CN208045491U - A kind of Transient Suppression Diode device for vehicle electronic device - Google Patents
A kind of Transient Suppression Diode device for vehicle electronic device Download PDFInfo
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- CN208045491U CN208045491U CN201820567847.1U CN201820567847U CN208045491U CN 208045491 U CN208045491 U CN 208045491U CN 201820567847 U CN201820567847 U CN 201820567847U CN 208045491 U CN208045491 U CN 208045491U
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- suppression diode
- transient suppression
- cooling fin
- diode chip
- weld tabs
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Abstract
The utility model belongs to technical field of electronic equipment,Propose a kind of Transient Suppression Diode device for vehicle electronic device,The Transient Suppression Diode device includes the first lead,First cooling fin,First Transient Suppression Diode chip,Second cooling fin,Second Transient Suppression Diode chip,Third cooling fin and the second lead,By by the first lead,First cooling fin,First Transient Suppression Diode chip,Second cooling fin,Second Transient Suppression Diode chip,Third cooling fin and the setting of the second lead sequential,Above-mentioned component is set sequentially to connect by multiple weld tabs respectively simultaneously,Transient Suppression Diode device is radiated in time when bearing the high-voltage pulse in short-term of second grade,Avoiding the heat that existing Transient Suppression Diode chip generates cannot radiate easy the problem of damaging Transient Suppression Diode chip because of overheat in time.
Description
Technical field
The utility model belongs to technical field of electronic equipment more particularly to a kind of transient state for vehicle electronic device inhibits
Diode component.
Background technology
It is constantly promoted with the intelligence degree of intelligent automobile, the type of vehicle electronic device is also more and more, and power supply is made
Huge effect is played in the steady operation of vehicle electronic device for the reliable and stable foundation stone of electronic equipment.Vehicle electronics is set
The pulse generated inside standby power-supply system usually has the characteristics that voltage amplitude is low, pulsewidth is grown, and pulsewidth maximum can reach
Hundreds of milliseconds.
However, existing transient state inhibits (Transient Voltage Suppressor, TVS) diode bearing millisecond
When the high-voltage pulse in short-term of grade, since the mesolow surge pulse width time length of Millisecond will produce a large amount of heat, if generate
Heat cannot radiate in time to be easy to puncture Transient Suppression Diode chip because of overheat.
Utility model content
The purpose of this utility model is to provide a kind of Transient Suppression Diode devices for vehicle electronic device, it is intended to
Existing Transient Suppression Diode chip is solved in the high-voltage pulse in short-term for bearing Millisecond, due to the mesolow wave of Millisecond
It gushes pulse width time length and will produce a large amount of heat, be easy to puncture because of overheat if the heat generated cannot radiate in time
The problem of Transient Suppression Diode chip.
The utility model embodiment provides a kind of Transient Suppression Diode device for vehicle electronic device, the wink
It includes the first Transient Suppression Diode chip, the second Transient Suppression Diode chip, the first lead, that state, which inhibits diode component,
Two leads, the first cooling fin, the second cooling fin, third cooling fin；First lead, first cooling fin, described first
Transient Suppression Diode chip, second cooling fin, the second Transient Suppression Diode chip, the third cooling fin with
And the second lead sequential setting；It is arranged between first cooling fin and the first Transient Suppression Diode chip
There is the first weld tabs, the second weld tabs is provided between the first Transient Suppression Diode chip and second cooling fin, it is described
Third weld tabs is provided between second cooling fin and the second Transient Suppression Diode chip, second transient state inhibits two poles
It is provided with the 4th weld tabs between tube chip and the third cooling fin.
Optionally, first cooling fin passes through first weld tabs and the first Transient Suppression Diode chip phase
Even, the first Transient Suppression Diode chip is connected by second weld tabs with second cooling fin, and described second dissipates
Backing is connected by the third weld tabs with the second Transient Suppression Diode chip, the second Transient Suppression Diode core
Piece is connected by the 4th weld tabs with the third cooling fin.
Optionally, the first Transient Suppression Diode chip connects with the second Transient Suppression Diode chip-in series
It connects.
Optionally, the Transient Suppression Diode device further includes：First soldering paste and the second soldering paste；First lead connects
It connected the first soldering paste to connect with first cooling fin, second lead is connected by the second soldering paste and the third cooling fin
It connects.
Optionally, first cooling fin, second cooling fin and the third cooling fin are copper particle.
Optionally, the Transient Suppression Diode device further includes packaging body；First cooling fin, first weldering
Piece, the first Transient Suppression Diode chip, second weld tabs, second cooling fin, the third weld tabs, described
Two Transient Suppression Diode chips, the 4th weld tabs and the third cooling fin are located at the package interior.
Optionally, the packaging body is epoxy resin.
Optionally, first weld tabs, second weld tabs, the third weld tabs and the 4th weld tabs be tin piece,
One or more of silver strip, copper sheet, zinc metal sheet.
A kind of Transient Suppression Diode device for vehicle electronic device provided in the utility model, the transient state inhibit
Diode component includes the first lead, the first cooling fin, the first Transient Suppression Diode chip, the second cooling fin, the second wink
State inhibits diode chip for backlight unit, third cooling fin and the second lead, by pressing down the first lead, the first cooling fin, the first transient state
Diode chip for backlight unit, the second cooling fin, the second Transient Suppression Diode chip, third cooling fin and the second lead sequential processed
Setting, while so that above-mentioned component is sequentially connected by multiple weld tabs respectively so that Transient Suppression Diode device is bearing second grade
High-voltage pulse in short-term when can radiate in time, avoiding heat that existing Transient Suppression Diode chip generates cannot be timely
Heat dissipation is easy the problem of damaging Transient Suppression Diode chip because of overheat.
Description of the drawings
Fig. 1 is a kind of Transient Suppression Diode device for vehicle electronic device that the utility model embodiment 1 provides
Circuit structure diagram.
Specific implementation mode
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation
Example, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only explaining this
Utility model is not used to limit the utility model.
Fig. 1 is a kind of Transient Suppression Diode device for vehicle electronic device that the utility model embodiment 1 provides
Structural schematic diagram, as described in Figure 1, Transient Suppression Diode device in the present embodiment includes the first Transient Suppression Diode core
Piece 41, the second Transient Suppression Diode chip 42, the first lead 11, the second lead 12, the first cooling fin 21, the second cooling fin
22, third cooling fin 23；Specifically, the first lead 11, the first cooling fin 21, the first Transient Suppression Diode chip 41, second
Cooling fin 22, the second Transient Suppression Diode chip 42, third cooling fin 23 and the setting of 12 sequential of the second lead；First
The first weld tabs 31, the first Transient Suppression Diode chip are provided between cooling fin 21 and the first Transient Suppression Diode chip 41
41 and second are provided with the second weld tabs 32 between cooling fin 22, the second cooling fin 22 and the second Transient Suppression Diode chip 42 it
Between be provided with third weld tabs 33, be provided with the 4th weld tabs between the second Transient Suppression Diode chip 42 and third cooling fin 23
34。
As one embodiment of the utility model, the first cooling fin 21 passes through the first weld tabs 31 and the first Transient Suppression Diode
Chip 41 is connected, and the first Transient Suppression Diode chip 41 is connected by the second weld tabs 32 with the second cooling fin 22, the second heat dissipation
Piece 22 is connected by third weld tabs 33 with the second Transient Suppression Diode chip 42, and the second Transient Suppression Diode chip 42 passes through
4th weld tabs 34 is connected with third cooling fin 23.Specifically, second face in the first face of the first weld tabs 31 and the first cooling fin 21
First face of welding, the second face of the first weld tabs 31 and the first Transient Suppression Diode chip 41 is welded, and the of the second weld tabs 32
It is welded on one side with the second face of the first Transient Suppression Diode chip 41, the second face of the second weld tabs 32 and the second cooling fin 22
First face is welded, and the second face of the first face of third weld tabs 33 and the second cooling fin 22 is welded, the second face of third weld tabs 33 with
First face of the second Transient Suppression Diode chip 42 is welded, the first face of the 4th weld tabs 34 and the second Transient Suppression Diode core
Second face of piece 42 is welded, and the second face of the 4th weld tabs 34 is welded with the first face of third cooling fin 23.
In the present embodiment, the first lead 11 and the second lead 12 are lead frame, the first Transient Suppression Diode core
Piece 41 is connect with the first cooling fin 21 by the first weld tabs 31, and the first Transient Suppression Diode chip 41 and the second cooling fin 22 are logical
The connection of the second weld tabs 32 is crossed, the first Transient Suppression Diode core can be increased by the first cooling fin 21 and the second cooling fin 22
The heat dissipation area of piece 41 so that the first Transient Suppression Diode chip 41 radiates in time in the case where bearing compared with high impulse.
As one embodiment of the utility model, the first Transient Suppression Diode chip 41 and the second Transient Suppression Diode core
Piece 42 is connected in series with.
In the present embodiment, the first end of the first Transient Suppression Diode chip 41 is connect with the first lead 11, the first wink
State inhibits the second end of diode chip for backlight unit 41 to be connect with the first end of the second Transient Suppression Diode chip 42, and the second transient state inhibits
The second end of diode chip for backlight unit 42 is connect with the second lead 12, by by the first Transient Suppression Diode chip 41 and the second transient state
Inhibit diode chip for backlight unit 42 to be connected in series with the through-current capability of enhancing Transient Suppression Diode device, the electricity of bigger can be born
Stream impact, such as：Transient Suppression Diode device under equal unit area, the transient state for being 18V with two breakdown voltages press down
Diode chip for backlight unit processed connects to obtain the Transient Suppression Diode device that breakdown voltage is 36V, and the transient state which is 36V presses down
Diode component processed is more stronger than the through-current capability for the Transient Suppression Diode chip that single breakdown voltage is 36V.
Specifically, the first Transient Suppression Diode chip 41 in the present embodiment and the second Transient Suppression Diode core
The both ends of piece 42 are both provided with cooling fin, due to by electric current it is bigger, caused by the ontology of Transient Suppression Diode chip
Heat is bigger, therefore, can increase heat dissipation effect by the way that cooling fin is arranged at Transient Suppression Diode chip both ends, avoid wink
State inhibits diode chip for backlight unit to be damaged because of over-heat inside.
As one embodiment of the utility model, the Transient Suppression Diode device further includes：First soldering paste and the second weldering
Cream；The connection of first lead 11 is connect by the first soldering paste with the first cooling fin 21, and the second lead 12 passes through the second soldering paste and third
Cooling fin 23 connects.
In the present embodiment, make the first lead 11 and the first cooling fin by putting upper first soldering paste on the first cooling fin 21
21 connections make the second lead 12 be connect with third cooling fin by putting upper second soldering paste on third cooling fin 23.
As one embodiment of the utility model, the first cooling fin 21, the second cooling fin 22 and third cooling fin 23 are
Copper particle.Specifically, the first cooling fin 21, the second cooling fin 22 and third cooling fin 23, which are copper particle, can increase cooling fin
Heat dissipation area, while the heat dissipation effect of Transient Suppression Diode chip is also increased, which includes
First Transient Suppression Diode chip 41 and the second Transient Suppression Diode chip 42.
As one embodiment of the utility model, the Transient Suppression Diode device in the present embodiment further includes packaging body；The
One cooling fin 21, the first weld tabs 31, the first Transient Suppression Diode chip 41, the second weld tabs 32, the second cooling fin 22, third weldering
Piece 33, the second Transient Suppression Diode chip 42, the 4th weld tabs 34 and third cooling fin 23 are located at package interior.
In the present embodiment, the first cooling fin 21, the first weld tabs 31, the weldering of the first Transient Suppression Diode chip 41, second
Piece 32, the second cooling fin 22, third weld tabs 33, the second Transient Suppression Diode chip 42, the 4th weld tabs 34 and third heat dissipation
After piece 23 is sequentially arranged, its entirety is positioned in graphite smelting tool, puts it into vacuum drying oven and is sintered after fixed, to sintering
Device afterwards is encapsulated to form completed device with packaging body.Specifically, the connection of the first lead 11 passes through the first soldering paste and the first heat dissipation
Piece 21 connects, and the second lead 12 is connect by the second soldering paste with third cooling fin 23, and the first lead 11 and the second lead 12 expose
Packaging body.
As one embodiment of the utility model, the packaging body is epoxy resin.In the present embodiment, the first cooling fin
21, the first weld tabs 31, the first Transient Suppression Diode chip 41, the second weld tabs 32, the second cooling fin 22, third weld tabs 33,
After two Transient Suppression Diode chips 42, the 4th weld tabs 34 and third cooling fin 23 are sequentially arranged, its entirety is positioned over stone
In Mo Ye tools, puts it into vacuum drying oven and be sintered after fixed, encapsulating formation is carried out with epoxy resin to sintered device
Complete product.Specifically, the connection of the first lead 11 is connect by the first soldering paste with the first cooling fin 21, the second lead 12 passes through the
Two soldering paste are connect with third cooling fin 23, and the first lead 11 and the second lead 12 expose outside epoxy resin.
As one embodiment of the utility model, the first weld tabs 31, the second weld tabs 32, third weld tabs 33 and the 4th weld tabs 34
For one or more of tin piece, silver strip, copper sheet, zinc metal sheet.In the present embodiment, the first weld tabs 31, the second weld tabs 32, third
Weld tabs 33 can be identical or different, and selected material determines according to specific needs.
A kind of Transient Suppression Diode device for vehicle electronic device provided in the utility model, the transient state inhibit
Diode component includes the first lead, the first cooling fin, the first Transient Suppression Diode chip, the second cooling fin, the second wink
State inhibits diode chip for backlight unit, third cooling fin and the second lead, by pressing down the first lead, the first cooling fin, the first transient state
Diode chip for backlight unit, the second cooling fin, the second Transient Suppression Diode chip, third cooling fin and the second lead sequential processed
Setting, while so that above-mentioned component is sequentially connected by multiple weld tabs respectively so that Transient Suppression Diode device is bearing second grade
High-voltage pulse in short-term when can radiate in time, avoiding heat that existing Transient Suppression Diode chip generates cannot be timely
Heat dissipation is easy the problem of damaging Transient Suppression Diode chip because of overheat.
The above is only the preferred embodiments of the present utility model only, is not intended to limit the utility model, all in this practicality
All any modification, equivalent and improvement etc., should be included in the guarantor of the utility model made by within novel spirit and principle
Within the scope of shield.
Claims (8)
1. a kind of Transient Suppression Diode device for vehicle electronic device, which is characterized in that the Transient Suppression Diode
Device includes the first Transient Suppression Diode chip, the second Transient Suppression Diode chip, the first lead, the second lead, first
Cooling fin, the second cooling fin, third cooling fin；
First lead, first cooling fin, the first Transient Suppression Diode chip, second cooling fin, institute
State the second Transient Suppression Diode chip, the third cooling fin and the second lead sequential setting；
The first weld tabs, the first transient state suppression are equipped between first cooling fin and the first Transient Suppression Diode chip
The second weld tabs is equipped between diode chip for backlight unit processed and second cooling fin, second cooling fin inhibits with second transient state
It is equipped with third weld tabs between diode chip for backlight unit, is equipped between the second Transient Suppression Diode chip and the third cooling fin
4th weld tabs.
2. Transient Suppression Diode device as described in claim 1, which is characterized in that first cooling fin passes through described
One weld tabs is connected with the first Transient Suppression Diode chip, and the first Transient Suppression Diode chip passes through described second
Weld tabs is connected with second cooling fin, and second cooling fin inhibits two poles by the third weld tabs and second transient state
Tube chip is connected, and the second Transient Suppression Diode chip is connected by the 4th weld tabs with the third cooling fin.
3. Transient Suppression Diode device as described in claim 1, which is characterized in that the first Transient Suppression Diode core
Piece is connect with the second Transient Suppression Diode chip-in series.
4. Transient Suppression Diode device as described in claim 1, which is characterized in that the Transient Suppression Diode device is also
Including：First soldering paste and the second soldering paste；
First lead is connect by first soldering paste with first cooling fin, and second lead passes through described second
Soldering paste is connect with the third cooling fin.
5. Transient Suppression Diode device as claimed in claim 2, which is characterized in that first cooling fin, described second
Cooling fin and the third cooling fin are copper particle.
6. Transient Suppression Diode device as claimed in claim 3, which is characterized in that the Transient Suppression Diode device is also
Including packaging body；
It is first cooling fin, first weld tabs, the first Transient Suppression Diode chip, second weld tabs, described
Second cooling fin, the third weld tabs, the second Transient Suppression Diode chip, the 4th weld tabs and the third dissipate
Backing is located at the inside of the packaging body.
7. Transient Suppression Diode device as claimed in claim 6, which is characterized in that the packaging body is epoxy resin.
8. Transient Suppression Diode device as claimed in claim 2, which is characterized in that first weld tabs, second weldering
Piece, the third weld tabs and the 4th weld tabs are any one or more in tin piece, silver strip, copper sheet and zinc metal sheet
?.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820567847.1U CN208045491U (en) | 2018-04-20 | 2018-04-20 | A kind of Transient Suppression Diode device for vehicle electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820567847.1U CN208045491U (en) | 2018-04-20 | 2018-04-20 | A kind of Transient Suppression Diode device for vehicle electronic device |
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| CN208045491U true CN208045491U (en) | 2018-11-02 |
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| CN201820567847.1U Active CN208045491U (en) | 2018-04-20 | 2018-04-20 | A kind of Transient Suppression Diode device for vehicle electronic device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109755139A (en) * | 2019-01-18 | 2019-05-14 | 乐山无线电股份有限公司 | A kind of manufacturing method of high-power packet routing device |
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2018
- 2018-04-20 CN CN201820567847.1U patent/CN208045491U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109755139A (en) * | 2019-01-18 | 2019-05-14 | 乐山无线电股份有限公司 | A kind of manufacturing method of high-power packet routing device |
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