CN103694936A - Epoxy resin pouring sealant and preparation method thereof - Google Patents
Epoxy resin pouring sealant and preparation method thereof Download PDFInfo
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- CN103694936A CN103694936A CN201310572973.8A CN201310572973A CN103694936A CN 103694936 A CN103694936 A CN 103694936A CN 201310572973 A CN201310572973 A CN 201310572973A CN 103694936 A CN103694936 A CN 103694936A
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Abstract
The present invention discloses an epoxy resin pouring sealant, which comprises the following components, by weight: 100 parts of an epoxy resin containing at least two epoxy groups and being a liquid state at a room temperature, 5-15 parts of an active diluent, 85-105 parts of an aliphatic anhydride curing agent, 1-10 parts of an acetylacetone metal complex, 10-30 parts of a toughening agent, and 60-80 parts of a filler. The epoxy resin pouring sealant preparation method comprises: treating silicon micro-powder for 4-5 h in an oven with a temperature of 110-150 DEG C to remove water, cooling to a temperature of 10-30 DEG C, adding an epoxy resin and an epoxy resin curing agent, stirring for 20-30 min, carrying out vacuum deaeration for 10-20 min, and releasing the vacuum. The epoxy resin pouring sealant has characteristics of good toughness, good high temperature and low temperature alternation resistance, simple preparation process, low viscosity, good fluidity, and substantially-improved electronic component packaging reliability and durability.
Description
Technical field:
The present invention relates to epoxy resin Application Areas, particularly a kind of epoxy resin embedding adhesive and preparation method thereof.
Background technology:
Epoxy resin itself is thermoplastic, and molecular weight is not high, and it must be cross-linked to form cancellated macromole with solidifying agent, just can demonstrate the advantage of epoxy resin.Nowadays, the Common Curing Agents adding for the synthesis of epoxy resin can volatilize a kind of more supervirulent irritant gas conventionally when curing, jeopardize HUMAN HEALTH, and the snappiness of cured article is poor, therefore need to solve associated problem and meet the need of market.
Summary of the invention:
The object of this invention is to provide a kind of epoxy resin embedding adhesive and preparation method thereof, this epoxy resin embedding adhesive has good toughness and high-low temperature resistant alternation, and preparation technology is simple, there is lower viscosity and good mobility, can greatly improve electronic devices and components package reliability and weather resistance.
For achieving the above object, a kind of epoxy resin embedding adhesive of the present invention, the weight part of take comprises following component: 100 parts contain under at least two epoxy group(ing), normal temperature is liquid epoxy resin, 5～15 portions of reactive thinners, 85～105 parts of aliphatic acid anhydride curing agents, 1～10 part of acetylacetone metal complex, 10～30 parts of toughner, 60～80 parts of fillers.
As technique scheme preferably, described epoxy resin is that epoxy equivalent (weight) is the bisphenol f type epoxy resin that 186～190 bisphenol A type epoxy resin and/or epoxy equivalent (weight) are 163～185.
As technique scheme preferably, described aliphatic acid anhydride curing agents is poly-nonane diacid acid anhydride or alkenyl succinic anhydrides.
As technique scheme preferably, described acetylacetone metal complex is as promotor, the metal ion of its introducing is a kind of in potassium, copper, zinc, iron, chromium.
As technique scheme preferably, described toughner is paracril or thiorubber.
As technique scheme preferably, described filler is through silane coupler modified silicon metal micro mist.
The preparation method of epoxy resin embedding adhesive of the present invention comprises the steps: silicon powder in the baking oven of 110～150 ℃, to process 4～5 hours, remove moisture, be cooled to after 10～30 ℃, add epoxy resin and epoxy curing agent, stir final vacuum deaeration in 20～30 minutes 10～20 minutes, remove vacuum.
Beneficial effect of the present invention is: this epoxy resin embedding adhesive has good toughness and high-low temperature resistant alternation, and preparation technology is simple, has lower viscosity and good mobility, can greatly improve electronic devices and components package reliability and weather resistance.
Embodiment:
Embodiment mono-:
A kind of epoxy resin embedding adhesive, in weight part, comprise that 100 parts contain under at least two epoxy group(ing), normal temperature for liquid epoxy resin, 5 portions of reactive thinners, 85 parts of aliphatic acid anhydride curing agents, 1 part of acetylacetone metal complex, 10 parts of toughner, 60 parts of fillers.
Epoxy resin is that epoxy equivalent (weight) is 186～190 bisphenol A type epoxy resin.
Aliphatic acid anhydride curing agents is poly-nonane diacid acid anhydride.
Acetylacetone metal complex is as promotor, and the metal ion of its introducing is potassium.
Toughner is paracril.
Filler is through silane coupler modified silicon metal micro mist.
The compound method of epoxy resin embedding adhesive comprises the steps: silicon powder to process 4.5 hours in the baking oven of 130 ℃, remove moisture, be cooled to, after 20 ℃, add epoxy resin and epoxy curing agent, stir final vacuum deaeration in 25 minutes 15 minutes, remove vacuum.
Embodiment bis-:
An epoxy resin embedding adhesive, the weight part of take comprises that 100 parts contain under at least two epoxy group(ing), normal temperature as liquid epoxy resin, 10 portions of reactive thinners, 95 parts of aliphatic acid anhydride curing agents, 5 parts of acetylacetone metal complex, 20 parts of toughner, 70 fillers.
Epoxy resin is that epoxy equivalent (weight) is 186～190 bisphenol A type epoxy resin.
Aliphatic acid anhydride curing agents is poly-nonane diacid acid anhydride.
Acetylacetone metal complex is as promotor, and the metal ion of its introducing is potassium.
Toughner is paracril.
Filler is through silane coupler modified silicon metal micro mist.
The compound method of epoxy resin embedding adhesive comprises the steps: silicon powder to process 4.5 hours in the baking oven of 130 ℃, remove moisture, be cooled to, after 20 ℃, add epoxy resin and epoxy curing agent, stir final vacuum deaeration in 25 minutes 15 minutes, remove vacuum.
Embodiment tri-:
An epoxy resin embedding adhesive, the weight part of take comprises that 100 parts contain under at least two epoxy group(ing), normal temperature is liquid epoxy resin, 15 portions of reactive thinners, 105 parts of aliphatic acid anhydride curing agents, 10 parts of acetylacetone metal complex, 30 parts of toughner, 80 parts of fillers.
Epoxy resin is that epoxy equivalent (weight) is 186～190 bisphenol A type epoxy resin.
Aliphatic acid anhydride curing agents is poly-nonane diacid acid anhydride.
Acetylacetone metal complex is as promotor, and the metal ion of its introducing is potassium.
Toughner is paracril.
Filler is through silane coupler modified silicon metal micro mist.
The compound method of epoxy resin embedding adhesive, comprises the steps: silicon powder to process 4.5 hours in the baking oven of 130 ℃, removes moisture, be cooled to after 20 ℃, add epoxy resin and epoxy curing agent, stir final vacuum deaeration in 25 minutes 15 minutes, remove vacuum.
Comparative example:
An epoxy resin embedding adhesive, the weight part of take comprises 100 parts, and to contain under at least two epoxy group(ing), normal temperature be liquid epoxy resin, 15 portions of reactive thinners, 105 parts of dicy-curing agents, 10 parts of imidazoles curing catalysts, 30 parts of toughner, 80 parts of fillers.
Epoxy resin is that epoxy equivalent (weight) is 186～190 bisphenol A type epoxy resin.
Aliphatic acid anhydride curing agents is poly-nonane diacid acid anhydride.
Acetylacetone metal complex is as promotor, and the metal ion of its introducing is potassium.
Toughner is paracril.
Filler is through silane coupler modified silicon metal micro mist.
The compound method of epoxy resin embedding adhesive, comprises the steps: silicon powder to process 4.5 hours in the baking oven of 130 ℃, removes moisture, be cooled to after 20 ℃, add epoxy resin and epoxy curing agent, stir final vacuum deaeration in 25 minutes 15 minutes, remove vacuum.
Specifically see the following form 1:
The epoxy resin embedding adhesive mechanical electric performance comparison of table 1 embodiment and comparative example
Above embodiment, not the content of composition of the present invention is imposed any restrictions, any trickle modification, equivalent variations and modification that every foundation technical spirit of the present invention or composition composition or content are done above embodiment, all still belong in the scope of technical solution of the present invention.
Claims (7)
1. an epoxy resin embedding adhesive, is characterized in that: the weight part of take comprises following component: 100 parts contain under at least two epoxy group(ing), normal temperature is liquid epoxy resin, 5～15 portions of reactive thinners, 85～105 parts of aliphatic acid anhydride curing agents, 1～10 part of acetylacetone metal complex, 10～30 parts of toughner, 60～80 parts of fillers.
2. epoxy resin embedding adhesive according to claim 1, is characterized in that: described epoxy resin is that epoxy equivalent (weight) is the bisphenol f type epoxy resin that 186～190 bisphenol A type epoxy resin and/or epoxy equivalent (weight) are 163～185.
3. epoxy resin embedding adhesive according to claim 1, is characterized in that: described aliphatic acid anhydride curing agents is poly-nonane diacid acid anhydride or alkenyl succinic anhydrides.
4. epoxy resin embedding adhesive according to claim 1, is characterized in that: described acetylacetone metal complex is as promotor, and the metal ion of its introducing is a kind of in potassium, copper, zinc, iron, chromium.
5. epoxy resin embedding adhesive according to claim 1, is characterized in that: described toughner is paracril or thiorubber.
6. epoxy resin embedding adhesive according to claim 1, is characterized in that: described filler is through silane coupler modified silicon metal micro mist.
7. the preparation method of epoxy resin embedding adhesive claimed in claim 1, it is characterized in that comprising the steps: silicon powder is processed 4～5 hours in the baking oven of 110～150 ℃, remove moisture, be cooled to after 10～30 ℃, add epoxy resin and epoxy curing agent, stir final vacuum deaeration in 20～30 minutes 10～20 minutes, remove vacuum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310572973.8A CN103694936A (en) | 2013-11-14 | 2013-11-14 | Epoxy resin pouring sealant and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310572973.8A CN103694936A (en) | 2013-11-14 | 2013-11-14 | Epoxy resin pouring sealant and preparation method thereof |
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| CN103694936A true CN103694936A (en) | 2014-04-02 |
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| CN201310572973.8A Pending CN103694936A (en) | 2013-11-14 | 2013-11-14 | Epoxy resin pouring sealant and preparation method thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104403620A (en) * | 2014-11-12 | 2015-03-11 | 中国空空导弹研究院 | Tough high strength epoxy resin potting material and preparation method and application thereof |
| CN105925223A (en) * | 2016-06-03 | 2016-09-07 | 福建盈浩工艺制品有限公司 | Environment-friendly instant adhesive and preparation method thereof |
| CN111944122A (en) * | 2019-05-16 | 2020-11-17 | 北京化工大学 | High-strength high-modulus low-viscosity epoxy resin system and preparation method thereof |
| CN115011292A (en) * | 2021-08-30 | 2022-09-06 | 烟台德邦科技股份有限公司 | Epoxy resin bonding material capable of being cured by magnetic field and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59174615A (en) * | 1983-03-25 | 1984-10-03 | Toshiba Corp | Curing of epoxy resin composition |
| CN102015884A (en) * | 2008-04-21 | 2011-04-13 | 三键株式会社 | Conductive resin composition |
| CN102040802A (en) * | 2010-10-14 | 2011-05-04 | 天津联美化学工业有限公司 | Epoxy resin system and application thereof |
| CN102827566A (en) * | 2012-09-19 | 2012-12-19 | 三友（天津）高分子技术有限公司 | Single-component high/low-temperature-resistant epoxy resin composition |
-
2013
- 2013-11-14 CN CN201310572973.8A patent/CN103694936A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59174615A (en) * | 1983-03-25 | 1984-10-03 | Toshiba Corp | Curing of epoxy resin composition |
| CN102015884A (en) * | 2008-04-21 | 2011-04-13 | 三键株式会社 | Conductive resin composition |
| CN102040802A (en) * | 2010-10-14 | 2011-05-04 | 天津联美化学工业有限公司 | Epoxy resin system and application thereof |
| CN102827566A (en) * | 2012-09-19 | 2012-12-19 | 三友（天津）高分子技术有限公司 | Single-component high/low-temperature-resistant epoxy resin composition |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104403620A (en) * | 2014-11-12 | 2015-03-11 | 中国空空导弹研究院 | Tough high strength epoxy resin potting material and preparation method and application thereof |
| CN105925223A (en) * | 2016-06-03 | 2016-09-07 | 福建盈浩工艺制品有限公司 | Environment-friendly instant adhesive and preparation method thereof |
| CN105925223B (en) * | 2016-06-03 | 2019-03-15 | 福建盈浩文化创意股份有限公司 | A kind of environmental protection instant glue and preparation method thereof |
| CN111944122A (en) * | 2019-05-16 | 2020-11-17 | 北京化工大学 | High-strength high-modulus low-viscosity epoxy resin system and preparation method thereof |
| CN115011292A (en) * | 2021-08-30 | 2022-09-06 | 烟台德邦科技股份有限公司 | Epoxy resin bonding material capable of being cured by magnetic field and preparation method thereof |
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Application publication date: 20140402 |