CN203522629U - Photovoltaic power management module - Google Patents
Photovoltaic power management module Download PDFInfo
- Publication number
- CN203522629U CN203522629U CN201320697991.4U CN201320697991U CN203522629U CN 203522629 U CN203522629 U CN 203522629U CN 201320697991 U CN201320697991 U CN 201320697991U CN 203522629 U CN203522629 U CN 203522629U
- Authority
- CN
- China
- Prior art keywords
- diode chip
- electrode body
- backlight unit
- knot
- electrically connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005476 soldering Methods 0.000 claims abstract description 10
- 238000005245 sintering Methods 0.000 claims abstract description 5
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 230000003685 thermal hair damage Effects 0.000 abstract description 5
- 230000005855 radiation Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 238000010257 thawing Methods 0.000 description 1
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Photovoltaic Devices (AREA)
Abstract
The utility model discloses a photovoltaic power management module comprising at least two electrode bodies, wherein the right-side electrode body of two adjacent electrode bodies is provided with a diode chip, the diode chip has a P node and an N node, the P node of the diode chip is electrically connected to the right-side electrode body, the N node of the diode chip is electrically connected to the left-side electrode body through a connecting piece, the left end of the connecting piece is soldered to the left-side electrode body through reflow soldering, the right end of the connecting piece is soldered to the N node of the diode chip through reflow soldering, and the P node of the diode chip and the right-side electrode body are electrically connected together through sintering. The photovoltaic power management module has the advantage that thermal damage is not easy to occur.
Description
Technical field
The present invention relates to photovoltaic module technical field, especially relate to a kind of photo-voltaic power supply administration module.
Background technology
Photo-voltaic power supply administration module is a vitals in photovoltaic terminal box; can be simultaneously for the bypass diode module terminal box of the polysilicon photovoltaic PV panel of a plurality of assemblies, in order to protect the battery component that energy that illumination assembly produces may crested to consume when there is hot spot effect.Conventionally, the diode chip for backlight unit in this photo-voltaic power supply administration module is plugged on electric conductor by soldering or by auxiliary element, and dispels the heat by the pin of diode.Like this, the heat producing on the PN junction of this diode chip for backlight unit is difficult to dissipate, and causes diode chip for backlight unit temperature rise higher, easily damages.
Summary of the invention
The object of this invention is to provide a kind of photo-voltaic power supply administration module, it has the feature of the cause thermal damage of not being prone to.
The technical solution adopted in the present invention is: photo-voltaic power supply administration module, comprise at least 2 electrode bodies, wherein, in adjacent electrode body, the electrode body that is positioned at right side is provided with diode chip for backlight unit, this diode chip for backlight unit has P knot and N knot, and the P of this diode chip for backlight unit knot is electrically connected to this and is positioned at the electrode body on right side, simultaneously, the N knot of this diode chip for backlight unit is electrically connected to the electrode body that is positioned at left side by brace, the left end of described brace welds the electrode body that is positioned at left side by Reflow Soldering, the N that right-hand member welds this diode chip for backlight unit by Reflow Soldering ties, simultaneously, the P knot of this diode chip for backlight unit and the electrode body that is positioned at right side are electrically connected by the mode of sintering.
The outer enclosure of described diode chip for backlight unit, brace has epoxy resin layer.
The advantage that the present invention has is: be not prone to cause thermal damage.Photo-voltaic power supply administration module of the present invention improves for the connected mode of diode chip for backlight unit and corresponding electrode body.; a utmost point of this diode chip for backlight unit connects an electrode body by the mode of sintering; another utmost point connects another electrode body by the mode of Reflow Soldering; thereby reduced the connected contact resistance of all multicomponents; reach good ohmic contact resistance, and then it is less not only to produce heat, heat radiation better; and welding position is difficult for melting, and is not then prone to the phenomenon of cause thermal damage.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the present invention is further described:
Fig. 1 is the front view of embodiments of the invention.
In figure: 10, electrode body; 20, brace; 30, diode chip for backlight unit; 40, epoxy resin layer.
Embodiment
Embodiment, as shown in Figure 1: photo-voltaic power supply administration module, comprises at least 2 electrode bodies 10.The example that is connected to 2 adjacent electrode bodies 10 describes below.In this adjacent electrode body 10, the electrode body 10 that is positioned at right side is provided with diode chip for backlight unit 30, and this diode chip for backlight unit 30 has P knot and N knot.Concrete, the P knot of this diode chip for backlight unit 30 is electrically connected to this and is positioned at the electrode body 10 on right side, and the N knot of this diode chip for backlight unit 30 is electrically connected to the electrode body 10 that is positioned at left side by a connecting piece 20.Further say, the left end of this brace 20 welds by Reflow Soldering the electrode body 10, the N that right-hand member welds this diode chip for backlight unit 30 by Reflow Soldering that are positioned at left side and ties.Meanwhile, the P of this diode chip for backlight unit 30 knot and the electrode body 10 that is positioned at right side are electrically connected by the mode of sintering.Like this, reduced the connected contact resistance of all multicomponents, reach good ohmic contact resistance, and then it has been less not only to produce heat, heat radiation is better, and the difficult thawing in welding position, is not prone to the phenomenon of cause thermal damage.
Further say, the outer enclosure of this diode chip for backlight unit 30, brace 20 has epoxy resin layer 40.Like this, make this photo-voltaic power supply administration module form an integral body.
The foregoing is only the preferred embodiments of the present invention; not thereby limit the scope of the claims of the present invention; every equivalent structure or conversion of equivalent flow process that utilizes specification of the present invention and accompanying drawing content to do; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.
Claims (2)
1. photo-voltaic power supply administration module, comprise at least 2 electrode bodies (10), wherein, in adjacent electrode body (10), the electrode body (10) that is positioned at right side is provided with diode chip for backlight unit (30), this diode chip for backlight unit (30) has P knot and N knot, and the P of this diode chip for backlight unit (30) knot is electrically connected to this and is positioned at the electrode body (10) on right side, simultaneously, the N knot of this diode chip for backlight unit (30) is electrically connected to the electrode body (10) that is positioned at left side by brace (20), it is characterized in that: the left end of described brace (20) welds the electrode body (10) that is positioned at left side by Reflow Soldering, right-hand member welds the N knot of this diode chip for backlight unit (30) by Reflow Soldering, simultaneously, the P knot of this diode chip for backlight unit (30) and the electrode body (10) that is positioned at right side are electrically connected by the mode of sintering.
2. photo-voltaic power supply administration module according to claim 1, is characterized in that: the outer enclosure of described diode chip for backlight unit (30), brace (20) has epoxy resin layer (40).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320697991.4U CN203522629U (en) | 2013-11-07 | 2013-11-07 | Photovoltaic power management module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320697991.4U CN203522629U (en) | 2013-11-07 | 2013-11-07 | Photovoltaic power management module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203522629U true CN203522629U (en) | 2014-04-02 |
Family
ID=50381500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320697991.4U Expired - Lifetime CN203522629U (en) | 2013-11-07 | 2013-11-07 | Photovoltaic power management module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203522629U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104639026A (en) * | 2013-11-07 | 2015-05-20 | 苏州同泰新能源科技有限公司 | Photovoltaic power management module |
-
2013
- 2013-11-07 CN CN201320697991.4U patent/CN203522629U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104639026A (en) * | 2013-11-07 | 2015-05-20 | 苏州同泰新能源科技有限公司 | Photovoltaic power management module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104576792A (en) | Solar cell piece, solar cell assembly and bypass diode assembling method | |
| CN104467656A (en) | Photovoltaic module junction box with high heat dissipation performance | |
| CN203788238U (en) | High-heat-dissipation pencil type junction box | |
| WO2011130996A1 (en) | Solar cell assembly with multiple junction boxes | |
| CN102683446A (en) | Diode module for protecting solar photovoltaic battery component | |
| CN203522629U (en) | Photovoltaic power management module | |
| CN204257664U (en) | Diode | |
| CN103532490B (en) | Photovoltaic power source management module | |
| CN104639026A (en) | Photovoltaic power management module | |
| CN204118840U (en) | LED heat-energy recovering apparatus | |
| CN203761279U (en) | Assembling structure of a rectifying voltage regulator for motorcycle | |
| CN103856165A (en) | Crystalline silicon solar cell module provided with integrated bus bar | |
| CN204289477U (en) | Solar battery sheet, solar module | |
| CN202058742U (en) | Solar photovoltaic component | |
| CN204577425U (en) | Novel photovoltaic bypass integration module | |
| CN205430164U (en) | Photovoltaic terminal box and diode | |
| CN202940229U (en) | Photovoltaic power supply management module | |
| CN203537310U (en) | Photovoltaic power management module | |
| CN202977479U (en) | Bus bar for solar cell module | |
| CN203708192U (en) | Photovoltaic junction box | |
| CN203691340U (en) | Protective device of solar photovoltaic cell assembly | |
| CN216252662U (en) | Photovoltaic bypass module and photovoltaic cell | |
| CN205122630U (en) | Full high power density LED chip package structure of establishing ties | |
| CN204928741U (en) | Photovoltaic module terminal box of triangle columnar structure | |
| US20130269968A1 (en) | Wire Connecting Device for Solar Cell |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SUZHOU TONGTAI NEW ENERGY TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: XU GUOXING Effective date: 20140504 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20140504 Address after: Song Ling Zhen Wujiang District of Suzhou City, Jiangsu province 215000 Suzhou River Road No. 18 (Science Park) Patentee after: SUZHOU TONGTAI NEW ENERGY TECHNOLOGY Co.,Ltd. Address before: Canglang District of Suzhou City, Jiangsu province 215000 King Road No. 49 building 3 Room 303 Patentee before: Xu Guoxing |
|
| CX01 | Expiry of patent term |
Granted publication date: 20140402 |
|
| CX01 | Expiry of patent term |