CN114574137A - Packaging adhesive for bonding PC (polycarbonate) material of relay and preparation method thereof - Google Patents
Packaging adhesive for bonding PC (polycarbonate) material of relay and preparation method thereof Download PDFInfo
- Publication number
- CN114574137A CN114574137A CN202210181071.0A CN202210181071A CN114574137A CN 114574137 A CN114574137 A CN 114574137A CN 202210181071 A CN202210181071 A CN 202210181071A CN 114574137 A CN114574137 A CN 114574137A
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- Prior art keywords
- epoxy resin
- bonding
- relay
- packaging adhesive
- parts
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/66—Mercaptans
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2255—Oxides; Hydroxides of metals of molybdenum
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/32—Phosphorus-containing compounds
- C08K2003/321—Phosphates
- C08K2003/322—Ammonium phosphate
- C08K2003/323—Ammonium polyphosphate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
Abstract
The invention discloses a packaging adhesive for bonding a PC material of a relay and a preparation method thereof, wherein the packaging adhesive comprises the following components in parts by weight: 50-70 parts of epoxy resin A, 25-50 parts of toughening agent B, 100-150 parts of flame retardant C, 1-5 parts of auxiliary agent D, 40-80 parts of curing agent E, 5-10 parts of accelerator F and 0-6 parts of stabilizer G. Compared with the prior art, the epoxy resin adhesive has the advantages that the sulfydryl (-SH) is introduced into the epoxy resin structure, the sealing property and the aging resistance are greatly improved, the flexibility and the viscosity of the packaging adhesive are reasonably adjusted, the packaging adhesive for bonding the PC material of the relay can realize automatic assembly line production, the epoxy resin adhesive is quickly cured at the temperature of 80 ℃, after the epoxy resin adhesive is cured, the electric appliance after the packaging passes through a severe drop experiment, a water boiling experiment and an air pressure experiment, the product reject ratio is extremely low, and the storage property is good.
Description
Technical Field
The invention relates to the technical field of adhesives, in particular to a packaging adhesive for bonding a PC material of a relay and a preparation method thereof.
Background
The relay is used as an electrical product to be sealed, so that the pollution of dust, harmful gas and humidity in the air to the relay is prevented, and the adaptability and the working reliability of the relay to severe environments are improved. The outer cover, the bottom cover, the wire wheel, the embedded copper, the inserting sheet and other parts of the relay are made of plastic materials, the common plastic materials comprise PBT, nylon, bakelite and other materials, in recent years, polycarbonate PC is often used as the transparent outer cover of the relay due to the characteristics of transparency, flame retardance and the like, and the relay parts have high requirements on the mechanical property, the thermal property, the electrical property and the like of the plastic.
The common single-group epoxy resin adhesive has weak bonding capability to polycarbonate PC, poor impact resistance and poor sealing property, and can not pass severe drop experiments, boiling experiments and air pressure experiments when used for bonding the polycarbonate PC by a relay, so that new requirements are provided for the epoxy packaging adhesive for bonding and sealing the polycarbonate PC material. In view of this, the invention develops an epoxy resin packaging adhesive which has the characteristics of high bonding strength with polycarbonate PC, high impact resistance, air tightness, high aging resistance and the like.
Disclosure of Invention
The invention aims to provide the packaging adhesive for bonding the PC material of the relay and the preparation method thereof, which overcome the problems of weak bonding capability, poor impact resistance, poor sealing property and the like of single-group epoxy resin adhesive to the PC material of the relay, have the advantages of fast curing at 60-80 ℃, strong bonding force, good sealing property and the like, can completely realize automatic production when being used for sealing the PC material of the relay, and have excellent performance and good storage property.
The technical scheme adopted by the invention for achieving the purpose is as follows:
a packaging adhesive for bonding a PC material of a relay comprises the following components in parts by weight:
preferably, the epoxy resin A is one or two of bisphenol A diglycidyl ether type epoxy resin and bisphenol F diglycidyl ether type epoxy resin, the epoxy equivalent is 160-.
Preferably, the toughening agent B is one or more of polyurethane modified epoxy resin, dimer acid modified epoxy resin, CTBN modified epoxy resin and epoxidized polybutadiene epoxy resin, the epoxy equivalent is 300-500, and the viscosity is lower than 100000 mpa.s.
Preferably, the flame retardant C is one or more of aluminum hydroxide, molybdenum dioxide and ammonium polyphosphate, and the mesh number of the flame retardant C is not less than 2500 meshes.
Preferably, the assistant D is a polyether defoamer. The control of the relay industry on organic silicon is strict, and the polyether defoaming agent does not contain organic silicon.
Preferably, the curing agent E is a polymer containing-SH functional groups, and the curing agent E is one or more of difunctional ethylene glycol bis (3-mercaptopropionate), trifunctional trimethylolpropane tris (3-mercaptopropionate) and tetrafunctional pentaerythritol tetrakis (3-mercaptopropionate).
Preferably, the accelerator F is one or two of imidazole derivatives or modified amines, can be used as an epoxy resin latent curing agent, and can be specifically one or two of Japanese AJICURE PN-23 and Japanese Fuji chemical FXR-1020.
Preferably, the stabilizer G is a stabilizer, has the function of reducing the reactivity by coordinating and combining with the imidazole accelerator, and specifically can be one or two of the Japanese national chemical products Cureduct A9250 and Cureduct L-07N.
The invention also provides a preparation method of the packaging adhesive for bonding the relay PC material, which comprises the following steps:
s1, adding the stabilizer G and the accelerator F into the epoxy resin A, stirring and dispersing at a low temperature, uniformly mixing, and introducing cooling water to maintain the temperature within 25 ℃ to obtain an epoxy resin/stabilizer/accelerator coordination complex;
s2, adding the toughening agent B into the epoxy resin A, stirring at a high speed for dispersion, and uniformly mixing to obtain an epoxy resin mixture;
s3, adding the curing agent E into the epoxy resin mixture obtained in the step S2, stirring at a high speed and mixing uniformly, sequentially adding the auxiliary D defoaming agent and the flame retardant C, stirring at a high speed and mixing uniformly to obtain a mixture, and cooling to the temperature of 25 ℃;
s4, adding the mixture obtained in the step S3 into the coordination complex in the step S1, stirring and mixing uniformly at a low speed, and introducing cooling water to maintain the temperature within 25 ℃ to obtain the packaging adhesive for bonding the PC material of the relay.
Preferably, the rotating speed of the high-speed stirring is 1000-1500 r/min; the rotation speed of the low-speed stirring is 100-200 r/min.
Compared with the prior art, the invention has the following beneficial effects:
1. the packaging adhesive for bonding the PC material of the relay has the advantages of fast curing at 60-80 ℃, strong bonding force, good sealing property and the like, meets 94UL-VO, has very excellent bonding property to polycarbonate PC, can completely realize automatic production when used for sealing the PC material of the relay, and has convenient preparation method flow and simple and easy operation.
2. The packaging adhesive for bonding the PC material of the relay overcomes the problems of weak bonding capability, poor impact resistance, poor sealing property and the like of single-component epoxy resin adhesive to the PC, greatly improves the sealing property and aging resistance by introducing sulfydryl (-SH) into an epoxy resin structure, reasonably adjusts the flexibility and viscosity of the packaging adhesive, can realize automatic flow line production, is quickly cured at 80 ℃, and has extremely low product reject ratio and good storage property after being cured and electrical appliances after being packaged pass a severe drop experiment, a boiling experiment and an air pressure experiment.
The foregoing is a summary of the technical solutions of the present invention, and the present invention is further described below with reference to specific embodiments.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the following embodiments are described in detail. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Example 1: the packaging adhesive for bonding the relay PC material and the preparation method thereof provided by the embodiment comprise the following components in parts by weight: epoxy resin A, a toughening agent B, a flame retardant C, an auxiliary agent D, a curing agent E, an accelerator F and a stabilizer G. The dosage ratio of each component is shown in table 1.
Preferably, the epoxy resin A is one or two of bisphenol A diglycidyl ether type epoxy resin and bisphenol F diglycidyl ether type epoxy resin, the epoxy equivalent thereof is 160-200, the viscosity thereof is 5000-10000mpa.s, and the epoxy resin A becomes the main resin part of the packaging adhesive. The toughening agent B is one or more of polyurethane modified epoxy resin, dimer acid modified epoxy resin, CTBN modified epoxy resin and epoxidized polybutadiene epoxy resin, the epoxy equivalent is 300-500, and the viscosity is lower than 100000 mpa.s. The fire retardant C is one or more of aluminum hydroxide, molybdenum dioxide and ammonium polyphosphate, and the mesh number of the fire retardant C is not less than 2500 meshes. The auxiliary agent D is a polyether defoaming agent. The control of the relay industry on organic silicon is strict, and the polyether defoaming agent does not contain organic silicon. The curing agent E is a polymer containing-SH functional groups, and is one or more of difunctional ethylene glycol bis (3-mercaptopropionate), trifunctional trimethylolpropane tris (3-mercaptopropionate) and tetrafunctional pentaerythritol tetrakis (3-mercaptopropionate). The accelerator F is one or two of imidazole derivatives or modified amines, can be used as a latent curing agent of the epoxy resin, and can be specifically one or two of Japanese ajocure PN-23 and Japanese Fuji chemical FXR-1020. The stabilizer G is a stabilizer, has the function of reducing the reactivity by coordination and combination with the imidazole accelerator, and specifically can be one or two of Cureduct A9250 and Cureduct L-07N formed in Japan.
In the embodiment, a single bifunctional curing agent is adopted, so that the crosslinking density is low, the colloid is too soft, and the test of water boiling, negative pressure and aging performance cannot be passed except for good anti-falling performance; trimethylolpropane tri (3-mercaptopropionate) and pentaerythritol tetra (3-mercaptopropionate) ester are used as curing agents or mixed curing agents.
The embodiment also provides a preparation method of the packaging adhesive for bonding the PC material of the relay, which comprises the following steps that the high-speed stirring rotating speed is 1000-; the rotating speed of the low-speed stirring is 100-:
s1, adding the stabilizer G and the accelerator F into the epoxy resin A, stirring and dispersing at a low temperature, uniformly mixing, and introducing cooling water to maintain the temperature within 25 ℃ to obtain an epoxy resin/stabilizer/accelerator coordination complex;
s2, adding the toughening agent B into the epoxy resin A, stirring at a high speed for dispersion, and uniformly mixing to obtain an epoxy resin mixture;
s3, adding the curing agent E into the epoxy resin mixture obtained in the step S2, stirring at a high speed and mixing uniformly, sequentially adding the auxiliary D defoaming agent and the flame retardant C, stirring at a high speed and mixing uniformly to obtain a mixture, and cooling to the temperature of 25 ℃;
s4, adding the mixture obtained in the step S3 into the coordination complex in the step S1, stirring and mixing uniformly at a low speed, and introducing cooling water to maintain the temperature within 25 ℃ to obtain the packaging adhesive for bonding the PC material of the relay.
Examples 2 to 4: the magnetic conductive adhesive for the wound sheet type common mode inductor and the manufacturing method thereof provided by the embodiment are basically the same as those of the embodiment 1, except that: the kinds and the amounts of the components are different, and are specifically shown in the following table 1. In example 2, a stabilizer is not used, and the storage time at normal temperature is short, so that the requirement of industrial production cannot be met; the embodiment 3 and the embodiment 4 have good construction performance, can pass relevant tests of the industry, have good storage life and can completely meet the requirements of polycarbonate PC packaging in the relay industry.
Table 1, comparative example and examples 1 to 4, types and amounts of raw materials, and results of measurement of properties
Example 5: the present embodiment provides a packaging adhesive for bonding PC materials of relays and a method for manufacturing the same, which is substantially the same as any of embodiments 1 to 4, except that: the packaging adhesive for bonding the PC material of the relay is prepared from the following components in parts by weight:
example 6: the present embodiment provides a packaging adhesive for bonding PC materials of relays and a method for manufacturing the same, which is substantially the same as any of embodiments 1 to 4, except that: the packaging adhesive for bonding the PC material of the relay is prepared from the following components in parts by weight:
example 7: the present embodiment provides a packaging adhesive for bonding PC materials of relays and a method for manufacturing the same, which is substantially the same as any of embodiments 1 to 4, except that: the packaging adhesive for bonding the PC material of the relay is prepared from the following components in parts by weight:
variations and modifications to the above-described embodiments may occur to those skilled in the art, which fall within the scope and spirit of the above description. Therefore, the present invention is not limited to the specific embodiments disclosed and described above, and some modifications and variations of the present invention should fall within the scope of the claims of the present invention.
Claims (10)
1. The packaging adhesive for bonding the PC material of the relay is characterized by comprising the following components in parts by weight:
2. the encapsulant for bonding PC material of relay as claimed in claim 1, wherein the epoxy resin A is one or two of bisphenol A diglycidyl ether type epoxy resin and bisphenol F diglycidyl ether type epoxy resin, and has an epoxy equivalent of 160-.
3. The packaging adhesive for bonding the PC material of the relay as claimed in claim 1, wherein the toughening agent B is one or more of polyurethane modified epoxy resin, dimer acid modified epoxy resin, CTBN modified epoxy resin and epoxidized polybutadiene epoxy resin, the epoxy equivalent is 300-500, and the viscosity is less than 100000 mpa.s.
4. The packaging adhesive for bonding the PC material of the relay according to claim 1, wherein the flame retardant C is one or more of aluminum hydroxide, molybdenum dioxide and ammonium polyphosphate, and the mesh number of the flame retardant C is not less than 2500 meshes.
5. The packaging adhesive for bonding the relay PC material as claimed in claim 1, wherein the additive D is a polyether defoamer.
6. The encapsulant for bonding PC materials of relays according to claim 1, wherein the curing agent E is a polymer containing-SH functional group, and the curing agent E is one or more of difunctional ethylene glycol bis (3-mercaptopropionate), trifunctional trimethylolpropane tris (3-mercaptopropionate), and tetrafunctional pentaerythritol tetrakis (3-mercaptopropionate).
7. The packaging adhesive for bonding the PC material of the relay according to claim 1, wherein the accelerator F is one or two of imidazole derivatives or modified amines.
8. The encapsulant for bonding PC materials of relays according to claim 1, wherein the stabilizer G is a stabilizer.
9. A method for preparing the packaging adhesive for bonding the PC material of the relay according to any one of claims 1 to 8, which comprises the following steps:
s1, adding the stabilizer G and the accelerator F into the epoxy resin A, stirring and dispersing at a low temperature, uniformly mixing, and introducing cooling water to maintain the temperature within 25 ℃ to obtain an epoxy resin/stabilizer/accelerator coordination complex;
s2, adding the toughening agent B into the epoxy resin A, stirring at a high speed for dispersion, and uniformly mixing to obtain an epoxy resin mixture;
s3, adding the curing agent E into the epoxy resin mixture obtained in the step S2, stirring at a high speed and mixing uniformly, sequentially adding the auxiliary D defoaming agent and the flame retardant C, stirring at a high speed and mixing uniformly to obtain a mixture, and cooling to the temperature of 25 ℃;
s4, adding the mixture obtained in the step S3 into the coordination complex in the step S1, stirring and mixing uniformly at a low speed, and introducing cooling water to maintain the temperature within 25 ℃ to obtain the packaging adhesive for bonding the PC material of the relay.
10. The method for preparing the packaging adhesive for bonding the PC material of the relay as claimed in claim 9, wherein the high-speed stirring speed is 1000-1500 r/min; the rotating speed of the low-speed stirring is 100-200 r/min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210181071.0A CN114574137A (en) | 2022-02-26 | 2022-02-26 | Packaging adhesive for bonding PC (polycarbonate) material of relay and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210181071.0A CN114574137A (en) | 2022-02-26 | 2022-02-26 | Packaging adhesive for bonding PC (polycarbonate) material of relay and preparation method thereof |
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| CN114574137A true CN114574137A (en) | 2022-06-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210181071.0A Pending CN114574137A (en) | 2022-02-26 | 2022-02-26 | Packaging adhesive for bonding PC (polycarbonate) material of relay and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115386324A (en) * | 2022-09-21 | 2022-11-25 | 上海仁速新材料有限公司 | Epoxy adhesive and preparation method and application thereof |
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| KR20110069393A (en) * | 2009-12-17 | 2011-06-23 | 주식회사 원케미컬 | Epoxy resin composition and sealant comprising the same |
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| CN104774584A (en) * | 2014-12-29 | 2015-07-15 | 北京海斯迪克新材料有限公司 | One-component epoxy adhesive used for bonding LED backlight modules LENS |
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