back side of described surface-mounted integrated circuit is equipped with metal forming, and described surface-mounted integrated circuit divides
Do not offer the duct of the bottom connection metal forming supplying power amplifier, radio frequency chip, power supply chip, be filled with in each duct
Heat conduction alite paste, the back side of described surface-mounted integrated circuit is fixed with radiator and described Aluminium Radiator and described gold by connector
Belong to paper tinsel to be close to.
Further, described duct inwall is coated with layers of copper.
Further, described metal forming is Copper Foil.
Further, described heat conduction alite paste is stannum silver paste, silver paste, tin cream or a combination thereof, or heat conduction alite paste is
Alloy or metal.
Further, described radiator is Aluminium Radiator, and described connector is for sequentially passing through Aluminium Radiator, integrated electricity
The screw of road plate, and described tip of screw contacts with metal forming, the edge of described surface-mounted integrated circuit offers to be worn for screw
If through hole.
Further, the gap filling between described radiator and surface-mounted integrated circuit has highly heat-conductive material.
Further, the front of described surface-mounted integrated circuit is pasted with screening cover.
Compared with prior art, the invention has the beneficial effects as follows: one, the radiator structure of transmitter by power amplifier, penetrate
Frequently chip and power supply chip are integrated in the front of surface-mounted integrated circuit, and changing traditional stepped construction is single chip architecture, and pcb board thickness is ultra-thin
Design, shortens thermally conductive pathways, ultra lightweight, lightens the burden for carrier aircraft；Two, PCB is backed with metal forming, increases heat-conducting area, makes heat
Spread toward surrounding；Meanwhile, large-sized duct is all arranged at power amplifier, radio frequency chip, the bottom of power supply chip, set up layers of copper,
Heat conduction alite paste is connected so that heat fast spread with the metal forming of PCB bottom rear, and Aluminium Radiator contacts with metal forming soon
Speed heat conduction, heat radiation, in order to avoid heat accumulation forms high temperature；Three, screening cover attachment, is playing outside shielding protection effect, can be indirect
By contact and pad the heat on pcb board is imported to screening cover, make screening cover also become one of radiator.
Accompanying drawing explanation
Fig. 1 is the structural representation of transmitter (Tx) machine A；
Fig. 2 is the schematic enlarged-scale view at the A of transmitter (Tx) machine A；
Fig. 3 is the structural representation of transmitter (Tx) machine B；
Fig. 4 is the schematic enlarged-scale view at the B of transmitter (Tx) machine B；
Fig. 5 is the structural representation of the radiator structure of the transmitter of the present invention；
Fig. 6 is the structural representation in Fig. 5 at C.
Detailed description of the invention
Below in conjunction with the accompanying drawings and embodiment, the detailed description of the invention of the present invention is described in further detail.Hereinafter implement
Example is used for illustrating the present invention, but is not limited to the scope of the present invention.
As it can be seen in figures 5 and 6, the radiator structure of the transmitter of the present invention, including the surface-mounted integrated circuit that thickness is 0.4～1.0mm
1, the more existing surface-mounted integrated circuit of surface-mounted integrated circuit 1 is thin, so can shorten thermally conductive pathways, and the front of surface-mounted integrated circuit 1 is provided with merit
Rate amplifier 2, radio frequency chip and power supply chip, the front of surface-mounted integrated circuit is pasted with screening cover 3, and only 4 fillet welding stannum consolidate, screen
Cover lid 3 abundant protections, it is to avoid model plane drop damage device and result in greater loss, and are also convenient for detachable maintaining, can realize again
Heat indirectly imports to screening cover 3 with heat radiation by pad；The back side of surface-mounted integrated circuit 1 is equipped with Copper Foil and (does not shows in figure
Go out), surface-mounted integrated circuit 1 offers respectively and connects metal forming for power amplifier 2, radio frequency chip, the bottom of power supply chip
Duct, duct inwall is coated with layers of copper, is filled with stannum silver paste in each duct, and layers of copper, Copper Foil are made by copper product, copper heat conduction
Coefficient 398W/m.K, can quick conductive dispel the heat, and the back side of surface-mounted integrated circuit 1 is fixed with Aluminium Radiator 4 and aluminum by connector
Radiator 4 processed is close to Copper Foil.
The connector of the radiator structure of the transmitter of the present invention is to sequentially pass through Aluminium Radiator 4, the spiral shell of surface-mounted integrated circuit 1
Following closely, and tip of screw contacts with Copper Foil, the edge of surface-mounted integrated circuit offers the through hole 5 worn for screw, such aluminum
Radiator 4 forms contact heat conduction with Copper Foil, and meanwhile, the gap filling between Aluminium Radiator 4 and surface-mounted integrated circuit 1 has height to lead
Hot material carrys out auxiliary heat conduction, the preferred heat-conducting silicone grease of highly heat-conductive material or graphite so that Copper Foil completely with Aluminium Radiator 4 " contact "
So that heat quickly conducts to Aluminium Radiator 4.
The radiator structure of the transmitter of the present invention is under calm Indoor Temperature state, and temperature stabilization, below 70 DEG C, has wind
Under state, temperature can be stable between 30-40 DEG C, and this operating temperature does not the most affect performance (the general core of main euthermic chip PA
Sheet internal temperature requires can be working properly within 80-120 DEG C, and performance is unaffected), real realization is dispelled the heat in time, empty calory
Accumulation, it is not necessary to be installed in addition with fan.Without the operation vibration of fan, transmitter service behaviour is more stable, and figure passes power supply unit
Use time length and extend figure pass life-span.
Below it is only the preferred embodiment of the present invention, it is noted that those skilled in the art are come
Saying, on the premise of without departing from the technology of the present invention principle, it is also possible to make some improvement and modification, these improve and modification also should
It is considered as protection scope of the present invention.
Claims (7)
1. the radiator structure of transmitter, it is characterised in that: include that surface-mounted integrated circuit, the front of described surface-mounted integrated circuit are provided with power
Amplifier, radio frequency chip and power supply chip, the back side of described surface-mounted integrated circuit is equipped with metal forming, and described surface-mounted integrated circuit divides
Do not offer the duct of the bottom connection metal forming supplying power amplifier, radio frequency chip, power supply chip, be filled with in each duct
Heat conduction alite paste, the back side of described surface-mounted integrated circuit is fixed with radiator and described Aluminium Radiator and described gold by connector
Belong to paper tinsel to be close to.
The radiator structure of transmitter the most according to claim 1, it is characterised in that: it is coated with layers of copper on the inwall of described duct.
The radiator structure of transmitter the most according to claim 1, it is characterised in that: described metal forming is Copper Foil.
The radiator structure of transmitter the most according to claim 1, it is characterised in that: described heat conduction alite paste be stannum silver paste,
Silver paste, tin cream or a combination thereof, or heat conduction alite paste is alloy or metal.
The radiator structure of transmitter the most according to claim 1, it is characterised in that: described radiator is Aluminium Radiator,
Described connector is the screw sequentially passing through Aluminium Radiator, surface-mounted integrated circuit, and described tip of screw contacts with metal forming,
The edge of described surface-mounted integrated circuit offers the through hole worn for screw.
6. according to the radiator structure of the transmitter described in any one in claim 2-4, it is characterised in that: described radiator with
Gap filling between surface-mounted integrated circuit has highly heat-conductive material.
7. according to the radiator structure of the transmitter described in any one in claim 1-4, it is characterised in that: described integrated circuit
The front of plate is pasted with screening cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610554617.7A CN106130575A (en) | 2016-07-14 | 2016-07-14 | The radiator structure of transmitter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610554617.7A CN106130575A (en) | 2016-07-14 | 2016-07-14 | The radiator structure of transmitter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106130575A true CN106130575A (en) | 2016-11-16 |
Family
ID=57282662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610554617.7A Pending CN106130575A (en) | 2016-07-14 | 2016-07-14 | The radiator structure of transmitter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106130575A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455461A (en) * | 2016-12-27 | 2017-02-22 | 成都芯通科技股份有限公司 | PCB (printed circuit board) cooling device and case |
| CN108305859A (en) * | 2018-02-06 | 2018-07-20 | 安徽皇广实业有限公司 | A kind of receiver radiator |
Citations (7)
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| US20060274500A1 (en) * | 2005-05-31 | 2006-12-07 | Toshiba Tec Kabushiki Kaisha | Heat radiating structure for CPU |
| CN101106894A (en) * | 2007-08-01 | 2008-01-16 | 锐迪科无线通信技术（上海）有限公司 | Heat dispersion structure for RF power amplifier circuit |
| CN101556941A (en) * | 2009-05-13 | 2009-10-14 | 重庆三祥汽车电控系统有限公司 | Heat radiation structure of surface mounting high-power element |
| CN101616539A (en) * | 2009-08-07 | 2009-12-30 | 杭州华三通信技术有限公司 | A kind of high-power device heat dissipation structure and implementation method |
| CN201479461U (en) * | 2009-09-08 | 2010-05-19 | 武汉正维电子技术有限公司 | Heat-radiation structure used for power amplifier |
| CN203596971U (en) * | 2013-10-12 | 2014-05-14 | 上海斐讯数据通信技术有限公司 | Circuit board having heat dissipation function |
| CN105188318A (en) * | 2015-09-11 | 2015-12-23 | 上海斐讯数据通信技术有限公司 | Heat radiation device, electronic equipment and manufacturing method |
-
2016
- 2016-07-14 CN CN201610554617.7A patent/CN106130575A/en active Pending
Patent Citations (7)
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|---|---|---|---|---|
| US20060274500A1 (en) * | 2005-05-31 | 2006-12-07 | Toshiba Tec Kabushiki Kaisha | Heat radiating structure for CPU |
| CN101106894A (en) * | 2007-08-01 | 2008-01-16 | 锐迪科无线通信技术（上海）有限公司 | Heat dispersion structure for RF power amplifier circuit |
| CN101556941A (en) * | 2009-05-13 | 2009-10-14 | 重庆三祥汽车电控系统有限公司 | Heat radiation structure of surface mounting high-power element |
| CN101616539A (en) * | 2009-08-07 | 2009-12-30 | 杭州华三通信技术有限公司 | A kind of high-power device heat dissipation structure and implementation method |
| CN201479461U (en) * | 2009-09-08 | 2010-05-19 | 武汉正维电子技术有限公司 | Heat-radiation structure used for power amplifier |
| CN203596971U (en) * | 2013-10-12 | 2014-05-14 | 上海斐讯数据通信技术有限公司 | Circuit board having heat dissipation function |
| CN105188318A (en) * | 2015-09-11 | 2015-12-23 | 上海斐讯数据通信技术有限公司 | Heat radiation device, electronic equipment and manufacturing method |
Non-Patent Citations (2)
| Title |
|---|
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455461A (en) * | 2016-12-27 | 2017-02-22 | 成都芯通科技股份有限公司 | PCB (printed circuit board) cooling device and case |
| CN106455461B (en) * | 2016-12-27 | 2019-09-06 | 成都芯通软件有限公司 | A kind of PCB circuit board radiator and cabinet |
| CN108305859A (en) * | 2018-02-06 | 2018-07-20 | 安徽皇广实业有限公司 | A kind of receiver radiator |
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| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20161116 |