CN103756611B - A kind of low-temperature curing patch red glue and preparation method thereof - Google Patents
A kind of low-temperature curing patch red glue and preparation method thereof Download PDFInfo
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- CN103756611B CN103756611B CN201310719124.0A CN201310719124A CN103756611B CN 103756611 B CN103756611 B CN 103756611B CN 201310719124 A CN201310719124 A CN 201310719124A CN 103756611 B CN103756611 B CN 103756611B
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Abstract
The present invention relates to electronics glue technical field, refer in particular to a kind of low-temperature curing patch red glue and preparation method thereof, patch red glue of the present invention adopt the dihydroxyphenyl propane of scientific formula or bisphenol F epoxy resin and thinner, promotor, stablizer, by composition proportion and the preparation method of the present invention of science, the viscosity of patch red glue, raising speed of response and cross-linking density and thermotolerance can be effectively reduced, and can curing reaction be accelerated, reduce solidification value, shorten set time, improve physical and mechanical property; Meet the requirement of low-temperature curing, under the low temperature environment of 100-150 DEG C, the solidification of equal energy very fast time, adapts to the demand of the miniaturization of electronic apparatus, ensures components and parts performance, reduction energy consumption, minimizing enterprise production cost.
Description
Technical field
The present invention relates to electronics glue technical field, refer in particular to a kind of low-temperature curing patch red glue and preparation method thereof.
Background technology
Patch red glue, also referred to as SMT solid, the red glue of SMT, it is the caking agent being dispersed with stiffening agent, pigment, solvent etc. in the lotion of redness equably, is mainly used to components and parts to be fixed in printed board, generally distributes by the method for some glue or steel mesh printing; Baking oven or Re-current welder heat hardening is put into after sticking components and parts.Along with electronic industry development; electronic apparatus is to the development of the aspect such as miniaturization, lightweight, multi-functional, high-performance, environmental protection; the application of surface mounting technology is more and more general; in SMT technological process, patch red glue is more and more important; solidified by Reflow Soldering; chip type electronic component is adhered to specific position, ensures not come off in wave soldering process.
Patch red glue not only requires that curing speed is fast, and bonding strength is large, and has good sizability, as the not wire drawing of glue point, the glue that do not overflow, does not subside, requires more and more lower to solidification value.On market, the most solidification value of patch red glue is at about 150 degree, and 2-5 minute set time is not etc.Along with the miniaturization of electronic apparatus, hot setting causes disadvantageous effect to some components and parts performance, and energy consumption is also high, increases enterprise's production cost.
Summary of the invention
The invention reside in and contain the high problem of solidification value for current patch red glue, and a kind of low-temperature curing patch red glue overcome the above problems and preparation method thereof is provided.
For achieving the above object, the present invention adopts following technical scheme:
A kind of low-temperature curing patch red glue, composition and the Parts by Ingredients of described patch red glue are as follows:
Epoxy resin: dihydroxyphenyl propane or bisphenol F epoxy resin be a kind of or its combination wherein, containing 26.5 ~ 56.5 parts;
Thinner: p-tert-butyl-phenyl glycidyl ether, trimethylolethane trimethacrylate glycidyl ether, sorbyl alcohol polyglycidyl ether be a kind of or its combination wherein, containing 5.0 ~ 15.0 parts; Viscosity, raising speed of response and cross-linking density and thermotolerance can be effectively reduced;
Stablizer: the two octadecyl ester of dithio-salicylic acid, triphenyl phosphite, thio-2 acid is a kind of or its combination wherein, containing 1.0 ~ 5.0 parts;
Promotor: PDU, wherein a kind of or its combination of 2,4,6-tri-(dimethylamino methyl) phenol, benzyldimethylamine, glyoxal ethyline urea, containing 13 ~ 15.5 parts; Can curing reaction be accelerated, reduce solidification value, shorten set time, also can improve physical and mechanical property.
Thixotropic agent: aerosil, containing 5.0 ~ 15.0 parts;
Filler: magnesium oxide, silicon powder, nano aluminium oxide, superfine calcined kaolin, white carbon black, tetrafluoroethylene, calcium carbonate is a kind of or its combination wherein, containing 7.0 ~ 23.0 parts;
Pigment: red iron oxide, everbright fast red one or its combination, containing 0.1 ~ 1.0 part;
Solidifying agent: MY-24 tertiary amine adducts, PN-23J imidazole adducts, glyoxal ethyline, Succinic anhydried, diethylenetriamine be a kind of or its combination wherein, containing 23.0 ~ 38.0 parts.
Preferably, the bisphenol A epoxide resin in described epoxy resin is bisphenol A epoxide resin 828EL, and the bisphenol F epoxy resin in epoxy resin is bisphenol F epoxy resin 862.
The preparation method of above-mentioned low-temperature curing patch red glue, comprises following processing step:
(1), successively epoxy resin, thinner, pigment are added in vacuum double planetary mixer, high-speed stirring speed 200r/min ± 10r/min, stirring at low speed speed 20r/min ± 3r/min, vacuum tightness 0.06-0.09MPa, time 30 ± 5min, temperature controls at 40 ± 5 DEG C, and dispersed with stirring is even;
(2), successively stablizer, promotor, thixotropic agent, filler are added again, high-speed stirring speed 250r/min ± 10r/min, stirring at low speed speed 30r/min ± 3r/min, vacuum tightness 0.06-0.09MPa, time 180 ± 10min, temperature controls 15 ± 5 DEG C of dispersed with stirring even;
(3), again solidifying agent is added, high-speed stirring speed 200r/min ± 10r/min, stirring at low speed speed 20r/min ± 3r/min, vacuum tightness 0.06-0.09MPa, time 90 ± 5min, temperature controls at 20 ± 5 DEG C, and namely dispersed with stirring evenly obtains described low-temperature curing patch red glue.
Beneficial effect of the present invention is: patch red glue of the present invention adopt the dihydroxyphenyl propane of scientific formula or bisphenol F epoxy resin and thinner, promotor, stablizer, by composition proportion and the preparation method of the present invention of science, the viscosity of patch red glue, raising speed of response and cross-linking density and thermotolerance can be effectively reduced, and can accelerate curing reaction, reduce solidification value, shorten set time, improve physical and mechanical property; Meet the requirement of low-temperature curing, under the low temperature environment of 100-150 DEG C, the solidification of equal energy very fast time, adapts to the demand of the miniaturization of electronic apparatus, ensures components and parts performance, reduction energy consumption, minimizing enterprise production cost.
Embodiment
Below in conjunction with embodiment, the present invention is further described:
Embodiment 1:
The patch red glue of the present embodiment is made up of the component containing following weight part:
Embodiment 2:
The patch red glue of the present embodiment is made up of the component containing following weight part:
Embodiment 3:
The patch red glue of the present embodiment is made up of the component containing following weight part:
Embodiment 4:
The patch red glue of the present embodiment is made up of the component containing following weight part:
The preparation method of low-temperature curing patch red glue of the present invention, comprises following processing step:
(1), successively epoxy resin, thinner, pigment are added in vacuum double planetary mixer, high-speed stirring speed 200r/min ± 10r/min, stirring at low speed speed 20r/min ± 3r/min, vacuum tightness 0.06-0.09MPa, time 30 ± 5min, temperature controls at 40 ± 5 DEG C, and dispersed with stirring is even;
(2), successively stablizer, promotor, thixotropic agent, filler are added again, high-speed stirring speed 250r/min ± 10r/min, stirring at low speed speed 30r/min ± 3r/min, vacuum tightness 0.06-0.09MPa, time 180 ± 10min, temperature controls 15 ± 5 DEG C of dispersed with stirring even;
(3), again solidifying agent is added, high-speed stirring speed 200r/min ± 10r/min, stirring at low speed speed 20r/min ± 3r/min, vacuum tightness 0.06-0.09MPa, time 90 ± 5min, temperature controls at 20 ± 5 DEG C, and namely dispersed with stirring evenly obtains described low-temperature curing patch red glue.
Detect by experiment, the present invention four embodiment and conventional solidified patch red glue solidify and see the following form 1 to solidification result detection contrast table under conventional and low temperature curing conditions, as can be seen from contrast table, low-temperature curing patch red glue of the present invention, there is good curability at low temperatures and set time short and there is good physicals:
Table 1 detects Data Comparison table
The above embodiment, just preferred embodiments of the present invention, be not limit practical range of the present invention, therefore all equivalences done according to structure, feature and the principle described in the present patent application the scope of the claims change or modify, and all should be included in patent claim of the present invention.
Claims (3)
1. a low-temperature curing patch red glue, is characterized in that, composition and the Parts by Ingredients of described patch red glue are as follows:
Epoxy resin: bisphenol F epoxy resin is containing 26.5 ~ 56.5 parts;
Thinner: p-tert-butyl-phenyl glycidyl ether, trimethylolethane trimethacrylate glycidyl ether, sorbyl alcohol polyglycidyl ether be a kind of or its combination wherein, containing 5.0 ~ 15.0 parts;
Stablizer: the two octadecyl ester of dithio-salicylic acid, triphenyl phosphite, thio-2 acid is a kind of or its combination wherein, containing 1.0 ~ 5.0 parts;
Promotor: PDU, 2,4,6-tri-(dimethylamino methyl) phenol, benzyldimethylamine, glyoxal ethyline urea be a kind of or its combination wherein, containing 13 ~ 15.5 parts;
Thixotropic agent: aerosil, containing 5.0 ~ 15.0 parts;
Filler: magnesium oxide, silicon powder, nano aluminium oxide, superfine calcined kaolin, white carbon black, tetrafluoroethylene, calcium carbonate is a kind of or its combination wherein, containing 7.0 ~ 23.0 parts;
Pigment: red iron oxide, everbright fast red one or its combination, containing 0.1 ~ 1.0 part;
Solidifying agent: MY-24 tertiary amine adducts, PN-23J imidazole adducts, glyoxal ethyline, Succinic anhydried, diethylenetriamine be a kind of or its combination wherein, containing 23.0 ~ 38.0 parts.
2. low-temperature curing patch red glue according to claim 1, is characterized in that: described bisphenol F epoxy resin is bisphenol F epoxy resin 862.
3. the preparation method of low-temperature curing patch red glue according to claim 1 and 2, comprises following processing step:
(1), successively epoxy resin, thinner, pigment are added in vacuum double planetary mixer, high-speed stirring speed 200r/min ± 10r/min, stirring at low speed speed 20r/min ± 3r/min, vacuum tightness 0.06-0.09MPa, time 30 ± 5min, temperature controls at 40 ± 5 DEG C, and dispersed with stirring is even;
(2), successively stablizer, promotor, thixotropic agent, filler are added again, high-speed stirring speed 250r/min ± 10r/min, stirring at low speed speed 30r/min ± 3r/min, vacuum tightness 0.06-0.09MPa, time 180 ± 10min, temperature controls 15 ± 5 DEG C of dispersed with stirring even;
(3), again solidifying agent is added, high-speed stirring speed 200r/min ± 10r/min, stirring at low speed speed 20r/min ± 3r/min, vacuum tightness 0.06-0.09MPa, time 90 ± 5min, temperature controls at 20 ± 5 DEG C, and namely dispersed with stirring evenly obtains described low-temperature curing patch red glue.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310719124.0A CN103756611B (en) | 2013-12-23 | 2013-12-23 | A kind of low-temperature curing patch red glue and preparation method thereof |
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| CN201310719124.0A CN103756611B (en) | 2013-12-23 | 2013-12-23 | A kind of low-temperature curing patch red glue and preparation method thereof |
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| CN103756611B true CN103756611B (en) | 2015-09-02 |
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Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106554513B (en) * | 2015-09-30 | 2019-06-28 | 中国石油化工股份有限公司 | Nanocomposite and preparation method thereof and rubber composition and vulcanized rubber and their application |
| CN106554512A (en) * | 2015-09-30 | 2017-04-05 | 中国石油化工股份有限公司 | Nano composite material and preparation method thereof and rubber composition and vulcanite and their application |
| CN107541169A (en) * | 2017-08-22 | 2018-01-05 | 樊之雄 | A kind of rapid curing easily stores the preparation method of gluing sheet |
| CN108219728A (en) * | 2018-01-10 | 2018-06-29 | 深圳市邦大科技有限公司 | A kind of Halogen is without sulphur patch red glue and preparation method thereof |
| CN108485571A (en) * | 2018-04-04 | 2018-09-04 | 苏州盛威佳鸿电子科技有限公司 | A kind of low-temperature setting patch red glue |
| CN108504317A (en) * | 2018-04-20 | 2018-09-07 | 苏州盛威佳鸿电子科技有限公司 | A kind of quick-setting SMT paster adhesive |
| CN108395861A (en) * | 2018-04-20 | 2018-08-14 | 苏州盛威佳鸿电子科技有限公司 | A kind of fire safe type SMT paster adhesive in pb-free solder |
| CN108395862A (en) * | 2018-04-20 | 2018-08-14 | 苏州盛威佳鸿电子科技有限公司 | A kind of SMT low-temperature setting patch red glue in pb-free solder |
| CN108893085A (en) * | 2018-05-31 | 2018-11-27 | 苏州盛威佳鸿电子科技有限公司 | A kind of paster glue for surface mounting technology |
| CN108753234A (en) * | 2018-05-31 | 2018-11-06 | 苏州盛威佳鸿电子科技有限公司 | A kind of high stability SMT paster adhesive |
| CN110283424A (en) * | 2019-05-29 | 2019-09-27 | 浙江百合航太复合材料有限公司 | A kind of low-temperature setting halogen-free flame retardant epoxy resin composition and its prepreg method |
| CN111500089A (en) * | 2020-04-20 | 2020-08-07 | 池州市贵兴非矿新材料有限公司 | Active calcium carbonate and preparation method thereof |
| CN113088224B (en) * | 2021-02-26 | 2022-11-29 | 广东美的白色家电技术创新中心有限公司 | Protection composition applied to packaging product, power module and preparation method of power module |
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| CN101412896A (en) * | 2007-10-17 | 2009-04-22 | 比亚迪股份有限公司 | Bicomponent epoxy adhesive and preparation thereof |
| CN102850948A (en) * | 2012-09-20 | 2013-01-02 | 烟台德邦科技有限公司 | Surface mount adhesive for surface mount technology and preparation method of surface mount adhesive |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101412896A (en) * | 2007-10-17 | 2009-04-22 | 比亚迪股份有限公司 | Bicomponent epoxy adhesive and preparation thereof |
| CN102850948A (en) * | 2012-09-20 | 2013-01-02 | 烟台德邦科技有限公司 | Surface mount adhesive for surface mount technology and preparation method of surface mount adhesive |
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