CN106349992A - Flexible conductive adhesive for electronic component adhesion and surface encapsulation - Google Patents
Flexible conductive adhesive for electronic component adhesion and surface encapsulation Download PDFInfo
- Publication number
- CN106349992A CN106349992A CN201610772218.8A CN201610772218A CN106349992A CN 106349992 A CN106349992 A CN 106349992A CN 201610772218 A CN201610772218 A CN 201610772218A CN 106349992 A CN106349992 A CN 106349992A
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- China
- Prior art keywords
- conductive adhesive
- flexible
- parts
- electronic component
- surface encapsulation
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a flexible conductive adhesive for electronic component adhesion and surface encapsulation. The flexible conductive adhesive contains a flexible group and a rigid group so as to improve the flexibility and the mechanical property of the conductive adhesive. The conductive adhesive comprises the following components in percentage by weight: 15 to 20 percent of flexible epoxy, 3.1 to 8.5 percent of a conductive adhesive matrix, 0.1 to 0.5 percent of an accelerant, 65 to 80 percent of silver powder and 0.2 to 10 percent of a flexible one-dimensional nano-conductive material, wherein the conductive adhesive matrix comprises the following components in parts by weight: 60 to 75 parts of modified epoxy resin, 10 to 15 parts of flexible additives, 0.5 to 1 part of an organosilicone coupling agent and 5 to 8 parts of an imidazole curing agent. The flexible conductive adhesive has the basic properties of the common conductive adhesive, has the obviously reduced resistance, has excellent conductivity and high flexibility, can meet the requirements of flexible electronic products, and is particularly suitable for an electronic packaging technology in microelectronics industry.
Description
Technical field
The present invention relates to a kind of flexible conductive adhesive for electronic component bonding and surface encapsulation, belong to electronic material technology
Field.
Background technology
Epoxy resin has many excellent performances, and its corrosion resistance is good, shrinkage factor is low, has good chemically and thermally steady
Qualitative, high intensity and high-moduluss, adhesive property is high and processing characteristics is excellent.Therefore, the conduction with epoxy resin as matrix material
Glue is widely used in Electronic Encapsulating Technology.But epoxy resin problems faced is crosslink density height after its solidification, matter is crisp, appearance
Easy to crack, be easily caused and depart between base component, pliability is not enough.This defect greatly limit it in some skills
The application in art field.Epoxy resin has been applied to structural bond material, semiconductor sealing material, laminate, integrated in recent years
The many aspects such as circuit, these applications require that epoxy resin has higher performance.Therefore, modified epoxy, carries
The performance of high epoxy resin, the always important topic of industry research.
Content of the invention
It is an object of the invention to overcoming deficiency of the prior art, provide a kind of bonding and surface envelope for electronic component
The flexible conductive adhesive of dress, makes the flexible increase of conducting resinl matrix by flexible additive, so that mechanical performance is improved.
The purpose of the present invention is achieved through the following technical solutions: a kind of for electronic component bonding and surface encapsulation
Flexible conductive adhesive, is made up of following formula, and the composition of conducting resinl is calculated as with weight fraction:
15-20wt% flexible epoxy；
3.1-8.5wt% conducting resinl matrix；
0.1-0.5wt% accelerator；
65-80wt% argentum powder and 0.2-10wt% flexibility 1-dimention nano conductive material；
Wherein: the composition of conducting resinl matrix is calculated as with weight fraction:
60～75 parts of modified epoxy；
10～15 parts of flexible additive；
0.5～1 part of silicone coupling agent；
5～8 parts of imidazole curing agent.
Described modified epoxy is modifying epoxy resin by organosilicon, organic titanium modified epoxy and organic boron modification ring
One of oxygen tree fat.
Described flexibility additive is poly- (2- methyl -2- acrylic acid methyl ester. and 4- vinylphenol), poly- (dimethyl-silicon
One of oxygen alkane and diphenyl siloxane) and 1,3- propylene glycol double (4- Aminobenzoate).
Described silicone coupling agent is one of vinyl silanes, amino silane, epoxy radicals silicone hydride organic coupling agent.
Compared with prior art, the beneficial effect that the present invention is reached is: this kind of flexibility additive and conducting resinl matrix shape
The network consistency becoming is suitable for electric current conduction, therefore, it is possible to reduce the resistance of conducting resinl while improving conducting resinl flexibility
Rate.Its pliability solves substrate and element problem of Cracking in encapsulation, and flexible 1-dimention nano conductive material is CNT or leads
Electric metal nano wire, having superior electrical conductivity can be with good pliability, and after multiple bending, electric conductivity has almost no change,
Flexible electronic product demand can be met, be particularly well-suited to the Electronic Encapsulating Technology in microelectronics industry.
Specific embodiment
Describe the present invention with reference to embodiment.Following examples are only used for clearly illustrating this
Bright technical scheme, and can not be limited the scope of the invention with this.
Embodiment 1:
The disclosed flexible conductive adhesive for electronic component bonding and surface encapsulation of the present embodiment, its composition is in terms of weight fraction
For flexible epoxy: 200wt；Conducting resinl matrix: 85wt；Accelerator: 5wt；Argentum powder: 800wt；Flexible 1-dimention nano conductive material:
100wt.
Wherein: the composition of conducting resinl matrix is calculated as with weight fraction: 60 parts of modified epoxy；15 parts of flexible additive；
0.5 part of silicone coupling agent；5 parts of imidazole curing agent.
Modified epoxy is modifying epoxy resin by organosilicon, and flexible additive is poly- (2- methyl -2- acrylic acid methyl ester.
With 4- vinylphenol), silicone coupling agent is vinyl silicane coupling agent.
Embodiment 2:
The disclosed flexible conductive adhesive for electronic component bonding and surface encapsulation of the present embodiment, its composition is in terms of weight fraction
For flexible epoxy: 180wt；Conducting resinl matrix: 60wt；Accelerator: 3wt；Argentum powder: 700wt；Flexible 1-dimention nano conductive material:
80wt.
Wherein: the composition of conducting resinl matrix is calculated as with weight fraction: 70 parts of modified epoxy；13 parts of flexible additive；
0.75 part of silicone coupling agent；6 parts of imidazole curing agent.
Modified epoxy is organic titanium modified epoxy, and flexible additive is poly- (dimethyl siloxane and diphenyl
Siloxanes), silicone coupling agent is amino silicane coupling agent.
Embodiment 3:
The disclosed flexible conductive adhesive for electronic component bonding and surface encapsulation of the present embodiment, its composition is in terms of weight fraction
For flexible epoxy: 150wt；Conducting resinl matrix: 31wt；Accelerator: 1wt；Argentum powder: 650wt；Flexible 1-dimention nano conductive material:
2wt.
Wherein: the composition of conducting resinl matrix is calculated as with weight fraction: 75 parts of modified epoxy；10 parts of flexible additive；
1 part of silicone coupling agent；8 parts of imidazole curing agent.
Modified epoxy is organic boron modified epoxy, and flexible additive is double (the 4- aminobenzene of 1,3- propylene glycol
Formic acid esters), silicone coupling agent is epoxy radicals silicone hydride organic coupling agent.
The above is only the preferred embodiment of the present invention it is noted that ordinary skill people for the art
For member, on the premise of without departing from the technology of the present invention principle, some improvement can also be made and deform, these improve and deform
Also should be regarded as protection scope of the present invention.
Claims (4)
1. a kind of for electronic component bonding and surface encapsulation flexible conductive adhesive it is characterised in that this conducting resinl composition with
Weight fraction is calculated as:
15-20wt% flexible epoxy；
3.1-8.5wt% conducting resinl matrix；
0.1-0.5wt% accelerator；
65-80wt% argentum powder and 0.2-10wt% flexibility 1-dimention nano conductive material；
Wherein: the composition of conducting resinl matrix is calculated as with weight fraction:
60～75 parts of modified epoxy；
10～15 parts of flexible additive；
0.5～1 part of silicone coupling agent；
5～8 parts of imidazole curing agent.
2. as described in claims 1 for electronic component bonding and surface encapsulation flexible conductive adhesive it is characterised in that
Described modified epoxy is in modifying epoxy resin by organosilicon, organic titanium modified epoxy and organic boron modified epoxy
One kind.
3. as described in claims 1 for electronic component bonding and surface encapsulation flexible conductive adhesive it is characterised in that
Described flexibility additive is poly- (2- methyl -2- acrylic acid methyl ester. and 4- vinylphenol), poly- (dimethyl siloxane and two
One of phenyl siloxane) and 1,3- propylene glycol double (4- Aminobenzoate).
4. as described in claims 1 for electronic component bonding and surface encapsulation flexible conductive adhesive it is characterised in that
Described silicone coupling agent is one of vinyl silanes, amino silane, epoxy radicals silicone hydride organic coupling agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610772218.8A CN106349992A (en) | 2016-08-31 | 2016-08-31 | Flexible conductive adhesive for electronic component adhesion and surface encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610772218.8A CN106349992A (en) | 2016-08-31 | 2016-08-31 | Flexible conductive adhesive for electronic component adhesion and surface encapsulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106349992A true CN106349992A (en) | 2017-01-25 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610772218.8A Pending CN106349992A (en) | 2016-08-31 | 2016-08-31 | Flexible conductive adhesive for electronic component adhesion and surface encapsulation |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112940642A (en) * | 2019-12-11 | 2021-06-11 | Dic株式会社 | Conductive adhesive sheet |
| WO2022188504A1 (en) * | 2021-03-11 | 2022-09-15 | 无锡帝科电子材料股份有限公司 | Heat-cured conductive adhesive and preparation method therefor |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101629057A (en) * | 2009-08-22 | 2010-01-20 | 漳立冰 | Nano conductive adhesive and preparation method thereof |
| CN101864262A (en) * | 2009-11-03 | 2010-10-20 | 上海上大瑞沪微系统集成技术有限公司 | Flexible conductive adhesive |
| CN102391807A (en) * | 2011-07-06 | 2012-03-28 | 上海上大瑞沪微系统集成技术有限公司 | Preparation method of rapidly solidified anisotropic conductive adhesive |
| CN102408858A (en) * | 2011-10-24 | 2012-04-11 | 上海大学 | Stable type conductive adhesive and preparation method thereof |
| CN103555242A (en) * | 2013-10-17 | 2014-02-05 | 广东生益科技股份有限公司 | Halogen-free flame-retardant epoxy resin composition and high-flexibility halogen-free cover film prepared from same |
| CN103571418A (en) * | 2013-11-12 | 2014-02-12 | 烟台德邦科技有限公司 | Flexible underfill and preparation method thereof |
-
2016
- 2016-08-31 CN CN201610772218.8A patent/CN106349992A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101629057A (en) * | 2009-08-22 | 2010-01-20 | 漳立冰 | Nano conductive adhesive and preparation method thereof |
| CN101864262A (en) * | 2009-11-03 | 2010-10-20 | 上海上大瑞沪微系统集成技术有限公司 | Flexible conductive adhesive |
| CN102391807A (en) * | 2011-07-06 | 2012-03-28 | 上海上大瑞沪微系统集成技术有限公司 | Preparation method of rapidly solidified anisotropic conductive adhesive |
| CN102408858A (en) * | 2011-10-24 | 2012-04-11 | 上海大学 | Stable type conductive adhesive and preparation method thereof |
| CN103555242A (en) * | 2013-10-17 | 2014-02-05 | 广东生益科技股份有限公司 | Halogen-free flame-retardant epoxy resin composition and high-flexibility halogen-free cover film prepared from same |
| CN103571418A (en) * | 2013-11-12 | 2014-02-12 | 烟台德邦科技有限公司 | Flexible underfill and preparation method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112940642A (en) * | 2019-12-11 | 2021-06-11 | Dic株式会社 | Conductive adhesive sheet |
| WO2022188504A1 (en) * | 2021-03-11 | 2022-09-15 | 无锡帝科电子材料股份有限公司 | Heat-cured conductive adhesive and preparation method therefor |
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Application publication date: 20170125 |
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