CN109216469A - It can avoid the diode of pin bending - Google Patents
It can avoid the diode of pin bending Download PDFInfo
- Publication number
- CN109216469A CN109216469A CN201710510909.5A CN201710510909A CN109216469A CN 109216469 A CN109216469 A CN 109216469A CN 201710510909 A CN201710510909 A CN 201710510909A CN 109216469 A CN109216469 A CN 109216469A
- Authority
- CN
- China
- Prior art keywords
- diode
- plastic
- chip
- sealed body
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 title claims abstract description 7
- 239000004020 conductor Substances 0.000 claims abstract description 15
- 239000002184 metal Substances 0.000 claims description 6
- 230000009467 reduction Effects 0.000 abstract description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses the diode of avoidable pin bending, including chip, conductor and plastic-sealed body, for the chip package in plastic-sealed body, the conductor is connected to chip two sides, and the plastic-sealed body both ends are provided with threaded hole, are provided with heat sink strip on the plastic-sealed body.The advantageous effect of the invention is; by the way that threaded hole is arranged; keep the pin of diode detachable; facilitate storage; it also avoids in use because often can directly be bent to pin; to generate to the stress damage of chip, and then the problem of lead to the reduction of diode electric property, the heat-sinking capability of diode is improved by the way that heat sink strip is arranged.
Description
Technical field
The invention belongs to electronic component technology fields, and in particular to can avoid the diode of pin bending.
Background technique
Diode, in electronic component, there are two the devices of electrode for a kind of tool, only an electric current are allowed to be flowed through by single direction,
Many uses are the functions using its rectification.And varactor is then used to the adjustable condenser as electronic type.It is most of
The current direction that diode has we normally referred to as " rectify " function.The most common function of diode is exactly only to allow
Electric current, by (referred to as forward bias voltage drop), blocks (referred to as reverse bias) when reversed by single direction.Therefore, diode can be thought
At the non-return valve of electronic edition.
The diode of prior art is in transport storing process, the problem of pin frangibility, in use because
Often directly to be bent to pin, so that the stress damage to chip is generated, and then lead to the reduction of diode electric property
Problem, the bad problem of heat dissipation in use.
Summary of the invention
The purpose of the present invention is to provide to solve the problems mentioned in the above background technology.
To achieve the above object, the invention provides the following technical scheme: can avoid the diode of pin bending, including core
Piece, conductor and plastic-sealed body, for the chip package in plastic-sealed body, the conductor is fixed on chip two sides, the conductor and chip
It is electrically connected, the plastic-sealed body both ends are provided with threaded hole, are provided with heat sink strip on the plastic-sealed body.
Preferably, the threaded hole bottom is provided with sheet metal, and the sheet metal and the conductor are electrically connected.
Preferably, the heat sink strip is evenly arranged on plastic-sealed body.
Technical effect and advantage of the invention: the detachable diode of the invention, having reached pin by setting threaded hole can
The effect of replacement.Pin is directly bent so that diode avoids in use, the stress of chip is damaged to generate
The problem of hurting, and then leading to the reduction of diode electric property solves diode in use by the way that heat sink strip is arranged
The bad problem of heat dissipation.
Detailed description of the invention
Fig. 1 is the structural diagram of the present invention.
Fig. 2 is structural schematic diagram of the invention.
In figure: 1 plastic-sealed body, 2 chips, 3 conductors, 4 threaded holes, 5 heat sink strips.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
The present invention provides the diodes that can avoid pin bending as shown in Fig. 1 and Fig. 2, including chip 2,3 and of conductor
Plastic-sealed body 1, the chip 2 are encapsulated in plastic-sealed body 1, and the conductor 3 is fixed on 2 two sides of chip, the conductor 3 and 2 electricity of chip
Property connection, 1 both ends of plastic-sealed body are provided with threaded hole 4, are provided with heat sink strip 5 on the plastic-sealed body 1.
Further, 4 bottom of threaded hole is provided with sheet metal, and the sheet metal and the conductor 3 are electrically connected.
Further, the heat sink strip is evenly arranged on plastic-sealed body.
The detachable diode of the present invention has achieved the effect that pin is replaceable by the way that threaded hole 4 is arranged.So that diode exists
It is avoided in use process and pin is directly bent, to generate the stress damage to chip, and then lead to diode electrical resistance
The problem of reduction of energy, solves the problems, such as that the heat dissipation of diode in use is bad by the way that heat sink strip 3 is arranged.
Finally, it should be noted that the foregoing is only a preferred embodiment of the present invention, it is not intended to restrict the invention,
Although the present invention is described in detail referring to the foregoing embodiments, for those skilled in the art, still may be used
To modify the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features,
All within the spirits and principles of the present invention, any modification, equivalent replacement, improvement and so on should be included in of the invention
Within protection scope.
Claims (3)
1. the diode of avoidable pin bending, including chip (2), conductor (3) and plastic-sealed body (1), the chip (2) are encapsulated in
In plastic-sealed body (1), the conductor (3) is fixed on chip (2) two sides, and the conductor (3) and chip (2) are electrically connected, the modeling
Envelope body (1) both ends are provided with threaded hole (4), are provided with heat sink strip (5) on the plastic-sealed body (1).
2. according to claim 1, it is characterised in that: threaded hole (4) bottom is provided with sheet metal, the sheet metal
It is electrically connected with the conductor (3).
3. according to claim 1, it is characterised in that: the heat sink strip (5) is evenly arranged on plastic-sealed body (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710510909.5A CN109216469A (en) | 2017-06-29 | 2017-06-29 | It can avoid the diode of pin bending |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710510909.5A CN109216469A (en) | 2017-06-29 | 2017-06-29 | It can avoid the diode of pin bending |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109216469A true CN109216469A (en) | 2019-01-15 |
Family
ID=64976473
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710510909.5A Pending CN109216469A (en) | 2017-06-29 | 2017-06-29 | It can avoid the diode of pin bending |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109216469A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110459518A (en) * | 2019-08-21 | 2019-11-15 | 河源创基电子科技有限公司 | A kind of Chip-diode structure |
-
2017
- 2017-06-29 CN CN201710510909.5A patent/CN109216469A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110459518A (en) * | 2019-08-21 | 2019-11-15 | 河源创基电子科技有限公司 | A kind of Chip-diode structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN216288418U (en) | Improved shaft type diode, bypass module using same and photovoltaic module junction box | |
| CN109216469A (en) | It can avoid the diode of pin bending | |
| CN103532006A (en) | Semiconductor laser | |
| CN206059901U (en) | A kind of high-power semiconductor laser | |
| CN201956345U (en) | GPP (glass passivation pellet) high-voltage diode | |
| CN204497239U (en) | Metallic packaging big current, high voltage, fast recovery diode | |
| CN207690806U (en) | A kind of solar panel | |
| CN216904275U (en) | Reverse connection and overvoltage prevention high-efficiency diode module | |
| CN208045491U (en) | A kind of Transient Suppression Diode device for vehicle electronic device | |
| CN203967081U (en) | A kind of multi-chip Transient Voltage Suppressor | |
| CN203367267U (en) | Solder dosage-self adaptive rectifier structure | |
| CN207624675U (en) | A kind of patch type moment inhibition diode chip for backlight unit | |
| CN211125645U (en) | Miniature bridge rectifier | |
| CN204029796U (en) | A kind of single-phase rectification bridge | |
| CN206179859U (en) | Packaging structure of series connection diode | |
| CN216252662U (en) | Photovoltaic bypass module and photovoltaic cell | |
| CN203522629U (en) | Photovoltaic power management module | |
| CN216413065U (en) | Bidirectional paster transient voltage suppression device | |
| CN209981205U (en) | High heat dissipation plug-in components diode | |
| CN204516534U (en) | A kind of circuit protection plate type semiconductor components and parts | |
| CN204733087U (en) | A kind of high heat conduction and heat radiation rectifier bridge structure | |
| CN209804662U (en) | SOD-323 type diode structure | |
| CN210986510U (en) | Linear L ED lamp circuit of high power factor | |
| CN204440217U (en) | Based on the power circuit of three-terminal voltage-stabilizing chip | |
| CN203746838U (en) | New type composite diode |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190115 |