CN104371616A - Preparation method of phenolic resin conductive adhesive - Google Patents
Preparation method of phenolic resin conductive adhesive Download PDFInfo
- Publication number
- CN104371616A CN104371616A CN201310353369.6A CN201310353369A CN104371616A CN 104371616 A CN104371616 A CN 104371616A CN 201310353369 A CN201310353369 A CN 201310353369A CN 104371616 A CN104371616 A CN 104371616A
- Authority
- CN
- China
- Prior art keywords
- conductive adhesive
- phenolic resin
- agitator tank
- epoxy resin
- preparation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a preparation method of a phenolic resin conductive adhesive, the product belongs to the field of chemical engineering; the phenolic resin conductive adhesive is prepared from liquid phenolic resin, epoxy resin, epoxy resin diluent, nitrile rubber, polyvinyl butyral, a silane coupling agent, diphenyl methane diamine and copper powder as raw materials by certain supplemented process conditions, the preparation method has the following advantages of use of general equipment and simple production process, the product is commonly used in microelectronic assembly including connection of thin conducting wires and printing circuits, plating bottom plates and metal layers and metal chassis of ceramic glued objects, and bonding waveguide tuning and hole repairing of bonding conducting wires and tube sockets, and bonding elements and plane holes passing through the printing circuit.
Description
Technical field
Product of the present invention belongs to chemical field, particularly relates to a kind of preparation method of resol electro-conductive adhesive.
Background technology
Electro-conductive adhesive is that one can glued joint various material effectively, there is again the tackiness agent of conductivity, electro-conductive adhesive can be divided into structure-type and the large class of filled-type two, and structure-type refers to that namely the macromolecular material itself as conductive resin matrix has the conductive resin of electroconductibility; Filled-type refers to that usual tackiness agent is as matrix, and rely on interpolation electroconductive stuffing to make glue have the conductive resin of electric action, the preparation of current conducting polymer composite is very complicated, also have larger distance from practical application, is therefore widely usedly filled conductive glue.The electroconductive stuffing that filled conductive glue stick adds, is metal-powder usually.Electro-conductive adhesive is usually used in microelectronics assembling, comprise thin wire to be connected with printed wiring, plated board, the metal level of ceramic adherend, metal chassis, bonding wire and base, bonding element with through the plane hole of printed wiring, the tuning and hole of bonding waveguide is repaired.The complex material that electro-conductive adhesive is made up of the electroconductive stuffing such as metal powder or graphite and synthetic resins, it is main moiety with matrix resin and conductive filler material and conducting particles usually, by the bonding effect of matrix resin, conducting particles is combined, form conductive path, the conduction realized by gluing material connects.The metallics that electro-conductive adhesive uses has: the powder of gold and silver, copper, aluminium, zinc, iron, nickel and graphite and some conductive compounds; The body material that uses has conventional as adhesive systems such as epoxy resin, silicone resin, polyimide resin, resol, urethane, acrylic resins.These tackiness agent define the molecular skeleton knot of electro-conductive adhesive after hardening, provide mechanical property and adhesiveproperties guarantee, and make conductive filler particles form passage.The present invention selects resol and copper powder to be that main raw material is to produce resol electro-conductive adhesive.The major advantage of use resol is: resol has excellent thermotolerance, flame resistivity, water tolerance, acid resistance better, mechanical and electric property is good, especially cheap, add different auxiliary materials when making tackiness agent, the synvaren of Various Functions can be obtained.The present invention with liquid phenolic resin, epoxy resin, epoxy resin diluent, paracril, polyvinyl butyral acetal, silane coupling agent, diphenylmethanediamiand, copper powder for raw material, and be aided with certain processing condition to produce resol electro-conductive adhesive, the advantage of this preparation method is: use general-purpose equipment, production technique simple, end-use is extensive.
Summary of the invention
The problem to be solved in the present invention is to provide a kind of method producing resol electro-conductive adhesive in batches, the method is with liquid phenolic resin, epoxy resin, epoxy resin diluent, paracril, polyvinyl butyral acetal, silane coupling agent, diphenylmethanediamiand, copper powder is raw material, and be aided with certain processing condition to produce resol electro-conductive adhesive, the raw material weight proportioning of producing the use of this product is: liquid phenolic resin 32-34%, epoxy resin 4-6%, epoxy resin diluent 12%, liquid nitrile rubber 2%, polyvinyl butyral acetal 2%, silane coupling agent 2%, diphenylmethanediamiand 1%, copper powder 43%.
The present invention can be achieved through the following technical solutions:
A preparation method for resol electro-conductive adhesive, its feature is made up of following steps:
1. the liquid phenolic resin of formula ratio is sent into the first agitator tank, start stirrer, rotating speed is 20 revs/min, after temperature being elevated to 35-40 DEG C, the liquid nitrile rubber of formula ratio is sent into the first agitator tank, is cooled to normal temperature after stirring.
2. the epoxy resin diluent of formula ratio is sent into the second agitator tank, start stirrer, rotating speed is 25 revs/min, add epoxy resin, polyvinyl butyral acetal, silane coupling agent, the diphenylmethanediamiand of formula ratio at normal temperatures successively, after stirring reaction 0.5-0.7 hour, the mixture of liquid phenolic resin and liquid nitrile rubber is added the second agitator tank, adds the copper powder of formula ratio after stirring reaction 0.3-0.4 hour, stir and get product.
Temperature of reaction in the first agitator tank described in step (1) is 37.5 DEG C.
Normal temperature in the second agitator tank described in step (2) is 5-30 DEG C.
The invention has the beneficial effects as follows: the preparation method providing a kind of resol electro-conductive adhesive, this preparation method uses that general-purpose equipment, production technique are simple, product price is cheap, and product can at room temperature solidify, of many uses, and has extremely low resistivity.
Embodiment
Embodiment 1
By account for total amount be 32% liquid phenolic resin send into the first agitator tank, start stirrer, rotating speed is 20 revs/min, after temperature being elevated to 35-40 DEG C by account for total amount be 2% liquid nitrile rubber send into the first agitator tank, be cooled to normal temperature after stirring; By account for total amount be 12% epoxy resin diluent send into the second agitator tank, start stirrer, rotating speed is 25 revs/min, add successively at normal temperatures account for total amount be 6% epoxy resin, account for total amount be 2% polyvinyl butyral acetal, account for total amount be 2% silane coupling agent, account for the diphenylmethanediamiand that total amount is 1%, after stirring reaction 0.5-0.7 hour, the mixture of liquid phenolic resin and liquid nitrile rubber is added the second agitator tank, add after stirring reaction 0.3-0.4 hour account for total amount be 43% copper powder, stir and get product.
Embodiment 2
By account for total amount be 33% liquid phenolic resin send into the first agitator tank, start stirrer, rotating speed is 20 revs/min, after temperature being elevated to 35-40 DEG C by account for total amount be 2% liquid nitrile rubber send into the first agitator tank, be cooled to normal temperature after stirring; By account for total amount be 12% epoxy resin diluent send into the second agitator tank, start stirrer, rotating speed is 25 revs/min, add successively at normal temperatures account for total amount be 5% epoxy resin, account for total amount be 2% polyvinyl butyral acetal, account for total amount be 2% silane coupling agent, account for the diphenylmethanediamiand that total amount is 1%, after stirring reaction 0.5-0.7 hour, the mixture of liquid phenolic resin and liquid nitrile rubber is added the second agitator tank, add after stirring reaction 0.3-0.4 hour account for total amount be 43% copper powder, stir and get product.
Embodiment 3
By account for total amount be 34% liquid phenolic resin send into the first agitator tank, start stirrer, rotating speed is 20 revs/min, after temperature being elevated to 35-40 DEG C by account for total amount be 2% liquid nitrile rubber send into the first agitator tank, be cooled to normal temperature after stirring; By account for total amount be 12% epoxy resin diluent send into the second agitator tank, start stirrer, rotating speed is 25 revs/min, add successively at normal temperatures account for total amount be 4% epoxy resin, account for total amount be 2% polyvinyl butyral acetal, account for total amount be 2% silane coupling agent, account for the diphenylmethanediamiand that total amount is 1%, after stirring reaction 0.5-0.7 hour, the mixture of liquid phenolic resin and liquid nitrile rubber is added the second agitator tank, add after stirring reaction 0.3-0.4 hour account for total amount be 43% copper powder, stir and get product.
Claims (3)
1. a preparation method for resol electro-conductive adhesive, its raw material weight proportioning used is: liquid phenolic resin 32-34%, epoxy resin 4-6%, epoxy resin diluent 12%, liquid nitrile rubber 2%, polyvinyl butyral acetal 2%, silane coupling agent 2%, diphenylmethanediamiand 1%, copper powder 43%; It is characterized in that: the liquid phenolic resin of formula ratio is sent into the first agitator tank by step (1), start stirrer, rotating speed is 20 revs/min, after temperature being elevated to 35-40 DEG C, the liquid nitrile rubber of formula ratio is sent into the first agitator tank, is cooled to normal temperature after stirring; The epoxy resin diluent of formula ratio is sent into the second agitator tank by step (2), start stirrer, rotating speed is 25 revs/min, add epoxy resin, polyvinyl butyral acetal, silane coupling agent, the diphenylmethanediamiand of formula ratio at normal temperatures successively, after stirring reaction 0.5-0.7 hour, the mixture of liquid phenolic resin and liquid nitrile rubber is added the second agitator tank, adds the copper powder of formula ratio after stirring reaction 0.3-0.4 hour, stir and get product.
2. the preparation method of a kind of resol electro-conductive adhesive according to claim 1, is characterized in that: the temperature of reaction in the first agitator tank described in step (1) is 37.5 DEG C.
3. the preparation method of a kind of resol electro-conductive adhesive according to claim 1, is characterized in that: the normal temperature in the second agitator tank described in step (2) is 5-30 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310353369.6A CN104371616A (en) | 2013-08-15 | 2013-08-15 | Preparation method of phenolic resin conductive adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310353369.6A CN104371616A (en) | 2013-08-15 | 2013-08-15 | Preparation method of phenolic resin conductive adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104371616A true CN104371616A (en) | 2015-02-25 |
Family
ID=52550820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310353369.6A Pending CN104371616A (en) | 2013-08-15 | 2013-08-15 | Preparation method of phenolic resin conductive adhesive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104371616A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106281102A (en) * | 2016-08-31 | 2017-01-04 | 强新正品（苏州）环保材料科技有限公司 | Conducting resinl |
| TWI613268B (en) * | 2016-12-20 | 2018-02-01 | 國立臺灣師範大學 | Conductive carbon paste and conductive substrate comprising the same |
| CN112251176A (en) * | 2020-10-22 | 2021-01-22 | 苏州维盛特克电子有限公司 | Adhesive for adhering electromagnetic wave shielding of PDP (plasma display panel) protective screen and preparation method of functional film of adhesive |
| CN113831877A (en) * | 2021-09-27 | 2021-12-24 | 湖北晟特新材料有限公司 | Modified epoxy resin adhesive and application thereof in hard mica plate |
-
2013
- 2013-08-15 CN CN201310353369.6A patent/CN104371616A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106281102A (en) * | 2016-08-31 | 2017-01-04 | 强新正品（苏州）环保材料科技有限公司 | Conducting resinl |
| TWI613268B (en) * | 2016-12-20 | 2018-02-01 | 國立臺灣師範大學 | Conductive carbon paste and conductive substrate comprising the same |
| CN112251176A (en) * | 2020-10-22 | 2021-01-22 | 苏州维盛特克电子有限公司 | Adhesive for adhering electromagnetic wave shielding of PDP (plasma display panel) protective screen and preparation method of functional film of adhesive |
| CN113831877A (en) * | 2021-09-27 | 2021-12-24 | 湖北晟特新材料有限公司 | Modified epoxy resin adhesive and application thereof in hard mica plate |
| CN113831877B (en) * | 2021-09-27 | 2023-08-11 | 湖北晟特新材料有限公司 | Modified epoxy resin adhesive and application thereof in hard mica plate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100476285B1 (en) | Through-Hole Wiring Board | |
| JP5151902B2 (en) | Anisotropic conductive film | |
| CN103493297B (en) | Anisotropic conductive film, method of attachment and connection structural bodies | |
| JP2007091959A (en) | Anisotropically conductive adhesive | |
| JP4556936B2 (en) | Adhesive for electrode connection | |
| CN102191001B (en) | Epoxy conductive adhesive composition | |
| CN103923585A (en) | Conductive adhesive composition and conductive adhesive membrane | |
| JP2008094908A (en) | Adhesive for electrode connection | |
| CN102277109B (en) | Preparation method of environmentally-friendly photocuring silver conductive adhesive | |
| JP2006196850A (en) | Adhesive for connecting circuit | |
| CN104371616A (en) | Preparation method of phenolic resin conductive adhesive | |
| JP3837858B2 (en) | Conductive adhesive and method of using the same | |
| JP2007317563A (en) | Circuit connecting adhesive | |
| JP5267958B2 (en) | Adhesive composition | |
| CN108300360A (en) | Profiled metal particle conductive glued membrane and preparation method thereof | |
| CN103013408A (en) | Preparation method of conductive adhesive cured at room temperature | |
| CN104629643A (en) | Conductive glue, preparation method thereof and circuit board | |
| WO2015099049A1 (en) | Conductive paste and conductive film | |
| CN102404934B (en) | Circuit board substrate and manufacturing method thereof | |
| CN103184017A (en) | Additive for anisotropic conductive adhesives and preparation method thereof | |
| JP6132400B2 (en) | Conductive material | |
| JP4867805B2 (en) | Adhesive for electrode connection | |
| JP5273514B2 (en) | Electrode connecting adhesive and method for producing the same | |
| JP2009037928A (en) | Adhesive for electrode connection | |
| CN103571370A (en) | Circuit connection material |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150225 |
|
| WD01 | Invention patent application deemed withdrawn after publication |