CN205266075U - Heat dissipation screening cover - Google Patents
Heat dissipation screening cover Download PDFInfo
- Publication number
- CN205266075U CN205266075U CN201521098284.9U CN201521098284U CN205266075U CN 205266075 U CN205266075 U CN 205266075U CN 201521098284 U CN201521098284 U CN 201521098284U CN 205266075 U CN205266075 U CN 205266075U
- Authority
- CN
- China
- Prior art keywords
- heat
- screening cover
- chip
- copper foil
- heat conduction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a heat dissipation screening cover, use, when in case the chip release of screening cover below produces a large amount of heats, owing to correspond the position opening in its chip top, the heat conduction graphite copper foil layer that makes heat conduction mud layer that chip top was pasting and screening cover top paste can be abundant the contact together, then the heat can be rapid the chip that passes through transmit on the heat conduction mud layer earlier, transmit again on the heat conduction graphite copper foil layer, because the heat conductivity of graphite copper foil layer is very good, and the area that pastes is bigger, consequently, can lead away and release away through the graphite copper foil layer by the quick and effectual heat that produces the chip, because the heat conductivity of graphite is greater than the heat conductivity of the metal material of its screening cover far away, avoided because the heat conductivity of screening cover itself is not very good, and lead to its mainboard of electronic product slow in heat dissipation's problem.
Description
Technical field
The utility model belongs to electrical equipment accessory field. More particularly, the utility model relates to a kind of radiating shield case.
Background technology
Along with the continuous development and progress of society, the electronic product function of mobile phone plane plate and so on is also more and more. Along with functionIncrease and the continuous enhancing of performance, the power consumption of mobile phone is also more and more come larger, thus substantially not why the function machine epoch in the pastThe mobile phone heat dissipation problem of paying attention to, more and more important in the design of current electronic product, each large research and development manufacturer is all thinkingSeek in every way to and make as much as possible product dispel the heat better faster, avoid that in use self-temperature is too high draws because of productThe safety problem of sending out. In electronic product, what the most easily give out heat is generally power management chip and central processing unitChip, in most electronic product, for the EMI that better protects device on mainboard disturbs and ESD problem, thisTwo large chips are generally all placed in screening cover the inside. Therefore the heat how effectively these chips being produced is fast by upperThe screening cover of side is led away, has also just become the effective way of a solution product heat dissipation problem.
The more common general shield lid of electronic product mainly contains following several at present:
As shown in Figure 1, a kind of totally enclosed screening cover, anti-interference shield effectiveness is better, and radiating effect is poor;
As shown in Figure 2, aperture is evenly opened in screening cover top, and anti-interference shield effectiveness is better, and its perforate can make gas pairFlow, can play the effect of auxiliary heat dissipation, but radiating effect is general.
Above two kinds of common screening covers concerning general heating is not severe especially electronic product or more applicable, butFor the larger electronic product of some power dissipation ratios (such as the mobile phone of intel platform or dull and stereotyped and so on), even upper at chipBetween side and screening cover, placed after the approaching heat conduction mud layer of a slice and die size, above-mentioned two kinds of common screening covers are loose to itThermal effect is also nowhere near, and can not lead away in time fast the heat that power management chip and central processor core produce.
Utility model content
An object of the present utility model is to solve at least the problems referred to above, and provides at least below by the advantage of explanation.
The technical solution of the utility model is:
A kind of radiating shield case, it comprises:
Screening cover body, offers an opening on it, described opening be arranged on chip directly over;
Graphite copper foil layer, it is attached on described screening cover body;
With the heat conduction mud layer being attached on described chip, the upper surface of described heat conduction mud layer protrude from described opening and with described stoneThe contact of China ink copper foil layer, can dispel the heat by heat conduction mud layer and graphite copper foil layer fast.
Preferably, in described radiating shield case, the size of described opening and the size of described chip adapt, and ensureThe heat radiation of chip.
Preferably, in described radiating shield case, the size of described heat conduction mud layer and the size of described chip match.
Preferably, in described radiating shield case, on described screening cover body, also evenly offer some heat radiation through holes, canTo play the effect of auxiliary heat dissipation.
The radiating shield case that the utility model provides, in use, produces a large amount of heat once the chip of screening cover below dischargesWhen amount, due to correspondence position opening above its chip, heat conduction mud layer and the screening cover top that pasting chip top are pastedThe conductive graphite copper foil layer of can contact fully, and then heat can first be delivered to heat conduction by chip rapidlyOn mud layer, then be delivered on conductive graphite copper foil layer, because the thermal conductivity of graphite copper foil layer is very good, and the Area comparison pastingGreatly, the heat that therefore can fast and effectively chip be produced is led away and is discharged by graphite copper foil layer, due to graphiteThermal conductivity be far longer than the thermal conductivity of the metal material of its screening cover, avoided the not right and wrong of thermal conductivity due to screening cover itselfChang Hao, and cause its mainboard of electronic product slow problem of dispelling the heat.
Other advantage of the present utility model, target and feature embody the explanation of part by below, and part also will be by originallyThe research and practice of utility model and being understood by those skilled in the art.
Brief description of the drawings
Fig. 1 is the structural representation of existing fully closed screening cover;
Fig. 2 is the structural representation of the existing screening cover with heat radiation through hole;
The structural representation of the radiating shield case that Fig. 3 provides for the utility model;
The cross-sectional view of the radiating shield case that Fig. 4 provides for the utility model.
Detailed description of the invention
Below in conjunction with accompanying drawing, the utility model is described in further detail, to make those skilled in the art with reference to description literary compositionWord can be implemented according to this.
Should be appreciated that use herein such as " having ", " comprising " and " comprising " term do not allot one or more itsThe existence of its element or its combination or interpolation.
As shown in Figure 3 and Figure 4, the utility model provides a kind of radiating shield case, and it comprises:
Screening cover body 1, offers an opening 101 on it, described opening 101 be arranged on chip 4 directly over;
Graphite copper foil layer 2, it is attached on described screening cover body 1,
With the heat conduction mud layer 3 being attached on described chip 4, the upper surface of described heat conduction mud layer 3 protrudes from described opening 101And contact with described graphite copper foil layer 2, can dispel the heat by heat conduction mud layer 3 and graphite copper foil layer 2 fast.
In described radiating shield case, the size of the size of described opening 101 and described chip 4 adapts, and ensures chipHeat radiation.
In described radiating shield case, the size of the size of described heat conduction mud layer 3 and described chip 4 matches.
In described radiating shield case, on described screening cover body 1, also evenly offer some heat radiation through holes 5, play auxiliaryThe effect of heat radiation.
A kind of radiating shield case that the utility model provides, is on the basis of the screening cover of routine in Fig. 2, for its belowOn mainboard, there is position upper shed corresponding to chip that easily produces amount of heat, the reality of the size of its bore and lower square chipSize approaches, and then above chip, pastes the approaching heat conduction mud layer of a size and chip body size, in addition in whole shieldingA conductive graphite copper foil layer is pasted in the top of lid.
Discharge and produce a large amount of heats once the chip of screening cover below, due to correspondence position opening above its chip,The conductive graphite copper foil layer that heat conduction mud layer that chip top pasting and screening cover top are being pasted can contact fullyTogether, then heat can first be delivered on heat conduction mud layer by chip rapidly, then is delivered on conductive graphite copper foil layer,Because the thermal conductivity of graphite copper foil layer is very good, and the Area comparison pasting is large, therefore can fast and effectively chip be producedHeat lead away and discharge by graphite copper foil layer, because the thermal conductivity of graphite is far longer than the metal material of its screening coverThermal conductivity, avoided because the thermal conductivity of screening cover itself is not very good, and caused the heat radiation of its mainboard of electronic product slowProblem.
The utility model device is through above-mentioned steps, thereby produces heat can accelerate on its mainboard of electronic product chip operation timeAfter, the rate of release of its heat, thus reach the effect that is conducive to heat radiation.
Although embodiment of the present utility model is open as above, it is not restricted in description and embodiment listedUse, it can be applied to the various fields of the present utility model that are applicable to completely, for those skilled in the art, and canEasily realize other amendment, therefore do not deviating under the universal that claim and equivalency range limit this practicalityNovelly be not limited to specific details and illustrate here and the legend of describing.
Claims (4)
1. a radiating shield case, is characterized in that, comprising:
Screening cover body, offers an opening on it, described opening be arranged on chip directly over;
Graphite copper foil layer, it is attached on described screening cover body,
With the heat conduction mud layer being attached on described chip, the upper surface of described heat conduction mud layer protrude from described opening and with described stoneThe contact of China ink copper foil layer.
2. radiating shield case as claimed in claim 1, is characterized in that, the size of described opening and the chi of described chipVery little adapting.
3. radiating shield case as claimed in claim 2, is characterized in that, the size of described heat conduction mud layer and described chipSize match.
4. radiating shield case as claimed in claim 3, is characterized in that, on described screening cover body, also evenly offersSome heat radiation through holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521098284.9U CN205266075U (en) | 2015-12-25 | 2015-12-25 | Heat dissipation screening cover |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521098284.9U CN205266075U (en) | 2015-12-25 | 2015-12-25 | Heat dissipation screening cover |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205266075U true CN205266075U (en) | 2016-05-25 |
Family
ID=56007571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521098284.9U Active CN205266075U (en) | 2015-12-25 | 2015-12-25 | Heat dissipation screening cover |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205266075U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106231874A (en) * | 2016-08-26 | 2016-12-14 | 浙江众合科技股份有限公司 | A kind of radiator heat conducting gum mud operated pressing tool and board radiator structure |
| CN106533491A (en) * | 2016-10-20 | 2017-03-22 | 捷开通讯(深圳)有限公司 | Radio frequency module and mobile terminal for improving wireless signal intensity |
| CN107580449A (en) * | 2017-09-21 | 2018-01-12 | 广东欧珀移动通信有限公司 | Radome, radiating subassembly and electronic equipment |
| CN111147966A (en) * | 2019-12-25 | 2020-05-12 | 歌尔股份有限公司 | Loudspeaker module |
-
2015
- 2015-12-25 CN CN201521098284.9U patent/CN205266075U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106231874A (en) * | 2016-08-26 | 2016-12-14 | 浙江众合科技股份有限公司 | A kind of radiator heat conducting gum mud operated pressing tool and board radiator structure |
| CN106231874B (en) * | 2016-08-26 | 2018-07-13 | 浙江众合科技股份有限公司 | A kind of radiator heat conducting gum mud operated pressing tool and board radiator structure |
| CN108513495A (en) * | 2016-08-26 | 2018-09-07 | 浙江大学 | A kind of board radiator heat conducting gum mud pressure setting |
| CN108513495B (en) * | 2016-08-26 | 2019-07-16 | 浙江大学 | A kind of board radiator heat conducting gum mud pressure setting |
| CN106533491A (en) * | 2016-10-20 | 2017-03-22 | 捷开通讯(深圳)有限公司 | Radio frequency module and mobile terminal for improving wireless signal intensity |
| CN107580449A (en) * | 2017-09-21 | 2018-01-12 | 广东欧珀移动通信有限公司 | Radome, radiating subassembly and electronic equipment |
| CN111147966A (en) * | 2019-12-25 | 2020-05-12 | 歌尔股份有限公司 | Loudspeaker module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205266075U (en) | Heat dissipation screening cover | |
| CN206181696U (en) | Cell -phone shielding heat radiation structure of low thermal resistance and cell -phone that has this structure | |
| CN201585231U (en) | Electronic device with heat insulation structure | |
| CN102548365A (en) | Mobile terminal with high heat radiation performance | |
| CN106209122A (en) | The radio frequency integrated structure of transmitter | |
| CN104768340A (en) | Mobile terminal | |
| CN206775466U (en) | A kind of heat dissipation type photovoltaic terminal box | |
| CN103607872B (en) | Radiating shell | |
| CN105611719A (en) | Printed circuit board (PCB) structure with high heat conduction and dissipation | |
| CN203661497U (en) | Brushless electric car controller | |
| CN203859109U (en) | Chip packaging structure | |
| CN206294476U (en) | Electronic equipment | |
| CN206946374U (en) | A kind of computer motherboard | |
| CN201298958Y (en) | MOSFET soldering pad design circuit board with heat dissipation holes | |
| CN208402209U (en) | Heat sinking circuit board and appliance controller | |
| CN204031708U (en) | A kind of heat conduction and heat radiation and electromagnetic wave eliminator | |
| CN210807780U (en) | Ultrathin heat dissipation structure for PCB | |
| CN105848449A (en) | Heat dissipation device and electronic equipment | |
| CN208045491U (en) | A kind of Transient Suppression Diode device for vehicle electronic device | |
| CN206773608U (en) | A kind of modular computer host housing | |
| CN201774752U (en) | Bevel scraper | |
| CN205902310U (en) | Filter housing's high heat radiation structure for communication | |
| CN207201208U (en) | A kind of power amplifier | |
| CN205648335U (en) | Cloud stick shield assembly | |
| US20170042018A1 (en) | Dual Layer Shielding Cover and Terminal |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: No. 16, cuixing Road, Hui Xing street, Yubei District, Chongqing Patentee after: Chongqing Lanan Technology Co.,Ltd. Address before: No. 13-2, Jiangying Road, Nanan District, Chongqing, Chongqing Patentee before: CHONGQING BLUEBANK COMMUNICATION TECHNOLOGY Co.,Ltd. |
|
| CP03 | Change of name, title or address |