CN103571370A - Circuit connection material - Google Patents
Circuit connection material Download PDFInfo
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- CN103571370A CN103571370A CN201310338311.4A CN201310338311A CN103571370A CN 103571370 A CN103571370 A CN 103571370A CN 201310338311 A CN201310338311 A CN 201310338311A CN 103571370 A CN103571370 A CN 103571370A
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- epoxy resin
- beta
- methyl
- actual load
- circuit connection
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J163/10—Epoxy resins modified by unsaturated compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
Abstract
The invention relates to a circuit connection material for the connection of electrodes. The circuit connection material can suppress the warpage and contains Beta-methylol epoxy resins and a positive ion polymerization initiator. The Beta-methylol epoxy resins can be an independent bisphenol A Beta-methylol epoxy resin, bisphenol F Beta-methylol epoxy resin, and dicyclopentadiene Beta-methylol epoxy resin, or the mixing of the resins, the low-temperature solidification is improved and the warpage can be suppressed, particularly, the dicyclopentadiene Beta-methylol epoxy resin has a large-size framework, which can alleviate the stress and further reduce the warpage.
Description
Technical field
The present invention relates to the circuit connection material for interelectrode connection.
Background technology
In recent years, follow LCD(Liquid Crystal Display, liquid-crystal display) large screen, high definition, the frame stricturization of panel, connect the microminiaturization of chip and the graph thinning of connection also fast-developing.Therefore, for example, by COG(Chip On Glass, glass substrate chip) actual load and the warpage a little of the glass substrate that occurs also can make liquid crystal panel produce color spot.IC(Integrated Circuit when the generation reason of this color spot is actual load, unicircuit) difference of the thermal expansion amount of chip and glass substrate, thereby carried out the low temperature of actual load temperature.
For example, as ACF(Anisotropic Conductive Film, the low temperature method of anisotropic conductive film) crimping condition, attempted expecting than negatively charged ion cure system faster curing reaction cationic curing system (for example, with reference to patent documentation 1) or replace Racemic glycidol ether type epoxy and use the method (for example,, with reference to patent documentation 2) of reactive high alicyclic epoxy resin.
Yet, in the low-temperature curing of anisotropic conductive film in the past, be difficult to fully suppress the generation of warpage.
Prior art document
Patent documentation
Patent documentation 1: TOHKEMY 2007-162019 communique
Patent documentation 2: TOHKEMY 2007-238751 communique.
Summary of the invention
The problem that invention will solve
The present invention, in view of above-mentioned practical situation in the past propose, provides the circuit connection material of the generation that can suppress warpage.
For the method for dealing with problems
Present inventor conducts in-depth research, and found that, by coordinating the Beta-methyl type epoxy resin as epoxy resin, curability at low temperatures improves, and can suppress the generation of warpage.
, circuit connection material of the present invention is characterised in that, contains Beta-methyl type epoxy resin and cationic polymerization initiators.
In addition, actual load body of the present invention is characterised in that, by aforementioned circuit connecting material, the 1st electronic component and the 2nd electronic component is electrically connected to.
In addition, the manufacture method of actual load body of the present invention is characterised in that, aforementioned circuit connecting material is pasted on the terminal of the 1st electronic component, the 2nd electronic component is pre-configured in aforementioned circuit connecting material, by heated extrusion device, from aforementioned the 2nd electronic component, push, the terminal of aforementioned the 1st electronic component is connected with the terminal of aforementioned the 2nd electronic component.
Invention effect
According to the present invention, due to the Beta-methyl type epoxy resin being combined with as epoxy resin, thereby curability at low temperatures raising, can suppress the generation of warpage.
Accompanying drawing explanation
[Fig. 1] is for the side elevational view of the amount of warpage determination test of actual load body is described.
Embodiment
Below, in the time of with reference to accompanying drawing, at length embodiments of the present invention are described in the following sequence.
1. circuit connection material
2. the manufacture method of actual load body and actual load body
3. embodiment.
< 1. circuit connection material >
Circuit connection material in present embodiment contains Beta-methyl type epoxy resin and cationic polymerization initiators.
As Beta-methyl type epoxy resin, can be used alone or as a mixture dicyclopentadiene-type, bisphenol A-type, Bisphenol F type, phenol phenolic varnish type, alicyclic ring type, heterocyclic type, glycidyl ester type, glycidic amine type etc.
Among them, viewpoint from the physical property of cured article, is preferably used alone or as a mixture the dicyclopentadiene-type Beta-methyl epoxy resin shown in the bisphenol A-type Beta-methyl epoxy resin shown in following general formula (I), Bisphenol F type Beta-methyl epoxy resin and following general formula (II).Particularly dicyclopentadiene-type Beta-methyl epoxy resin, by the skeleton of its large volume, can make stress alleviate, and further reduces amount of warpage.
[changing 1]
Wherein, in general formula (I), R1, R2 represent the alkyl of hydrogen atom or carbonatoms 1～4 independently of one another, and n is 0～5.
[changing 2]
Wherein, in general formula (II), n is 0～5.
Bisphenol A-type Beta-methyl epoxy resin can make Beta-methyl Epicholorohydrin and bisphenol-a reaction and obtain, and Bisphenol F type Beta-methyl epoxy resin can make Beta-methyl Epicholorohydrin react with Bisphenol F and obtain.In addition, dicyclopentadiene-type Beta-methyl epoxy resin can make Beta-methyl Epicholorohydrin react and obtain with phenol Dicyclopentadiene (DCPD).
In addition, the content of Beta-methyl type epoxy resin is preferably 10～35 quality %.Content by Beta-methyl type epoxy resin is 10～35 quality % of caking agent composition, can show excellent curability at low temperatures, suppresses the generation of warpage simultaneously.When use level is less than 10 quality %, during low-temperature curing, can occur to solidify not enough.
In addition, for film formative is improved, preferably mix the phenoxy resin as high molecular expoxy resin of being prepared by Epicholorohydrin and bis-phenol.If the content of phenoxy resin is crossed at least, can not form film, if cross, have at most the tendency reducing for obtaining the removing property of the resin of electrical connection, thereby whole with respect to insulativity adhering resin, be preferably 20～60 quality %, 30～60 quality % more preferably.
The cation type of cationic polymerization initiators makes the epoxy ring-opening of epoxy resin end, makes epoxy resin self-crosslinking each other.As this cation curing agent, can enumerate the salt such as sulfonium salt, diazonium salt, salt compounded of iodine, phosphonium salt, selenium salt.Especially, there is the sulfonium salt of aryl because the reactivity under low temperature is excellent, validity period is long, thus suitable to cationic polymerization initiators.
In addition, other interpolation composition as caking agent composition, preferably adds silane coupling agent.As silane coupling agent, can use that epoxy system, amino system, sulfydryl are sulfide-based, uride system etc., in present embodiment, can preferably use epoxy is silane coupling agent.By this, can make the cementability at the interface of organic materials and inorganic materials improve.In addition, can also add mineral filler.As mineral filler, can use silicon-dioxide, talcum, titanium oxide, calcium carbonate, magnesium oxide etc., the kind of mineral filler is not particularly limited.Can control mobility by the content of mineral filler, improve particle-capture rate.In addition, when coordinating above-mentioned each composition, can preferably use toluene, ethyl acetate or their mixed solvent.
Circuit connection material in present embodiment is applicable to non-conductive film (NCF:Non Conductive Film) or dispersed electro-conductive particle form membranaceous anisotropic conductive film (ACF:Anisotropic Conductive Film) in caking agent.
As the electroconductive particle being scattered in ACF, can enumerate the known any electroconductive particle using in anisotropic conductive film.As electroconductive particle, can use such as: the particle of the various metal or metal alloy such as nickel, iron, copper, aluminium, tin, lead, chromium, cobalt, silver, gold, the particle forming at the surface coated metal of the resin particles such as epoxy resin, resol, acrylic resin, vinyl cyanide vinylbenzene (AS) resin, benzoguanamine resin, divinyl benzene series resin, phenylethylene resin series, on the surface of these particles, further be coated with particle that insulation film forms etc.In addition, the median size of electroconductive particle is preferably 1～10 μ m, 2～6 μ m more preferably.In addition, the average particle density of the electroconductive particle in caking agent composition, from the viewpoint of connection reliability and insulating reliability, is preferably 1000～80000/mm
2, 3000～50000/mm more preferably
2.
The circuit connection material that comprises this formation is owing to being combined with Beta-methyl type epoxy resin and cationic polymerization initiators, thereby curability at low temperatures raising, can also suppress the generation of warpage simultaneously.
Then, the manufacture method of aforementioned circuit connecting material is described.The manufacture method of the circuit connection material in present embodiment has following operation: peeling off the painting process of coating adhesive composition on base material and the composition of peeling off on base material is carried out to dry drying process.
In painting process, coordinate the aforementioned binder composition that contains Beta-methyl type epoxy resin and cationic polymerization initiators, after with an organic solvent adjusting, use excellent painting machine, apparatus for coating etc. that said composition is coated and peeled off on base material.
As organic solvent, can use toluene, ethyl acetate or their mixed solvent, other various organic solvents.In addition, peeling off base material comprises such as the strippers such as organosilicon being coated to PET(Poly Ethylene Terephthalate, polyethylene terephthalate), OPP(Oriented Polypropylene, oriented polypropylene), PMP(Poly-4-methylpentene-1, poly--4-methylpentene-1), PTFE(Polytetrafluoroethylene, tetrafluoroethylene) etc. the stepped construction forming, maintains the film shape of composition.
In drying process under connecing, by oven heat, heat drying apparatus etc., the binder composition of peeling off on base material is dried.By this, can obtain circuit connection material and form membranaceous adhesive film.
The manufacture method > of < 2. actual load bodies and actual load body
Then, to using actual load body and the manufacture method thereof of aforementioned circuit connecting material to describe.Actual load body in present embodiment is the circuit connection material that contains Beta-methyl type epoxy resin and cationic polymerization initiators by aforementioned, and the 1st electronic component and the 2nd electronic component are electrically connected to and are formed.
As the 1st electronic component, for example can enumerate: IZO(Indium Zinc Oxide, indium zinc oxide), noncrystalline ITO(Indium Tin Oxide, tin indium oxide) etc. surface there is the wiring material of the terminal of level and smooth fine pitch.
In addition, as the 2nd electronic component, can enumerate the IC(Integrated Circuit of the terminal that has formed fine pitch projection etc., unicircuit).
In addition, in the manufacture method of the actual load body in present embodiment, make aforementioned circuit connecting material be pasted on (pre-crimping) on the terminal of the 1st electronic component, the 2nd electronic component is pre-configured on circuit connection material, by heated extrusion device, from the 2nd electronic component, push, the terminal of the 1st electronic component is connected with the terminal of the 2nd electronic component, and described circuit connection material contains Beta-methyl type epoxy resin and cationic polymerization initiators.By this, obtain the actual load body that the terminal of the terminal of the 1st electronic component and the 2nd electronic component is formed by connecting by electroconductive particle.
Actual load body in present embodiment is because collaboration has the circuit connection material of Beta-methyl type epoxy resin and cationic polymerization initiators, thereby can solidify at low temperatures, can reduce amount of warpage.
[embodiment]
< 3. embodiment >
Below, embodiments of the invention are described.In the present embodiment, as circuit connection material, make the anisotropic conductive film (ACF:Anisotropic Conductive Film) that has coordinated Beta-methyl type epoxy resin, the conducting resistance of actual load body, amount of warpage are evaluated.Should illustrate, it is fixed that the present invention is not limited to these examples.
As described below the carrying out of evaluation of the making of the making of anisotropic conductive film, actual load body, the evaluation of conducting resistance and amount of warpage.
［ making of anisotropic conductive film ］
In the caking agent being formed by phenoxy resin (trade(brand)name: YP50, Dongdu change into society's system), epoxy resin, silane coupling agent (trade(brand)name: KBM403, chemistry society of SHIN-ETSU HANTOTAI system), solidifying agent (trade(brand)name: SI-60L, three new chemical society systems), the dispersed electro-conductive particle (name of an article: AUL704, Plot water chemistry industry society system) so that particle density is 50000/mm
2, the anisotropic conductive film of making thickness 20 μ m.Epoxy resin can be from bisphenol A-type Beta-methyl epoxy resin (make the bisphenol-a reaction of the Beta-methyl Epicholorohydrin of 2 moles and 1 mole and obtain), dicyclopentadiene-type Beta-methyl epoxy resin (making the Beta-methyl Epicholorohydrin of 2 moles react and obtain with the phenol Dicyclopentadiene (DCPD) of 1 mole), bisphenol A type epoxy resin (trade(brand)name: EP-828, ジ ャ パ Application エ ポキ シレジン society system), dicyclopentadiene-type epoxy resin (trade(brand)name: EP-4088S, ADEKA society system) two or more use alone or in combination in.
［ making of actual load body ］
Use anisotropic conductive film, evaluate and use IC(profile: 1.8mm * 20mm, hill height: 15 μ m) with evaluation engaging with ITO coated glass (the thick 0.5mm of glass).First, by being cut to the wide anisotropic conductive film of 1.5mm, being pasted on to evaluate and use ITO coated glass, carry out pre-crimping (condition: 70 ℃-1MPa-1sec), will evaluate thereon use IC position involutory after, under 135 ℃-60MPa-5sec of crimping condition, carry out formal crimping, obtain actual load body.
［ evaluation of conducting resistance ］
For actual load body, the contact resistance at mensuration initial stage (Initial), and the contact resistance after 85 ℃ of temperature, humidity 85%RH, the TH test (Thermal Humidity Test, humid heat test) of 500 hours.In mensuration, use multipurpose electronic table (model: multipurpose electronic table 7555, Yokogawa Motor society system), the resistance value while measuring circulating current 2mA by 4 terminal methods.Contact resistance value after TH test is less than 10.0 Ω and is evaluated as zero, and 10.0 Ω be evaluated as above *.
［ evaluation of amount of warpage ］
As shown in Figure 1, use contact pin type surface roughometer (trade(brand)name: society of SE-3H, little Ban institute system), from glass substrate 11 is connected to the downside of glass substrate 11 of the actual load body obtaining by anisotropic conductive film 13 with IC chip 12, with contact pilotage 20, scan, measure the amount of warpage (μ m) of glass substrate face.
［ embodiment 1 ］
The anisotropic conductive film of the caking agent that making consists of phenoxy resin 55 mass parts, bisphenol A-type Beta-methyl epoxy resin 35 mass parts, silane coupling agent 2 mass parts and solidifying agent 8 mass parts.
The contact resistance at the initial stage of the actual load body that the anisotropic conductive film of use embodiment 1 is made is 0.2 Ω, and the contact resistance after TH test is 6.3 Ω.Therefore conducting resistance is evaluated as zero.In addition, the amount of warpage of actual load body is 11.5 μ m.
［ embodiment 2 ］
The anisotropic conductive film of the caking agent that making consists of phenoxy resin 55 mass parts, dicyclopentadiene-type Beta-methyl epoxy resin 35 mass parts, silane coupling agent 2 mass parts and solidifying agent 8 mass parts.
The contact resistance at the initial stage of the actual load body that the anisotropic conductive film of use embodiment 2 is made is 0.2 Ω, and the contact resistance after TH test is 6.2 Ω.Therefore conducting resistance is evaluated as zero.In addition, the amount of warpage of actual load body is 9.8 μ m.
［ embodiment 3 ］
The anisotropic conductive film of the caking agent that making consists of phenoxy resin 55 mass parts, dicyclopentadiene-type Beta-methyl epoxy resin 25 mass parts, dicyclopentadiene-type epoxy resin 10 mass parts, silane coupling agent 2 mass parts and solidifying agent 8 mass parts.
The contact resistance at the initial stage of the actual load body that the anisotropic conductive film of use embodiment 3 is made is 0.2 Ω, and the contact resistance after TH test is 6.8 Ω.Therefore conducting resistance is evaluated as zero.In addition, the amount of warpage of actual load body is 9.7 μ m.
［ embodiment 4 ］
The anisotropic conductive film of the caking agent that making consists of phenoxy resin 55 mass parts, dicyclopentadiene-type Beta-methyl epoxy resin 15 mass parts, dicyclopentadiene-type epoxy resin 20 mass parts, silane coupling agent 2 mass parts and solidifying agent 8 mass parts.
The contact resistance at the initial stage of the actual load body that the anisotropic conductive film of use embodiment 4 is made is 0.2 Ω, and the contact resistance after TH test is 7.7 Ω.Therefore conducting resistance is evaluated as zero.In addition, the amount of warpage of actual load body is 9.4 μ m.
［ embodiment 5 ］
The anisotropic conductive film of the caking agent that making consists of phenoxy resin 55 mass parts, dicyclopentadiene-type Beta-methyl epoxy resin 5 mass parts, dicyclopentadiene-type epoxy resin 30 mass parts, silane coupling agent 2 mass parts and solidifying agent 8 mass parts.
The contact resistance at the initial stage of the actual load body that the anisotropic conductive film of use embodiment 5 is made is 0.2 Ω, and the contact resistance after TH test is 19.7 Ω.Therefore being evaluated as of conducting resistance *.In addition, the amount of warpage of actual load body is 8.7 μ m.
［ comparative example 1 ］
The anisotropic conductive film of the caking agent that making consists of phenoxy resin 55 mass parts, bisphenol A type epoxy resin 35 mass parts, silane coupling agent 2 mass parts and solidifying agent 8 mass parts.
The contact resistance at the initial stage of the actual load body that the anisotropic conductive film of use comparative example 1 is made is 0.4 Ω, and the contact resistance after TH test is 38.1 Ω.Therefore being evaluated as of conducting resistance *.In addition, the amount of warpage of actual load body is 8.5 μ m.
［ comparative example 2 ］
The anisotropic conductive film of the caking agent that making consists of phenoxy resin 55 mass parts, dicyclopentadiene-type epoxy resin 35 mass parts, silane coupling agent 2 mass parts and solidifying agent 8 mass parts.
The contact resistance at the initial stage of the actual load body that the anisotropic conductive film of use comparative example 2 is made is 0.4 Ω, and the contact resistance after TH test is 35.2 Ω.Therefore being evaluated as of conducting resistance *.In addition, the amount of warpage of actual load body is 8.3 μ m.
［ reference example 1 ］
The anisotropic conductive film of the caking agent identical with embodiment 1 that making consists of phenoxy resin 55 mass parts, bisphenol A-type Beta-methyl epoxy resin 35 mass parts, silane coupling agent 2 mass parts and solidifying agent 8 mass parts.
Use the anisotropic conductive film of reference example 1, under the condition of 170 ℃-60MPa-5sec, carry out thermo-compressed, make actual load body.The contact resistance at the initial stage of this actual load body is 0.2 Ω, and the contact resistance after TH test is 4.8 Ω.Therefore conducting resistance is evaluated as zero.In addition, the amount of warpage of actual load body is 16.7 μ m.
［ reference example 2 ］
The anisotropic conductive film of the caking agent identical with embodiment 2 that making consists of phenoxy resin 55 mass parts, dicyclopentadiene-type Beta-methyl epoxy resin 35 mass parts, silane coupling agent 2 mass parts and solidifying agent 8 mass parts.
Use the anisotropic conductive film of reference example 2, under the condition of 170 ℃-60MPa-5sec, carry out thermo-compressed, make actual load body.The contact resistance at the initial stage of this actual load body is 0.2 Ω, and the contact resistance after TH test is 4.0 Ω.Therefore conducting resistance is evaluated as zero.In addition, the amount of warpage of actual load body is 15.7 μ m.
［ reference example 3 ］
The anisotropic conductive film of the caking agent identical with comparative example 1 that making consists of phenoxy resin 55 mass parts, bisphenol A type epoxy resin 35 mass parts, silane coupling agent 2 mass parts and solidifying agent 8 mass parts.
Use the anisotropic conductive film of reference example 3, under the condition of 170 ℃-60MPa-5sec, carry out thermo-compressed, make actual load body.The contact resistance at the initial stage of this actual load body is 0.2 Ω, and the contact resistance after TH test is 6.0 Ω.Therefore conducting resistance is evaluated as zero.In addition, the amount of warpage of actual load body is 16.9 μ m.
［ reference example 4 ］
The anisotropic conductive film of the caking agent identical with comparative example 2 that making consists of phenoxy resin 55 mass parts, dicyclopentadiene-type epoxy resin 35 mass parts, silane coupling agent 2 mass parts and solidifying agent 8 mass parts.
Use the anisotropic conductive film of reference example 4, under the condition of 170 ℃-60MPa-5sec, carry out thermo-compressed, make actual load body.The contact resistance at the initial stage of this actual load body is 0.2 Ω, and the contact resistance after TH test is 5.8 Ω.Therefore conducting resistance is evaluated as zero.In addition, the amount of warpage of actual load body is 16.0 μ m.
The cooperation of the anisotropic conductive film in embodiment shown in table 1 1～5 and evaluation result, cooperation and the evaluation result of the anisotropic conductive film in comparative example shown in table 21,2 and reference example 1～4.
[table 1]
[table 2]
In common crimping condition (170 ℃-60MPa-5sec), as described in reference example 1～4, while using the arbitrary epoxy resin in bisphenol A-type Beta-methyl epoxy resin, DCP type Beta-methyl epoxy resin, bisphenol A type epoxy resin, DCP type epoxy resin, can obtain good conducting resistance, but amount of warpage is large.
In the crimping condition of low temperature (135 ℃-60MPa-5sec), as described in comparative example 1,2, while using bisphenol A type epoxy resin, DCP type epoxy resin, not enough owing to solidifying, thereby fail to obtain good conducting resistance.
On the other hand, as described in embodiment 1～5, while using bisphenol A-type Beta-methyl epoxy resin, DCP type Beta-methyl epoxy resin, under the crimping condition of low temperature, also obtain good conducting resistance, can reduce amount of warpage.While particularly using DCP type Beta-methyl epoxy resin, the effect of the skeleton by large volume, can further reduce amount of warpage.
Nomenclature
11 glass substrates, 12 IC chips, 13 anisotropic conductive film
Claims (6)
1. circuit connection material, it contains Beta-methyl type epoxy resin and cationic polymerization initiators.
2. circuit connection material claimed in claim 1, wherein, the use level of aforementioned Beta-methyl type epoxy resin is 10～35 quality %.
3. circuit connection material claimed in claim 2, wherein, aforementioned Beta-methyl type epoxy resin is bisphenol A-type Beta-methyl epoxy resin or dicyclopentadiene-type Beta-methyl epoxy resin.
4. circuit connection material claimed in claim 3, wherein, aforementioned cationic polymerization initiators is the sulfonium salt with aryl.
5. actual load body, it is by the circuit connection material described in any one in aforementioned claim 1 to 4, the 1st electronic component and the 2nd electronic component to be electrically connected to and to be formed.
6. the manufacture method of actual load body, wherein, make the circuit connection material described in any one in aforementioned claim 1 to 4 be pasted on the terminal of the 1st electronic component,
Make the 2nd electronic component be pre-configured in aforementioned circuit connecting material,
By heated extrusion device, from aforementioned the 2nd electronic component, push, the terminal of aforementioned the 1st electronic component is connected with the terminal of aforementioned the 2nd electronic component.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012173731A JP6007022B2 (en) | 2012-08-06 | 2012-08-06 | Circuit connection material |
| JP2012-173731 | 2012-08-06 |
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| CN103571370A true CN103571370A (en) | 2014-02-12 |
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| JP (1) | JP6007022B2 (en) |
| KR (1) | KR102098758B1 (en) |
| CN (1) | CN103571370A (en) |
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| CN105375232A (en) * | 2014-08-18 | 2016-03-02 | 迪睿合株式会社 | Method for manufacturing connection structure and anisotropic conductive adhesive film |
| CN107207923A (en) * | 2015-02-23 | 2017-09-26 | 迪睿合株式会社 | Multi-layer bonded film and connection structural bodies |
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| CN105375232A (en) * | 2014-08-18 | 2016-03-02 | 迪睿合株式会社 | Method for manufacturing connection structure and anisotropic conductive adhesive film |
| CN107207923A (en) * | 2015-02-23 | 2017-09-26 | 迪睿合株式会社 | Multi-layer bonded film and connection structural bodies |
| CN107207923B (en) * | 2015-02-23 | 2020-09-04 | 迪睿合株式会社 | Multilayer adhesive film and connection structure |
| CN111936543A (en) * | 2018-04-02 | 2020-11-13 | 三井化学株式会社 | Sheet-shaped epoxy resin composition, cured product thereof, and sealing sheet |
| CN111936543B (en) * | 2018-04-02 | 2023-06-30 | 三井化学株式会社 | Sheet-like epoxy resin composition, cured product thereof, and sealing sheet |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102098758B1 (en) | 2020-04-09 |
| JP2014031465A (en) | 2014-02-20 |
| JP6007022B2 (en) | 2016-10-12 |
| KR20140019235A (en) | 2014-02-14 |
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