CN101864262A - Flexible conductive adhesive - Google Patents
Flexible conductive adhesive Download PDFInfo
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- CN101864262A CN101864262A CN 201010220108 CN201010220108A CN101864262A CN 101864262 A CN101864262 A CN 101864262A CN 201010220108 CN201010220108 CN 201010220108 CN 201010220108 A CN201010220108 A CN 201010220108A CN 101864262 A CN101864262 A CN 101864262A
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Abstract
The invention relates to a flexible conductive adhesive, which is used for electronic element adhesion and surface encapsulation. The flexible conductive adhesive simultaneously contains flexible groups and rigid groups, the flexibility of the conductive adhesive and the mechanical property thereof are improved, and the conductive adhesive consists of the following ingredients by mass percent: 10 to 25 parts of conductive adhesive base bodies, 60 to 80 parts of micrometer silver powder and 0.05 to 5 parts of nanometer silver powder, wherein the conductive adhesive base bodies consist of the following ingredients in percentage by weight: 70 to 85 parts of modified epoxy resin, 5 to 20 parts of flexible additives, 0.5 to 2 parts of organic silicon type coupling agents and 2 to 10 parts of imidazole type curing agents. The invention has the basic performance of the ordinary conductive adhesive, and in addition, the resistance is obviously reduced. Because of the flexibility of the flexible conductive adhesive, the cracking problem of a base plate and elements in the encapsulation is solved, and the invention is particularly suitable for the electronic encapsulation technology in micro-electronic industry.
Description
Technical field
The present invention relates to a kind of flexible conductive adhesive that is used for electronic component bonding and surface encapsulation.
Background technology
Resins, epoxy has the performance of many excellences, and its erosion resistance is good, shrinking percentage is low, has good chemistry and thermostability, high strength and high-modulus, and adhesiveproperties is high and processing characteristics is good.Therefore, be that the conductive resin of body material has been widely used in the Electronic Packaging technology with Resins, epoxy.But the problem that Resins, epoxy faces is it solidifies back cross-linking density height, crisp, the easy cracking of matter, easily causes breaking away between the base component snappiness deficiency.This defective has limited its application in some technical field to a great extent.Resins, epoxy has been applied to many aspects such as structure adhesives, semiconductor sealing material, veneer sheet, unicircuit in recent years, and these Application Areass all require Resins, epoxy to have higher performance.Therefore, modified epoxy, the performance of raising Resins, epoxy is the important topic of industry research always.
Summary of the invention
The objective of the invention is to adopt a kind of flexible additive to make the flexible increase of conductive resin matrix, thereby mechanical property is improved.The network density that flexible additive of this kind and conductive resin matrix form is suitable for conduction of current, therefore can reduce the resistivity of conductive resin when improving the conductive resin flexibility.Its snappiness has solved substrate and element cracking problem in the encapsulation, is specially adapted to the Electronic Packaging technology in the microelectronics industry.
The objective of the invention is to be achieved through the following technical solutions.
A kind of flexible conductive adhesive is characterized in that being made up of following prescription: the conductive resin matrix, micro-silver powder, the nano-silver powder that contain flexible additive.Have in the flexible additive molecule structure flexible group-C-and-O-and aromatic group, its soft segment can be bonded in the fine and close cross linking of epoxy resin network, forms the close alternate two-phase network structure of pine, has improved the snappiness of conductive resin.Meanwhile, the introducing of aromatic group has guaranteed the stability of conductive resin mechanical property.
The composition of this flexible conductive adhesive is counted with weight fraction:
10～25 parts of conductive resin matrixes
60～80 parts of micro-silver powders
0.05～5 part of nano-silver powder
Above-mentioned conductive resin matrix is made up of modified epoxy, flexible additive, silicone based coupling agent and imidazole curing agent four parts.This four part shared proportion in the conductive resin matrix, count with weight fraction:
70～85 parts of modified epoxies
5～20 parts of flexible additives
0.5～2 part of silicone based coupling agent
2～10 parts of imidazole curing agents
Described modified epoxy is a kind of in modifying epoxy resin by organosilicon, organic titanium modified epoxy and the organic boron modified epoxy.
Described flexible additive is poly-(2-methyl-2-methyl acrylate and 4-vinylphenol), poly-(dimethyl siloxane and diphenyl siloxane) and 1, a kind of in the ammediol pair (4-Aminobenzoate).
Described silicone based coupling agent is a kind of in vinyl silanes, aminosilane, the epoxy radicals silicone hydride organic coupling agent.
Described imidazole curing agent is a kind of in glyoxal ethyline, 2-ethyl-4-methylimidazole, 2-phenylimidazole and the 1 cyano group 2-ethyl 4-methylimidazole.
Described micro-silver powder is of a size of 1～10 μ m, and the nanometer ping-pong ball is of a size of 50～500nm.
Description of drawings
Fig. 1 contains the conductive resin matrix dynamic mechanical analysis (DMA) of the flexible additive of Different Weight mark
Fig. 2 contains the conductive resin matrix differential scanning calorimetric figure (DSC) of the flexible additive of Different Weight mark
The conductive resin matrix resistivity that Fig. 3 contains the flexible additive of Different Weight mark compares
Embodiment
Describe the present invention below in conjunction with embodiment.
The flexible conductive adhesive of present embodiment is made up of the conductive resin matrix, micro-silver powder and the nano-silver powder that contain flexible additive, and its composition is counted with weight fraction:
20 parts of conductive resin matrixes
75 parts of micro-silver powders
5 parts of nano-silver powders
1. by suitable proportion preparation conductive resin matrix, count with weight fraction:
85 parts of modifying epoxy resin by organosilicon
1, two (the 4-Aminobenzoates) 5 parts of ammediol
2 parts of vinyl silanes
8 parts of 1 cyano group 2-ethyl 4-methylimidazoles
2. the matrix for preparing and micro-silver powder and nano-silver powder are mixed.
3. the conductive resin for preparing is cured at 150 ℃, be 50min set time.
4. solidify the back sample and carry out DMA, DSC and resistivity measurement.
Method steps and the parameter of present embodiment and embodiment 1 are basic identical, and different is that with flexible additive 1, two (4-Aminobenzoate) content of ammediol are brought up to 10 parts.
Method steps and the parameter of present embodiment and embodiment 1 are basic identical, and different is that with flexible additive 1, two (4-Aminobenzoate) content of ammediol are brought up to 15 parts.
As shown in Figure 1, under 150 ℃, contain the conductive resin (flexible conductive adhesive) of flexible additive, its storage modulus than the storage modulus of the conductive resin that does not contain flexible additive (inflexibility conductive resin) low about 50%.Prove that thus because the adding of flexible additive, the flexibility of conductive resin is improved really.
As shown in Figure 2, flexible additive is little to the solidification value influence of conductive resin.
As shown in Figure 3, than the inflexibility conductive resin, it is about 25% that the resistivity of flexible conductive adhesive has reduced, proof thus, because the adding of flexible additive, the electrical property of conductive resin is improved really.
Claims (6)
1. flexible conductive adhesive is characterized in that the composition of this conductive resin is counted with weight fraction:
10～25 parts of conductive resin matrixes
60～80 parts of micro-silver powders
0.05～5 part of nano-silver powder
Wherein the composition of conductive resin matrix is counted with weight fraction:
70～85 parts of modified epoxies
5～20 parts of flexible additives
0.5～2 part of silicone based coupling agent
2～10 parts of imidazole curing agents.
2. as claims 1 described flexible conductive adhesive, it is characterized in that described modified epoxy is a kind of in modifying epoxy resin by organosilicon, organic titanium modified epoxy and the organic boron modified epoxy.
3. as claims 1 described flexible conductive adhesive, it is characterized in that described flexible additive is poly-(2-methyl-2-methyl acrylate and 4-vinylphenol), poly-(dimethyl siloxane and diphenyl siloxane) and 1, a kind of in the ammediol pair (4-Aminobenzoate).
4. as claims 1 described flexible conductive adhesive, it is characterized in that described silicone based coupling agent is a kind of in vinyl silanes, aminosilane, the epoxy radicals silicone hydride organic coupling agent.
5. as claims 1 described flexible conductive adhesive, it is characterized in that described imidazole curing agent is a kind of in glyoxal ethyline, 2-ethyl-4-methylimidazole, 2-phenylimidazole and the 1 cyano group 2-ethyl 4-methylimidazole.
6. as claims 1 described flexible conductive adhesive, it is characterized in that described micro-silver powder is of a size of 1～10 μ m, nano-silver powder is of a size of 50～500nm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010220108 CN101864262A (en) | 2009-11-03 | 2010-06-25 | Flexible conductive adhesive |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910198199 | 2009-11-03 | ||
| CN200910198199.2 | 2009-11-03 | ||
| CN 201010220108 CN101864262A (en) | 2009-11-03 | 2010-06-25 | Flexible conductive adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101864262A true CN101864262A (en) | 2010-10-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010220108 Pending CN101864262A (en) | 2009-11-03 | 2010-06-25 | Flexible conductive adhesive |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102127288A (en) * | 2011-02-17 | 2011-07-20 | 上海上大瑞沪微系统集成技术有限公司 | Flexible epoxy plastic package material |
| CN102199407A (en) * | 2011-03-18 | 2011-09-28 | 中科院广州化学有限公司 | High-dispersing nanometer silver and high-performance conductive adhesive |
| CN103242775A (en) * | 2013-05-16 | 2013-08-14 | 长春永固科技有限公司 | Acrylic ester modified epoxy resin conductive chip adhesive |
| CN103436060A (en) * | 2013-08-20 | 2013-12-11 | 吴江市英力达塑料包装有限公司 | Corrosion-resistant waterborne conductive paint and preparation method thereof |
| CN103881300A (en) * | 2012-12-22 | 2014-06-25 | 富葵精密组件(深圳)有限公司 | Epoxy resin composite material and circuit board and producing methods thereof |
| CN104693686A (en) * | 2015-03-19 | 2015-06-10 | 西安交通大学 | Preparation method for micro/nanostructure epoxy composite insulating material for GIS |
| CN106349992A (en) * | 2016-08-31 | 2017-01-25 | 强新正品（苏州）环保材料科技有限公司 | Flexible conductive adhesive for electronic component adhesion and surface encapsulation |
| CN108624055A (en) * | 2018-04-13 | 2018-10-09 | 苏州佳值电子工业有限公司 | Antistatic silica gel and use for electronic products gasket based on electrostatic protection |
| CN110564336A (en) * | 2019-07-19 | 2019-12-13 | 北京理工大学珠海学院 | flexible conductive adhesive and preparation method thereof |
| CN111253883A (en) * | 2019-10-30 | 2020-06-09 | 安第斯新材料科技(浙江)有限公司 | Ultrafast photon curing conductive adhesive and preparation method thereof |
| CN112289877A (en) * | 2020-10-30 | 2021-01-29 | 中国电子科技集团公司第十八研究所 | Bypass diode module for flexible thin film solar cell module |
| CN113004807A (en) * | 2021-03-11 | 2021-06-22 | 无锡帝科电子材料股份有限公司 | Thermosetting conductive adhesive and preparation method thereof |
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| CN86104577A (en) * | 1985-07-18 | 1987-02-11 | 三菱电机株式会社 | Epoxy resin component |
| JPH02265981A (en) * | 1989-04-05 | 1990-10-30 | Matsushita Electric Ind Co Ltd | Electrically conductive adhesive |
| CN101033379A (en) * | 2006-03-10 | 2007-09-12 | 国家淀粉及化学投资控股公司 | Anisotropic conductive adhesive |
| CN101302413A (en) * | 2008-07-01 | 2008-11-12 | 上海上大瑞沪微系统集成技术有限公司 | High temperature resistant epoxide resin conductive adhesive |
-
2010
- 2010-06-25 CN CN 201010220108 patent/CN101864262A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN86104577A (en) * | 1985-07-18 | 1987-02-11 | 三菱电机株式会社 | Epoxy resin component |
| JPH02265981A (en) * | 1989-04-05 | 1990-10-30 | Matsushita Electric Ind Co Ltd | Electrically conductive adhesive |
| CN101033379A (en) * | 2006-03-10 | 2007-09-12 | 国家淀粉及化学投资控股公司 | Anisotropic conductive adhesive |
| CN101302413A (en) * | 2008-07-01 | 2008-11-12 | 上海上大瑞沪微系统集成技术有限公司 | High temperature resistant epoxide resin conductive adhesive |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102127288A (en) * | 2011-02-17 | 2011-07-20 | 上海上大瑞沪微系统集成技术有限公司 | Flexible epoxy plastic package material |
| CN102199407A (en) * | 2011-03-18 | 2011-09-28 | 中科院广州化学有限公司 | High-dispersing nanometer silver and high-performance conductive adhesive |
| CN103881300B (en) * | 2012-12-22 | 2016-08-24 | 富葵精密组件(深圳)有限公司 | Epoxy resin composite material and circuit board and preparation method thereof |
| CN103881300A (en) * | 2012-12-22 | 2014-06-25 | 富葵精密组件(深圳)有限公司 | Epoxy resin composite material and circuit board and producing methods thereof |
| CN103242775B (en) * | 2013-05-16 | 2015-06-10 | 长春永固科技有限公司 | Acrylic ester modified epoxy resin conductive chip adhesive |
| CN103242775A (en) * | 2013-05-16 | 2013-08-14 | 长春永固科技有限公司 | Acrylic ester modified epoxy resin conductive chip adhesive |
| CN103436060A (en) * | 2013-08-20 | 2013-12-11 | 吴江市英力达塑料包装有限公司 | Corrosion-resistant waterborne conductive paint and preparation method thereof |
| CN103436060B (en) * | 2013-08-20 | 2015-07-15 | 苏州欢颜电气有限公司 | Corrosion-resistant waterborne conductive paint and preparation method thereof |
| CN104693686A (en) * | 2015-03-19 | 2015-06-10 | 西安交通大学 | Preparation method for micro/nanostructure epoxy composite insulating material for GIS |
| CN106349992A (en) * | 2016-08-31 | 2017-01-25 | 强新正品（苏州）环保材料科技有限公司 | Flexible conductive adhesive for electronic component adhesion and surface encapsulation |
| CN108624055A (en) * | 2018-04-13 | 2018-10-09 | 苏州佳值电子工业有限公司 | Antistatic silica gel and use for electronic products gasket based on electrostatic protection |
| CN110564336A (en) * | 2019-07-19 | 2019-12-13 | 北京理工大学珠海学院 | flexible conductive adhesive and preparation method thereof |
| CN111253883A (en) * | 2019-10-30 | 2020-06-09 | 安第斯新材料科技(浙江)有限公司 | Ultrafast photon curing conductive adhesive and preparation method thereof |
| CN111253883B (en) * | 2019-10-30 | 2021-08-03 | 安第斯新材料科技(浙江)有限公司 | Ultrafast photon curing conductive adhesive and preparation method thereof |
| CN112289877A (en) * | 2020-10-30 | 2021-01-29 | 中国电子科技集团公司第十八研究所 | Bypass diode module for flexible thin film solar cell module |
| CN112289877B (en) * | 2020-10-30 | 2022-06-07 | 中国电子科技集团公司第十八研究所 | Bypass diode module for flexible thin film solar cell module |
| CN113004807A (en) * | 2021-03-11 | 2021-06-22 | 无锡帝科电子材料股份有限公司 | Thermosetting conductive adhesive and preparation method thereof |
| WO2022188504A1 (en) * | 2021-03-11 | 2022-09-15 | 无锡帝科电子材料股份有限公司 | Heat-cured conductive adhesive and preparation method therefor |
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Application publication date: 20101020 |