CN104576792A - Solar cell piece, solar cell assembly and bypass diode assembling method - Google Patents
Solar cell piece, solar cell assembly and bypass diode assembling method Download PDFInfo
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- CN104576792A CN104576792A CN201410797701.2A CN201410797701A CN104576792A CN 104576792 A CN104576792 A CN 104576792A CN 201410797701 A CN201410797701 A CN 201410797701A CN 104576792 A CN104576792 A CN 104576792A
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/142—Energy conversion devices
- H01L27/1421—Energy conversion devices comprising bypass diodes integrated or directly associated with the device, e.g. bypass diode integrated or formed in or on the same substrate as the solar cell
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The invention provides a solar cell piece, a solar cell assembly and a bypass diode assembling method. The solar cell piece comprises a first welding strip and a second welding strip, wherein the first welding strip and the second welding strip are arranged on different surfaces of the substrate; the solar cell piece further comprises at least one diode wafer; a first electrode and a second electrode of the diode wafer are arranged on two opposite surfaces; the first electrode of the diode wafer is electrically connected to the first welding strip; the second electrode of the diode wafer is electrically connected to the second welding strip. The technical scheme has the advantages as follows: through change of a designing and assembling way of bypass diodes of the solar assembly, the corresponding bypass diode is provided for each solar cell piece, so that when part of cell pieces are shaded, only the shaded cell pieces are isolated from a main circuit, that is, the temperature when the solar assembly generates heat spots is greatly reduced, the using reliability is improved, and the maximization of output power is ensured.
Description
Technical field
The present invention relates to solar module field, particularly relate to the assemble method of a kind of solar battery sheet, solar module and bypass diode, the scope of application is crystalline silicon battery plate (P type, N-type) and corresponding assembly.
Background technology
Solar module is combined to form in mode that is in parallel or series connection by multiple solar battery sheet usually, and arranges with the form of array arrangement.For the multiple solar battery sheet be connected in series or assembly, determined by by the minimum solar battery sheet of current capacity or assembly by the electric current of its inside.Therefore, when certain sheet solar battery sheet or assembly are damaged or are blocked, the electric current handling capacity of this battery will reduce, thus reverse bias occurs, and then likely be punctured by the solar battery sheet of other normal work on loop or assembly.
In prior art, a kind of common method is the two ends adopting bypass diode to be connected in parallel on solar module; when this solar module is damaged or is blocked and becomes load; the voltage at these bypass diode two ends raises rapidly and forward conduction occurs; thus make electric current flow through bypass diode but not solar module, thus solar module is played a protective role.
To adopt 60 solar battery sheets to form a solar module in prior art, usually comprise three groups, often organize the solar battery sheet of 20 series connection, and be that the solar battery sheet often organizing series connection configures a bypass diode.Therefore each solar module needs configuration three bypass diodes, the maximum reverse bias voltage of each bypass diode is about 12V (output voltage of each solar battery sheet is 0.6V).When often to organize in 20 solar battery sheets some be damaged or be blocked time, bypass diode, by the electric current of the solar battery sheet of shunting this group 20 series connection, makes it to separate from main circuit.In engineering, need to adopt special terminal box bypass diode to be connected to the side of solar module.Also can form a solar module by 96,72 or 54 solar battery sheets, so often group comprises the solar battery sheet of 32,24 or 18 series connection.
Therefore, the cost of bypass diode assembling and maintenance is high, and difficulty is large.And each group solar module can only have one group of bypass diode, requiring very high to resistance to pressure, is prior art problem demanding prompt solution.
Summary of the invention
Technical problem to be solved by this invention is, provides the assemble method of a kind of solar battery sheet, solar module and bypass diode, more effectively can provide bypass protection to solar battery sheet.
In order to solve the problem, the invention provides a kind of solar battery sheet, comprising: substrate; First assembly welding band and the second assembly welding band, described first assembly welding band comprises multiple first welding, and described second assembly welding band comprises multiple second welding, and described first welding and the second welding are arranged on the different surfaces of described substrate; Comprise at least one diode wafer further, first electrode and second electrode of described diode wafer are arranged on relative two on the surface, and the first electrode electricity of described diode wafer is connected to described first welding, the second electrode electricity of described diode wafer is connected to described second welding.
As the optional configuration mode of one, described first welding is connected with the negative pole grid line electricity of substrate, and described second welding is connected with the positive pole grid line electricity of substrate; First electrode of described diode is positive pole, and described second electrode is negative pole.Also can be configured to described first welding be connected with the positive pole grid line electricity of substrate, described second welding is connected with the negative pole grid line electricity of substrate; First electrode of described diode is negative pole, and described second electrode is positive pole.
The advantage of technique scheme is, a bypass diode wafer can be all configured for each solar cell plate base, namely the protected mode being referred to as " a corresponding parallel diode wafer protection (ECEDP:each cell each diode protection) of solar battery sheet " or being referred to as " corresponding solar battery sheet protection (ODOCP:one diode one cell protection) of parallel diode wafer " is achieved, like this when certain a slice solar battery sheet lost efficacy, only this sheet solar battery sheet is isolated from main circuit, and the solar battery sheet that in this battery strings, all the other normally work still can generate electricity.
Connection between above-mentioned diode wafer and welding can be realized by multiple set-up mode, include but not limited to diode wafer to be arranged in the through hole in substrate, between two weldings being arranged on substrate side, and be arranged on welding side and be connected with welding by syndeton.
As the optional set-up mode of one, described first welding and the second welding are symmetrical arranged relative to described substrate, and described second welding has an extension, described diode wafer is be arranged between described extension and the first welding further, first electrode and described first welding of described diode wafer are fitted, and the second electrode and described second welding of described diode wafer are fitted.
As the optional set-up mode of one, comprise one second further and extend grid line, described second extends grid line is arranged on the surface that described substrate is provided with described second welding, and be connected with the second welding, second electrode of described diode wafer is connected to described second further by one second electrode connecting piece and extends grid line, and the first electrode of described diode wafer is connected directly to described first welding further by one first electrode connecting piece.
As the optional set-up mode of one, comprise one first further and extend grid line and one second extension grid line, described first extends grid line and second extends the different surfaces that grid line is separately positioned on described substrate, and be connected with the first welding and the second welding respectively, first electrode of described diode wafer is connected to described first further by one first electrode connecting piece and extends grid line, and the second electrode of described diode wafer is connected to described second further by one second electrode connecting piece and extends grid line.
As the optional set-up mode of one, described first welding and the second welding are symmetrical arranged relative to described substrate, and described substrate comprises a through hole further, described through hole is positioned at the region of described first welding and the covering of the second welding, described diode wafer is embedded in described through hole, and by insulating barrier and described substrate electric isolation, the first electrode and described first welding of described diode wafer are fitted, the second electrode and described second welding of described diode wafer are fitted.
Invention further provides a kind of solar module, comprise the array be made up of multiple solar battery sheet, in described array, at least comprise an above-mentioned solar battery sheet.
Invention further provides a kind of assemble method of bypass diode, comprise the steps: to provide a substrate, described substrate comprises a positive electrode surface and a negative terminal surface; At least one through hole is formed in described substrate; Insulating barrier is covered at the sidewall of described through hole; In described through hole, embed a diode wafer, the positive pole of described diode wafer is exposed to the negative terminal surface of described substrate, and the negative pole of described diode wafer is exposed to the positive electrode surface of described substrate.
In the solar module of prior art and the bypass assembling of diode wafer, the whether conducting of bypass diode wafer, whether the bias voltage that solar battery sheet itself of just looking at problem produces is enough large, and do not need to produce higher back bias voltage to resist the malleation of the solar battery sheet generation that other normally work in battery strings.In such as 60 general components, problem solar battery sheet will produce the malleation that namely overcomes 19 solar battery sheets simultaneously and make diode wafer conducting voltage.The conducting of series diode wafer to be made like this, need problem solar battery sheet to produce and be at least greater than above-mentioned back bias voltage (this means that problem solar battery sheet can flow through larger reverse current using as load, produce more heat).In like manner, want the solar components string diode wafer conducting making 72 polycrystalline, problem solar battery sheet will produce higher bias voltage, and the voltage overcoming 23 solar battery sheets just can make diode wafer conducting protection problem solar battery sheet.
And each solar battery sheet in the present invention is by a diode wafer parallel connection, such assembly has has more responsive hot spot responding ability than traditional solar components.The shielded area of generation hot spot tests the assembly also demonstrating summary of the invention has less shielded area can start the conducting of bypass diode wafer.(the hot spot shielded area of solar battery sheet and solar battery sheet efficiency etc. have correlation, can only give a value range)
| Invention components | 60 traditional components | 72 traditional components | |
| The minimum shielded area threshold value that diode is started | 5％ | 10％ | 15％ |
| When hot spot produces, cell piece shielded area | 10％ | 15％+ | 20％- |
| When hot spot produces, assembly maximum temperature | 52.3 | 120 | 130 |
| When hot spot produces, bypass diode maximum temperature | 43 | 40～50 | 40～50 |
Therefore, the invention has the advantages that, by changing the design and assembly mode of solar module bypass diode wafer, for each solar battery sheet all arranges corresponding bypass diode wafer, can ensure when part solar battery sheet is subject to blocking like this, only the solar battery sheet be blocked is isolated from main circuit, and the solar battery sheet that in this solar cell string, all the other normally work still can generate electricity, assembly temperature during great reduction solar module generation hot spot, improve the dependability of assembly, the maximization of Assurance component power output simultaneously, therefore be a kind of more effective protected mode, and because diode wafer and substrate are semi-conducting material, therefore between diode wafer and welding, the reinforcing at interface and the reinforcing between substrate and welding can adopt same process to complete, therefore can not increase extra reinforcement material and reinforcement process simultaneously.And adopt without the need to arranging diode wafer again in the terminal box of this assembly, therefore the outlet of assembly is more convenient.
Accompanying drawing explanation
It is the structural representation of the first embodiment of solar battery sheet of the present invention shown in accompanying drawing 1A;
It is the equivalent circuit diagram of the structure shown in accompanying drawing 1A shown in accompanying drawing 1B;
Be adopt the series connection of solar battery sheet shown in accompanying drawing 1A to form battery strings shown in accompanying drawing 2A, and then form the embodiment schematic diagram of solar components;
It is the equivalent circuit diagram of the structure shown in accompanying drawing 2A shown in accompanying drawing 2B;
It is the structural representation of the second embodiment of solar battery sheet of the present invention shown in accompanying drawing 3A and 3B;
It is the structural representation of the 3rd embodiment of solar battery sheet of the present invention shown in accompanying drawing 4A and 4B;
It is the structural representation of the 4th embodiment of solar battery sheet of the present invention shown in accompanying drawing 5;
It is the step schematic diagram of the embodiment of construction manufacturing method shown in accompanying drawing 5 shown in accompanying drawing 6;
Accompanying drawing 7A to accompanying drawing 7E is the process schematic representation of method shown in accompanying drawing 6.
Embodiment
Elaborate below in conjunction with the embodiment of accompanying drawing to the assemble method of solar battery sheet provided by the invention, solar module and bypass diode.
In following embodiment, described first welding is configured to negative pole welding by unification, and be connected with the negative pole grid line electricity of substrate, described second welding is configured to positive pole welding, is connected with the positive pole grid line electricity of substrate; First electrode of described diode wafer is configured to positive pole, and described second electrode is configured to negative pole.
In other embodiment, described first welding can also be configured to positive pole welding, be connected with the positive pole grid line electricity of substrate, described second welding is configured to negative pole welding, is connected with the negative pole grid line electricity of substrate; First electrode of described diode wafer is configured to negative pole, and described second electrode is configured to positive pole.
First the first embodiment of solar battery sheet of the present invention is provided by reference to the accompanying drawings.
With reference to the structural representation shown in accompanying drawing 1A being this embodiment.Described in this embodiment, solar battery sheet 1 comprises substrate 10, and the different surfaces of substrate 10 arranges the first welding 11 and the second welding 12 respectively, and described first welding 11 and the second welding 12 are symmetrical arranged relative to described substrate.Described solar battery sheet 1 can be N-type battery slice or P type cell piece, makes solar battery sheet in accompanying drawing 1A for P-type silicon sheet.Described first welding 11 is connected with negative pole grid line (not indicating in the accompanying drawing) electricity of substrate 10, and described second welding 12 is connected with positive pole grid line (not indicating in the accompanying drawing) electricity of substrate 10.Described second welding 12 has extension (not indicating in accompanying drawing), and namely the second welding 12 extends to outside the edge of substrate 10.Namely first welding 11 itself needs to extend and is connected to the positive pole grid line of another solar battery sheet contiguous.The material of described first welding 11 and the second welding 12 is the metal that can weld with grid line.One diode wafer 13 is arranged between the second welding 12 extension and the first welding 11 further, and the positive pole 131 of described diode wafer 13 is fitted with described first welding 11, and negative pole 132 and described second welding 12 of described diode wafer 13 are fitted.The mode that described laminating can adopt welding or conductive tape to bind realizes.Described first welding 11 and the second welding 12 can be one group also can many groups, if many groups should have structure described in a group configuration cost embodiment at least.Described diode wafer 13 refers to directly from the laminated structure comprising a diode wafer structure under wafer cutting, directly uses not through encapsulation.Wafer and substrate 10 for making diode wafer 13 have approximate thickness usually, therefore can ensure that the clamp structure of the block form shown in Figure 1A can realize.Because diode wafer 13 and substrate 10 are semi-conducting material, therefore between diode wafer 13 and welding, the reinforcing at interface and the reinforcing between substrate 10 and welding can adopt same process to complete simultaneously, therefore can not increase extra reinforcement material and reinforcement process.Described diode wafer 13 is selected from any one in rectangle, circle, ellipse and polygon along the shape of cross section perpendicular to page.
As shown in fig. 1b, solar battery sheet 1 and diode wafer 13 are in parallel, thus make diode wafer 13 play the effect of bypass diode for independent a slice solar battery sheet 1 for the equivalent circuit diagram of the structure shown in accompanying drawing 1A.
In other embodiment, multiple diode wafer 13 can be clamped side by side, to strengthen the handling capacity of by-pass current between the first welding 11 and the second welding 12.
Be adopt solar battery sheet 1 shown in accompanying drawing 1A to connect to form battery strings shown in accompanying drawing 2A, and then form the embodiment schematic diagram of solar components.The first welding 11 on the substrate 10 of solar battery sheet 1 is same root bead bands with the second welding 202 on solar battery sheet 20 substrate 200 closed on, the first welding 211 on the substrate 210 of the solar battery sheet 21 that opposite side closes on is then same root bead bands with the second welding 12 on substrate 10, thus forms the battery strings of series connection.And solar battery sheet 20 and solar battery sheet 21 also can have the diode wafer 203 and 213 of similar parallel connection.
As shown in Figure 2 B, each solar battery sheet all arranges corresponding bypass diode to the equivalent circuit diagram of structure shown in accompanying drawing 2A.Can ensure like this, when certain a slice solar battery sheet lost efficacy, only this sheet solar battery sheet to be isolated from main circuit, and the solar battery sheet that in this battery strings, all the other normally work still can generate electricity.And due to a bypass diode only corresponding a slice solar battery sheet, therefore the requirement of withstand voltage of this bypass diode is greatly reduced.For silica-based solar cell, the maximum reverse bias voltage of this bypass diode is only 0.6V.Because the market price of diode is comformity relation with its maximum reverse bias value, although therefore arrange for a bypass diode relative to a string solar battery sheet, the number of diode increases to some extent, and the cost of single diode greatly reduces.And the area of plane of the diode wafer do not encapsulated is very little, only there is several square millimeter, therefore can be arranged in the space between solar cell chip arrays, the volume of whole solar module can not be increased.
Next the second embodiment of solar battery sheet of the present invention is provided by reference to the accompanying drawings.
Shown in accompanying drawing 3A and 3B, it is the structural representation of solar battery sheet described in this embodiment, comprise substrate 30, the different surfaces of substrate 30 arranges the first welding 31 and the second welding 32 respectively, wherein accompanying drawing 3A is the view from the first welding 31 side, and accompanying drawing 3B is the view from the second welding 32 side.In above-mentioned two views, the structure of opposite back side side is all represented by dotted lines.Described first welding 31 and the second welding 32 can be symmetrical arranged relative to described substrate 30.Described first welding 31 is connected with the negative pole grid line electricity of substrate 30, and described second welding 32 is connected with the positive pole grid line electricity of substrate 30.
Shown in accompanying drawing 3B, the surface at described second welding 32 place comprises one second further and extends grid line 321, and described second extends grid line 321 is arranged on the surface that described substrate 30 is provided with described second welding 32, and is connected with the second welding 32.Continue with reference to shown in accompanying drawing 3B, the negative pole of one diode wafer 33 is further by one second electrode connecting piece 342 (i.e. negative straps), be connected to described second and extend grid line 321, and then be connected to the positive pole grid line of the second welding 32 and substrate 30.Described second extends grid line 321 can adopt bonding jumper to be attached to substrate 30 surface, and the mode of coated with conductive slurry also can be adopted to be coated on the surface of substrate 30.Shown in accompanying drawing 3A, the positive pole of described diode wafer 33, further by one first electrode connecting piece 341 (i.e. positive strap), is connected directly to described first welding 31, and then is connected to the negative pole grid line of substrate 30.The material of described first electrode connecting piece 341 (i.e. positive strap) and the second electrode connecting piece 342 (i.e. negative straps) can be metal or other electric conducting material, can be identical with the welding material on substrate 30 surface.
Described second extension grid line 321 can be republished substrate positive electrode surface (being also the surface at the second welding 32 place) by screen mesh printing plate adjustment further.Print off overlap joint line by silk screen printing and extend grid line 321 as second, so that and the first electrode connecting piece 341 (i.e. positive strap) welding.
Because the different side of each leisure of two grid lines of solar battery sheet arbitrary in battery strings is connect (can with reference to shown in accompanying drawing 2A) by same root bead band with the offside grid line of cell piece closed on, thus every side all at least one welding should extend beyond the border of cell piece.Namely this embodiment extends the situation beyond the border of cell piece for the first welding 31.Second welding 32 then extends beyond cell piece at the other end of cell piece, if arrange diode wafer 33 in this side, the positive pole in only above-mentioned embodiment need being described and negative pole are exchanged.
Described diode wafer 33 refers to directly from the laminated structure comprising a diode structure under wafer cutting, directly uses not through encapsulation.Wafer and substrate 30 for making diode wafer 33 have approximate thickness usually, therefore can ensure that the clamp structure of the substrate 30 shown in accompanying drawing 3A and 3B and diode wafer 33 block form can realize smoothly.Because diode wafer 33 and substrate 30 are semi-conducting material, therefore between diode wafer 33 and two braces, the reinforcing at interface and the reinforcing between substrate 30 and two weldings can adopt same process to complete simultaneously, therefore can not increase extra reinforcement material and reinforcement process.
In other embodiment, multiple diode wafer 33 can be set up in parallel, and connected with welding electricity by identical or different braces in the mode of series connection or parallel connection, the mode of series connection can increase the voltage endurance capability of bypass, and mode in parallel can strengthen the electric current handling capacity of bypass.
The equivalent circuit diagram of said structure and the structural representation after forming solar module and equivalent circuit diagram similar with the first embodiment, therefore no longer to describe.Similar with last embodiment, structure provided in the present embodiment can ensure when certain a slice solar battery sheet lost efficacy equally, only this sheet battery is isolated from main circuit, and the solar battery sheet that in this battery strings, all the other normally work still can generate electricity, and the area of plane of the diode wafer do not encapsulated is very little, only there is several square millimeter, and the length of brace also can be arranged to several millimeter and namely can meet insulating requirements, therefore can be arranged in the space between solar cell chip arrays, the volume of whole solar module can not be increased.
Next the 3rd embodiment of solar battery sheet of the present invention is provided by reference to the accompanying drawings.
Shown in accompanying drawing 4A and 4B, it is the structural representation of solar battery sheet described in this embodiment.Comprise substrate 40, the different surfaces of substrate 40 arranges the first welding 41 and the second welding 42 respectively, and wherein accompanying drawing 4A is the view from the first welding 41 side, and accompanying drawing 4B is the view from the second welding 42 side.In above-mentioned two views, the structure of opposite back side side is all represented by dotted lines.Described first welding 41 and the second welding 42 can be symmetrical arranged relative to described substrate 40.Described first welding 41 is connected with the negative pole grid line electricity of substrate 40, and described second welding 42 is connected with the positive pole grid line electricity of substrate 40.
Shown in accompanying drawing 4A, the surface at described first welding 41 place comprises one first further and extends grid line 411, described first extends grid line 411 is arranged on the surface that described substrate 40 is provided with described first welding 41, and be connected with the first welding 41, the positive pole of a diode wafer 43 is connected to described first further by one first electrode connecting piece 441 (i.e. positive strap) and extends grid line 411.Shown in accompanying drawing 4B, the surface at described second welding 42 place comprises one second further and extends grid line 421, described second extends grid line 421 is arranged on the surface that described substrate 40 is provided with described second welding 42, and be connected with the second welding 42, the negative pole of diode wafer 43 is connected to described second by one second electrode connecting piece 442 (i.e. negative straps) and extends grid line 421.Described first extension grid line 411 and the second extension grid line 421 can adopt bonding jumper to be attached to substrate 40 surface, and the mode of coating (silk screen printing) electrocondution slurry also can be adopted to be formed at the surface of substrate 40.The material of described first electrode connecting piece 441 (i.e. positive strap) and the second electrode connecting piece 442 (i.e. negative straps) can be metal or other electric conducting material, can be identical with the welding material on substrate 40 surface.In order to improve the insulation property between the first electrode connecting piece 441 (i.e. positive strap) and the second electrode connecting piece 442 (i.e. negative straps), in this embodiment, first one end that electrode connecting piece 441 (i.e. positive strap) is being connected with diode wafer 43 comprises a bending further, to make between the body part of the body part of the second electrode connecting piece 442 (i.e. negative straps) and the first electrode connecting piece 441 (i.e. positive strap), there is a distance L, to improve insulating properties between the two.
Two weldings due to solar battery sheet need to connect (can with reference to shown in accompanying drawing 2A) at not homonymy with the solar battery sheet closed on separately, thus every side all at least one welding should extend beyond the border of solar battery sheet.Namely this embodiment extends the situation beyond the border of solar battery sheet for the second welding.Extend the situation beyond solar battery sheet for the first welding, the positive pole in only above-mentioned embodiment need being described and negative pole are exchanged.
Described diode wafer 43 refers to directly from the laminated structure comprising a diode structure under wafer cutting, directly uses not through encapsulation.Wafer and substrate 40 for making diode wafer 43 have approximate thickness usually, therefore can ensure that the clamp structure of the substrate 40 shown in accompanying drawing 4A and 4B and diode wafer 43 block form can realize smoothly.Because diode wafer 43 and substrate 40 are semi-conducting material, therefore between diode wafer 43 and two braces, the reinforcing at interface and the reinforcing between substrate 40 and two weldings can adopt same process to complete simultaneously, therefore can not increase extra reinforcement material and reinforcement process.
In other embodiment, multiple diode wafer 43 can be set up in parallel, and connected with welding electricity by identical or different braces in the mode of series connection or parallel connection, the mode of series connection can increase the voltage endurance capability of bypass, and mode in parallel can strengthen the electric current handling capacity of bypass.
The equivalent circuit diagram of said structure and the structural representation after forming solar module and equivalent circuit diagram similar with the first embodiment, therefore no longer to describe.Similar with last embodiment, structure provided in the present embodiment can ensure when certain a slice solar battery sheet lost efficacy equally, only this sheet battery is isolated from main circuit, and the solar battery sheet that in this battery strings, all the other normally work still can generate electricity, and the area of plane of the diode wafer do not encapsulated is very little, only there is several square millimeter, and the length of brace also can be arranged to several millimeter and namely can meet insulating requirements, therefore can be arranged in the space between solar cell chip arrays, the volume of whole solar module can not be increased.
Next the 4th embodiment of solar battery sheet of the present invention is provided by reference to the accompanying drawings.
With reference to shown in accompanying drawing 5, it is the structural representation of solar battery sheet described in this embodiment.Comprise substrate 50, the different surfaces of substrate 50 arranges the first welding 51 and the second welding 52 respectively, and described first welding 51 and the second welding 52 are symmetrical arranged relative to described substrate.Described first welding 51 is connected with the negative pole grid line electricity of substrate 50, and described second welding 52 is connected with the positive pole grid line electricity of substrate 50.Described substrate 50 comprises further a through hole (not indicating in accompanying drawing), described through hole is positioned at described first welding 51 and the common region covered of the second welding 52, one diode wafer 53 is embedded in described through hole, and by insulating barrier 54 and described substrate 50 electric isolation.Described insulator filler 54 adopts elastomeric material to make, such as, can be any one in infrared curing glue, ultra-violet curing glue and heat-curable glue, to ensure to be closely cooperated by described insulating barrier 54 between described diode wafer 53 and described through hole.Negative pole and described second welding 52 of described diode wafer 53 are fitted, and positive pole and described first welding 51 of described diode wafer 53 are fitted.The position of described through hole, can reduction the taking substrate 50 surface of minimum degree between the first welding 51 and the second welding 52, do not have an impact to efficiency of light absorption.
Described diode wafer 53 refers to directly from the laminated structure comprising a diode structure under wafer cutting, directly uses not through encapsulation.Wafer and substrate 50 for making diode wafer 53 have approximate thickness usually, therefore can ensure the diode wafer 53 shown in accompanying drawing 5 be embedded in substrate 50 after surface be flat.Because diode wafer 53 and substrate 50 are semi-conducting material, therefore between diode wafer 53 and two braces, the reinforcing at interface and the reinforcing between substrate 50 and two weldings can adopt same process to complete simultaneously, therefore can not increase extra reinforcement material and reinforcement process.
In other embodiment, multiple through hole can be set up in parallel to arrange multiple diode wafer 53 between the first welding 51 and the second welding 52, to strengthen the handling capacity of by-pass current.
The equivalent circuit diagram of said structure and the structural representation after forming solar module and equivalent circuit diagram similar with the first embodiment, therefore no longer to describe.Similar with last embodiment, structure provided in the present embodiment can ensure when certain a slice solar battery sheet lost efficacy equally, only this sheet battery is isolated from main circuit, and the solar battery sheet that in this battery strings, all the other normally work still can generate electricity, and this diode wafer is arranged on solar battery sheet inside, the volume of whole solar module therefore can not be increased.
Next the embodiment of structure fabrication mode described in above-mentioned 4th embodiment is provided by reference to the accompanying drawings.Accompanying drawing 6 is step schematic diagrames of this embodiment, comprising: step S60, provides a substrate, and described substrate comprises a positive electrode surface and a negative terminal surface; Step S61, forms at least one through hole in described substrate; Step S62, covers insulating barrier at the sidewall of described through hole; Step S63, embeds a diode wafer in described through hole, and the positive pole of described diode wafer and negative pole are exposed to positive electrode surface and the negative terminal surface of described substrate respectively; Step S64, the substrate surface in the relative both sides of described through hole forms welding.
Shown in accompanying drawing 7A, with reference to S60, provide a substrate 70, described substrate 70 comprises a positive electrode surface and a negative terminal surface.Described substrate 70 inside should comprise one for the vertical PN junctions structure (not indicating in accompanying drawing) of solar cell, and this PN junction structure can adopt any one normal method in prior art to be formed.Vertical PN junction defines P type surface and positive electrode surface in substrate 70, and N-type surface and negative terminal surface.
Shown in accompanying drawing 7B, refer step S61, forms at least one through hole 71 in described substrate 70.Form the method that the method for through hole 71 can adopt laser ablation, plasma etching or chemical corrosion.
Shown in accompanying drawing 7C, refer step S62, covers insulating barrier 74 at the sidewall of described through hole 71.Described insulating barrier 74 can adopt elastomeric material to make, to ensure to be closely cooperated by described insulating barrier 74 between the diode wafer of follow-up embedding and described through hole 71.In order to make the combination between the diode wafer of follow-up embedding and described insulating barrier 74 more firm, preferably adopting solidification glue to make described insulating barrier, comprising any one in infrared curing glue, ultra-violet curing glue and heat-curable glue.
Shown in accompanying drawing 7D, refer step S63, embeds a diode wafer 73 in described through hole 71, and the positive pole of described diode wafer 73 is exposed to the negative terminal surface of described substrate 70, and the negative pole of described diode wafer 73 is exposed to the positive electrode surface of described substrate 70.Closely cooperated by described insulating barrier 74 between described diode wafer 73 and described through hole 71.
Make in the execution mode of described insulating barrier 74 at employing solidification glue, the described insulating barrier 74 of solidification should be comprised further with the step of fixing described diode wafer 73 after this step.
So far, diode wafer 73 has been inserted in substrate 70, as long as and formed between substrate 70 electricity connect, namely can play the effect of bypass diode.The mode forming electricity connection has a lot, and a kind of direct mode is the method adopting accompanying drawing 7E and step S64, forms the first welding 71 and the second welding 72 at the substrate surface of the relative both sides of described through hole, and direct and diode wafer 73 is fitted.In other embodiment, also a distance can be set by between welding and through hole 71, and by intercell connector, both electricity be connected, peripheral conductive structure can also be formed.
The above is only the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (11)
1. a solar battery sheet, comprising:
Substrate;
First assembly welding band and the second assembly welding band, described first assembly welding band comprises multiple first welding, and described second assembly welding band comprises multiple second welding, and described first welding and the second welding are arranged on the different surfaces of described substrate;
It is characterized in that, comprise at least one diode wafer further, first electrode and second electrode of described diode wafer are arranged on relative two on the surface, and the first electrode electricity of described diode wafer is connected to described first welding, the second electrode electricity of described diode wafer is connected to described second welding.
2. solar battery sheet according to claim 1, it is characterized in that, described first welding and the second welding are symmetrical arranged relative to described substrate, and described second welding has an extension, described diode wafer is be arranged between described extension and the first welding further, first electrode and described first welding of described diode wafer are fitted, and the second electrode and described second welding of described diode wafer are fitted.
3. solar battery sheet according to claim 2, is characterized in that, within the edge, extension of described second welding is positioned at described diode wafer edge.
4. solar battery sheet according to claim 1, it is characterized in that, comprise one second further and extend grid line, described second extends grid line is arranged on the surface that described substrate is provided with described second welding, and be connected with the second welding, second electrode of described diode wafer is connected to described second further by one second electrode connecting piece and extends grid line, and the first electrode of described diode wafer is connected directly to described first welding further by one first electrode connecting piece.
5. solar battery sheet according to claim 1, it is characterized in that, comprise one first further and extend grid line and one second extension grid line, described first extends grid line and second extends the different surfaces that grid line is separately positioned on described substrate, and be connected with the first welding and the second welding respectively, second electrode of described diode wafer is connected to described second further by one second electrode connecting piece and extends grid line, and the first electrode of described diode wafer is connected to described first further by one first electrode connecting piece and extends grid line.
6. solar battery sheet according to claim 1, it is characterized in that, described first welding and the second welding are symmetrical arranged relative to described substrate, and described substrate comprises a through hole further, described through hole is positioned at the region of described first welding and the covering of the second welding, described diode wafer is embedded in described through hole, and by insulating barrier and described substrate electric isolation, first electrode and described first welding of described diode wafer are fitted, and the second electrode and described second welding of described diode wafer are fitted.
7. a solar module, comprises the array be made up of multiple solar battery sheet, it is characterized in that, at least comprises the solar battery sheet described in a Claims 1 to 5 any one in described array.
8. an assemble method for bypass diode, is characterized in that, comprises the steps:
There is provided a substrate, described substrate comprises a positive electrode surface and a negative terminal surface;
At least one through hole is formed in described substrate;
Insulating barrier is covered at the sidewall of described through hole;
In described through hole, embed a diode wafer, the positive pole of described diode wafer is exposed to the negative terminal surface of described substrate, and the negative pole of described diode wafer is exposed to the positive electrode surface of described substrate.
9. the assemble method of bypass diode according to claim 7, is characterized in that, described insulating barrier adopts elastomeric material to make, and is closely cooperated between described diode wafer and described through hole by described elastomeric material.
10. the assemble method of bypass diode according to claim 7, is characterized in that, described insulating barrier adopts solidification glue to make, and after the step embedding diode wafer, comprises the described insulating barrier of solidification further with the step of fixing described diode wafer.
The assemble method of 11. bypass diodes according to claim 7, is characterized in that, the substrate surface being included in the relative both sides of described through hole further forms the step of the first welding and the second welding.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410797701.2A CN104576792A (en) | 2014-12-19 | 2014-12-19 | Solar cell piece, solar cell assembly and bypass diode assembling method |
| JP2015134313A JP2016119445A (en) | 2014-12-19 | 2015-07-03 | Solar cell, solar cell module, and assembly method of bypass diode |
| PCT/CN2015/097933 WO2016095859A1 (en) | 2014-12-19 | 2015-12-18 | Solar cell slice, solar cell assembly and assembling method for bypass diode |
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| CN201410797701.2A CN104576792A (en) | 2014-12-19 | 2014-12-19 | Solar cell piece, solar cell assembly and bypass diode assembling method |
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| CN104576792A true CN104576792A (en) | 2015-04-29 |
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| CN201410797701.2A Pending CN104576792A (en) | 2014-12-19 | 2014-12-19 | Solar cell piece, solar cell assembly and bypass diode assembling method |
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| Country | Link |
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| JP (1) | JP2016119445A (en) |
| CN (1) | CN104576792A (en) |
| WO (1) | WO2016095859A1 (en) |
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Also Published As
| Publication number | Publication date |
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| JP2016119445A (en) | 2016-06-30 |
| WO2016095859A1 (en) | 2016-06-23 |
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