CN103756611A - Low-temperature curing patch red gum and preparation method thereof - Google Patents
Low-temperature curing patch red gum and preparation method thereof Download PDFInfo
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- CN103756611A CN103756611A CN201310719124.0A CN201310719124A CN103756611A CN 103756611 A CN103756611 A CN 103756611A CN 201310719124 A CN201310719124 A CN 201310719124A CN 103756611 A CN103756611 A CN 103756611A
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Abstract
The invention relates to the technical field of electronic glue, and particularly relates to a low-temperature curing patch red gum and a preparation method thereof. The patch red gum disclosed by the invention adopts bisphenol A or bisphenol F epoxy resin, a diluent, an accelerant and a stabilizer in a scientific formula. By adopting scientific ingredient ratio and the preparation method disclosed by the invention, the viscosity of the patch red gum can be effectively reduced, the reaction speed, the crosslinking density and the heat resistance can be effectively improved, curing reaction can be accelerated, the curing temperature is reduced, the curing time is shortened, the physical and mechanical properties are improved, the requirements of low-temperature curing are met; the curing can be quickly carried out in a low-temperature environment at 100-150 DEG C, the low-temperature curing patch red gum adopts to the miniaturization requirements of electronic appliances, the performances of the elements are ensured, energy consumption is reduced, and the production cost of an enterprise is reduced.
Description
Technical field
The present invention relates to electronics glue technical field, refer in particular to a kind of low-temperature curing patch red glue and preparation method thereof.
Background technology
Patch red glue, also referred to as SMT solid, the red glue of SMT, it is the caking agent of stiffening agent, pigment, solvent etc. of distributing equably in red lotion, is mainly used to components and parts to be fixed in printed board, generally distributes by the method for putting glue or steel mesh printing; After sticking components and parts, put into baking oven or Re-current welder heat hardening.Along with electronic industry development; electronic apparatus is to aspect development such as miniaturization, lightweight, multi-functional, high-performance, environmental protection; the application of surface mounting technology is more and more general; in SMT technological process, patch red glue is more and more important; by Reflow Soldering, solidify; chip type electronic component is adhered to specific position, guarantee not come off in wave soldering process.
Patch red glue not only requires curing speed fast, and bonding strength is large, and has good sizability, as glue put not wire drawing, overflow glue, do not subside etc., to solidification value, require more and more lower.On market, the most solidification values of patch red glue are in 150 degree left and right, and 2-5 minute set time is not etc.Along with the miniaturization of electronic apparatus, hot setting causes disadvantageous effect to some components and parts performance, and energy consumption is also high, increases enterprise's production cost.Summary of the invention
The invention reside in for current patch red glue and contain the problem that solidification value is high, and a kind of low-temperature curing patch red glue overcoming the above problems and preparation method thereof is provided.
For achieving the above object, the present invention adopts following technical scheme:
A kind of low-temperature curing patch red glue, the composition of described patch red glue and composition weight part are as follows:
Epoxy resin: dihydroxyphenyl propane or bisphenol F epoxy resin be a kind of or its combination wherein, containing 26.5～56.5 parts;
Thinner: p-tert-butyl-phenyl glycidyl ether, trimethylolethane trimethacrylate glycidyl ether, sorbyl alcohol polyglycidyl ether be a kind of or its combination wherein, containing 5.0～15.0 parts; Viscosity be can effectively reduce, speed of response and cross-linking density and thermotolerance improved;
Stablizer: wherein a kind of or its combination of dithio-salicylic acid, triphenyl phosphite, the two octadecyl esters of thio-2 acid, containing 1.0～5.0 parts;
Promotor: PDU, two two ureas, 2,4 of 2,4 methyl, 6-tri-(dimethylamino methyl) phenol, benzyldimethylamine, glyoxal ethyline urea be a kind of or its combination wherein, containing 13～15.5 parts; Can accelerate curing reaction, reduce solidification value, shorten set time, also can improve physical and mechanical property.
Thixotropic agent: aerosil, containing 5.0～15.0 parts;
Filler: magnesium oxide, silicon powder, nano aluminium oxide, superfine calcined kaolin, white carbon black, tetrafluoroethylene, calcium carbonate is a kind of or its combination wherein, containing 7.0～23.0 parts;
Pigment: red iron oxide, everbright fast red one or its combination, containing 0.1～1.0 part;
Solidifying agent: MY-24 tertiary amine adducts, PN-23J imidazoles affixture, glyoxal ethyline, Succinic anhydried, diethylenetriamine be a kind of or its combination wherein, containing 23.0～38.0 parts.
Preferably, the bisphenol A epoxide resin in described epoxy resin is bisphenol A epoxide resin 828EL, and the bisphenol F epoxy resin in epoxy resin is bisphenol F epoxy resin 862.
The preparation method of above-mentioned low-temperature curing patch red glue, comprises following processing step:
(1), successively epoxy resin, thinner, pigment are added in vacuum double-planet stirrer, high-speed stirring speed 200r/min ± 10r/min, stirring at low speed speed 20r/min ± 3r/min, vacuum tightness 0.06-0.09MPa, time 30 ± 5min, temperature is controlled at 40 ± 5 ℃, and dispersed with stirring is even;
(2), successively stablizer, promotor, thixotropic agent, filler are added again, high-speed stirring speed 250r/min ± 10r/min, stirring at low speed speed 30r/min ± 3r/min, vacuum tightness 0.06-0.09MPa, time 180 ± 10min, it is even that temperature is controlled at 15 ± 5 ℃ of dispersed with stirring;
(3) add, again solidifying agent, high-speed stirring speed 200r/min ± 10r/min, stirring at low speed speed 20r/min ± 3r/min, vacuum tightness 0.06-0.09MPa, time 90 ± 5min, temperature is controlled at 20 ± 5 ℃, and dispersed with stirring evenly obtains described low-temperature curing patch red glue.
Beneficial effect of the present invention is: patch red glue of the present invention adopt the dihydroxyphenyl propane of scientific formula or bisphenol F epoxy resin and thinner, promotor, stablizer, by composition proportion and the preparation method of the present invention of science, can effectively reduce viscosity, raising speed of response and cross-linking density and the thermotolerance of patch red glue, and curing reaction can be accelerated, reduce solidification value, shorten set time, improve physical and mechanical property; Meet the requirement of low-temperature curing, under the low temperature environment of 100-150 ℃, the equal comparatively fast time is curing, adapts to the demand of the miniaturization of electronic apparatus, and guarantee components and parts performance, reduces energy consumption, minimizing enterprise production cost.
Embodiment
Below in conjunction with embodiment, the present invention is further described:
Embodiment 1:
The patch red glue of the present embodiment is made by the component containing following weight part:
Embodiment 2:
The patch red glue of the present embodiment is made by the component containing following weight part:
Embodiment 3:
The patch red glue of the present embodiment is made by the component containing following weight part:
Embodiment 4:
The patch red glue of the present embodiment is made by the component containing following weight part:
The preparation method of low-temperature curing patch red glue of the present invention, comprises following processing step:
(1), successively epoxy resin, thinner, pigment are added in vacuum double-planet stirrer, high-speed stirring speed 200r/min ± 10r/min, stirring at low speed speed 20r/min ± 3r/min, vacuum tightness 0.06-0.09MPa, time 30 ± 5min, temperature is controlled at 40 ± 5 ℃, and dispersed with stirring is even;
(2), successively stablizer, promotor, thixotropic agent, filler are added again, high-speed stirring speed 250r/min ± 10r/min, stirring at low speed speed 30r/min ± 3r/min, vacuum tightness 0.06-0.09MPa, time 180 ± 10min, it is even that temperature is controlled at 15 ± 5 ℃ of dispersed with stirring;
(3) add, again solidifying agent, high-speed stirring speed 200r/min ± 10r/min, stirring at low speed speed 20r/min ± 3r/min, vacuum tightness 0.06-0.09MPa, time 90 ± 5min, temperature is controlled at 20 ± 5 ℃, and dispersed with stirring evenly obtains described low-temperature curing patch red glue.
Detect by experiment, the curing patch red glue of the present invention four embodiment and routine is curing under conventional and low-temperature curing condition sees the following form 1 to solidifying result detection contrast table, from contrast table, can find out, low-temperature curing patch red glue of the present invention, has good curability at low temperatures and set time short and have a good physicals:
Table 1 detects Data Comparison table
The above embodiment, it is preferred embodiments of the present invention, be not to limit practical range of the present invention, the equivalence of doing according to structure, feature and principle described in the present patent application the scope of the claims therefore all changes or modifies, and all should be included in patent claim of the present invention.
Claims (3)
1. a low-temperature curing patch red glue, is characterized in that, the composition of described patch red glue and composition weight part are as follows:
Epoxy resin: dihydroxyphenyl propane or bisphenol F epoxy resin be a kind of or its combination wherein, containing 26.5～56.5 parts;
Thinner: p-tert-butyl-phenyl glycidyl ether, trimethylolethane trimethacrylate glycidyl ether, sorbyl alcohol polyglycidyl ether be a kind of or its combination wherein, containing 5.0～15.0 parts;
Stablizer: wherein a kind of or its combination of dithio-salicylic acid, triphenyl phosphite, the two octadecyl esters of thio-2 acid, containing 1.0～5.0 parts;
Promotor: PDU, two two ureas, 2,4 of 2,4 methyl, 6-tri-(dimethylamino methyl) phenol, benzyldimethylamine, glyoxal ethyline urea be a kind of or its combination wherein, containing 13～15.5 parts;
Thixotropic agent: aerosil, containing 5.0～15.0 parts;
Filler: magnesium oxide, silicon powder, nano aluminium oxide, superfine calcined kaolin, white carbon black, tetrafluoroethylene, calcium carbonate is a kind of or its combination wherein, containing 7.0～23.0 parts;
Pigment: red iron oxide, everbright fast red one or its combination, containing 0.1～1.0 part;
Solidifying agent: MY-24 tertiary amine adducts, PN-23J imidazoles affixture, glyoxal ethyline, Succinic anhydried, diethylenetriamine be a kind of or its combination wherein, containing 23.0～38.0 parts.
2. low-temperature curing patch red glue according to claim 1, is characterized in that: the bisphenol A epoxide resin in described epoxy resin is bisphenol A epoxide resin 828EL, and the bisphenol F epoxy resin in epoxy resin is bisphenol F epoxy resin 862.
3. the preparation method of low-temperature curing patch red glue according to claim 1 and 2, comprises following processing step:
(1), successively epoxy resin, thinner, pigment are added in vacuum double-planet stirrer, high-speed stirring speed 200r/min ± 10r/min, stirring at low speed speed 20r/min ± 3r/min, vacuum tightness 0.06-0.09MPa, time 30 ± 5min, temperature is controlled at 40 ± 5 ℃, and dispersed with stirring is even;
(2), successively stablizer, promotor, thixotropic agent, filler are added again, high-speed stirring speed 250r/min ± 10r/min, stirring at low speed speed 30r/min ± 3r/min, vacuum tightness 0.06-0.09MPa, time 180 ± 10min, it is even that temperature is controlled at 15 ± 5 ℃ of dispersed with stirring;
(3) add, again solidifying agent, high-speed stirring speed 200r/min ± 10r/min, stirring at low speed speed 20r/min ± 3r/min, vacuum tightness 0.06-0.09MPa, time 90 ± 5min, temperature is controlled at 20 ± 5 ℃, and dispersed with stirring evenly obtains described low-temperature curing patch red glue.
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| CN201310719124.0A CN103756611B (en) | 2013-12-23 | 2013-12-23 | A kind of low-temperature curing patch red glue and preparation method thereof |
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| CN201310719124.0A CN103756611B (en) | 2013-12-23 | 2013-12-23 | A kind of low-temperature curing patch red glue and preparation method thereof |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106554513A (en) * | 2015-09-30 | 2017-04-05 | 中国石油化工股份有限公司 | Nano composite material and preparation method thereof and rubber composition and vulcanized rubber and their application |
| CN106554512A (en) * | 2015-09-30 | 2017-04-05 | 中国石油化工股份有限公司 | Nano composite material and preparation method thereof and rubber composition and vulcanite and their application |
| CN107541169A (en) * | 2017-08-22 | 2018-01-05 | 樊之雄 | A kind of rapid curing easily stores the preparation method of gluing sheet |
| CN108219728A (en) * | 2018-01-10 | 2018-06-29 | 深圳市邦大科技有限公司 | A kind of Halogen is without sulphur patch red glue and preparation method thereof |
| CN108395862A (en) * | 2018-04-20 | 2018-08-14 | 苏州盛威佳鸿电子科技有限公司 | A kind of SMT low-temperature setting patch red glue in pb-free solder |
| CN108395861A (en) * | 2018-04-20 | 2018-08-14 | 苏州盛威佳鸿电子科技有限公司 | A kind of fire safe type SMT paster adhesive in pb-free solder |
| CN108485571A (en) * | 2018-04-04 | 2018-09-04 | 苏州盛威佳鸿电子科技有限公司 | A kind of low-temperature setting patch red glue |
| CN108504317A (en) * | 2018-04-20 | 2018-09-07 | 苏州盛威佳鸿电子科技有限公司 | A kind of quick-setting SMT paster adhesive |
| CN108753234A (en) * | 2018-05-31 | 2018-11-06 | 苏州盛威佳鸿电子科技有限公司 | A kind of high stability SMT paster adhesive |
| CN108893085A (en) * | 2018-05-31 | 2018-11-27 | 苏州盛威佳鸿电子科技有限公司 | A kind of paster glue for surface mounting technology |
| CN110283424A (en) * | 2019-05-29 | 2019-09-27 | 浙江百合航太复合材料有限公司 | A kind of low-temperature setting halogen-free flame retardant epoxy resin composition and its prepreg method |
| CN111500089A (en) * | 2020-04-20 | 2020-08-07 | 池州市贵兴非矿新材料有限公司 | Active calcium carbonate and preparation method thereof |
| CN113088224A (en) * | 2021-02-26 | 2021-07-09 | 广东美的白色家电技术创新中心有限公司 | Protection composition applied to packaging product, power module and preparation method of power module |
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| CN101412896A (en) * | 2007-10-17 | 2009-04-22 | 比亚迪股份有限公司 | Bicomponent epoxy adhesive and preparation thereof |
| CN102850948A (en) * | 2012-09-20 | 2013-01-02 | 烟台德邦科技有限公司 | Surface mount adhesive for surface mount technology and preparation method of surface mount adhesive |
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2013
- 2013-12-23 CN CN201310719124.0A patent/CN103756611B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101412896A (en) * | 2007-10-17 | 2009-04-22 | 比亚迪股份有限公司 | Bicomponent epoxy adhesive and preparation thereof |
| CN102850948A (en) * | 2012-09-20 | 2013-01-02 | 烟台德邦科技有限公司 | Surface mount adhesive for surface mount technology and preparation method of surface mount adhesive |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106554513A (en) * | 2015-09-30 | 2017-04-05 | 中国石油化工股份有限公司 | Nano composite material and preparation method thereof and rubber composition and vulcanized rubber and their application |
| CN106554512A (en) * | 2015-09-30 | 2017-04-05 | 中国石油化工股份有限公司 | Nano composite material and preparation method thereof and rubber composition and vulcanite and their application |
| CN106554513B (en) * | 2015-09-30 | 2019-06-28 | 中国石油化工股份有限公司 | Nanocomposite and preparation method thereof and rubber composition and vulcanized rubber and their application |
| CN107541169A (en) * | 2017-08-22 | 2018-01-05 | 樊之雄 | A kind of rapid curing easily stores the preparation method of gluing sheet |
| CN108219728A (en) * | 2018-01-10 | 2018-06-29 | 深圳市邦大科技有限公司 | A kind of Halogen is without sulphur patch red glue and preparation method thereof |
| CN108485571A (en) * | 2018-04-04 | 2018-09-04 | 苏州盛威佳鸿电子科技有限公司 | A kind of low-temperature setting patch red glue |
| CN108395861A (en) * | 2018-04-20 | 2018-08-14 | 苏州盛威佳鸿电子科技有限公司 | A kind of fire safe type SMT paster adhesive in pb-free solder |
| CN108504317A (en) * | 2018-04-20 | 2018-09-07 | 苏州盛威佳鸿电子科技有限公司 | A kind of quick-setting SMT paster adhesive |
| CN108395862A (en) * | 2018-04-20 | 2018-08-14 | 苏州盛威佳鸿电子科技有限公司 | A kind of SMT low-temperature setting patch red glue in pb-free solder |
| CN108753234A (en) * | 2018-05-31 | 2018-11-06 | 苏州盛威佳鸿电子科技有限公司 | A kind of high stability SMT paster adhesive |
| CN108893085A (en) * | 2018-05-31 | 2018-11-27 | 苏州盛威佳鸿电子科技有限公司 | A kind of paster glue for surface mounting technology |
| CN110283424A (en) * | 2019-05-29 | 2019-09-27 | 浙江百合航太复合材料有限公司 | A kind of low-temperature setting halogen-free flame retardant epoxy resin composition and its prepreg method |
| CN111500089A (en) * | 2020-04-20 | 2020-08-07 | 池州市贵兴非矿新材料有限公司 | Active calcium carbonate and preparation method thereof |
| CN113088224A (en) * | 2021-02-26 | 2021-07-09 | 广东美的白色家电技术创新中心有限公司 | Protection composition applied to packaging product, power module and preparation method of power module |
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