CN106833465A - A kind of lower glass transition temperatures use for electronic products insulating cement and its preparation method and application - Google Patents
A kind of lower glass transition temperatures use for electronic products insulating cement and its preparation method and application Download PDFInfo
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- CN106833465A CN106833465A CN201611236536.9A CN201611236536A CN106833465A CN 106833465 A CN106833465 A CN 106833465A CN 201611236536 A CN201611236536 A CN 201611236536A CN 106833465 A CN106833465 A CN 106833465A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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Abstract
The invention discloses a kind of lower glass transition temperatures use for electronic products insulating cement, including component by mass percentage as follows：Matrix resin 80 ~ 95%；Promote to become agent 2 ~ 10%；Curing agent 3 ~ 10%；Described matrix resin includes the component of following parts by weight：100 parts of modified epoxy；50 ~ 80 parts of bisphenol f type epoxy resin；50 ~ 70 parts of halogen-free toughening agent；The modified epoxy is the mixture of one or more compositions in dimer acid modified epoxy resin, polyurethane modified epoxy resin or bisphenol A type epoxy resin.At normal temperatures with good pliability, in low temperature, intensity is remained able to meet and required the insulating cement that the present invention is provided, and bonding force is strong, and chloride content is low, more environmental protection, reliability.
Description
Technical field
The invention belongs to technical field of polymer materials, produced more particularly, to a kind of lower glass transition temperatures electronics
Product insulating cement and its preparation method and application.
Background technology
With the high speed development of microelectronics industry, integrated circuit high speed, densification increasingly, therefore it is required that encapsulating material
With good resistance to low temperature and bending property.
Country's Heat Conductive Insulation Adhesive is generally embedding class adhesive, epoxy-plastic packaging material at present（EMC）So that its is with low cost,
Process is simple is come out top with the advantages of being suitable to large-scale production in integrated circuit packaging material, at present whole world integrated circuit envelope
The 97% of package material uses EMC.But epoxy resin-cured product is generally more crisp, it is therefore desirable to epoxy resin is modified, it changes
Property method it is a lot, mainly have and be polymerized using epoxy resin and thermoplastic polymer, interpenetrating net polymer, thermotropic liquid crystal
The method of the blendings such as thing, core shell structure polymer, rubber and polyalcohol improves the shock resistance of system；It is plasticized by adding
Agent improves the toughness of cured product；It is possible to additionally incorporate the viscosity that system can also be reduced after liquid plasticizer, it is to avoid add heat conduction
System viscosity is caused to increase the difficulty brought to industrial coating after filler；Above-mentioned method of modifying is easily caused the pliability of insulating cement
Decline, certain difficulty is brought to practical application.And the Tg of epoxy resin is higher, it is difficult to meet low temperature resistant requirement, this
It is the current urgent problem in terms of dielectric adhesive.
The content of the invention
It is an object of the invention to according to deficiency of the prior art, there is provided a kind of lower glass transition temperatures electronics is produced
Product insulating cement.
Preparation side another object of the present invention is to provide above-mentioned lower glass transition temperatures use for electronic products insulating cement
Method.
It is still another object of the present invention to provide the application of above-mentioned lower glass transition temperatures use for electronic products insulating cement.
The purpose of the present invention is achieved through the following technical solutions：
The invention provides a kind of lower glass transition temperatures use for electronic products insulating cement, including as follows by mass percentage
Component：
Matrix resin 80 ~ 95%；
Promote to become agent 2 ~ 10%；
Curing agent 3 ~ 10%；
Described matrix resin includes the component of following parts by weight：
100 parts of modified epoxy；
50 ~ 80 parts of bisphenol f type epoxy resin；
50 ~ 70 parts of halogen-free toughening agent；
The modified epoxy is dimer acid modified epoxy resin, polyurethane modified epoxy resin and bisphenol A type epoxy resin
In one or more composition mixtures.
The epoxide equivalent of the modified epoxy is 200 ~ 1000 g/eq, and viscosity is 40000 ~ 90000 cP, Bisphenol F
The epoxide equivalent of epoxy resin is 150 ~ 500 g/eq, and viscosity is 3000 ~ 4500 cP；
The viscosity of halogen-free toughening agent is 10000 ~ 20000 cP.
Preferably, including as follows component by mass percentage：
Matrix resin 90 ~ 95%；
Promote to become agent 3 ~ 5%；
Curing agent 2 ~ 5%.
Preferably, described matrix resin includes the component of following parts by weight：
100 parts of modified epoxy；
55 ~ 65 parts of bisphenol f type epoxy resin；
60 ~ 70 parts of halogen-free toughening agent.
Preferably, the chloride content of bisphenol F epoxy resin is less than 900 ppm.
Preferably, the curing agent is the mixture of Imidizole accelerator and double cyanogen diamines, Imidizole accelerator and double cyanogen diamines
Mass ratio be 1：5~10.
Preferably, the Imidizole accelerator is selected from 2-methylimidazole, 2-ethyl-4-methylimidazole, 2- phenylimidazoles and 2-
The mixture of one or more compositions in phenyl -4-methylimidazole.
Preferably, it is described to promote to become agent into precipitated silica, aerosil, superfine silicon dioxide gel, powdered
Synthetic aluminium silicate or powdered synthetic calcium silicate.
Preferably, the toughener is for big molecular modification is epoxy resin toughened, rubber elastomer is epoxy resin toughened or heat
The mixture of one or more compositions during plastic resin is epoxy resin toughened..
It is present invention simultaneously provides the preparation method of the lower glass transition temperatures use for electronic products insulating cement including following
Step：
S1. the matrix resin comprising modified epoxy, bisphenol f type epoxy resin and halogen-free toughening agent is heated to 100 ~ 150
DEG C, add rush to become agent after mixing and stir；
S2. curing agent is added in the mixture for obtaining to step S1, is discharged after vacuum stirring.
Preferably, in step S2, after being discharged through three-roller after being stirred under vacuum in planetary mixer, normal temperature is preserved.
Preferably, in step S2, to adding curing agent first to stir 10 ~ 30 minutes in the mixture that step S1 is obtained, then
It is stirred under vacuum 20 ~ 40 minutes in planetary mixer, aforementioned operation is repeated until uniformly being mixed after stopping stirring 10 ~ 30 minutes
Compound.
The present invention is compounded by by modified epoxy, bisphenol f type epoxy resin and halogen-free toughening agent, and by control
The appropriate consumption of system, and the physical parameter of appropriate modified epoxy and bisphenol f type epoxy resin is selected, obtain more
The effect of preferable mechanical strength is realized under low temperature.The product that the present invention is provided is particularly suited for using at low temperatures.
Compared with prior art, the present invention has advantages below and beneficial effect：
Lower glass transition temperatures use for electronic products insulating cement of the present invention, by using comprising modified epoxy, bisphenol-f type ring
Oxygen tree fat, the matrix resin of halogen-free toughening agent are mixed with change agent, curing agent is promoted, and modified epoxy is dimer acid modified ring
The mixture of one or more compositions in oxygen tree fat, polyurethane modified epoxy resin and bisphenol A type epoxy resin, so obtains
Insulating cement normal temperature there is good pliability and lower glass transition temperatures, in low temperature, its intensity will not change too many and become
It is crisp；Chloride content is low, more environmental protection, reliability.
Specific embodiment
The present invention is further illustrated below in conjunction with specific embodiment, but embodiment does not do any type of to the present invention
Limit.Unless stated otherwise, the reagent for using of the invention, method and apparatus are the art conventional reagent, method and apparatus.
Unless stated otherwise, agents useful for same of the present invention and material are purchased in market.
Embodiment 1
The present embodiment provides a kind of lower glass transition temperatures use for electronic products insulating cement, and it includes following components：
Matrix resin 80g；
Promote to become agent 10g；
Curing agent 10g；
Wherein, 80g matrix resins include modified epoxy（Bisphenol A epoxide resin, solid, epoxide equivalent is 770-870
g/eq）40g, bisphenol f type epoxy resin（Viscosity is 3400-4200 cP, and epoxide equivalent is 167-174 g/eq）20g and toughness reinforcing
Agent（It is halogen-free toughening agent, viscosity is 10000-12000 cP）20g；It is hydrophilic aerosil to promote to become agent；Curing agent is
Imidizole accelerator（2-methylimidazole）With the mixture of double cyanogen diamines, its mass ratio is 1：5（2-methylimidazole is 1.67g, double cyanogen
Diamines is 8.33g）.
The preparation method of above-mentioned lower glass transition temperatures use for electronic products insulating cement, it is comprised the following steps：
（a）The modified epoxy of formula ratio, bisphenol f type epoxy resin and toughener are heated to 100 ~ 150 DEG C, are well mixed
The hydrophilic aerosil of formula ratio is added to stir afterwards；
（b）To step（a）The 2-methylimidazole and double cyanogen diamines of 1/2 formula ratio are added in the mixture for obtaining, 10 ~ 30 are first stirred
Minute, then vacuumize in planetary mixer continuation and stir 20 ~ 40 minutes, repeated after stopping stirring 10 ~ 30 minutes to room temperature
Aforementioned operation one time is until obtain a homogeneous mixture, normal temperature preservation after being discharged through three-roller is conducive to improving the matter of final products
Amount（Addition before and after curing agent can be adjusted according to thermal discharge）.
Embodiment 2
The present embodiment provides a kind of lower glass transition temperatures use for electronic products insulating cement, in its preparation method and embodiment 1
It is basically identical, the difference is that its constituent content is inconsistent, specially：
Matrix resin 95g；
Promote to become agent 2g；
Curing agent 3g；
Wherein, 95g matrix resins include modified epoxy（Polyurethane modified epoxy resin, viscosity is 40000-50000
CP, epoxide equivalent is 210-230 g/eq）38g, bisphenol f type epoxy resin（Viscosity is 3400-4200 cP, and epoxide equivalent is
167-174 g/eq）30.4g and toughener（Halogen, viscosity is 15000-17000 cP）26.6g；It is ultra-fine titanium dioxide to promote to become agent
Silica hydrogel；Curing agent is Imidizole accelerator（2-ethyl-4-methylimidazole）With the mixture of double cyanogen diamines, its mass ratio is 1：5
（2-ethyl-4-methylimidazole is 0.5g, and double cyanogen diamines are 2.5g）.
Embodiment 3
The present embodiment provides a kind of lower glass transition temperatures use for electronic products insulating cement, in its preparation method and embodiment 1
It is basically identical, the difference is that its constituent content is inconsistent, specially：
Matrix resin 90g；
Promote to become agent 5g；
Curing agent 5g；
Wherein, 90g matrix resins include modified epoxy（Dimer acid modified epoxy resin, viscosity is 40000-90000
CP, epoxide equivalent is 380-460 g/eq）39.1g, bisphenol f type epoxy resin（Viscosity is 3400-4200 cP, epoxide equivalent
It is 167-174 g/eq）23.5g and toughener（Halogen, viscosity is 10000-12000 cP）27.4g；It is powdered conjunction to promote to become agent
Into alumina silicate；Curing agent is Imidizole accelerator（2- phenylimidazoles）With the mixture of double cyanogen diamines, its mass ratio is 1：5（2- benzene
Base imidazoles is 0.83g, and double cyanogen diamines are 4.17g）.
Embodiment 4
The present embodiment provides a kind of lower glass transition temperatures use for electronic products insulating cement, in its preparation method and embodiment 3
It is basically identical, the difference is that curing agent is Imidizole accelerator（2- phenylimidazoles）With the mixture of double cyanogen diamines, its mass ratio is
1：10（2- phenylimidazoles are 0.45g, and double cyanogen diamines are 4.55g）.
Embodiment 5
The present embodiment provides a kind of lower glass transition temperatures use for electronic products insulating cement, in its preparation method and embodiment 3
It is basically identical, the difference is that curing agent is Imidizole accelerator（2- phenylimidazoles）With the mixture of double cyanogen diamines, its mass ratio is
1：9（2- phenylimidazoles are 0.5g, and double cyanogen diamines are 4.5g）.
Embodiment 6
The present embodiment provides a kind of lower glass transition temperatures use for electronic products insulating cement, in its preparation method and embodiment 1
It is basically identical, the difference is that its constituent content is inconsistent, specially：
Matrix resin 92g；
Promote to become agent 4g；
Curing agent 4g；
Wherein, 92g matrix resins include modified epoxy（Dimer acid modified epoxy resin, viscosity is 40000-90000
CP, epoxide equivalent is 380-460 g/eq）42.8g, bisphenol f type epoxy resin（Viscosity is 3400-4200 cP, epoxide equivalent
It is 167-174 g/eq）23.5g and toughener（Halogen, viscosity is 10000-12000 cP）25.7g；It is hydrophilic gas to promote to become agent
Aerosil；Curing agent is Imidizole accelerator（2- phenylimidazoles）With the mixture of double cyanogen diamines, its mass ratio is 1：7（2-
Phenyl -4-methylimidazole is 0.5g, and double cyanogen diamines are 3.5g）.
Embodiment 7
The present embodiment provides a kind of lower glass transition temperatures use for electronic products insulating cement, in its preparation method and embodiment 6
It is basically identical, unlike：92g matrix resins include modified epoxy（Dimer acid modified epoxy resin, viscosity is
40000-90000 cP, epoxide equivalent is 380-460 g/eq）39.2g, bisphenol f type epoxy resin（Viscosity is 3400-4200
CP, epoxide equivalent is 167-174 g/eq）25.4g and toughener（Halogen, viscosity is 10000-12000 cP）27.4g.
Embodiment 8
The present embodiment provides a kind of lower glass transition temperatures use for electronic products insulating cement, in its preparation method and embodiment 1
It is basically identical, the difference is that the quality of each component is：Modified epoxy（Dimer acid modified epoxy resin, viscosity is 40000-
90000 cP, epoxide equivalent is 380-460 g/eq）100g, bisphenol f type epoxy resin（Viscosity is 3400-4200 cP, ring
Oxygen equivalent is 167-174 g/eq）60g, toughener（Halogen, viscosity is 10000-12000 cP）65g, rush become agent hydrophilic gas
Aerosil is 10g, double cyanogen diamines（Average grain diameter is 10 microns）11g and Imidizole accelerator（Imidazoles latent curing
Agent）2g, i.e. matrix resin gross mass are 225g, and curing agent gross mass is 13g.
The performance test data table of insulating cement in the embodiment 1 to 8 of table 1
Comparative example 1
This comparative example provides a kind of lower glass transition temperatures use for electronic products insulating cement, and it includes following components：
Matrix resin 80g；
Promote to become agent 10g；
Curing agent 10g；
Wherein, 80g matrix resins include modified epoxy（Bisphenol A epoxide resin, solid, epoxide equivalent is 770-870
g/eq）70g, toughener (Halogen, viscosity is 10000-12000 cP) 10g；It is hydrophilic aerosil to promote to become agent；Gu
Agent is Imidizole accelerator（2-methylimidazole）With the mixture of double cyanogen diamines, its mass ratio is 1：5（2-methylimidazole is
1.67g, double cyanogen diamines are 8.33g）.
The preparation method of above-mentioned lower glass transition temperatures use for electronic products insulating cement, it is comprised the following steps：
（a）The modified epoxy of formula ratio, bisphenol f type epoxy resin are heated to 100 ~ 150 DEG C, are added after being well mixed and matched somebody with somebody
The hydrophilic aerosil of side's amount stirs；
（b）To step（a）The 2-methylimidazole and double cyanogen diamines of 1/2 formula ratio are added in the mixture for obtaining, 10 ~ 30 are first stirred
Minute, then vacuumize in planetary mixer continuation and stir 20 ~ 40 minutes, repeated after stopping stirring 10 ~ 30 minutes to room temperature
Aforementioned operation one time is until obtain a homogeneous mixture, normal temperature preservation after being discharged through three-roller is conducive to improving the matter of final products
Amount（Addition before and after curing agent can be adjusted according to thermal discharge）.
Comparative example 2
This comparative example provides a kind of lower glass transition temperatures use for electronic products insulating cement, and it includes following components：
Matrix resin 80g；
Promote to become agent 10g；
Curing agent 10g；
Wherein, 80g matrix resins include modified epoxy（Bisphenol A epoxide resin, solid, epoxide equivalent is 770-870
g/eq）60g, toughener（Halogen, viscosity is 10000-12000 cP）20g；It is hydrophilic aerosil to promote to become agent；Gu
Agent is Imidizole accelerator（2-methylimidazole）With the mixture of double cyanogen diamines, its mass ratio is 1：5（2-methylimidazole is
1.67g, double cyanogen diamines are 8.33g）.
The preparation method of above-mentioned lower glass transition temperatures use for electronic products insulating cement, it is comprised the following steps：
（a）The modified epoxy of formula ratio, bisphenol f type epoxy resin are heated to 100 ~ 150 DEG C, are added after being well mixed and matched somebody with somebody
The hydrophilic aerosil of side's amount stirs；
（b）To step（a）The 2-methylimidazole and double cyanogen diamines of 1/2 formula ratio are added in the mixture for obtaining, 10 ~ 30 are first stirred
Minute, then vacuumize in planetary mixer continuation and stir 20 ~ 40 minutes, repeated after stopping stirring 10 ~ 30 minutes to room temperature
Aforementioned operation one time is until obtain a homogeneous mixture, normal temperature preservation after being discharged through three-roller is conducive to improving the matter of final products
Amount（Addition before and after curing agent can be adjusted according to thermal discharge）.
Comparative example 3：
This comparative example provides a kind of lower glass transition temperatures use for electronic products insulating cement, and it includes following components：
Matrix resin 80g；
Promote to become agent 10g；
Curing agent 10g；
Wherein, 80g matrix resins include modified epoxy（Bisphenol A epoxide resin, solid, epoxide equivalent is 770-870
g/eq）20g, bisphenol f type epoxy resin（Viscosity is 3400-4200 cP, and epoxide equivalent is 167-174 g/eq）20g and toughness reinforcing
Agent（Halogen, viscosity is 10000-12000 cP）40g；It is hydrophilic aerosil to promote to become agent；Curing agent promotees for imidazoles
Enter agent（2-methylimidazole）With the mixture of double cyanogen diamines, its mass ratio is 1：5（2-methylimidazole is 1.67g, and double cyanogen diamines are
8.33g）.
The preparation method of above-mentioned lower glass transition temperatures use for electronic products insulating cement, it is comprised the following steps：
（a）The modified epoxy of formula ratio, bisphenol f type epoxy resin and halogen-free toughening agent are heated to 100 ~ 150 DEG C, mixing
The hydrophilic aerosil of formula ratio is added to stir after uniform；
（b）To step（a）The 2-methylimidazole and double cyanogen diamines of 1/2 formula ratio are added in the mixture for obtaining, 10 ~ 30 are first stirred
Minute, then vacuumize in planetary mixer continuation and stir 20 ~ 40 minutes, repeated after stopping stirring 10 ~ 30 minutes to room temperature
Aforementioned operation one time is until obtain a homogeneous mixture, normal temperature preservation after being discharged through three-roller is conducive to improving the matter of final products
Amount（Addition before and after curing agent can be adjusted according to thermal discharge）.
Be the results are shown in Table shown in 2 in comparative example 1 ~ 3.
Table 2
Wherein, the product crosslinking degree that comparative example 3 is prepared not enough, is unsatisfactory for test request, is substandard product.
And due to lacking bisphenol f type epoxy resin in comparative example 1 and comparative example 2, its Tg is still within above zero, it is difficult to
Meet low temperature resistant mechanical property requirements.
The above embodiments merely illustrate the technical concept and features of the present invention, its object is to allow person skilled in the art
Scholar will appreciate that present disclosure and implement according to this that it is not intended to limit the scope of the present invention, all according to the present invention
The equivalent change or modification that Spirit Essence is made, should all be included within the scope of the present invention.
Claims (10)
1. a kind of lower glass transition temperatures use for electronic products insulating cement, it is characterised in that including as follows by mass percentage
Component：
Matrix resin 80 ~ 95%；
Promote to become agent 2 ~ 10%；
Curing agent 3 ~ 10%；
Described matrix resin includes the component of following parts by weight：
100 parts of modified epoxy；
50 ~ 80 parts of bisphenol f type epoxy resin；
50 ~ 70 parts of halogen-free toughening agent；
The modified epoxy is dimer acid modified epoxy resin, polyurethane modified epoxy resin and bisphenol A type epoxy resin
In one or more composition mixtures；
The epoxide equivalent of the modified epoxy is 200 ~ 1000 g/eq, and viscosity is 40000 ~ 90000 cP；
The epoxide equivalent of bisphenol F epoxy resin is 150 ~ 500 g/eq, and viscosity is 3000 ~ 4500 cP；
The viscosity of halogen-free toughening agent is 10000 ~ 20000 cP.
2. lower glass transition temperatures use for electronic products insulating cement according to claim 1, it is characterised in that including as follows
Component by mass percentage：
Matrix resin 90 ~ 95%；
Promote to become agent 3 ~ 5%；
Curing agent 2 ~ 5%
Described matrix resin includes the component of following parts by weight：
100 parts of modified epoxy；
55 ~ 65 parts of bisphenol f type epoxy resin；
60 ~ 70 parts of halogen-free toughening agent.
3. lower glass transition temperatures use for electronic products insulating cement according to claim 1, it is characterised in that Bisphenol F ring
The chloride content of oxygen tree fat is less than 900 ppm.
4. lower glass transition temperatures use for electronic products insulating cement according to claim 1, it is characterised in that the solidification
Agent is the mixture of Imidizole accelerator and double cyanogen diamines, and Imidizole accelerator is 1 with the mass ratio of double cyanogen diamines：5~10.
5. lower glass transition temperatures use for electronic products insulating cement according to claim 4, it is characterised in that the imidazoles
Accelerator is selected from the one kind in 2-methylimidazole, 2-ethyl-4-methylimidazole, 2- phenylimidazoles and 2- phenyl -4-methylimidazole
Or the mixture of several compositions.
6. lower glass transition temperatures use for electronic products insulating cement according to claim 1, it is characterised in that the rush becomes
Agent is precipitated silica, aerosil, superfine silicon dioxide gel, powdered synthetic aluminium silicate or powdered synthesis silicon
Sour calcium.
7. lower glass transition temperatures use for electronic products insulating cement according to claim 1, it is characterised in that the toughness reinforcing
Agent be that big molecular modification is epoxy resin toughened, rubber elastomer is epoxy resin toughened or Toughened With High Performance Thermoplastics epoxy resin in
The mixture of one or more compositions.
8. in claim 1 to 7 any lower glass transition temperatures use for electronic products insulating cement preparation method, its feature
It is to comprise the following steps：
S1. the matrix resin comprising modified epoxy, bisphenol f type epoxy resin and halogen-free toughening agent is heated to 100 ~ 150
DEG C, add rush to become agent after mixing and stir；
S2. curing agent is added in the mixture for obtaining to step S1, is discharged after vacuum stirring.
9. the preparation method of lower glass transition temperatures use for electronic products insulating cement according to claim 8, it is characterised in that
In step S2, after being discharged through three-roller after being stirred under vacuum in planetary mixer, normal temperature is preserved.
10. the preparation method of lower glass transition temperatures use for electronic products insulating cement according to claim 8, its feature exists
In in step S2, to adding curing agent first to stir in the mixture that step S1 is obtained 10 ~ 30 minutes, then in planetary mixer
It is middle to be stirred under vacuum 20 ~ 40 minutes, aforementioned operation is repeated until obtaining a homogeneous mixture after stopping stirring 10 ~ 30 minutes.
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| CN107805973A (en) * | 2017-10-20 | 2018-03-16 | 南通日芝电力材料有限公司 | Mutual inductor coil interlayer dielectic, modified epoxy and preparation method |
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| CN114774041A (en) * | 2021-05-25 | 2022-07-22 | 镇江利德尔复合材料有限公司 | Novel single-component adhesive and preparation method thereof |
| CN115895338A (en) * | 2022-11-17 | 2023-04-04 | 佛山英捷力新材料科技有限公司 | UV-LED character ink-jet ink for flexible circuit board and preparation method thereof |
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