CN208298814U - A kind of novel high-power plastic packaging protection device - Google Patents
A kind of novel high-power plastic packaging protection device Download PDFInfo
- Publication number
- CN208298814U CN208298814U CN201821089133.0U CN201821089133U CN208298814U CN 208298814 U CN208298814 U CN 208298814U CN 201821089133 U CN201821089133 U CN 201821089133U CN 208298814 U CN208298814 U CN 208298814U
- Authority
- CN
- China
- Prior art keywords
- tablet
- cooling fin
- wire jumper
- chip
- plastic packaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Packages (AREA)
Abstract
The utility model discloses a kind of novel high-power plastic packagings to protect device, including protector body, the protector body is equipped with integral type tablet, the integral type tablet includes cooling fin and upper tablet, it is processed as one formula tablet between the cooling fin and upper tablet by copper material in special shape, wire jumper is equipped with inside the protector body, the wire jumper is in contact with the end of upper tablet, the upper tablet is connect with the position that wire jumper is in contact by solder(ing) paste, chip is equipped with inside the protector body, the chip is between cooling fin and wire jumper.The utility model compared with prior art the advantages of be: can be improved assembly precision, reduce the molding bad ratio of crimping, improve finished product yield, reduce product cost.
Description
Technical field
The utility model relates to protector technical fields, in particular to a kind of novel high-power plastic packaging to protect device.
Background technique
High-power plastic packaging protection device construction on existing market is copper radiating rib and upper tablet two-piece type independent of each other
Structure is chip between copper radiating rib and tablet, and in high/low temperature cyclic process, because of fault of construction, thermal expansion stress can not be obtained
To being released effectively, extrusion stress is generated to chip, chip rupture etc. is caused to fail, it is lower to eventually lead to finished product yield, raw
It is high to produce cost.
Utility model content
The purpose of the utility model is to overcome above technological deficiency, providing one kind can be improved assembly precision, reduce at
The bad ratio of type crimping improves finished product yield, reduces the novel high-power plastic packaging protection device of product cost.
In order to solve the above technical problems, technical solution provided by the utility model are as follows: a kind of novel high-power plastic packaging guarantor
Device, including protector body are protected, the protector body is equipped with integral type tablet, and the integral type tablet includes dissipating
Backing and upper tablet are processed as one formula tablet between the cooling fin and upper tablet by copper material in special shape, the protection
Device body interior is equipped with wire jumper, and the wire jumper is in contact with the end of upper tablet, what the upper tablet was in contact with wire jumper
Position is connected by solder(ing) paste, is equipped with chip inside the protector body, the chip be located at cooling fin and wire jumper it
Between.
As an improvement, the protector body is epoxy plastics material.
As an improvement, the cooling fin is copper radiating rib.
As an improvement, the chip is silicon chip.
The beneficial effect of the utility model compared with prior art is: the utility model cooling fin uses different with upper tablet
Type copper material is processed as one formula, avoids the error of assembling, crimping bad retirement when can reduce molding, wire jumper and upper tablet connect
Contact portion position is linked by solder(ing) paste, hardness itself is not high after solder(ing) paste solidification, when being stored in high and low temperature environment, this company
Socket part position can greatly buffer thermal expansion stress, to be protected to chip, greatly improve finished product yield,
Reduce production cost.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of novel high-power plastic packaging protection device of the utility model；
Fig. 2 is a kind of connection schematic diagram of novel high-power plastic packaging protection device and protected device of the utility model；
Fig. 3 is a kind of working principle diagram of novel high-power plastic packaging protection device of the utility model；
It is as shown in the figure: 1, protector body, 2, cooling fin, 3, upper tablet, 4, wire jumper, 5, chip.
Specific embodiment
In order to make the content of the utility model be easier to be clearly understood, below in conjunction in the utility model embodiment
Attached drawing, the technical scheme in the utility model embodiment is clearly and completely described.
As shown in Figure 1, a kind of novel high-power plastic packaging protects device, including protector body 1, the protector sheet
Body 1 is equipped with integral type tablet, and the integral type tablet includes cooling fin 2 and upper tablet 3, the cooling fin 2 and feeding
It is processed as one formula tablet between piece 3 by copper material in special shape, wire jumper 4, the wire jumper is equipped with inside the protector body 1
4 are in contact with the end of upper tablet 3, and the upper tablet 3 is connect with the position that wire jumper 4 is in contact by solder(ing) paste, described
Chip 5 is equipped with inside protector body 1, the chip 5 is between cooling fin 2 and wire jumper 4.
Referring to Fig. 2, the high-power plastic packaging protection device is Transient Suppression Diode, it is called clamped type diode, is one
Commonplace a high-effect circuit brake is used before an article or item in a contract in the world, can incorrect energy in absorbing circuit it is prominent
Wave.When in use, plastic packaging protection device (plastic packaging AK6 shown in figure) is in parallel with protected device.
Referring to Fig. 3, the working principle of plastic packaging protection device is as follows: under the conditions of applied in reverse, when occurring in circuit
When the surging of big energy, impedance value is down to extremely low conduction value immediately, so that high current be allowed to pass through, this device maximum can permit
Perhaps 10000 amperes of electric current passes through, while voltage clamping in scheduled level, and the response time is only 10-12 nanosecond, thus
Precision components in effective protection electronic circuit.
The material that the protector body 1 uses is epoxy plastics.
The cooling fin 2 is copper radiating rib.
The chip 5 is silicon chip.
When the utility model is specifically implemented: cooling fin and tablet are that integral type is processed, improved efficiency when welding assembly, group
It is high to fill precision；Meanwhile wire-jumper type structure, it greatly reduces thermal expansion stress and the extruding of chip is destroyed, can be greatly improved
Finished product yield.
The utility model and embodiments thereof are described above, this description is no restricted, shown in attached drawing
Be also one of the embodiments of the present invention, actual structure is not limited to this.All in all if this field
Those of ordinary skill is enlightened by it, without deviating from the purpose of the present invention, not inventively design with
The similar frame mode of the technical solution and embodiment, all should belong to the protection range of the utility model.
Claims (4)
1. a kind of novel high-power plastic packaging protects device, it is characterised in that: including protector body (1), the protector
Ontology (1) is equipped with integral type tablet, and the integral type tablet includes cooling fin (2) and upper tablet (3), the cooling fin
(2) it is processed as one formula tablet between upper tablet (3) by copper material in special shape, is equipped with and jumps inside the protector body (1)
Line (4), the wire jumper (4) are in contact with the end of upper tablet (3), the portion that the upper tablet (3) is in contact with wire jumper (4)
Position is connected by solder(ing) paste, is equipped with chip (5) inside the protector body (1), and the chip (5) is located at cooling fin
(2) between wire jumper (4).
2. the novel high-power plastic packaging of one kind according to claim 1 protects device, it is characterised in that: the protector
Ontology (1) is epoxy plastics material.
3. the novel high-power plastic packaging of one kind according to claim 1 protects device, it is characterised in that: the cooling fin
It (2) is copper radiating rib.
4. the novel high-power plastic packaging of one kind according to claim 1 protects device, it is characterised in that: the chip
It (5) is silicon chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821089133.0U CN208298814U (en) | 2018-07-10 | 2018-07-10 | A kind of novel high-power plastic packaging protection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821089133.0U CN208298814U (en) | 2018-07-10 | 2018-07-10 | A kind of novel high-power plastic packaging protection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208298814U true CN208298814U (en) | 2018-12-28 |
Family
ID=64700256
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821089133.0U Active CN208298814U (en) | 2018-07-10 | 2018-07-10 | A kind of novel high-power plastic packaging protection device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208298814U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109755139A (en) * | 2019-01-18 | 2019-05-14 | 乐山无线电股份有限公司 | A kind of manufacturing method of high-power packet routing device |
-
2018
- 2018-07-10 CN CN201821089133.0U patent/CN208298814U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109755139A (en) * | 2019-01-18 | 2019-05-14 | 乐山无线电股份有限公司 | A kind of manufacturing method of high-power packet routing device |
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