CN108219728A - A kind of Halogen is without sulphur patch red glue and preparation method thereof - Google Patents
A kind of Halogen is without sulphur patch red glue and preparation method thereof Download PDFInfo
- Publication number
- CN108219728A CN108219728A CN201810022333.2A CN201810022333A CN108219728A CN 108219728 A CN108219728 A CN 108219728A CN 201810022333 A CN201810022333 A CN 201810022333A CN 108219728 A CN108219728 A CN 108219728A
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- China
- Prior art keywords
- agent
- sulphur
- red glue
- preparation
- patch red
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
Abstract
The invention discloses a kind of Halogen without sulphur patch red glue and preparation method thereof, the ingredient of the patch red glue and the component of ingredient percent；Including epoxy resin 45% 80%, curing agent 1% 20%, accelerating agent 1% 5%, diluent 1% 20%, thixotropic agent 1% 5%, dry powder 10% 20%, toughener 3% 15%, oils wetting agent 0.1% 5%.The present invention is scientific and reasonable for structure, easy-to-operate, Halogen uses epoxy resin without sulphur patch red glue, curing agent, accelerating agent, diluent, thixotropic agent, dry powder, toughener, oils wetting agent is raw material, oily substance is used as wetting agent, not only it is halogen-free not sulfur-bearing, the rate of spread is high, wetability is strong, it is and corrosion-free, surface insulation resistance is high, dry powder and toughener, not only increase the toughness of patch red glue, and it is also prevented from the phenomenon that cracked, simple production process of the present invention, it is of low cost, it is easy to use, performance is stablized, the advantages that toughness is greatly and adhesive strength is high.
Description
Technical field
The present invention relates to patch red glue and preparation method thereof technical field, specially a kind of Halogen without sulphur patch red glue and its
Preparation method.
Background technology
With the fast development of electronic industry, closely related Electronic Encapsulating Technology is also increasingly advanced therewith, SMT surfaces
Package technique is exactly a kind of encapsulation technology therein, and the typical technological process of one kind of SMT surface installation techniques is Heraeus-wave
Peak Welding is to bind chip components and parts on a surface of pcb board, and in pcb board by the way of Heraeus
Inserting through-hole component or patch type component are plugged on another face, is then worked by wave-soldering with regard to attaching can be favorably accomplished.
Patch red glue does not require nothing more than that curing rate is fast, and adhesive strength is big, and with good sizability, such as glue point not
Wire drawing, does not collapse non-excessive glue, lower and lower to solidification temperature requirement, and patch red glue majority solidification temperature is at 150 degree in the market
Left and right, hardening time 2-5 minute is differed, and with the miniaturization of electronic apparatus, hot setting causes certain component performances
Adverse effect, energy consumption is also high, increases enterprise's production cost, and be susceptible to crackle, the rate of spread by high temperature in patch red glue
It is low, wetability is low, and high with burn into surface insulation resistance.
Invention content
The present invention provides a kind of Halogen without sulphur patch red glue and preparation method thereof, can effectively solve in above-mentioned background technology
The problem of proposing high energy height, surface insulated difference and non-refractory.
To achieve the above object, the present invention provides following technical solution：A kind of Halogen is without sulphur patch red glue and its preparation side
Method, the ingredient of the patch red glue and the component of ingredient percent；Including epoxy resin 45%-80%, curing agent 1%-20%,
Accelerating agent 1%-5%, diluent 1%-20%, thixotropic agent 1%-5%, dry powder 10%-20%, toughener 3%-15%, oils wetting agent
0.1%-5%。
According to above-mentioned technical proposal, a kind of Halogen is without sulphur patch red glue and preparation method thereof, the ingredient of the patch red glue
And the component of ingredient percent；Including epoxy resin 50%-70%, curing agent 5%-15%, accelerating agent 2%-5%, diluent 5%-
20%, thixotropic agent 2%-5%, dry powder 15%-20%, toughener 5%-15%, oils wetting agent 1%-5%.
According to above-mentioned technical proposal, the curing agent is added by fatty amine, MY-24 three-levels amine adduct, PN-23J imidazoles
By stirring, that paste is made is spare after into object, 2-methylimidazole, succinic anhydride, diethylenetriamine one of which or its mixing.
According to above-mentioned technical proposal, the accelerating agent is by phenyl dimethylurea, four base ammonium chlorides, benzyl dimethylamine, 2- first
Base imidazoles urea one of which or combination.
According to above-mentioned technical proposal, the diluent is dilute by trimethylolethane trimethacrylate glycidol ether, butanol, activating agent
Release agent H8 one of which or its composition.
According to above-mentioned technical proposal, the thixotropic agent be by aerosil, precipitated silica, organobentonite its
Middle a kind of or its composition.
According to above-mentioned technical proposal, the dry powder is by talcum powder, calcium carbonate, land plaster, albarium, barium sulfate, height
Ridge soil, wollastonite, mica powder, silica one of which or its composition.
According to above-mentioned technical proposal, the toughener is by carboxyl liquid nitrile rubber, carboxyl-terminated liguid nitrile rubber, gathers
Sulphur rubber, liquid silastic, polyethers, polysulfones, polyimides, nano-calcium carbonate, nano-titanium dioxide one of which or its composition.
According to above-mentioned technical proposal, the oils wetting agent is by for castor oil, soybean oil, sesame oil or canola
The combination of one or both of oil.
According to above-mentioned technical proposal, preparation method of the Halogen without sulphur patch red glue includes the following steps：
1）First will epoxy resin, accelerating agent, diluent and thixotropic agent be sequentially added and be stirred in vacuum double planetary mixer, at a high speed
Stir speed (S.S.) be 250r/min ± 10r/min, stirring at low speed rate be 25r/min ± 3r/min, mixing time for 30min ±
2min, vacuum degree 0.06-0.09MPa, temperature are controlled at 40 DEG C ± 5 DEG C.
2）Again successively by dry powder, toughener, oils wetting agent adds in, high-speed stirred rate 280r/min ± 10r/min,
Stirring at low speed rate 30r/min ± 3r/min, vacuum degree 0.06-0.09MPa, 180 ± 10min of time, temperature control 15 ±
5 DEG C are dispersed with stirring uniformly.
3）Finally add curing agent, high-speed stirred rate 200r/min ± 10r/min, stirring at low speed rate 20r/min
± 3r/min, vacuum degree 0.06-0.09MPa, 90 ± 5min of time, temperature are controlled at 20 ± 5 DEG C, are dispersed with stirring uniformly, discharging
Afterwards natural cooling up to the Halogen without sulphur patch red glue.
Compared with prior art, scientific and reasonable for structure, easy-to-operate of the invention, Halogen use ring without sulphur patch red glue
Oxygen resin, curing agent, accelerating agent, diluent, thixotropic agent, dry powder, toughener, oils wetting agent is raw material, using oils object
Matter is wetting agent, is not only halogen-free not that sulfur-bearing, the rate of spread are high, wetability is strong but also corrosion-free, surface insulation resistance is high, double
Fly powder and toughener, not only increase the toughness of patch red glue, but also be also prevented from the phenomenon that cracked, accelerating agent is that one kind can add
Fast organosilicon epoxy resin curing reduces solidification temperature and shortens the substance of hardening time, and diluent is one kind for reducing glue
The substance of stick viscosity, the power of impregnation for having had adhesive, modified technique performance simple production process of the present invention, it is of low cost,
The advantages that easy to use, performance is stablized, and toughness is big and adhesive strength is high.
Description of the drawings
Attached drawing is used to provide further understanding of the present invention, and a part for constitution instruction, the reality with the present invention
Example is applied together for explaining the present invention, is not construed as limiting the invention.
In the accompanying drawings：
Fig. 1 is the preparation flow figure of the present invention.
Specific embodiment
The preferred embodiment of the present invention is illustrated below in conjunction with attached drawing, it should be understood that preferred reality described herein
It applies example to be merely to illustrate and explain the present invention, be not intended to limit the present invention.
Embodiment 1：A kind of Halogen is without sulphur patch red glue and preparation method thereof, the ingredient of patch red glue and composition quality percentage
The component of ratio；Including epoxy resin 45%-80%, curing agent 1%-20%, accelerating agent 1%-5%, diluent 1%-20%, thixotropic agent 1%-
5%, dry powder 10%-20%, toughener 3%-15%, oils wetting agent 0.1%-5%.
Preferably, curing agent is by fatty amine, MY-24 three-levels amine adduct, PN-23J imidazole adducts, 2- methyl miaows
By stirring, that paste is made is spare after azoles, succinic anhydride, diethylenetriamine one of which or its mixing.
Preferably, accelerating agent is by phenyl dimethylurea, four base ammonium chlorides, benzyl dimethylamine, 2-methylimidazole urea wherein one
Kind or combination.
Preferably, diluent is by trimethylolethane trimethacrylate glycidol ether, butanol, activating agent diluent H8 one of which
Or its composition.
Preferably, thixotropic agent is by aerosil, precipitated silica, organobentonite one of which or its group
Into.
Preferably, dry powder is by talcum powder, calcium carbonate, land plaster, albarium, barium sulfate, kaolin, wollastonite, cloud
Female powder, silica one of which or its composition.
Preferably, toughener is by carboxyl liquid nitrile rubber, carboxyl-terminated liguid nitrile rubber, polysulfide rubber, liquid silicon
Rubber, polyethers, polysulfones, polyimides, nano-calcium carbonate, nano-titanium dioxide one of which or its composition.
Preferably, oils wetting agent is by for one kind in castor oil, soybean oil, sesame oil or Canola Oil or two
Kind combination.
Preferably, preparation method of the Halogen without sulphur patch red glue, includes the following steps：
1）First will epoxy resin, accelerating agent, diluent and thixotropic agent be sequentially added and be stirred in vacuum double planetary mixer, at a high speed
Stir speed (S.S.) be 250r/min ± 10r/min, stirring at low speed rate be 25r/min ± 3r/min, mixing time for 30min ±
2min, vacuum degree 0.06-0.09MPa, temperature are controlled at 40 DEG C ± 5 DEG C.
2）Again successively by dry powder, toughener, oils wetting agent adds in, high-speed stirred rate 280r/min ± 10r/min,
Stirring at low speed rate 30r/min ± 3r/min, vacuum degree 0.06-0.09MPa, 180 ± 10min of time, temperature control 15 ±
5 DEG C are dispersed with stirring uniformly.
3）Finally add curing agent, high-speed stirred rate 200r/min ± 10r/min, stirring at low speed rate 20r/min
± 3r/min, vacuum degree 0.06-0.09MPa, 90 ± 5min of time, temperature are controlled at 20 ± 5 DEG C, are dispersed with stirring uniformly, discharging
The Halogen of natural cooling to obtain the final product is without sulphur patch red glue afterwards.
Embodiment 2：The ingredient of patch red glue and the component of ingredient percent；Including epoxy resin 50%-70%, curing
Agent 5%-15%, accelerating agent 2%-5%, diluent 5%-20%, thixotropic agent 2%-5%, dry powder 15%-20%, toughener 5%-15%, oils
Wetting agent 1%-5%.
Preferably, curing agent is by fatty amine, MY-24 three-levels amine adduct, PN-23J imidazole adducts, 2- methyl miaows
By stirring, that paste is made is spare after azoles, succinic anhydride, diethylenetriamine one of which or its mixing.
Preferably, accelerating agent is by phenyl dimethylurea, four base ammonium chlorides, benzyl dimethylamine, 2-methylimidazole urea wherein one
Kind or combination.
Preferably, diluent is by trimethylolethane trimethacrylate glycidol ether, butanol, activating agent diluent H8 one of which
Or its composition.
Preferably, thixotropic agent is by aerosil, precipitated silica, organobentonite one of which or its group
Into.
Preferably, dry powder is by talcum powder, calcium carbonate, land plaster, albarium, barium sulfate, kaolin, wollastonite, cloud
Female powder, silica one of which or its composition.
Preferably, toughener is by carboxyl liquid nitrile rubber, carboxyl-terminated liguid nitrile rubber, polysulfide rubber, liquid silicon
Rubber, polyethers, polysulfones, polyimides, nano-calcium carbonate, nano-titanium dioxide one of which or its composition.
Preferably, oils wetting agent is by for one kind in castor oil, soybean oil, sesame oil or Canola Oil or two
Kind combination.
Preferably, preparation method of the Halogen without sulphur patch red glue, includes the following steps：
1）First will epoxy resin, accelerating agent, diluent and thixotropic agent be sequentially added and be stirred in vacuum double planetary mixer, at a high speed
Stir speed (S.S.) be 250r/min ± 10r/min, stirring at low speed rate be 25r/min ± 3r/min, mixing time for 30min ±
2min, vacuum degree 0.06-0.09MPa, temperature are controlled at 40 DEG C ± 5 DEG C.
2）Again successively by dry powder, toughener, oils wetting agent adds in, high-speed stirred rate 280r/min ± 10r/min,
Stirring at low speed rate 30r/min ± 3r/min, vacuum degree 0.06-0.09MPa, 180 ± 10min of time, temperature control 15 ±
5 DEG C are dispersed with stirring uniformly.
3）Finally add curing agent, high-speed stirred rate 200r/min ± 10r/min, stirring at low speed rate 20r/min
± 3r/min, vacuum degree 0.06-0.09MPa, 90 ± 5min of time, temperature are controlled at 20 ± 5 DEG C, are dispersed with stirring uniformly, discharging
The Halogen of natural cooling to obtain the final product is without sulphur patch red glue afterwards.
Based on above-mentioned, it is an advantage of the current invention that Halogen without sulphur patch red glue using epoxy resin, curing agent, accelerating agent,
Diluent, thixotropic agent, dry powder, toughener, oils wetting agent are raw material, use oily substance as wetting agent, not only not halogen
Sulfur-bearing, the rate of spread be not high, wetability is strong and corrosion-free, surface insulation resistance is high for element, and dry powder and toughener not only increase
The toughness of patch red glue, and be also prevented from the phenomenon that cracked, accelerating agent be one kind can accelerate organosilicon epoxy resin curing,
It reduces solidification temperature and shortens the substance of hardening time, diluent is a kind of substance for reducing adhesive viscosity, makes gluing
The power of impregnation that agent has had, modified technique performance simple production process of the present invention, of low cost, easy to use, performance stabilization, toughness
The advantages that big and adhesive strength is high
Finally it should be noted that：The foregoing is merely the preferred embodiments of the present invention, are not intended to restrict the invention, although ginseng
The present invention is described in detail according to previous embodiment, it for those skilled in the art, still can be to preceding
The technical solution recorded in each embodiment is stated to modify or carry out equivalent replacement to which part technical characteristic.It is all this
Within the spirit and principle of invention, any modification, equivalent replacement, improvement and so on should be included in the protection model of the present invention
Within enclosing.
Claims (10)
1. a kind of Halogen is without sulphur patch red glue and preparation method thereof, it is characterised in that：The ingredient of the patch red glue and into sub-prime
Measure the component of percentage；Including epoxy resin 45%-80%, curing agent 1%-20%, accelerating agent 1%-5%, diluent 1%-20%, thixotroping
Agent 1%-5%, dry powder 10%-20%, toughener 3%-15%, oils wetting agent 0.1%-5%.
2. a kind of Halogen according to claim 1 is without sulphur patch red glue and preparation method thereof, it is characterised in that：The patch
The ingredient of red glue and the component of ingredient percent；Including epoxy resin 50%-70%, curing agent 5%-15%, accelerating agent 2%-
5%, diluent 5%-20%, thixotropic agent 2%-5%, dry powder 15%-20%, toughener 5%-15%, oils wetting agent 1%-5%.
3. a kind of Halogen according to claim 1 or 2 is without sulphur patch red glue, it is characterised in that：The curing agent is by fat
Fat amine, MY-24 three-levels amine adduct, PN-23J imidazole adducts, 2-methylimidazole, succinic anhydride, diethylenetriamine wherein one
Kind or its mixing after by stirring, that paste is made is spare.
4. a kind of Halogen according to claim 1 or 2 is without sulphur patch red glue and preparation method thereof, it is characterised in that：It is described
Accelerating agent is by phenyl dimethylurea, four base ammonium chlorides, benzyl dimethylamine, 2-methylimidazole urea one of which or combination.
5. a kind of Halogen according to claim 1 or 2 is without sulphur patch red glue and preparation method thereof, it is characterised in that：It is described
Diluent by trimethylolethane trimethacrylate glycidol ether, butanol, activating agent diluent H8 one of which or its form.
6. a kind of Halogen according to claim 1 or 2 is without sulphur patch red glue and preparation method thereof, it is characterised in that：It is described
Thixotropic agent by aerosil, precipitated silica, organobentonite one of which or its form.
7. a kind of Halogen according to claim 1 or 2 is without sulphur patch red glue and preparation method thereof, it is characterised in that：It is described
Dry powder be by talcum powder, calcium carbonate, land plaster, albarium, barium sulfate, kaolin, wollastonite, mica powder, silica its
Middle a kind of or its composition.
8. a kind of Halogen according to claim 1 or 2 is without sulphur patch red glue and preparation method thereof, it is characterised in that：It is described
Toughener be by carboxyl liquid nitrile rubber, carboxyl-terminated liguid nitrile rubber, polysulfide rubber, liquid silastic, polyethers, polysulfones,
Polyimides, nano-calcium carbonate, nano-titanium dioxide one of which or its composition.
9. a kind of Halogen according to claim 1 or 2 is without sulphur patch red glue and preparation method thereof, it is characterised in that：It is described
Oils wetting agent is by for the combination of one or both of castor oil, soybean oil, sesame oil or Canola Oil.
10. a kind of Halogen according to claim 1 or 2 is without sulphur patch red glue and preparation method thereof, which is characterized in that including
Following steps：
1）First will epoxy resin, accelerating agent, diluent and thixotropic agent be sequentially added and be stirred in vacuum double planetary mixer, at a high speed
Stir speed (S.S.) be 250r/min ± 10r/min, stirring at low speed rate be 25r/min ± 3r/min, mixing time for 30min ±
2min, vacuum degree 0.06-0.09MPa, temperature are controlled at 40 DEG C ± 5 DEG C；
2）Again successively by dry powder, toughener, oils wetting agent adds in, high-speed stirred rate 280r/min ± 10r/min, low
Fast stir speed (S.S.) 30r/min ± 3r/min, vacuum degree 0.06-0.09MPa, 180 ± 10min of time, temperature are controlled 15 ± 5
It DEG C is dispersed with stirring uniformly；
3）Finally add curing agent, high-speed stirred rate 200r/min ± 10r/min, stirring at low speed rate 20r/min ± 3r/
Min, vacuum degree 0.06-0.09MPa, 90 ± 5min of time, temperature are controlled at 20 ± 5 DEG C, are dispersed with stirring uniformly, after discharging certainly
It so cools down up to the Halogen without sulphur patch red glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810022333.2A CN108219728A (en) | 2018-01-10 | 2018-01-10 | A kind of Halogen is without sulphur patch red glue and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810022333.2A CN108219728A (en) | 2018-01-10 | 2018-01-10 | A kind of Halogen is without sulphur patch red glue and preparation method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN108219728A true CN108219728A (en) | 2018-06-29 |
Family
ID=62640809
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810022333.2A Pending CN108219728A (en) | 2018-01-10 | 2018-01-10 | A kind of Halogen is without sulphur patch red glue and preparation method thereof |
Country Status (1)
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109628040A (en) * | 2018-12-29 | 2019-04-16 | 佛山市诺普材料科技有限公司 | It is a kind of with low solvent content and the stable conductive silver glue and preparation method thereof of performance |
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Application publication date: 20180629 |