CN112289877A - Bypass diode module for flexible thin film solar cell module - Google Patents
Bypass diode module for flexible thin film solar cell module Download PDFInfo
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- CN112289877A CN112289877A CN202011196894.8A CN202011196894A CN112289877A CN 112289877 A CN112289877 A CN 112289877A CN 202011196894 A CN202011196894 A CN 202011196894A CN 112289877 A CN112289877 A CN 112289877A
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- bypass diode
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- thin film
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- 239000010409 thin film Substances 0.000 title claims abstract description 31
- 239000000853 adhesive Substances 0.000 claims abstract description 22
- 229910000679 solder Inorganic materials 0.000 claims description 20
- 239000003292 glue Substances 0.000 claims description 14
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 9
- 238000005219 brazing Methods 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 5
- 239000004642 Polyimide Substances 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 239000002390 adhesive tape Substances 0.000 abstract description 24
- 230000001070 adhesive effect Effects 0.000 abstract description 16
- 238000003466 welding Methods 0.000 abstract description 10
- 238000009826 distribution Methods 0.000 abstract description 3
- 238000012858 packaging process Methods 0.000 description 7
- 238000010030 laminating Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 238000010248 power generation Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 230000006750 UV protection Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004224 protection Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/0445—PV modules or arrays of single PV cells including thin film solar cells, e.g. single thin film a-Si, CIS or CdTe solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/044—PV modules or arrays of single PV cells including bypass diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/044—PV modules or arrays of single PV cells including bypass diodes
- H01L31/0443—PV modules or arrays of single PV cells including bypass diodes comprising bypass diodes integrated or directly associated with the devices, e.g. bypass diodes integrated or formed in or on the same substrate as the photovoltaic cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Photovoltaic Devices (AREA)
Abstract
A bypass diode module for a flexible thin film solar cell module, comprising: the flexible bypass diode comprises a flexible conductive adhesive tape, a flexible bypass diode, a transparent insulating adhesive tape, a flexible welding tape, a first connecting adhesive and a second connecting adhesive, wherein a first surface of the first connecting adhesive is connected with a lower surface of the flexible bypass diode, a second surface of the first connecting adhesive is connected with an upper surface of the flexible conductive adhesive tape, a first end lower surface of the flexible welding tape is connected with a second surface of the second connecting adhesive, a second end upper surface of the flexible welding tape is connected with a lower surface of the flexible conductive adhesive tape, a first end of the transparent insulating adhesive tape is arranged between a first end lower surface of the flexible welding tape and an upper surface of the flexible bypass diode, and a second end of the transparent insulating adhesive tape is arranged between a lower surface of the flexible conductive adhesive tape and a second end upper surface of the flexible welding tape. The invention has the characteristics of light weight and high flexibility, and greatly improves the reliability of the assembly on the premise of not influencing the solar cell distribution rate.
Description
Technical Field
The invention belongs to the technical field of photovoltaic power generation, and particularly relates to a bypass diode module for a flexible thin film solar cell module.
Background
The flexible thin film solar cell module has the characteristics of high flexibility, light weight and the like, and is widely applied to aircrafts such as solar unmanned aircrafts, satellites and the like. Generally, surface protrusions such as an antenna and a propeller exist on the surface of the aircraft, and the surface protrusions inevitably shade the aircraft to block the solar cell during the flight of the aircraft. If the solar cell module is not provided with the bypass diode, when part of the solar cell is shaded by the shadow, the part of the solar cell can become the load of other solar cells to bear the local hot spot effect, and the problem of irreversible efficiency reduction is caused after the solar cell works under the shadow shading for a long time.
In order to reduce the local hot spot effect, a bypass diode is generally adopted in the industry to protect the solar cell. However, the existing bypass diode layout mainly has the following problems:
(1) the bypass diode is arranged in parallel with the solar cell, but the effective power generation area of the solar cell is reduced, so that the power generation power of the aircraft is reduced;
(2) the bypass diode and the solar cell are integrated into a whole, but the bypass diode is large in thickness and poor in flexibility under the common condition, and the requirement of a flexible thin film solar cell module is not met.
Disclosure of Invention
In order to solve the above problems, the present invention provides a bypass diode module for a flexible thin film solar cell module, comprising: the flexible bypass diode comprises a flexible conductive adhesive tape, a flexible bypass diode, a transparent insulating adhesive tape, a flexible welding tape, a first connecting adhesive and a second connecting adhesive, wherein a first surface of the first connecting adhesive is connected with a lower surface of the flexible bypass diode, a second surface of the first connecting adhesive is connected with an upper surface of the flexible conductive adhesive tape, a first end lower surface of the flexible welding tape is connected with a second surface of the second connecting adhesive, a second end upper surface of the flexible welding tape is connected with a lower surface of the flexible conductive adhesive tape, a first end of the transparent insulating adhesive tape is arranged between a first end lower surface of the flexible welding tape and an upper surface of the flexible bypass diode, and a second end of the transparent insulating adhesive tape is arranged between a lower surface of the flexible conductive adhesive tape and a second end upper surface of the flexible welding tape.
Preferably, the first and second connection glues are located within the flexible bypass diode surface.
Preferably, the flexible conductive tape comprises a conductive strip with self-adhesive properties.
Preferably, the conductive strips with self-adhesive property are silver foil strips with uniformly-dotted conductive silver adhesive.
Preferably, the flexible bypass diode comprises a GaInP bypass diode or a silicon based bypass diode.
Preferably, the transparent insulating tape includes a PET insulating tape and a polyimide insulating tape.
Preferably, the soft solder strip comprises a tin-plated braze strip.
Preferably, the tin-plated brazing strip has a thickness ranging from 0.1mm to 0.15mm and a width ranging from 1mm to 1.5 mm.
Preferably, the first and second connection glues include conductive silver paste and solder paste.
Preferably, the solder paste has a curing melting point of greater than 150 ℃.
The application provides a bypass diode module for flexible thin film solar module has following beneficial effect:
(1) in the lamination packaging process with the flexible thin film solar cell module, the light soft soldering tape has the function of releasing stress, plays a role in connection and simultaneously reduces damage to the solar cell;
(2) in the laminating and packaging process with the flexible thin-film solar cell module, the flexible conductive adhesive tape can be completely attached to the solar cell, so that the problems of over-cut, scratch and the like on the solar cell can be avoided while good attaching degree and conductivity between the bypass diode module and the solar cell are ensured;
(3) in the laminating and packaging process with the flexible thin film solar cell module, the problem that the connecting glue is heated and secondarily melted and flows is solved, and the possibility of short circuit failure of the diode module is reduced;
(4) the invention has the characteristics of light weight and high flexibility, can be installed on the back surface of a solar cell module, and greatly improves the reliability of the module on the premise of not influencing the solar cell distribution rate.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic diagram of a side view of a bypass diode module for a flexible thin film solar cell module according to the present invention;
fig. 2 is a schematic top view of a bypass diode module for a flexible thin film solar cell module according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings in conjunction with the following detailed description. It should be understood that the description is intended to be exemplary only, and is not intended to limit the scope of the present invention. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.
In an embodiment of the present application, as shown in fig. 1-2, the present application provides a bypass diode module for a flexible thin film solar cell module, including: the flexible bypass diode comprises a flexible conductive adhesive tape 1, a flexible bypass diode 2, a transparent insulating adhesive tape 3, a soft solder tape 4, a first connecting adhesive 5 and a second connecting adhesive 6, wherein a first surface of the first connecting adhesive 5 is connected with a lower surface of the flexible bypass diode 2, a second surface of the first connecting adhesive 5 is connected with an upper surface of the flexible conductive adhesive tape 1, a first surface of the second connecting adhesive 6 is connected with a lower surface of a first end of the soft solder tape 4, a second surface of the soft solder tape 4 is connected with an upper surface of the flexible bypass diode 2, an upper surface of a second end of the soft solder tape 4 is connected with a lower surface of the flexible conductive adhesive tape 1, a first end of the transparent insulating adhesive tape 3 is arranged between the lower surface of the first end of the soft solder tape 4 and the upper surface of the flexible bypass diode 2, and a second end of the transparent insulating adhesive tape 3 is arranged between.
When the bypass diode module for the flexible thin film solar cell module is used, the bypass diode module can be installed on the back surface of the flexible thin film solar cell module through the flexible conductive adhesive tape 1, when part of solar cells are shielded by shadows, the bypass diode module can isolate the part of solar cells, the effect of reducing the local hot spot effect is achieved, and the safety and reliability of the solar cell module are improved.
In the present embodiment, the first connection paste 5 and the second connection paste 6 are located within the surface of the flexible bypass diode 2. The first connecting glue 5 and the second connecting glue 6 are positioned in the surface of the flexible bypass diode 2 and do not exceed the surface of the flexible bypass diode 2, so that the self-short circuit of the flexible bypass diode 2 is prevented when the first connecting glue 5 and the second connecting glue 6 exceed the edge of the surface of the flexible bypass diode 2 and are connected with each other.
In the embodiment of the present application, the flexible conductive tape 1 includes a conductive strip with self-adhesive property. When the adopted flexible conductive adhesive tape 1 is a conductive strip with viscosity, good attaching degree and conductivity between the bypass diode module and the solar cell can be ensured. For example, the conductive strips with self-adhesive property are silver foil strips with conductive silver paste uniformly coated in dots.
In the present embodiment, the flexible bypass diode 2 comprises a GaInP bypass diode or a silicon-based bypass diode. The GaInP bypass diode or the silicon-based bypass diode is a light flexible bypass diode, and is thin in thickness, small in size and high in flexibility.
In the embodiment of the present application, the transparent insulating tape 3 includes a PET insulating tape and a polyimide insulating tape. Further, a polyimide insulating tape having strong ultraviolet resistance and strong ozone resistance is preferable.
In the present embodiment, the soft solder strip 4 comprises a tin-plated brazing strip. The tin-plated brazing strip is a light soft soldering strip and has good performance. Furthermore, the thickness range of the tin-plated brazing strip is 0.1mm-0.15mm, and the width range is 1mm-1.5 mm.
In the embodiment of the present application, the first and second connection pastes 5 and 6 include conductive silver paste and solder paste.
In the examples of the present application, the solder paste has a curing melting point of more than 150 ℃. When the adopted connecting glue is soldering paste with high curing melting point, the problem of secondary melting flow can not occur in the laminating and packaging process of the connecting glue and the flexible thin-film solar cell module, and the possibility of short circuit failure of the diode module is reduced.
The application provides a bypass diode module for flexible thin film solar module has following beneficial effect:
(1) in the lamination packaging process with the flexible thin film solar cell module, the light soft soldering tape has the function of releasing stress, plays a role in connection and simultaneously reduces damage to the solar cell;
(2) in the laminating and packaging process with the flexible thin-film solar cell module, the flexible conductive adhesive tape can be completely attached to the solar cell, so that the problems of over-cut, scratch and the like on the solar cell can be avoided while good attaching degree and conductivity between the bypass diode module and the solar cell are ensured;
(3) in the laminating and packaging process with the flexible thin film solar cell module, the problem that the connecting glue is heated and secondarily melted and flows is solved, and the possibility of short circuit failure of the diode module is reduced;
(4) the invention has the characteristics of light weight and high flexibility, can be installed on the back surface of a solar cell module, and greatly improves the reliability of the module on the premise of not influencing the solar cell distribution rate.
It is to be understood that the above-described embodiments of the present invention are merely illustrative of or explaining the principles of the invention and are not to be construed as limiting the invention. Therefore, any modification, equivalent replacement, improvement and the like made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. Further, it is intended that the appended claims cover all such variations and modifications as fall within the scope and boundaries of the appended claims or the equivalents of such scope and boundaries.
Claims (10)
1. A bypass diode module for a flexible thin film solar cell module, comprising: flexible electrically conductive sticky tape (1), flexible bypass diode (2), transparent insulating tape (3), soft solder strip (4), first connection glue (5) and second connection glue (6), the first face of first connection glue (5) is connected the lower surface and the second face of flexible bypass diode (2) are connected the upper surface of flexible electrically conductive sticky tape (1), the first face of second connection glue (6) is connected the first end lower surface and the second face of soft solder strip (4) are connected the upper surface of flexible bypass diode (2), the second end upper surface of soft solder strip (4) is connected the lower surface of flexible electrically conductive sticky tape (1), transparent insulating tape (3) first end set up in the first end lower surface of soft solder strip (4) with between the upper surface of flexible bypass diode (2) and the second end upper surface set up in the lower surface of flexible electrically conductive sticky tape (1) with between the second end upper surface of soft solder strip (4).
2. The bypass diode module for a flexible thin film solar cell module according to claim 1, characterized in that the first connection paste (5) and the second connection paste (6) are located within the surface of the flexible bypass diode (2).
3. The bypass diode module for a flexible thin film solar cell module according to claim 1, wherein the flexible conductive tape (1) comprises a conductive strip with self-adhesive properties.
4. The bypass diode module for a flexible thin-film solar cell module as claimed in claim 3, wherein the self-adhesive conductive strip is a silver foil strip with a uniform spot coating of conductive silver paste.
5. The bypass diode module for a flexible thin film solar cell module according to claim 1, characterized in that the flexible bypass diode (2) comprises a GaInP bypass diode or a silicon based bypass diode.
6. The bypass diode module for a flexible thin film solar cell module according to claim 1, wherein the transparent insulating tape (3) comprises a PET insulating tape and a polyimide insulating tape.
7. The bypass diode module for a flexible thin film solar cell module according to claim 1, characterized in that the soft solder strip (4) comprises a tin-plated copper solder strip.
8. The bypass diode module for a flexible thin film solar cell module according to claim 7, wherein the tinned brazing tape has a thickness in the range of 0.1mm to 0.15mm and a width in the range of 1mm to 1.5 mm.
9. The bypass diode module for a flexible thin film solar cell module according to claim 1, wherein the first and second connection pastes (5, 6) comprise conductive silver paste and solder paste.
10. The bypass diode module for a flexible thin film solar cell module as claimed in claim 9, wherein the solder paste has a curing melting point of more than 150 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011196894.8A CN112289877B (en) | 2020-10-30 | 2020-10-30 | Bypass diode module for flexible thin film solar cell module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011196894.8A CN112289877B (en) | 2020-10-30 | 2020-10-30 | Bypass diode module for flexible thin film solar cell module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112289877A true CN112289877A (en) | 2021-01-29 |
| CN112289877B CN112289877B (en) | 2022-06-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011196894.8A Active CN112289877B (en) | 2020-10-30 | 2020-10-30 | Bypass diode module for flexible thin film solar cell module |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113327993A (en) * | 2021-05-25 | 2021-08-31 | 中国电子科技集团公司第十八研究所 | High-output-voltage flexible thin-film solar cell module for near space aircraft |
| CN113629160A (en) * | 2021-07-01 | 2021-11-09 | 中国电子科技集团公司第十八研究所 | Bypass diode module for ultrathin flexible solar cell module |
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|---|---|---|---|---|
| CN113327993A (en) * | 2021-05-25 | 2021-08-31 | 中国电子科技集团公司第十八研究所 | High-output-voltage flexible thin-film solar cell module for near space aircraft |
| CN113629160A (en) * | 2021-07-01 | 2021-11-09 | 中国电子科技集团公司第十八研究所 | Bypass diode module for ultrathin flexible solar cell module |
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