CN104774584A - One-component epoxy adhesive used for bonding LED backlight modules LENS - Google Patents
One-component epoxy adhesive used for bonding LED backlight modules LENS Download PDFInfo
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- CN104774584A CN104774584A CN201410840121.7A CN201410840121A CN104774584A CN 104774584 A CN104774584 A CN 104774584A CN 201410840121 A CN201410840121 A CN 201410840121A CN 104774584 A CN104774584 A CN 104774584A
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Abstract
The present invention relates to the technical field of adhesives, and relates to a one-component epoxy adhesive used for bonding LED backlight modules LENS, and a preparation method thereof. The one-component epoxy adhesive comprises the following components by weight: 30-40 parts of epoxy resin; 10-15 parts of an epoxy flexibilizer; 34-40 parts of polymercaptan; 20-30 parts of a filler; 5-7 parts of a promoter; 1-2 parts of a stabilizer; 0.5-1 part of a coupling agent and 1-2 parts of a water absorbent. Compared with the previous invention, the one-component epoxy adhesive has excellent heat and humidity aging resistance while maintaining low temperature curing performance.
Description
Technical field
The invention belongs to field of adhesive technology, be specifically related to a kind of in LED-backlit module manufacturing processed for single-component epoxy sizing agent of bonding LENS and preparation method thereof.
Technical background
The fast development of liquid-crystal display industry in recent years, and backlight (BackLight) as liquid-crystal display (
lCD) a kind of light source behind, its illumination effect by directly have influence on LCD MODULE (
lCM) visual effect.In the technological process of producing backlight, a LENS by PMMA material is needed to bond to low-temperature fast-curing sizing agent on pcb board, this has had swift and violent growth with the glue consumption of glue point in recent years, and the curing system of this epoxy resin and thiol esters compound generally adopting imidazoles or amine affixture to do promotor with glue point is as patent: CN1934158A, but because imidazoles or amine affixture ratio are easier to water suction, therefore the problem of this system ubiquity wet and heat ageing resistant poor performance, affect the work-ing life of product.Under this technical background, what the present invention adopted some polyfunctionalities has naphthalene skeleton, biphenyl type, two benzene-type, diphenyl ketone type, the isostructural epoxy resin of naphthalene nucleus phenol aldehyde type, improve the cross-linking density of system and the wet-hot aging performance of TG point and then raising system, adopt the toughner with hydrophobic property to improve the hydrophobic performance of system, the problem of system toughness deficiency after improving TG can be made up simultaneously, adopt and there is the wet and heat ageing resistant agent of carbodiimide structure and then reach the performance of raising system high-temp resisting high-humidity resisting.The feature that the wet and heat ageing resistant agent of carbodiimide structure utilizes carbodiimide and hydroxyl to react, by the removing hydroxyl removal in system, and be converted into urea groups after carbodiimide water suction, the latter also can react with epoxy resin, the cross-linking density of further raising system and then raising wet-hot aging performance.
Summary of the invention
The present invention mainly solves the problem of existing low-temperature fast-curing single-component epoxy wet and heat ageing resistant deficiency, by optimal screening epoxy resin, thiol esters resin, toughner, especially interpolation has the wet and heat ageing resistant agent of carbodiimide structure to reach the object of wet and heat ageing resistant.This sizing agent can reach 80 DEG C of 5min solidifications, initial shear strength (steel to steel) can reach more than 20MPa, and can also more than 16MPa be reached in two 85 shearing resistances after aging 400 hours, property retention rate is more than 80%, compared with conventional epoxy tackiness agent, be not only and can realize low-temperature fast-curing, and effectively improve wet and heat ageing resistant performance.
Constituent proportioning of the present invention is as follows:
Epoxy resin described in the present invention be polyfunctionality have in naphthalene skeleton, biphenyl type, two benzene-type, diphenyl ketone type, the isostructural epoxy resin of naphthalene nucleus phenol aldehyde type one or more.
Described epoxy toughening agent is one or more in nucleocapsid structure rubber particles (winning wound 2240A, Tao Shi F301), colloidal nano silica dioxide granule (NANOPOXA410, NANOPOXA510), organosilicone elastic precursor copolymer (ALBIFLEX296, ALBIFLEX348).
Described polythiol is one or more in four (3-thiohydracrylic acid) pentaerythritol ester, Glycerin (3-mercaptopropionic acid ester), two (3-thiohydracrylic acid) glycol ester, trimethylolpropane tris (2-mercaptoacetate), dimercapto acetic acid diethyl alcohol ester, isooctyl mercaptoacetate, oxyethyl group trimethylolpropane tris (3-thiohydracrylic acid) ester, the different monooctyl ester of thiohydracrylic acid.
Described filler is one or more in talcum powder, water-ground limestone, light calcium carbonate, silicon powder, calcium oxide, zinc oxide, boron nitride, aluminum oxide, calcium sulfate, titanium dioxide, meteorological silicon-dioxide.
Described promotor is modified imidazole and extension, modified amine compound, as PN-23 (Japanese aginomoto), MY-24 (Japanese aginomoto), PN-H (Japanese aginomoto), PN-25 Japan aginomoto), FXR-1080 (Japanese fuji changes into), one or more in FXR-1030 (Japanese fuji changes into), M-10 (Changzhou common calla company).
Described stablizer is one or more in n-butyl isocyanate, n-Isopropyl isocyanate, phenylcarbimide, benzyl mustard oil.
Described water-retaining agent is one or more in dicyclohexylcarbodiimide, N, N '-DIC, 1-(3-dimethylamino-propyl)-3-ethyl-carbodiimide hydrochloride.
Described coupling agent is: one or more in 3 glycydoxy Trimethoxy silanes, gamma-mercaptopropyltriethoxysilane, two (γ-triethoxysilylpropyl)-tetrasulfide, phenyltrimethoxysila,e, phenyl triethoxysilane, Union carbide A-162.The preparation method of tackiness agent of the present invention is:
Accurately take each raw material by described formula rate, epoxy resin, epoxide diluent, polythiol and coupling agent are added in reactor successively, after vacuum stirring is even, add filler, stablizer and promotor, discharging after being uniformly dispersed.
The beneficial effect of the present invention compared with conventional art: can be low-temperature fast-curing, hydrothermal aging excellent performance, two 85 performances after aging 400 hours can also remain on more than 80%.
Embodiment
Below in conjunction with specific embodiment, the present invention will be further described.
Embodiment 1
Preparation method:
Preparation method:
Various raw material is accurately weighed by formula rate, first by four glycidyl group amino-phenol, organosilicon composite resin, Glycerin (3-mercaptopropionic acid ester), oxyethyl group trimethylolpropane tris (3-thiohydracrylic acid) ester, gamma-mercaptopropyltriethoxysilane, N, N '-DIC mixes, after add calcium sulfate (point add for three times) and mix, add aerosil more successively, titanium dioxide, n-Isopropyl isocyanate, PN-23 mix (control temperature is 20-35 degree), discharging after full vacuum 30min.
Embodiment 2
Preparation method:
Various raw material is accurately weighed by formula rate, first resorcinol formaldehyde 4 glycidyl ether, ALBIFLEX296, four (3-thiohydracrylic acid) pentaerythritol ester, oxyethyl group trimethylolpropane tris (3-thiohydracrylic acid) ester, 3 glycydoxy Trimethoxy silanes, dicyclohexylcarbodiimide are mixed, after add calcium carbonate (point add for three times) and mix, add aerosil more successively, phenylcarbimide, PN-H mix (control temperature is 20-35 degree), discharging after full vacuum 30min.
Embodiment 3
Preparation method:
Various raw material is accurately weighed by formula rate, first novolac epoxy, NANOPOXA410, four (3-thiohydracrylic acid) pentaerythritol ester, oxyethyl group trimethylolpropane tris (3-thiohydracrylic acid) ester, 3 glycydoxy Trimethoxy silanes, 1-(3-dimethylamino-propyl)-3-ethyl-carbodiimide hydrochloride are mixed, after add calcium carbonate (point add for three times) and mix, add aerosil more successively, benzyl mustard oil, PN-H mix (control temperature is 20-35 degree), discharging after full vacuum 30min.
Table 1 is the performance test results after the solidification of the comparative example of like product on listed embodiment and market, and test result shows:
The present invention has excellent ageing-resistant performance, can meet the needs that LED-backlit module LENS is bonding.
Table 1
Note: shearing resistance is tested by the standard of GB/T7124-1986.
Above-described specific embodiment; further detailed description has been carried out to object of the present invention, technical scheme and beneficial effect; be understood that; the foregoing is only specific embodiments of the invention; be not limited to the present invention; within the spirit and principles in the present invention all, any amendment made, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (7)
1. one kind for bonding epoxy binder in monocomponent in of LED-backlit module LENS and preparation method thereof, and it is characterized in that, described epoxy binder in monocomponent in is made up of following by weight:
Epoxy resin described in the present invention be polyfunctionality have in naphthalene skeleton, biphenyl type, two benzene-type, diphenyl ketone type, the isostructural epoxy resin of naphthalene nucleus phenol aldehyde type one or more.
Described epoxy toughening agent is one or more in nucleocapsid structure rubber particles, organosilicon composite resin, colloidal nano silica dioxide granule, organosilicone elastic precursor copolymer.
Described polythiol is one or more in four (3-thiohydracrylic acid) pentaerythritol ester, Glycerin (3-mercaptopropionic acid ester), two (3-thiohydracrylic acid) glycol ester, trimethylolpropane tris (2-mercaptoacetate), dimercapto acetic acid diethyl alcohol ester, isooctyl mercaptoacetate, oxyethyl group trimethylolpropane tris (3-thiohydracrylic acid) ester, the different monooctyl ester of thiohydracrylic acid.
Described filler is one or more in talcum powder, water-ground limestone, light calcium carbonate, silicon powder, calcium oxide, zinc oxide, boron nitride, aluminum oxide, calcium sulfate, titanium dioxide, meteorological silicon-dioxide.
Described promotor is modified imidazole and extension, modified amine compound
Described stablizer is one or more in n-butyl isocyanate, n-Isopropyl isocyanate, phenylcarbimide, benzyl mustard oil.
Described water-retaining agent is one or more in dicyclohexylcarbodiimide, N, N '-DIC, 1-(3-dimethylamino-propyl)-3-ethyl-carbodiimide hydrochloride.
Described coupling agent is: one or more in 3-glycydoxy Trimethoxy silane, gamma-mercaptopropyltriethoxysilane, two (γ-triethoxysilylpropyl)-tetrasulfide, phenyltrimethoxysila,e, phenyl triethoxysilane, Union carbide A-162.
2. epoxy binder in monocomponent according to claim 1, it is characterized in that, described promotor comprises one or more in PN-23, MY-24, PN-H, PN-25, FXR-1080, FXR-1030, M-10.
3. epoxy binder in monocomponent according to claim 1, it is characterized in that, described epoxy toughening agent nucleocapsid structure rubber particles comprise win in wound 2240A, Tao Shi F301 one or more, epoxy toughening agent colloidal nano silica dioxide granule comprise in NANOPOXA410, NANOPOXA510 one or more, epoxy toughening agent organosilicone elastic precursor copolymer comprise in ALBIFLEX296, ALBIFLEX348 one or more.
4. epoxy binder in monocomponent according to claim 1, is characterized in that, described epoxy binder in monocomponent in by weight mark is composed of the following components:
。
5. epoxy binder in monocomponent according to claim 1, is characterized in that, described epoxy binder in monocomponent in by weight mark is composed of the following components:
。
6. according to epoxy binder in monocomponent according to claim 1, it is characterized in that, described epoxy binder in monocomponent in by weight mark is composed of the following components:
。
7. the method for preparation encapsulating compound as described in any one of claim 1-6, it is characterized in that, described preparation method is:
Accurately take each raw material by described formula rate, by epoxy resin, epoxy toughening agent, polythiol, water-retaining agent and coupling agent add in reactor successively, after vacuum stirring is even, add filler, stablizer and promotor, discharging after being uniformly dispersed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410840121.7A CN104774584A (en) | 2014-12-29 | 2014-12-29 | One-component epoxy adhesive used for bonding LED backlight modules LENS |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410840121.7A CN104774584A (en) | 2014-12-29 | 2014-12-29 | One-component epoxy adhesive used for bonding LED backlight modules LENS |
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| CN104774584A true CN104774584A (en) | 2015-07-15 |
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| CN201410840121.7A Pending CN104774584A (en) | 2014-12-29 | 2014-12-29 | One-component epoxy adhesive used for bonding LED backlight modules LENS |
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106554740A (en) * | 2016-11-11 | 2017-04-05 | 烟台德邦科技有限公司 | A kind of low-temperature fast-curing one-component epoxy adhesive and preparation method thereof |
| JP2017125149A (en) * | 2016-01-15 | 2017-07-20 | 住友ベークライト株式会社 | Sealing resin composition and electronic apparatus |
| CN107090262A (en) * | 2017-06-19 | 2017-08-25 | 上海都伟光伏科技有限公司 | A kind of good composition epoxy resin of transparency and its applied in automotive field |
| CN107090263A (en) * | 2017-06-19 | 2017-08-25 | 上海都伟光伏科技有限公司 | A kind of photovoltaic cutting epoxide-resin glue and preparation method thereof |
| CN107090260A (en) * | 2017-06-01 | 2017-08-25 | 上海应用技术大学 | A kind of high transmission adhesive and preparation method thereof |
| CN109536098A (en) * | 2018-11-09 | 2019-03-29 | 苏州昇攀新材料技术有限公司 | A kind of epoxy adhesive and preparation method thereof for LED backlight mould group |
| CN110194942A (en) * | 2019-06-20 | 2019-09-03 | 广州机械科学研究院有限公司 | A kind of low-temperature rapid thermal cured one-component epoxy adhesive and preparation method thereof |
| CN110330927A (en) * | 2019-08-12 | 2019-10-15 | 山东益丰生化环保股份有限公司 | A kind of LED bi-component casting glue and preparation method thereof |
| CN110776865A (en) * | 2019-11-27 | 2020-02-11 | 山东益丰生化环保股份有限公司 | Preparation method of polythiol curing adhesive |
| CN111234753A (en) * | 2020-04-03 | 2020-06-05 | 苏州世诺新材料科技有限公司 | Adhesive composition with high glass transition temperature and application thereof |
| CN114574137A (en) * | 2022-02-26 | 2022-06-03 | 东莞市恒尔朗实业有限公司 | Packaging adhesive for bonding PC (polycarbonate) material of relay and preparation method thereof |
| CN114989757A (en) * | 2022-06-29 | 2022-09-02 | 东莞市德聚胶接技术有限公司 | Low-temperature fast-curing humidity-heat-resistant epoxy adhesive and preparation method and application thereof |
| WO2023109165A1 (en) * | 2021-12-16 | 2023-06-22 | 韦尔通科技股份有限公司 | Underfill material, and preparation method therefor and use thereof |
| WO2023181831A1 (en) * | 2022-03-23 | 2023-09-28 | ナミックス株式会社 | Resin composition, adhesive or encapsulation material, cured object, semiconductor device, and electronic component |
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| CN101665674A (en) * | 2009-09-30 | 2010-03-10 | 烟台德邦科技有限公司 | Single-component thread locking epoxy precoated adhesive and preparation method thereof |
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Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017125149A (en) * | 2016-01-15 | 2017-07-20 | 住友ベークライト株式会社 | Sealing resin composition and electronic apparatus |
| CN106554740A (en) * | 2016-11-11 | 2017-04-05 | 烟台德邦科技有限公司 | A kind of low-temperature fast-curing one-component epoxy adhesive and preparation method thereof |
| CN107090260A (en) * | 2017-06-01 | 2017-08-25 | 上海应用技术大学 | A kind of high transmission adhesive and preparation method thereof |
| CN107090263B (en) * | 2017-06-19 | 2020-11-13 | 上海都昱新材料科技有限公司 | Epoxy resin adhesive for photovoltaic cutting and preparation method thereof |
| CN107090262A (en) * | 2017-06-19 | 2017-08-25 | 上海都伟光伏科技有限公司 | A kind of good composition epoxy resin of transparency and its applied in automotive field |
| CN107090263A (en) * | 2017-06-19 | 2017-08-25 | 上海都伟光伏科技有限公司 | A kind of photovoltaic cutting epoxide-resin glue and preparation method thereof |
| CN109536098A (en) * | 2018-11-09 | 2019-03-29 | 苏州昇攀新材料技术有限公司 | A kind of epoxy adhesive and preparation method thereof for LED backlight mould group |
| CN110194942A (en) * | 2019-06-20 | 2019-09-03 | 广州机械科学研究院有限公司 | A kind of low-temperature rapid thermal cured one-component epoxy adhesive and preparation method thereof |
| CN110330927A (en) * | 2019-08-12 | 2019-10-15 | 山东益丰生化环保股份有限公司 | A kind of LED bi-component casting glue and preparation method thereof |
| CN110776865A (en) * | 2019-11-27 | 2020-02-11 | 山东益丰生化环保股份有限公司 | Preparation method of polythiol curing adhesive |
| CN111234753A (en) * | 2020-04-03 | 2020-06-05 | 苏州世诺新材料科技有限公司 | Adhesive composition with high glass transition temperature and application thereof |
| CN111234753B (en) * | 2020-04-03 | 2022-02-25 | 世晨材料技术(上海)有限公司 | Adhesive composition with high glass transition temperature and application thereof |
| WO2023109165A1 (en) * | 2021-12-16 | 2023-06-22 | 韦尔通科技股份有限公司 | Underfill material, and preparation method therefor and use thereof |
| CN114574137A (en) * | 2022-02-26 | 2022-06-03 | 东莞市恒尔朗实业有限公司 | Packaging adhesive for bonding PC (polycarbonate) material of relay and preparation method thereof |
| WO2023181831A1 (en) * | 2022-03-23 | 2023-09-28 | ナミックス株式会社 | Resin composition, adhesive or encapsulation material, cured object, semiconductor device, and electronic component |
| CN114989757A (en) * | 2022-06-29 | 2022-09-02 | 东莞市德聚胶接技术有限公司 | Low-temperature fast-curing humidity-heat-resistant epoxy adhesive and preparation method and application thereof |
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Effective date of registration: 20160429 Address after: 100041 Beijing City, Shijingshan District Badachu high tech Park Park Road No. 5 Applicant after: BEIJING TIANSHAN NEW MATERIAL TECHNOLOGY CO., LTD. Address before: 100041 Beijing City, Shijingshan District Badachu high tech Park Park Road No. 5, room 101 Applicant before: Beijing Hystic New Materials Co., Ltd. |
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