CN107086208A - A kind of diode bars band acted on bypass - Google Patents
A kind of diode bars band acted on bypass Download PDFInfo
- Publication number
- CN107086208A CN107086208A CN201710341291.4A CN201710341291A CN107086208A CN 107086208 A CN107086208 A CN 107086208A CN 201710341291 A CN201710341291 A CN 201710341291A CN 107086208 A CN107086208 A CN 107086208A
- Authority
- CN
- China
- Prior art keywords
- diode
- band
- diode bars
- bars band
- volume
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005611 electricity Effects 0.000 claims abstract description 9
- 238000009413 insulation Methods 0.000 claims abstract description 7
- 230000001681 protective effect Effects 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 claims description 3
- 229920002545 silicone oil Polymers 0.000 claims description 3
- 238000004804 winding Methods 0.000 claims description 3
- 229910000838 Al alloy Inorganic materials 0.000 claims description 2
- 229910001021 Ferroalloy Inorganic materials 0.000 claims description 2
- DYAHQFWOVKZOOW-UHFFFAOYSA-N Sarin Chemical compound CC(C)OP(C)(F)=O DYAHQFWOVKZOOW-UHFFFAOYSA-N 0.000 claims description 2
- 239000002390 adhesive tape Substances 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 239000004411 aluminium Substances 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000000108 ultra-filtration Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 238000005516 engineering process Methods 0.000 abstract description 6
- 230000015556 catabolic process Effects 0.000 abstract 1
- 238000006731 degradation reaction Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 4
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000001010 compromised effect Effects 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004643 material aging Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000010257 thawing Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/044—PV modules or arrays of single PV cells including bypass diodes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
The invention discloses a kind of diode bars band; the diode bars band is layer structure; layered structure from top to bottom includes the diaphragm with insulation function, the band being made up of multiple Diode series, the release liners with stickup, the conductive tape of electric action and with protective effect.The diode bars band that the present invention is provided, volume, which can be made, is used for solar photovoltaic assembly volume to volume production technology.Produced, greatly improved than manual assembly bypass diode efficiency using the diode bars band of the present invention.When cell piece breaks down or blocked hair point efficiency degradation or do not generate electricity, the electric current allowed produced by other cell pieces flows out from diode, makes solar components continue to generate electricity, will not be gone wrong because of certain a piece of cell piece and produce the obstructed situation of electricity-generating circuit.The present invention is solved in photovoltaic module production process, the problem of single diode is difficult to incorporate between chip, is simplified production technology, is improved production efficiency.
Description
Technical field
The present invention relates to solar cell module technical field, prefabricated two pole of more particularly to a kind of web-like packing forms
Streaking tube.
Background technology
The development lived with people, the application of photovoltaic module is more and more extensive.In actual applications, if photovoltaic module by
Dry plate cell piece is composed in series.In order to which each piece of cell piece reached in higher photoelectric transformation efficiency, same block assembly all must
With similar characteristic.In use, in fact it could happen that one or Battery pack mismatch, such as shadowed layer, cell piece go out
Show crackle, internal Joint failure etc., referred to as hot spot effect.May be compared with due to occurring the serious local local temperature of hot spot effect
Height, causes component regional area to burn or formed blackening, solder joint thawing, encapsulating material aging, glass rupture, welding corrosion etc. forever
Long property destruction, the safety and reliability to component causes great hidden danger.It has been proposed that, each cell piece should be in parallel one
Bypass diode, then can reduce the influence of hot spot effect to greatest extent, but to being set on existing solar photovoltaic assembly
Diode is put, mounting process is complicated, and efficiency is low, can consume substantial amounts of human cost, it is impossible to reach current flexible solar photovoltaic
The requirement of component continuous production.
The content of the invention
It is an object of the invention to provide a kind of diode bars band, its is rollable coiled, is produced for flexible solar
Volume to volume technique in journey, is that solar panel fast and stable installs bypass diode.
In order to solve the above technical problems, the invention discloses a kind of diode bars band, the diode bars band is stratiform knot
Structure, layered structure from top to bottom includes the diaphragm with insulation function, the band being made up of multiple Diode series, tool
There are stickup, the conductive tape of electric action and the release liners with protective effect.
Further, the band that is made up of multiple Diode series be by multiple chip diodes and tinsel according to
It is secondary to be in series.The insertion of each diode is welded between two panels tinsel, each diode polarity court in band
To consistent.Tinsel plays a part of neighboring diode of connecting, while when the diode conducts, tinsel, which is played, distributes heat
The effect of amount.Chip diode and electronic component, with high withstand voltage electrical characteristic（Preferably greater than 1500V）
Further, tinsel material includes copper, iron, aluminium, copper alloy, ferroalloy, aluminum alloy materials, tinsel thickness
0.3-0.8mm。
Further, the material of the diaphragm with insulation function includes PET, sarin resin or PA, and its thickness is
0.1-0.3mm。
Further, the conductive tape is arranged on the centre position between adjacent diode, is used for and solar panels
Main grid line electrode connection, conductive tape thickness be 0.1-0.5mm.
Further, the release liners are silicone oil paper, can both cling conductive tape, be easy to separate both again, release
Thickness of paper degree is 0.5-1mm, and release liners, which are internally formed, can accommodate the groove of diode.
Further, the volume is formed by above-mentioned diode bars tape wrapping, and the winding diameter of the volume is more than or equal to
500mm。
Further, it is a kind of to be used to above-mentioned diode roll of strip prepare the preparation side with bypass flexible photovoltaic component
Method, by the conductive tape in the centre position being arranged between adjacent diode of the volume and the main grid line electrode of solar panels
Connect to form bypass diode.
Further, the distance of the two neighboring conductive tape can be the integral multiple of battery unit main gate line distance.
It can select in parallel with a cell piece, each cell piece can thus be protected.
Can also n it is in parallel, the battery pack of n cell piece is protected with realizing.
The diode bars band that the present invention is provided, volume, which can be made, is used for solar photovoltaic assembly volume to volume production technology.Make
Produced, greatly improved than manual assembly bypass diode efficiency, while such structure with the diode bars band of the present invention
Easily prepare and install, stratiform global design can ensure that electronic component is not compromised, diode bars band is used for solar energy
During volt the manufacturing of component, particularly flexible photovoltaic component, play a part of bypass diode, when heat occurs in cell piece
When spot effect can not generate electricity, the electric current allowed produced by other cell pieces flows out from diode, makes solar components continue to generate electricity, no
Can be because certain a piece of cell piece goes wrong and produces the obstructed situation of electricity-generating circuit.The present invention solves photovoltaic module and produced
Cheng Zhong, the problem of single diode is difficult to incorporate between chip, simplifies production technology, improves production efficiency.
Brief description of the drawings
Fig. 1 is the layer structure schematic diagram of the diode bars band of the present invention.
Fig. 2 is the structural representation of diode bars band of the present invention.
Fig. 3 is diode bars band of the present invention and solar cell connection diagram.
Embodiment
To make the objects, technical solutions and advantages of the present invention clearer, clear and definite, develop simultaneously embodiment pair referring to the drawings
The present invention is further elaborated.
A kind of diode bars band, the diode bars band is layer structure, and layered structure from top to bottom includes having
The diaphragm 1 of insulation function, the band 2 being made up of multiple Diode series, the and of conductive tape 3 with stickup, electric action
Release liners 4 with protective effect.The band 2 being made up of multiple Diode series is by multiple chip diodes 21 and gold
Category paillon foil 22 is sequentially connected in series and formed, and the insertion of each diode is welded between two panels tinsel, in band each two
Pole pipe polarity is towards unanimously, and the material of tinsel 21 is copper alloy, tinsel thickness 0.5mm；Tinsel 21 and diode
Junction 24 is more roomy than tinsel 21, and to increase the area of dissipation of diode, the diaphragm 1 with insulation function is
PET materials, its thickness is 0.2.The conductive tape 3 is arranged on the centre position between adjacent diode, is used for and the sun
The electrode of main gate line 5 connection of energy plate, conductive tape thickness is 0.4mm, and the release liners are silicone oil paper, can both cling conducting resinl
Band, is easy to separate both again, and release liners thickness is 0.8mm, and release liners, which are internally formed, can accommodate the groove of diode, work as outside
Pressure is deformed upon, and formation can accommodate the groove of diode, further to produce protective effect.By above-mentioned layered structure rolled
Diode roll of strip is formed, the winding diameter of the volume is 600mm, by being arranged between adjacent diode for the volume
The conductive tape in centre position and the main grid line electrode of solar panels connect to form bypass diode, the two neighboring conduction
The distance of adhesive tape can be 3 times of adjacent cell main gate line distance.Battery pack to 3 cell pieces is protected, when 3
The battery pack of adjacent battery composition, when there is hot spot effect and can not generated electricity in one of them, the electricity allowed produced by other cell pieces
Stream makes solar components continue to generate electricity from diode outflow, will not be because certain a piece of cell piece goes wrong and produces generating electricity
The obstructed situation in road.The present invention is solved in photovoltaic module production process, the problem of single diode is difficult to incorporate between chip,
Production technology is simplified, production efficiency is improved.
Above example is only used for that the present invention is specifically described, and it does not play any to protection scope of the present invention
Restriction effect, protection scope of the present invention is determined by claim.According to techniques known and disclosed in this invention
Technical scheme, can be derived or association goes out many flexible programs, all these flexible programs, also be regarded as be the present invention protection
Scope.
Claims (9)
1. a kind of diode bars band acted on bypass, it is characterised in that the diode bars band is layer structure, the layer
Shape structure from top to bottom includes the diaphragm with insulation function, the band being made up of multiple Diode series, with pasting, lead
The conductive tape of electro ultrafiltration and the release liners with protective effect.
2. diode bars band as claimed in claim 1, it is characterised in that the band that is made up of multiple Diode series is
Be sequentially connected in series and formed by multiple chip diodes and tinsel, each diode insertion be welded on two panels tinsel it
Between, each diode polarity in band is towards unanimously.
3. diode bars band as claimed in claim 1 or 2, it is characterised in that tinsel material includes copper, iron, aluminium, copper and closed
Gold, ferroalloy, aluminum alloy materials, tinsel thickness are 0.3-0.8mm.
4. diode bars band as claimed in claim 3, it is characterised in that the material bag of the diaphragm with insulation function
PET, sarin resin or PA are included, its thickness is 0.1-0.3mm.
5. diode bars band as claimed in claim 4, it is characterised in that the conductive tape is a kind of to be arranged on adjacent two
Centre position between pole pipe, is connected for the main grid line electrode with solar panels, and conductive tape thickness is 0.1-0.5mm.
6. diode bars band as claimed in claim 5, it is characterised in that the release liners are silicone oil paper, can both cling and lead
Electric adhesive tape, is easy to separate both again, and release liners thickness is 0.5-1mm, and release liners, which are internally formed, can accommodate the groove of diode.
7. a kind of diode roll of strip, it is characterised in that the volume is as the diode bars tape wrapping described in claim 1-6
Into the winding diameter of the volume is more than or equal to 500mm.
8. a kind of diode roll of strip by described in claim 7 is used to prepare the preparation method with bypass flexible photovoltaic component,
Characterized in that, by the conductive tape in the centre position being arranged between adjacent diode of the volume and the master of solar panels
Gate line electrode connects to form bypass diode.
9. preparation method as claimed in claim 8, it is characterised in that the distance of the two neighboring conductive tape can be electricity
The integral multiple of pool unit main gate line distance.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710341291.4A CN107086208A (en) | 2017-05-16 | 2017-05-16 | A kind of diode bars band acted on bypass |
| PCT/CN2018/087188 WO2018210283A1 (en) | 2017-05-16 | 2018-05-16 | Diode strip, photovoltaic device, and manufacturing method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710341291.4A CN107086208A (en) | 2017-05-16 | 2017-05-16 | A kind of diode bars band acted on bypass |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107086208A true CN107086208A (en) | 2017-08-22 |
Family
ID=59608151
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710341291.4A Pending CN107086208A (en) | 2017-05-16 | 2017-05-16 | A kind of diode bars band acted on bypass |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN107086208A (en) |
| WO (1) | WO2018210283A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018210283A1 (en) * | 2017-05-16 | 2018-11-22 | 北京铂阳顶荣光伏科技有限公司 | Diode strip, photovoltaic device, and manufacturing method therefor |
| CN112289877A (en) * | 2020-10-30 | 2021-01-29 | 中国电子科技集团公司第十八研究所 | Bypass diode module for flexible thin film solar cell module |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102011105019A1 (en) * | 2011-06-20 | 2012-12-20 | A.Quellmalz GmbH | Method for manufacturing transverse connector of solar module in photovoltaic plant, involves contacting bypass diode with carrier strip using curable adhesive embedded in longitudinal fixing tab |
| WO2016095859A1 (en) * | 2014-12-19 | 2016-06-23 | 上海锐吉电子科技有限公司 | Solar cell slice, solar cell assembly and assembling method for bypass diode |
| US20160226439A1 (en) * | 2015-01-29 | 2016-08-04 | Solaria Corporation | Solar module with diode device for shading |
| WO2016126787A1 (en) * | 2015-02-05 | 2016-08-11 | Ii-Vi Incorporated | Composite substrate with alternating pattern of diamond and metal or metal alloy |
| CN206961815U (en) * | 2017-05-16 | 2018-02-02 | 北京汉能薄膜发电技术有限公司 | A kind of diode bars band and diode roll of strip |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103826382B (en) * | 2014-02-20 | 2017-12-15 | 鹤山市银雨照明有限公司 | A kind of folding type flexible circuit board and the LED bar graph lamp with this kind of flexible circuit board |
| CN107086208A (en) * | 2017-05-16 | 2017-08-22 | 北京汉能薄膜发电技术有限公司 | A kind of diode bars band acted on bypass |
-
2017
- 2017-05-16 CN CN201710341291.4A patent/CN107086208A/en active Pending
-
2018
- 2018-05-16 WO PCT/CN2018/087188 patent/WO2018210283A1/en active Application Filing
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102011105019A1 (en) * | 2011-06-20 | 2012-12-20 | A.Quellmalz GmbH | Method for manufacturing transverse connector of solar module in photovoltaic plant, involves contacting bypass diode with carrier strip using curable adhesive embedded in longitudinal fixing tab |
| WO2016095859A1 (en) * | 2014-12-19 | 2016-06-23 | 上海锐吉电子科技有限公司 | Solar cell slice, solar cell assembly and assembling method for bypass diode |
| US20160226439A1 (en) * | 2015-01-29 | 2016-08-04 | Solaria Corporation | Solar module with diode device for shading |
| WO2016126787A1 (en) * | 2015-02-05 | 2016-08-11 | Ii-Vi Incorporated | Composite substrate with alternating pattern of diamond and metal or metal alloy |
| US20160233142A1 (en) * | 2015-02-05 | 2016-08-11 | Ii-Vi Incorporated | Composite Substrate with Alternating Pattern of Diamond and Metal or Metal Alloy |
| CN206961815U (en) * | 2017-05-16 | 2018-02-02 | 北京汉能薄膜发电技术有限公司 | A kind of diode bars band and diode roll of strip |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018210283A1 (en) * | 2017-05-16 | 2018-11-22 | 北京铂阳顶荣光伏科技有限公司 | Diode strip, photovoltaic device, and manufacturing method therefor |
| CN112289877A (en) * | 2020-10-30 | 2021-01-29 | 中国电子科技集团公司第十八研究所 | Bypass diode module for flexible thin film solar cell module |
| CN112289877B (en) * | 2020-10-30 | 2022-06-07 | 中国电子科技集团公司第十八研究所 | Bypass diode module for flexible thin film solar cell module |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018210283A1 (en) | 2018-11-22 |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20180725 Address after: 100176 Beijing Daxing District Beijing economic and Technological Development Zone Rongchang East Street 7 hospital 6 Building 3001 room. Applicant after: BEIJING APOLLO DING RONG SOLAR TECHNOLOGY Co.,Ltd. Address before: No. 0-A, Chaoyang District, Beijing, Beijing Applicant before: BEIJING HANERGY THIN FILM TECHNOLOGIES Co.,Ltd. |
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| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 100076 6015, 6th floor, building 8, 9 Yingshun Road, Yinghai Town, Daxing District, Beijing Applicant after: Beijing Dingrong Photovoltaic Technology Co.,Ltd. Address before: 3001, room 6, building No. 7, Rongchang East Street, Beijing economic and Technological Development Zone, Beijing, Daxing District 100176, China Applicant before: BEIJING APOLLO DING RONG SOLAR TECHNOLOGY Co.,Ltd. |
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| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20210428 Address after: 518000 Guangdong city of Shenzhen province Qianhai Shenzhen Hong Kong cooperation zone before Bay Road No. 1 building 201 room A (located in Shenzhen Qianhai business secretary Co. Ltd.) Applicant after: Hongyi Technology Co.,Ltd. Address before: 100076 6015, 6th floor, building 8, 9 Yingshun Road, Yinghai Town, Daxing District, Beijing Applicant before: Beijing Dingrong Photovoltaic Technology Co.,Ltd. |