CN108070336A - A kind of formula of OLED device conducting resinl - Google Patents
A kind of formula of OLED device conducting resinl Download PDFInfo
- Publication number
- CN108070336A CN108070336A CN201711376106.1A CN201711376106A CN108070336A CN 108070336 A CN108070336 A CN 108070336A CN 201711376106 A CN201711376106 A CN 201711376106A CN 108070336 A CN108070336 A CN 108070336A
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- China
- Prior art keywords
- parts
- conducting resinl
- oled device
- formula
- device conducting
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
Abstract
The invention discloses a kind of formulas of OLED device conducting resinl, are according to mass parts composition：50~100 parts of epoxy resin, 10~25 parts of phenolic resin, 75~150 parts of copper powder, 5~15 parts of graphene, 25~50 parts of curing agent, 0.5~2 part of plasticizer, 1~2 part of toughener, 1~2 part of accelerating agent, 2~3 parts of antioxidant MB, 1~2 part of thickener.OLED device conducting resinl has good electric conductivity in the present invention, and chemical property is stablized, and disclosure satisfy that the requirement of a variety of electronic product manufacturing conditions.
Description
Technical field
The present invention relates to field of material technology, more particularly to a kind of formula of OLED device conducting resinl.
Background technology
With the fast development of electronics industry, the minimizing, is lightening of electronic product, integrated trend are increasingly apparent,
The encapsulation technology requirement of corresponding electronic product is also higher and higher.Conducting resinl is usually by conductive filler, resin, curing agent, solvent
Deng composition, conductive filler provides electrical property, and resin provides physical and mechanical property.The conductive filler of conducting resinl have metal (gold,
Silver, copper etc.), carbon, metal oxide, several classes such as conducting polymer.Metallic conduction glue resistivity is relatively low, performance most preferably bronze
Conducting resinl, but it is expensive；Silver-colored electrical conductivity is high, and good in oxidation resistance, performance are stablized, but Ag+ can generate electricity and move under electric field action
Phenomenon is moved, reduces electric conductivity, influences service life, and sliver-powder conducting glue is also insufficient there are toughness, conducting resinl when product drops
The shortcomings that easily dropping；Copper powder is cheap, will not generate migration under the electric field, but the chemical property of copper powder is more active,
It easily aoxidizes, conducting resinl resistance is caused to raise, difficulty is brought to the application of cupric powder conductive adhesive.Base-material is according to asphalt mixtures modified by epoxy resin
Fat, in winter epoxy resin easily crystallize, be not easy to disperse, easily reunite, coating performance is poor, and internal stress is larger, shock resistance energy
Force difference, product easily split.
For this reason, it is necessary in view of the above-mentioned problems, propose a kind of formula of OLED device conducting resinl, can solve existing
Problem present in technology.
The content of the invention
It is an object of the invention to provide a kind of formula of OLED device conducting resinl, with overcome it is of the prior art not
Foot.
To achieve the above object, the present invention provides following technical solution：
A kind of formula of OLED device conducting resinl, according to mass parts composition be：50~100 parts of epoxy resin, phenolic aldehyde tree
10~25 parts of fat, 75~150 parts of copper powder, 5~15 parts of graphene, 25~50 parts of curing agent, 0.5~2 part of plasticizer, toughener 1
~2 parts, 1~2 part of accelerating agent, 2~3 parts of antioxidant MB, 1~2 part of thickener.
Preferably, it is according to mass parts composition：60~100 parts of epoxy resin, 15~25 parts of phenolic resin, copper powder 90~
150 parts, 7.5~15 parts of graphene, 30~50 parts of curing agent, 0.75~2 part of plasticizer, 1.25~2 parts of toughener, accelerating agent
1.25~2 parts, 2.25~3 parts of antioxidant MB, 1.25~2 parts of thickener.
Preferably, it is according to mass parts composition：80~100 parts of epoxy resin, 20~25 parts of phenolic resin, copper powder 120~
150 parts, 12.5~15 parts of graphene, 40~50 parts of curing agent, 1.25~2 parts of plasticizer, 1.75~2 parts of toughener, accelerating agent
1.75~2 parts, 2.75~3 parts of antioxidant MB, 1.5~2 parts of thickener.
Preferably, the mass ratio of the epoxy resin and the copper powder is 1:1.5.
Preferably, the curing agent is epoxy hardener.
Preferably, the plasticizer is dibutyl phthalate.
Preferably, the toughener is polysulfide rubber toughener.
Preferably, the accelerating agent is amine type accelerator.
Compared with prior art, the advantage of the invention is that：OLED device conducting resinl has good lead in the present invention
Electrical property, and chemical property is stablized, and disclosure satisfy that the requirement of a variety of electronic product manufacturing conditions.
Specific embodiment
The present invention is described further by the following example：According to following embodiments, the present invention may be better understood.
However, as it will be easily appreciated by one skilled in the art that the described specific material ratio of embodiment, process conditions and its result are only used
In illustrating the present invention, without the present invention described in detail in claims should will not be limited.
The present invention discloses a kind of formula of OLED device conducting resinl, is according to mass parts composition：Epoxy resin 50~100
Part, 10~25 parts of phenolic resin, 75~150 parts of copper powder, 5~15 parts of graphene, 25~50 parts of curing agent, plasticizer 0.5~2
Part, 1~2 part of toughener, 1~2 part of accelerating agent, 2~3 parts of antioxidant MB, 1~2 part of thickener.
Wherein, the mass ratio of the epoxy resin and the copper powder is 1:1.5.
Further, the curing agent is epoxy hardener.
Further, the plasticizer is dibutyl phthalate.
Further, the toughener is polysulfide rubber toughener.
Further, the accelerating agent is amine type accelerator.
Following formulas that the OLED device conducting resinl in the present invention is illustrated with specifically embodiment.
Embodiment 1
It is according to mass parts composition：50 parts of epoxy resin, 10 parts of phenolic resin, 75 parts of copper powder, 5 parts of graphene, curing agent
25 parts, 0.5 part of plasticizer, 1 part of toughener, 1 part of accelerating agent, 2 parts of antioxidant MB, 1 part of thickener.
Embodiment 2
It is according to mass parts composition：60 parts of epoxy resin, 15 parts of phenolic resin, 90 parts of copper powder, 7.5 parts of graphene cure
30 parts of agent, 0.75 part of plasticizer, 1.25 parts of toughener, 1.25 parts of accelerating agent, 2.25 parts of antioxidant MB, 1.25 parts of thickener.
Embodiment 3
It is according to mass parts composition：80 parts of epoxy resin, 20 parts of phenolic resin, 120 parts of copper powder, 12.5 parts of graphene, Gu
40 parts of agent, 1.25 parts of plasticizer, 1.75 parts of toughener, 1.75 parts of accelerating agent, 2.75 parts of antioxidant MB, 1.5 parts of thickener.
Embodiment 4
It is according to mass parts composition：100 parts of epoxy resin, 25 parts of phenolic resin, 150 parts of copper powder, 15 parts of graphene cure
50 parts of agent, 2 parts of plasticizer, 2 parts of toughener, 2 parts of accelerating agent, 3 parts of antioxidant MB, 2 parts of thickener.
OLED device conducting resinl has good electric conductivity in the present invention, and chemical property is stablized；By to this hair
Conducting resinl in bright carries out electrical performance testing, as a result understands, the volume resistivity of the conducting resinl is 2.26 × 10-3Ω·cm。
Finally, it is to be noted that, term " comprising ", "comprising" or its any other variant be intended to it is non-exclusive
Property include so that process, method, article or equipment including a series of elements not only include those elements, but also
Further include other elements that are not explicitly listed or further include for this process, method, article or equipment it is intrinsic
Element.
Claims (8)
1. a kind of formula of OLED device conducting resinl, which is characterized in that be according to mass parts composition：Epoxy resin 50~100
Part, 10~25 parts of phenolic resin, 75~150 parts of copper powder, 5~15 parts of graphene, 25~50 parts of curing agent, plasticizer 0.5~2
Part, 1~2 part of toughener, 1~2 part of accelerating agent, 2~3 parts of antioxidant MB, 1~2 part of thickener.
2. the formula of OLED device conducting resinl according to claim 1, which is characterized in that be according to mass parts composition：
60~100 parts of epoxy resin, 15~25 parts of phenolic resin, 90~150 parts of copper powder, 7.5~15 parts of graphene, curing agent 30~50
Part, 0.75~2 part of plasticizer, 1.25~2 parts of toughener, 1.25~2 parts of accelerating agent, 2.25~3 parts of antioxidant MB, thickener
1.25~2 parts.
3. the formula of OLED device conducting resinl according to claim 2, which is characterized in that be according to mass parts composition：
80~100 parts of epoxy resin, 20~25 parts of phenolic resin, 120~150 parts of copper powder, 12.5~15 parts of graphene, curing agent 40~
50 parts, 1.25~2 parts of plasticizer, 1.75~2 parts of toughener, 1.75~2 parts of accelerating agent, 2.75~3 parts of antioxidant MB, thickening
1.5~2 parts of agent.
4. the formula of OLED device conducting resinl as claimed in any of claims 1 to 3, which is characterized in that described
The mass ratio of epoxy resin and the copper powder is 1:1.5.
5. the formula of OLED device conducting resinl according to claim 1, which is characterized in that the curing agent is consolidated for epoxy
Agent.
6. the formula of OLED device conducting resinl according to claim 1, which is characterized in that the plasticizer is adjacent benzene two
Formic acid dibutyl ester.
7. the formula of OLED device conducting resinl according to claim 1, which is characterized in that the toughener is polysulfide rubber
Glue toughener.
8. the formula of OLED device conducting resinl according to claim 1, which is characterized in that the accelerating agent promotees for amine
Into agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711376106.1A CN108070336A (en) | 2017-12-19 | 2017-12-19 | A kind of formula of OLED device conducting resinl |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711376106.1A CN108070336A (en) | 2017-12-19 | 2017-12-19 | A kind of formula of OLED device conducting resinl |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108070336A true CN108070336A (en) | 2018-05-25 |
Family
ID=62158969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711376106.1A Pending CN108070336A (en) | 2017-12-19 | 2017-12-19 | A kind of formula of OLED device conducting resinl |
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| CN (1) | CN108070336A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109054708A (en) * | 2018-06-07 | 2018-12-21 | 太仓萃励新能源科技有限公司 | A kind of preparation method of wiring board plug-hole PPTC adhesive |
| CN110684494A (en) * | 2019-10-12 | 2020-01-14 | 宇石能源(南通)有限公司 | Conductive adhesive for bonding bipolar plate of fuel cell and preparation method thereof |
| CN111303812A (en) * | 2020-04-20 | 2020-06-19 | 深圳市精鼎盛电子材料有限公司 | Low-temperature fast-curing single-component sealant |
| CN113372863A (en) * | 2021-06-22 | 2021-09-10 | 深圳市汇海鑫科技有限公司 | High-thermal-conductivity and high-electric-conductivity organic adhesive and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10130600A (en) * | 1996-11-01 | 1998-05-19 | Sumitomo Metal Mining Co Ltd | Electrically conductive adhesive |
| CN105315943A (en) * | 2015-11-24 | 2016-02-10 | 苏州盖德精细材料有限公司 | High-heat-conductivity epoxy resin conducting resin and preparing method thereof |
| CN107254287A (en) * | 2017-07-25 | 2017-10-17 | 合肥欧仕嘉机电设备有限公司 | A kind of conducting resinl and preparation method |
-
2017
- 2017-12-19 CN CN201711376106.1A patent/CN108070336A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10130600A (en) * | 1996-11-01 | 1998-05-19 | Sumitomo Metal Mining Co Ltd | Electrically conductive adhesive |
| CN105315943A (en) * | 2015-11-24 | 2016-02-10 | 苏州盖德精细材料有限公司 | High-heat-conductivity epoxy resin conducting resin and preparing method thereof |
| CN107254287A (en) * | 2017-07-25 | 2017-10-17 | 合肥欧仕嘉机电设备有限公司 | A kind of conducting resinl and preparation method |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109054708A (en) * | 2018-06-07 | 2018-12-21 | 太仓萃励新能源科技有限公司 | A kind of preparation method of wiring board plug-hole PPTC adhesive |
| CN110684494A (en) * | 2019-10-12 | 2020-01-14 | 宇石能源(南通)有限公司 | Conductive adhesive for bonding bipolar plate of fuel cell and preparation method thereof |
| CN111303812A (en) * | 2020-04-20 | 2020-06-19 | 深圳市精鼎盛电子材料有限公司 | Low-temperature fast-curing single-component sealant |
| CN113372863A (en) * | 2021-06-22 | 2021-09-10 | 深圳市汇海鑫科技有限公司 | High-thermal-conductivity and high-electric-conductivity organic adhesive and preparation method thereof |
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Application publication date: 20180525 |
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