CN102627928A - Low temperature curing adhesive for camera modules, and preparation method thereof - Google Patents
Low temperature curing adhesive for camera modules, and preparation method thereof Download PDFInfo
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- CN102627928A CN102627928A CN2012100768360A CN201210076836A CN102627928A CN 102627928 A CN102627928 A CN 102627928A CN 2012100768360 A CN2012100768360 A CN 2012100768360A CN 201210076836 A CN201210076836 A CN 201210076836A CN 102627928 A CN102627928 A CN 102627928A
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Abstract
The invention discloses a low temperature curing adhesive for camera modules. The adhesive is prepared from the raw materials, by weight, 20-40 parts of an epoxy resin, 10-30 parts of a curing agent, 0.1-1 part of a stabilizing agent, 0.1-5 parts of a promoter, 1-5 parts of a thixotropic agent, 10-50 parts of a filler, 1-2 parts of a silane coupling agent and 1-2 parts of a coloring agent, wherein the epoxy resin comprises one or two selected from a bisphenol A epoxy resin, a bisphenol F epoxy resin, a novolac epoxy resin and a rubber modified epoxy resin; and the curing agent comprises one or more selected from a modified amine curing agent, a mercaptan curing agent and an imidazole curing agent. The invention also discloses a preparation method of the adhesive. The composition and the ratio of the adhesive are reasonable, and the low temperature rapid curing of the adhesive can be guaranteed with latent mercaptan and the modified amine curing agent. Performances of the adhesive are stable at room temperature because of a neutralizing effect of the acid stabilizing agent and the imidazole promoter. The service life of the adhesive can reach above seven days in a working environment. The adhesive of the invention is mainly applied to devices of memory cards, CCD/CMOS and the like, and has very good bonding force to various plastic materials of the cameral modules.
Description
Technical field
The present invention relates to a kind of tackiness agent, particularly a kind of camera module is used low-temperature setting adhesive; The invention still further relates to a kind of preparation method of this tackiness agent.
Background technology
Epoxy resin is owing to have the bonding that good cohesiveness, erosion resistance, electric insulating quality, HS etc. are widely used in multiple material.It has played important effect in fields such as electronics, electric, machinofacture, aerospace.Along with the develop rapidly of electronic technology, continuing to bring out of the miniaturized of encapsulation and the densification of assembling and various novel encapsulated technology, also increasingly high to the requirement of electronics assembling quality.
In the assembling process of camera module,, require the solidification value can not too high (80-100 ℃) because some optical components can not be high temperature resistant.Therefore needing to use can low temperature quick response solidifying agent, and these tackiness agent storing temps are generally at-25 ℃, the low tackiness agent of solidification value often work-ing life very short, just can not use a couple of days in Working environment.This is because tackiness agent also slow crosslinking reaction can take place under the room temperature.How the low temperature fast setting and the ambient-temp-stable of balance tackiness agent are technical problems to be solved.
Summary of the invention
Technical problem to be solved by this invention is the deficiency to prior art, and a kind of low-temperature curable is provided, and camera module stable under the room temperature sticks with glue agent.
Another technical problem to be solved by this invention has provided a kind of preparation method that above-mentioned camera module sticks with glue agent.
Technical problem to be solved by this invention is to realize through following technical scheme.The present invention is that a kind of camera module is used low-temperature setting adhesive, is characterized in that it is to be processed by following materials of weight proportions:
Epoxy resin 20-40; Solidifying agent 10-30;
Stablizer 0.1-1; Promotor 0.1-5;
Thixotropic agent 1-5; Filler 10-50;
Silane coupling agent 1-2; Tinting material 1-2;
Said epoxy resin is selected from: bisphenol A epoxide resin, bisphenol F epoxy resin, novolac epoxy, one or both in the rubber modified epoxy resin;
Said solidifying agent is selected from: modified amine curing agent, thio-alcohol solidifying agent, one or several in the imidazole curing agent;
Said stablizer is selected from: a kind of in LAURIC ACID 99 MIN, TRIMETHOXY BENZOIC ACID (FOR MANUFACTURING OF T.M., Whitfield's ointment, the barbituric acid;
Said promotor is modified imidazole salt complex compound;
Said thixotropic agent is an aerosil, a kind of in the organobentonite;
Said filler is mineral filler, is selected from silicon-dioxide, quartz, lime carbonate, mica, talcum powder, one or several in the Calucium Silicate powder;
Said silane coupling agent is selected from 2-(3, the 4-epoxycyclohexyl) ethyl trimethoxy silane, 3-Racemic glycidol oxygen propyl trimethoxy silicane, 3-ammonia third Trimethoxy silane, one or several in 3-ammonia third triethoxyl silane;
Said tinting material is a carbon black.
Camera module of the present invention is with in the low-temperature setting adhesive technical scheme, and the preferred weight proportioning of each raw material is:
Epoxy resin 30; Solidifying agent 20;
Stablizer 0.5; Promotor 2.5;
Thixotropic agent 2.5; Filler 30;
Silane coupling agent 1.5; Tinting material 1.5.
Technical problem to be solved by this invention can also further realize through following technical scheme.The invention also discloses the preparation method of a kind of camera module, be characterized in that its step is following with low-temperature setting adhesive:
(1) with epoxy resin, tinting material joins in the reaction kettle in proportion and mixes;
(2) add thixotropic agent successively, filler, solidifying agent, stablizer, silane coupling agent mixes;
(3) add promotor, vacuumize and mix 2-10 degree packing, storage.
Compared with prior art, tackiness agent prescription of the present invention and reasonable ratio guarantee low temperature (about 80 ℃) fast setting through using latent mercaptan and modified amine curing agent.At room temperature, since the neutralizing effect of sour stablizer and imidazoles promotor, its stable performance.In Working environment (about 25 ℃), can guarantee to reach work-ing life more than seven days.Tackiness agent of the present invention is mainly used in devices such as memory card, CCD/CMOS, and the multiple plastic material of camera module is had splendid bonding force.
Embodiment
Below further describe concrete technical scheme of the present invention,, and do not constitute restriction its right so that those skilled in the art understands the present invention further.
Embodiment 1, and a kind of camera module is used low-temperature setting adhesive, and it is to be processed by following materials of weight proportions:
Epoxy resin 30; Solidifying agent 20;
Stablizer 0.5; Promotor 2.5;
Thixotropic agent 2.5; Filler 30;
Silane coupling agent 1.5; Tinting material 1.5;
Said epoxy resin is selected from: bisphenol A epoxide resin, bisphenol F epoxy resin, novolac epoxy, one or both in the rubber modified epoxy resin;
Said solidifying agent is selected from: modified amine curing agent, thio-alcohol solidifying agent, one or several in the imidazole curing agent;
Said stablizer is selected from: a kind of in LAURIC ACID 99 MIN, TRIMETHOXY BENZOIC ACID (FOR MANUFACTURING OF T.M., Whitfield's ointment, the barbituric acid;
Said promotor is modified imidazole salt complex compound;
Said thixotropic agent is an aerosil, a kind of in the organobentonite;
Said filler is mineral filler, is selected from silicon-dioxide, quartz, lime carbonate, mica, talcum powder, one or several in the Calucium Silicate powder;
Said silane coupling agent is selected from 2-(3, the 4-epoxycyclohexyl) ethyl trimethoxy silane, 3-Racemic glycidol oxygen propyl trimethoxy silicane, 3-ammonia third Trimethoxy silane, one or several in 3-ammonia third triethoxyl silane;
Said tinting material is a carbon black.
Its step of its preparation side is following:
(1) with epoxy resin, tinting material joins in the reaction kettle in proportion and mixes;
(2) add thixotropic agent successively, filler, solidifying agent, stablizer, silane coupling agent mixes;
(3) add promotor, vacuumize and mix 2-10 degree packing, storage.
Embodiment 2, and a kind of camera module is used low-temperature setting adhesive, and it is to be processed by following materials of weight proportions:
Epoxy resin 20; Solidifying agent 10;
Stablizer 0.1; Promotor 0.1;
Thixotropic agent 1; Filler 10;
Silane coupling agent 1; Tinting material 1;
Said epoxy resin is selected from: bisphenol A epoxide resin, bisphenol F epoxy resin, novolac epoxy, one or both in the rubber modified epoxy resin;
Said solidifying agent is selected from: modified amine curing agent, thio-alcohol solidifying agent, one or several in the imidazole curing agent;
Said stablizer is selected from: a kind of in LAURIC ACID 99 MIN, TRIMETHOXY BENZOIC ACID (FOR MANUFACTURING OF T.M., Whitfield's ointment, the barbituric acid;
Said promotor is modified imidazole salt complex compound;
Said thixotropic agent is an aerosil, a kind of in the organobentonite;
Said filler is mineral filler, is selected from silicon-dioxide, quartz, lime carbonate, mica, talcum powder, one or several in the Calucium Silicate powder;
Said silane coupling agent is selected from 2-(3, the 4-epoxycyclohexyl) ethyl trimethoxy silane, 3-Racemic glycidol oxygen propyl trimethoxy silicane, 3-ammonia third Trimethoxy silane, one or several in 3-ammonia third triethoxyl silane;
Said tinting material is a carbon black.By ordinary method preparation of the prior art.
Embodiment 3, and a kind of camera module is used low-temperature setting adhesive, and it is to be processed by following materials of weight proportions:
Epoxy resin 40; Solidifying agent 30;
Stablizer 1; Promotor 5;
Thixotropic agent 5; Filler 50;
Silane coupling agent 2; Tinting material 2;
Said epoxy resin is selected from: bisphenol A epoxide resin, bisphenol F epoxy resin, novolac epoxy, one or both in the rubber modified epoxy resin;
Said solidifying agent is selected from: modified amine curing agent, thio-alcohol solidifying agent, one or several in the imidazole curing agent;
Said stablizer is selected from: a kind of in LAURIC ACID 99 MIN, TRIMETHOXY BENZOIC ACID (FOR MANUFACTURING OF T.M., Whitfield's ointment, the barbituric acid;
Said promotor is modified imidazole salt complex compound;
Said thixotropic agent is an aerosil, a kind of in the organobentonite;
Said filler is mineral filler, is selected from silicon-dioxide, quartz, lime carbonate, mica, talcum powder, one or several in the Calucium Silicate powder;
Said silane coupling agent is selected from 2-(3, the 4-epoxycyclohexyl) ethyl trimethoxy silane, 3-Racemic glycidol oxygen propyl trimethoxy silicane, 3-ammonia third Trimethoxy silane, one or several in 3-ammonia third triethoxyl silane;
Said tinting material is a carbon black.
Embodiment 4, and a kind of camera module is used low-temperature setting adhesive, and it makes by following method: following weight proportion material is sequentially added into reaction kettle, bisphenol A epoxide resin 20; Bisphenol F epoxy resin 15, carbon black 1, thiol-cured dose 18,2-is (3.; The 4-epoxycyclohexyl) ethyl trimethoxy silane 0.5,3-ammonia third triethoxyl silane 0.5, aerosil 3, talcum powder 41; Imidazoles promotor 1 vacuumized mixed at high speed 2 hours, mixed 2-10 ℃ of storage of back packing.
Embodiment 5, and a kind of camera module is used low-temperature setting adhesive, and it makes by following method: following weight proportion material is sequentially added into reaction kettle, bisphenol A epoxide resin 40; Carbon black 1, modified amine curing agent 20,3-Racemic glycidol oxygen propyl trimethoxy silicane 0.5; 3-ammonia third Trimethoxy silane 0.5, aerosil 3, silicon-dioxide 34; Imidazoles promotor 3 vacuumized mixed at high speed 2 hours, mixed 2-10 ℃ of storage of back packing.
Get embodiment 4 and 5 prepared camera modules are used low-temperature setting adhesive, carry out tensile shear strength and room temperature storage stability experiment by ordinary method, the result is referring to table 1
Table 1 tensile shear strength and room temperature storage stability data
Claims (3)
1. a camera module is used low-temperature setting adhesive, it is characterized in that, it is to be processed by following materials of weight proportions:
Epoxy resin 20-40; Solidifying agent 10-30;
Stablizer 0.1-1; Promotor 0.1-5;
Thixotropic agent 1-5; Filler 10-50;
Silane coupling agent 1-2; Tinting material 1-2;
Said epoxy resin is selected from: bisphenol A epoxide resin, bisphenol F epoxy resin, novolac epoxy, one or both in the rubber modified epoxy resin;
Said solidifying agent is selected from: modified amine curing agent, thio-alcohol solidifying agent, one or several in the imidazole curing agent;
Said stablizer is selected from: a kind of in LAURIC ACID 99 MIN, TRIMETHOXY BENZOIC ACID (FOR MANUFACTURING OF T.M., Whitfield's ointment, the barbituric acid;
Said promotor is modified imidazole salt complex compound;
Said thixotropic agent is an aerosil, a kind of in the organobentonite;
Said filler is mineral filler, is selected from silicon-dioxide, quartz, lime carbonate, mica, talcum powder, one or several in the Calucium Silicate powder;
Said silane coupling agent is selected from 2-(3, the 4-epoxycyclohexyl) ethyl trimethoxy silane, 3-Racemic glycidol oxygen propyl trimethoxy silicane, 3-ammonia third Trimethoxy silane, one or several in 3-ammonia third triethoxyl silane;
Said tinting material is a carbon black.
2. camera module according to claim 1 is used low-temperature setting adhesive, it is characterized in that, the weight proportion of each raw material is:
Epoxy resin 30; Solidifying agent 20;
Stablizer 0.5; Promotor 2.5;
Thixotropic agent 2.5; Filler 30;
Silane coupling agent 1.5; Tinting material 1.5.
3. a camera module according to claim 1 or claim 2 is characterized in that with the preparation method of low-temperature setting adhesive its step is following:
(1) with epoxy resin, tinting material joins in the reaction kettle in proportion and mixes;
(2) add thixotropic agent successively, filler, solidifying agent, stablizer, silane coupling agent mixes;
(3) add promotor, vacuumize and mix 2-10 degree packing, storage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN2012100768360A CN102627928A (en) | 2012-03-22 | 2012-03-22 | Low temperature curing adhesive for camera modules, and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100768360A CN102627928A (en) | 2012-03-22 | 2012-03-22 | Low temperature curing adhesive for camera modules, and preparation method thereof |
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| CN102627928A true CN102627928A (en) | 2012-08-08 |
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| CN2012100768360A Pending CN102627928A (en) | 2012-03-22 | 2012-03-22 | Low temperature curing adhesive for camera modules, and preparation method thereof |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103960234A (en) * | 2013-01-29 | 2014-08-06 | 粟贵武 | Novel stabilizers of sulfonylurea type herbicides |
| CN104212395A (en) * | 2014-09-29 | 2014-12-17 | 莱芜金鼎电子材料有限公司 | Epoxy resin adhesive for flexible copper clad plate and production method thereof |
| CN104774584A (en) * | 2014-12-29 | 2015-07-15 | 北京海斯迪克新材料有限公司 | One-component epoxy adhesive used for bonding LED backlight modules LENS |
| CN105440998A (en) * | 2015-11-26 | 2016-03-30 | 河南豫冠化工科技开发有限公司 | Low-temperature fast-curing epoxy resin adhesive and preparation method thereof |
| CN108342175A (en) * | 2018-02-07 | 2018-07-31 | 滕凤琴 | A kind of epoxyn and preparation method thereof |
| CN108977145A (en) * | 2017-05-31 | 2018-12-11 | 烟台信友新材料股份有限公司 | A kind of high moisture-proof temperature curing epoxy low glue and preparation method thereof |
| CN109575860A (en) * | 2018-11-27 | 2019-04-05 | 深圳市明粤科技有限公司 | A kind of low-temperature fast-curing conductive silver glue and preparation method thereof |
| CN110205071A (en) * | 2019-07-01 | 2019-09-06 | 昆山秉德电子科技有限公司 | A kind of thermally conductive epoxy structural rubber of quick-drying and its preparation method and application |
| CN111574946A (en) * | 2020-05-21 | 2020-08-25 | 重庆索梦得新材料科技有限公司 | High-strength wafer structure adhesive and preparation method thereof |
| CN112980370A (en) * | 2021-03-25 | 2021-06-18 | 重庆索梦得新材料科技有限公司 | High-strength wafer structure adhesive |
| CN117903564A (en) * | 2024-01-18 | 2024-04-19 | 惠州市帕克威乐新材料有限公司 | Thixotropic low-temperature cured epoxy resin and preparation method thereof |
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| US20070293603A1 (en) * | 2006-06-19 | 2007-12-20 | Ashland Licensing And Intellectual Property Llc | Epoxy adhesive composition and use thereof |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103960234A (en) * | 2013-01-29 | 2014-08-06 | 粟贵武 | Novel stabilizers of sulfonylurea type herbicides |
| CN104212395A (en) * | 2014-09-29 | 2014-12-17 | 莱芜金鼎电子材料有限公司 | Epoxy resin adhesive for flexible copper clad plate and production method thereof |
| CN104774584A (en) * | 2014-12-29 | 2015-07-15 | 北京海斯迪克新材料有限公司 | One-component epoxy adhesive used for bonding LED backlight modules LENS |
| CN105440998A (en) * | 2015-11-26 | 2016-03-30 | 河南豫冠化工科技开发有限公司 | Low-temperature fast-curing epoxy resin adhesive and preparation method thereof |
| CN105440998B (en) * | 2015-11-26 | 2018-06-26 | 河南豫冠化工科技开发有限公司 | A kind of preparation method of low-temperature fast-curing epoxyn |
| CN108977145A (en) * | 2017-05-31 | 2018-12-11 | 烟台信友新材料股份有限公司 | A kind of high moisture-proof temperature curing epoxy low glue and preparation method thereof |
| CN108342175A (en) * | 2018-02-07 | 2018-07-31 | 滕凤琴 | A kind of epoxyn and preparation method thereof |
| CN109575860A (en) * | 2018-11-27 | 2019-04-05 | 深圳市明粤科技有限公司 | A kind of low-temperature fast-curing conductive silver glue and preparation method thereof |
| CN110205071A (en) * | 2019-07-01 | 2019-09-06 | 昆山秉德电子科技有限公司 | A kind of thermally conductive epoxy structural rubber of quick-drying and its preparation method and application |
| CN111574946A (en) * | 2020-05-21 | 2020-08-25 | 重庆索梦得新材料科技有限公司 | High-strength wafer structure adhesive and preparation method thereof |
| CN112980370A (en) * | 2021-03-25 | 2021-06-18 | 重庆索梦得新材料科技有限公司 | High-strength wafer structure adhesive |
| CN117903564A (en) * | 2024-01-18 | 2024-04-19 | 惠州市帕克威乐新材料有限公司 | Thixotropic low-temperature cured epoxy resin and preparation method thereof |
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Application publication date: 20120808 |