CN206524322U - Electron speed regulator and moveable platform - Google Patents

Abstract

A kind of electron speed regulator, including：Upper casing；Lower casing, is correspondingly arranged with the upper casing, and the lower casing is collectively forming a housing with the upper casing；Circuit board, in the housing, the circuit board include upper surface and with the upper surface back to setting lower surface, the upper surface is set in face of the inwall of the upper casing, the lower surface is set in face of the inwall of the lower casing, wherein, the upper surface is provided with multiple first metal-oxide-semiconductors, and the lower surface is provided with multiple second metal-oxide-semiconductors；The top surface of first metal-oxide-semiconductor and second metal-oxide-semiconductor is embedded with thermal conductive metal plate；The thermal conductive metal plate of first metal-oxide-semiconductor is connected by the first heat conductive pad with the inwall heat conduction of the upper casing；The thermal conductive metal plate of second metal-oxide-semiconductor is connected by the second heat conductive pad with the inwall heat conduction of the lower casing.The thermal diffusivity of above-mentioned electron speed regulator preferably, and is beneficial to the Miniaturization Design of electron speed regulator.The utility model also provides a kind of moveable platform of the above-mentioned electron speed regulator of application.

Description

Electronic governor, and movable platform

technical field

The utility model relates to motor control technology, in particular to an electronic governor and a movable platform using the electronic governor.

Background technique

Existing high-current electronic speed controllers, for example, electronic speed controllers above 40A, are very large in size, so the installation will be very limited. At the same time, the large size is also accompanied by heavy weight, maneuverability and battery life. will decrease accordingly.

However, if the integration degree of the high-current electronic governor is increased, the heat dissipation will be poor, and the electronic governor cannot work normally due to the high temperature.

Utility model content

The main technical problem to be solved by the embodiments of the utility model is to provide an electronic governor with a small volume and good heat dissipation.

An electronic governor, comprising:

Upper shell;

a lower case, which is arranged corresponding to the upper case, and the lower case and the upper case jointly form a shell; and

The circuit board is installed in the housing, the circuit board includes an upper surface and a lower surface opposite to the upper surface, the upper surface faces the inner wall of the upper case, and the lower surface faces The inner wall of the lower shell is provided with,

Wherein, the upper surface is provided with a plurality of first MOS tubes, and the lower surface is provided with a plurality of second MOS tubes; the top surfaces of the first MOS tubes and the second MOS tubes are embedded with heat-conducting metal piece;

The thermally conductive metal sheet of the first MOS tube is thermally connected to the inner wall of the upper case through a first thermally conductive pad;

The thermally conductive metal sheet of the second MOS tube is thermally connected to the inner wall of the lower case through a second thermally conductive pad.

In the electronic governor, the first MOS tube and the second MOS tube are the main heat sources, and the top surfaces of the first MOS tube and the second MOS tube are embedded with heat-conducting metal sheets, and the first MOS tube and the second MOS tube The MOS tube can dissipate heat directly through the heat-conducting metal sheet, so that the thermal resistance of the top of the first MOS tube and the second MOS tube is greatly reduced compared with the thermal resistance of the traditional MOS tube with a plastic package on the top, greatly enhancing the The heat conduction capacity on the heat conduction path of the first MOS tube and the second MOS tube; at the same time, the first MOS tube and the second MOS tube pass through the first heat conduction pad and the second heat conduction pad and the upper shell and the lower shell of the electronic governor respectively The heat conduction increases the heat exchange area between the first MOS tube and the second MOS and the outside, thereby effectively improving the heat dissipation efficiency of the electronic governor. Since the heat dissipation efficiency of the first MOS tube and the second MOS tube is improved, the MOS tubes can be mounted on opposite sides of the circuit board at the same time to reduce the occupied space of the circuit board; and, the first MOS tube and the second MOS tube The heat dissipation efficiency of the MOS tube is high, and it is convenient to adopt a smaller size MOS tube, thereby further reducing the occupied space of the circuit board, thereby facilitating the miniaturization design of the electronic governor.

In one embodiment, the heat-conducting metal sheet is directly encapsulated in the first MOS tube and the second MOS tube, and the top surface of the heat-conducting metal sheet is at least partially exposed.

In one of the embodiments, a plurality of the first MOS transistors are arranged opposite to a plurality of the second MOS transistors;

Alternatively, multiple first MOS transistors and multiple second MOS transistors are arranged alternately.

In one of the embodiments, the number of the first MOS transistors is greater than or equal to 6;

Or/and, the number of the second MOS transistors is greater than or equal to six.

In one of the embodiments, a plurality of the first MOS transistors are arranged in parallel and spaced apart, and distributed in a matrix;

Or/and, a plurality of the second MOS transistors are arranged in parallel and at intervals, and distributed in a matrix.

In one embodiment, the thermal pad is a thermally conductive adhesive layer or a thermally conductive grease layer.

In one embodiment, the thermally conductive adhesive layer is a thermally conductive silicone layer.

In one embodiment, the thermally conductive grease layer is a thermally conductive silicone grease layer.

In one embodiment, the width and length of the first MOS transistor and the second MOS transistor are both less than 4 mm.

In one embodiment, the width and length of the first MOS transistor and the second MOS transistor are both 3.3 mm.

In one of the embodiments, the maximum operating current allowed by the electronic speed controller is greater than or equal to 30 amperes.

In one of the embodiments, the maximum operating current allowed by the electronic speed controller is 35-60 amperes.

In one embodiment, both the upper shell and the lower shell are metal shells.

In one embodiment, both the upper shell and the lower shell are aluminum shells.

In one of the embodiments, the outer surface of the upper case is provided with a plurality of heat dissipation fins in a region corresponding to the first MOS;

Or/and, the outer surface of the lower case is provided with a plurality of cooling fins in a region corresponding to the second MOS tube.

In one of the embodiments, a plurality of the first MOS tubes share one thermal pad;

Or/and, multiple second MOS tubes share one thermal pad.

A mobile platform comprising:

frame;

a plurality of motors installed on the frame;

The electronic speed controller described in any one of the above has a plurality of electronic speed controllers, which are respectively electrically connected to the plurality of motors, and are used to control a plurality of the plurality of motors; and

a controller, communicatively connected to a plurality of electronic governors;

Wherein, the controller separately controls the working state of the motor through a plurality of the electronic speed regulators.

In one of the embodiments, the movable platform is an unmanned aerial vehicle or an unmanned chassis vehicle.

Description of drawings

Fig. 1 is an exploded view of the electronic governor of the present utility model;

Fig. 2 is a perspective view of the electronic governor shown in Fig. 1;

Fig. 3 is a sectional view along line C-C in Fig. 2;

Fig. 4 is a schematic diagram of a movable platform using the electronic speed controller shown in Fig. 1 .

detailed description

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. example. Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

It should be noted that when a component is said to be "fixed" to another component, it can be directly on the other component or there can also be an intervening component. When a component is said to be "connected" to another component, it may be directly connected to the other component or there may be intervening components at the same time. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of illustration only.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of this invention. The terminology used in the description of the utility model herein is only for the purpose of describing specific embodiments, and is not intended to limit the utility model. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

In the process of implementing the present invention, the inventors found that improving the heat dissipation efficiency of the MOS tube can effectively reduce the volume of the electronic governor and increase the maximum operating current of the electronic governor.

The invention provides an electronic governor, which comprises a housing, a circuit board and a plurality of MOS transistors mounted on opposite surfaces of the circuit board. A heat-conducting metal sheet is embedded on the top surface of each MOS tube. Wherein, the heat-conducting metal sheets of the MOS tubes located on opposite sides of the circuit board contact the inner wall of the housing through the heat-conducting pads, so as to transfer the heat generated by the MOS tubes to the housing.

In the above-mentioned electronic speed controller, since the top surface of each MOS tube is embedded with a heat-conducting metal sheet, the thermal resistance at the top is greatly reduced compared with that of the traditional MOS tube with a plastic package on the top, and the thermal resistance is greatly enhanced. The thermal conductivity on the thermal conduction path of the MOS tube is guaranteed. At the same time, the MOS tube conducts heat conduction through the heat conduction pad and the inner wall of the housing of the electronic governor, which increases the heat exchange area between the MOS tube and the outside, thereby effectively improving the heat dissipation efficiency of the electronic governor. Since the heat dissipation efficiency of the MOS tube is improved, the MOS tube can be mounted on opposite sides of the circuit board at the same time to reduce the occupied space of the circuit board; and the heat dissipation efficiency of the first MOS tube and the second MOS tube is higher , it is convenient to use a smaller size MOS tube, thereby further reducing the occupied space of the circuit board, thereby facilitating the miniaturization design of the electronic speed controller.

In one of the embodiments, the housing includes an upper shell and a lower shell spliced with the upper shell. The lower shell and the upper shell jointly form a shell. A circuit board is mounted within the housing.

In one of the embodiments, the type and size of the MOS tubes mounted on opposite sides of the circuit board can be the same or different.

Below in conjunction with the accompanying drawings, some embodiments of the present utility model will be described in detail. In the case of no conflict, the following embodiments and features in the embodiments can be combined with each other.

Referring to FIG. 1 to FIG. 3 , the electronic governor 100 of the embodiment of the present invention includes an upper case 110 , a lower case 120 , and a circuit board 130 . The lower case 120 is set corresponding to the upper case 110 . The lower shell 120 and the upper shell 110 jointly form a shell. The circuit board 130 is installed in the housing.

The circuit board 130 includes an upper surface 130a and a lower surface 130b opposite to the upper surface 130a. The upper surface 130 a is disposed facing the inner wall of the upper case 110 , and the lower surface 130 b is disposed facing the inner wall of the lower case 120 .

Wherein, the upper surface 130a is provided with a plurality of first MOS transistors 150a, and the lower surface 130b is provided with a plurality of second MOS transistors 150b. Both the top surfaces of the first MOS tube 150a and the second MOS tube 150b are embedded with a heat conducting metal sheet 150c. The thermally conductive metal sheet 150c of the first MOS tube 150a is thermally connected to the inner wall of the upper case 110 through the first thermally conductive pad 160a. The thermally conductive metal sheet 150c of the second MOS tube 150b is thermally connected to the inner wall of the lower case 120 through the second thermally conductive pad 160b.

In the electronic governor 100, the first MOS tube 150a and the second MOS tube 150b are the main heat sources, and the top surfaces of the first MOS tube 150a and the second MOS tube 150b are embedded with a heat-conducting metal sheet 150c, and the second The first MOS tube 150a and the second MOS tube 150b can dissipate heat directly through the heat-conducting metal sheet 150c, so that the thermal resistance of the tops of the first MOS tube 150a and the second MOS tube 150b is compared with that of a traditional MOS tube whose top is a plastic package. The thermal resistance of the tube is greatly reduced, which greatly enhances the heat conduction capacity on the heat conduction path of the first MOS tube 150a and the second MOS tube 150b; at the same time, the first MOS tube 150a and the second MOS tube 150b respectively pass through the first thermal pad 160a And the second heat conduction pad 160b conducts heat conduction with the upper shell 110 and the lower shell 120 of the electronic governor 100, which increases the heat exchange area between the first MOS tube 150a and the second MOS and the outside world, thereby effectively improving the electronic governor 100. cooling efficiency. Since the heat dissipation efficiency of the first MOS tube 150a and the second MOS tube 150b is improved, the MOS tubes can be mounted on opposite sides of the circuit board 130 at the same time to reduce the occupied space of the circuit board 130; and, the first MOS tube The heat dissipation efficiency of the tube 150 a and the second MOS tube 150 b is high, which facilitates the use of smaller MOS tubes, thereby further reducing the occupied space of the circuit board 130 , thereby facilitating the miniaturization design of the electronic speed controller 100 .

The heat-conducting metal sheet 150c is directly encapsulated in the first MOS tube 150a and the second MOS tube 150b, and the top surface of the heat-conducting metal sheet 150c is at least partially exposed. That is, when the first MOS transistor 150a and the second MOS transistor 150b are packaged, the thermally conductive metal sheet 150c is directly packaged together.

The positions of the first MOS transistor 150a and the second MOS transistor 150b can be designed according to different requirements. For example, in one of the embodiments, a plurality of the first MOS transistors 150a are arranged opposite to a plurality of the second MOS transistors 150b, so as to further save the occupied space of the circuit board 130 and facilitate the miniaturization of the electronic speed controller 100 design. In other embodiments, multiple first MOS transistors 150a and multiple second MOS transistors 150b are alternately arranged to increase the effective heat dissipation area of a single MOS transistor and further improve the heat dissipation efficiency of the MOS transistor.

The number of the first MOS tube 150a and the second MOS tube 150b can be set according to actual needs, and a large-sized MOS tube of the traditional electronic governor 100 can be replaced by a plurality of smaller-sized MOS tubes to improve the MOS tube. The heat dissipation efficiency of the tube is reduced while reducing the occupied space. For example, in the illustrated embodiment, the number of the first MOS transistors 150a is greater than or equal to 6, and the number of the second MOS transistors 150b is greater than or equal to 6.

The relative positions of the number of the first MOS transistors 150a and the second MOS transistors 150b can be designed according to different requirements, for example, in the illustrated embodiment, a plurality of the first MOS transistors 150a are arranged in parallel and spaced apart, and distributed in a matrix , so that the plurality of first MOS transistors 150a can dissipate heat evenly. The plurality of second MOS transistors 150b are arranged in parallel and at intervals, and distributed in a matrix, so as to facilitate the uniform heat dissipation of the plurality of second MOS transistors 150b.

Since the heat dissipation efficiency of the MOS tube is greatly improved, a small-sized packaging process can be used to package the MOS tube, for example, the width and length of the first MOS tube 150a and the second MOS tube 150b are both less than 4 mm, for example, The width and length of the first MOS tube 150a and the second MOS tube 150b can be 4mm, 3.8mm, 3.6mm, 3.5mm, 3.2mm, 3.0mm, 2.8mm, 2.6mm, 2.5mm and so on. The width and length of the first MOS transistor 150a and the second MOS transistor 150b may be different. Specifically, in the illustrated embodiment, the width and length of the first MOS transistor 150 a and the second MOS transistor 150 b are both 3.3 millimeters.

The maximum operating current allowed by the ESC is greater than or equal to 30 amperes, and the number of the first MOS transistors 150a and the second MOS transistors 150b can be increased according to the maximum operating current allowed by the ESC. For example, the maximum operating current allowed by the ESC may be 35 amperes, 45 amperes, 50 amperes, 55 amperes, 60 amperes and so on.

The heat conduction pad is a heat conduction glue layer or a heat conduction grease layer. The thermally conductive adhesive layer can be made of adhesive with better thermal conductivity, for example, the thermally conductive adhesive layer is a thermally conductive silica gel layer. The thermally conductive grease layer may be made of grease with good thermal conductivity, for example, the thermally conductive grease layer may be a thermally conductive silicone grease layer.

The arrangement of the heat conduction pad can be designed according to different requirements. For example, in the illustrated embodiment, a plurality of the first MOS tubes 150a share a heat conduction pad, and a plurality of the second MOS tubes 150b share a heat conduction pad. In order to improve the conduction efficiency between the first MOS transistor 150 a and the second MOS transistor 150 b and the upper shell 110 and the lower shell 120 . Certainly, in other embodiments, each first MOS transistor 150a may correspond to a heat conduction pad, and each second MOS transistor 150b may be separately provided with a heat conduction pad, so as to avoid mutual influence between each MOS transistor.

In order to improve the heat exchange efficiency between the MOS tube and the outside, the upper shell 110 and the lower shell 120 are metal shells. For example, in the illustrated implementation, the upper shell 110 and the lower shell 120 are both aluminum shells. Of course, in other embodiments, the upper shell 110 and the lower shell 120 can also be other metal shells, for example, aluminum alloy, the same alloy, and the like.

The opening edge of the upper case 110 is provided with a first upper groove and a second lower groove, and the opening edge of the lower case 120 is provided with a first lower groove and a second lower groove. The first upper groove and the first lower groove are arranged correspondingly, and are joined together to form a threading hole 170a. The second upper groove and the second lower groove are arranged correspondingly, and are spliced together to form a receiving hole 170b for accommodating a capacitor.

In order to further improve the heat exchange efficiency between the MOS tube and the outside, a plurality of cooling fins 180a are provided on the outer surface of the upper case 110 corresponding to the area of the first MOS. A plurality of cooling fins 180b are provided on the outer surface of the lower case 120 corresponding to the area of the second MOS tube 150b.

Based on the above-mentioned electronic speed controller 100, the utility model also provides a movable platform, and the said movable platform utilizes the above-mentioned electronic speed controller 100 to drive a motor. The movable platform is an unmanned aerial vehicle or an unmanned chassis vehicle.

Please also refer to FIG. 4 , the movable platform 10 of the embodiment of the present invention includes a plurality of electronic speed controllers 100 , a frame 200 , a plurality of motors 300 , and a controller 400 . Multiple motors 300 are installed on the frame 200 . A plurality of electronic speed controllers 100 are respectively electrically connected to the plurality of motors 300 for controlling the plurality of motors 300 . The controller 400 is communicatively connected with a plurality of the electronic speed governors 100 .

Wherein, the controller 400 respectively controls the working states of the multiple motors 300 through the multiple electronic speed controllers 100 . Specifically, in the illustrated embodiment, the movable platform is an unmanned aerial vehicle, the controller 400 is a flight controller, and the motor 300 is used to drive the propellers to provide flight power for the unmanned aerial vehicle.

The above descriptions are only embodiments of the present utility model, and are not intended to limit the patent scope of the present utility model. Any equivalent structure or equivalent process transformation made by using the description of the utility model and the contents of the accompanying drawings, or directly or indirectly used in other Related technical fields are all included in the patent protection scope of the present utility model in the same way.

Claims (18)

1. a kind of electron speed regulator, it is characterised in that including：

Upper casing；

Lower casing, is correspondingly arranged with the upper casing, and the lower casing is collectively forming a housing with the upper casing；And

Circuit board, in the housing, the circuit board includes upper surface and with the upper surface back under setting Surface, the upper surface is set in face of the inwall of the upper casing, and the lower surface is set in face of the inwall of the lower casing,

Wherein, the upper surface is provided with multiple first metal-oxide-semiconductors, and the lower surface is provided with multiple second metal-oxide-semiconductors；First MOS The top surface of pipe and second metal-oxide-semiconductor is embedded with thermal conductive metal plate；

The thermal conductive metal plate of first metal-oxide-semiconductor is connected by the first heat conductive pad with the inwall heat conduction of the upper casing；

The thermal conductive metal plate of second metal-oxide-semiconductor is connected by the second heat conductive pad with the inwall heat conduction of the lower casing.

2. electron speed regulator according to claim 1, it is characterised in that the thermal conductive metal plate is directly encapsulated into described In one metal-oxide-semiconductor and second metal-oxide-semiconductor, and the top surface of the thermal conductive metal plate is at least partly exposed.

3. electron speed regulator according to claim 1, it is characterised in that multiple first metal-oxide-semiconductors and multiple described the Two metal-oxide-semiconductors are oppositely arranged；

Or, multiple first metal-oxide-semiconductors are staggered with multiple second metal-oxide-semiconductors.

4. electron speed regulator according to claim 1, it is characterised in that the quantity of first metal-oxide-semiconductor is more than or equal to 6 It is individual；

And/or, the quantity of second metal-oxide-semiconductor is more than or equal to 6.

5. electron speed regulator according to claim 1, it is characterised in that multiple first metal-oxide-semiconductor parallel intervals are set, And in matrix distribution；

And/or, multiple second metal-oxide-semiconductor parallel intervals are set, and in matrix distribution.

6. electron speed regulator according to claim 1, it is characterised in that the heat conductive pad is heat-conducting glue layer or thermal grease conduction Layer.

7. electron speed regulator according to claim 6, it is characterised in that the heat-conducting glue layer is heat conduction silicone.

8. electron speed regulator according to claim 6, it is characterised in that the heat conduction lipid layer is thermal conductive silicon lipid layer.

9. electron speed regulator according to claim 1, it is characterised in that first metal-oxide-semiconductor and second metal-oxide-semiconductor Width, length be respectively less than 4 millimeters.

10. electron speed regulator according to claim 9, it is characterised in that first metal-oxide-semiconductor and the 2nd MOS The width of pipe, length are 3.3 millimeters.

11. electron speed regulator according to claim 1, it is characterised in that the maximum functional that the electron speed regulator allows Electric current is more than or equal to 30 amperes.

12. electron speed regulator according to claim 11, it is characterised in that the maximum functional that the electron speed regulator allows Electric current is 35~60 amperes.

13. electron speed regulator according to claim 1, it is characterised in that the upper casing and lower casing are metal-back.

14. electron speed regulator according to claim 13, it is characterised in that the upper casing and lower casing are aluminum hull.

15. electron speed regulator according to claim 1, it is characterised in that the outer surface correspondence described first of the upper casing MOS region is provided with multiple radiating fins；

And/or, the region of outer surface correspondence second metal-oxide-semiconductor of the lower casing is provided with multiple radiating fins.

16. electron speed regulator according to claim 1, it is characterised in that multiple first metal-oxide-semiconductors share a heat conduction Pad；

And/or, multiple second metal-oxide-semiconductors share a heat conductive pad.

17. a kind of moveable platform, it is characterised in that including：

Frame；

Multiple motors, in the frame；

Electron speed regulator described in any one of claim 1~16, is multiple, electrically connects, be used for the multiple motor respectively Control multiple the multiple motors；And

Controller, is communicated to connect with multiple electron speed regulators；

Wherein, the controller controls the working condition of the motor by multiple electron speed regulators respectively.

18. moveable platform according to claim 17, it is characterised in that the moveable platform is unmanned vehicle, Or unmanned chassis vehicle.