JPH11335443A - Epoxy resin composition for sealing, semiconductor device, semiconductor chip module and semiconductor chip package using the composition - Google Patents
Epoxy resin composition for sealing, semiconductor device, semiconductor chip module and semiconductor chip package using the compositionInfo
- Publication number
- JPH11335443A JPH11335443A JP14171998A JP14171998A JPH11335443A JP H11335443 A JPH11335443 A JP H11335443A JP 14171998 A JP14171998 A JP 14171998A JP 14171998 A JP14171998 A JP 14171998A JP H11335443 A JPH11335443 A JP H11335443A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- epoxy
- epoxy resin
- silica powder
- curing agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は半導体チップなどの
エポキシ封止用樹脂組成物、特にフリップチップの封止
に使用されるアンダーフィル材と、それを用いた半導体
装置、半導体チップモジュール、および半導体チップパ
ッケージに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin composition for sealing an epoxy such as a semiconductor chip, particularly an underfill material used for sealing a flip chip, and a semiconductor device, a semiconductor chip module and a semiconductor using the same. Related to chip packages.
【０００２】[0002]
【従来の技術】従来の電子部品の実装方式であるチップ
オンボードは、ピングリッドアレイ、ボールグリッドア
レイなどを含むものであって、チップを基板に接着し、
チップと基板をワイヤボンドで導通させ、チップの上を
樹脂で封止するものである。2. Description of the Related Art A chip-on-board, which is a conventional mounting method of electronic components, includes a pin grid array, a ball grid array, and the like.
The chip and the substrate are electrically connected by wire bonding, and the chip is sealed with resin.
【０００３】従来のチップオンボード用樹脂には、基板
と樹脂の熱膨張係数の差から生ずる応力ひずみを少なく
するために、シリカ粉末で代表される無機質充填剤が配
合されているが、封止する場所がチップ上であるため、
シリカの粒径について特に規定しなくても問題がなかっ
た。[0003] Conventional resin for chip-on-board contains an inorganic filler typified by silica powder in order to reduce stress strain caused by a difference in thermal expansion coefficient between the substrate and the resin. Because the place to do is on the chip,
There was no problem even if the particle size of silica was not specified.
【０００４】これに対して、フリップチップはチップと
基板とをバンプで導通させ、チップと基板の間を樹脂で
封止する実装方式である。On the other hand, a flip chip is a mounting method in which a chip and a substrate are electrically connected by bumps, and a space between the chip and the substrate is sealed with a resin.
【０００５】フリップチップを封止する場合には、チッ
プと基板の間がおよそ１００μｍと狭いため、粒径５０
μｍ以上のシリカを使用した従来のチップオンボード用
樹脂は、フリップチップと基板の間への樹脂の充填性が
悪いため、使用できない。また硬化剤に酸無水物を使用
するには耐湿性に関して問題があった。When a flip chip is sealed, the gap between the chip and the substrate is as small as about 100 μm.
A conventional chip-on-board resin using silica having a size of not less than μm cannot be used because of poor filling of the resin between the flip chip and the substrate. In addition, the use of an acid anhydride as a curing agent has a problem with respect to moisture resistance.
【０００６】[0006]
【発明が解決しようとする課題】本発明は、上記の事情
に鑑みてなされたもので、フリップチップのチップと基
板の間への充填性、即ちアンダーフィル性を向上させ、
しかも作業性を損なうことなく耐湿性を一段と向上させ
た一液性エポキシ封止用樹脂組成物と、それを用いた半
導体装置、半導体チップモジュール、および半導体チッ
プパッケージを提供するものである。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has an object to improve a filling property between a chip and a substrate of a flip chip, that is, to improve an underfill property.
Moreover, the present invention provides a one-component epoxy sealing resin composition having further improved moisture resistance without impairing workability, and a semiconductor device, a semiconductor chip module, and a semiconductor chip package using the same.
【０００７】[0007]
【課題を解決するための手段】本発明の一液性エポキシ
封止用樹脂組成物は、グリシジルエーテル型エポキシ樹
脂、硬化剤、および平均粒径１〜５μｍ且つ最大粒径２
０μｍ以下の球状シリカ粉末を含有することを特徴とす
るものである。According to the present invention, there is provided a one-part epoxy resin encapsulating resin composition comprising a glycidyl ether type epoxy resin, a curing agent, an average particle diameter of 1 to 5 μm and a maximum particle diameter of 2 μm.
It is characterized by containing spherical silica powder of 0 μm or less.
【０００８】本発明において、充填材として平均粒径１
〜５μｍ且つ最大粒径２０μｍ以下の球状シリカ粉末を
用いることによって、フリップチップのチップと基板の
間への充填性、即ちアンダーフィル性を向上させること
ができる。In the present invention, the filler has an average particle size of 1
By using a spherical silica powder having a particle size of 5 μm or less and a maximum particle diameter of 20 μm or less, the filling property between the chip and the substrate of the flip chip, that is, the underfill property can be improved.
【０００９】また本発明の一液性エポキシ封止用樹脂組
成物は、グリシジルエーテル型エポキシ樹脂、イミダゾ
ール系カプセル型硬化剤、および球状シリカ粉末を含有
することを特徴とするものである。Further, the one-pack type epoxy resin encapsulating resin composition of the present invention is characterized by containing a glycidyl ether type epoxy resin, an imidazole type capsule type curing agent, and a spherical silica powder.
【００１０】本発明において、硬化剤としてイミダゾー
ル系カプセル型硬化剤を用いることによって、封止工程
における作業性を損なうことなく封止された製品の耐湿
性を向上させることができる。In the present invention, by using an imidazole-based capsule-type curing agent as the curing agent, the moisture resistance of the sealed product can be improved without impairing the workability in the sealing step.
【００１１】また本発明の一液性エポキシ封止用樹脂組
成物は、グリシジルエーテル型エポキシ樹脂、グリジシ
ルアミン型エポキシ樹脂、イミダゾール系カプセル型硬
化剤、および平均粒径１〜５μｍ且つ最大粒径２０μｍ
以下の球状シリカ粉末を含有することを特徴とするもの
である。The one-pack type epoxy resin encapsulating resin composition of the present invention comprises a glycidyl ether type epoxy resin, a glycidylamine type epoxy resin, an imidazole type capsule type curing agent, an average particle size of 1 to 5 μm and a maximum particle size of 20 μm.
It is characterized by containing the following spherical silica powder.
【００１２】本発明において、グリジシルアミン型エポ
キシ樹脂を用いることにより、硬化前の樹脂組成物の低
粘性により、アンダーフィル性を向上させるとともに、
樹脂の硬化性を高めて封止された製品の耐湿性を向上さ
せることができる。In the present invention, the use of a glycidylamine type epoxy resin improves the underfill property due to the low viscosity of the resin composition before curing.
It is possible to enhance the curability of the resin and improve the moisture resistance of the sealed product.
【００１３】また本発明のエポキシ封止用樹脂組成物
は、ビスフェノールＦジグリシジルエーテル型エポキシ
樹脂、ｐ−アミノフェノール型エポキシ樹脂、イミダゾ
ール系カプセル型硬化剤、および平均粒径１〜５μｍ且
つ最大粒径２０μｍ以下の球状シリカ粉末を含有するこ
とを特徴とするものである。The epoxy sealing resin composition of the present invention comprises a bisphenol F diglycidyl ether type epoxy resin, a p-aminophenol type epoxy resin, an imidazole type capsule type curing agent, an average particle size of 1 to 5 μm and a maximum particle size. It is characterized by containing spherical silica powder having a diameter of 20 μm or less.
【００１４】本発明において、ビスフェノールＦジグリ
シジルエーテル型エポキシ樹脂、ｐ−アミノフェノール
型エポキシ樹脂、イミダゾール系カプセル型硬化剤硬化
前の樹脂組成物の粘性を低めてアンダーフィル性を向上
させるとともに、封止工程における作業性を損なうこと
なく、しかも封止された製品の硬化性を高め、耐湿性を
含めた信頼性を向上させることができる。In the present invention, the viscosity of the resin composition before curing the bisphenol F diglycidyl ether type epoxy resin, the p-aminophenol type epoxy resin, and the imidazole type capsule type curing agent is reduced to improve the underfill property, and It is possible to enhance the curability of the sealed product without impairing the workability in the stopping step and improve the reliability including the moisture resistance.
【００１５】また本発明のエポキシ封止用樹脂組成物
は、球状シリカ粉末が溶融シリカ粉末であることを特徴
とするものである。The resin composition for epoxy encapsulation of the present invention is characterized in that the spherical silica powder is a fused silica powder.
【００１６】本発明により、球状シリカ粉末として溶融
シリカ粉末を用いることによって、組成物の硬化前の粘
性を低めて充填性を向上するとともに、硬化後の熱膨張
率を低くして熱応力を低減することができる。According to the present invention, by using a fused silica powder as the spherical silica powder, the viscosity of the composition before curing is reduced and the filling property is improved, and the thermal expansion coefficient after curing is reduced to reduce the thermal stress. can do.
【００１７】また本発明のエポキシ封止用樹脂組成物
は、前記エポキシ封止用樹脂組成物が球状シリカ以外の
無機充填材、カップリング材、消泡材、顔料および染料
の各添加剤のうち少なくとも１種を含有することを特徴
とするものである。The resin composition for epoxy encapsulation of the present invention is characterized in that the resin composition for epoxy encapsulation is selected from the group consisting of inorganic fillers other than spherical silica, coupling agents, defoamers, pigments and dyes. It is characterized by containing at least one kind.
【００１８】本発明により、添加剤を選択して添加する
ことによって、硬化前および硬化後の物性を適宜制御す
ることができる。According to the present invention, physical properties before and after curing can be appropriately controlled by selecting and adding additives.
【００１９】また本発明の半導体装置は、上記いずれか
のエポキシ封止用樹脂組成物をフリップチップのアンダ
ーフィル材として用いてなることを特徴とするものであ
る。また本発明の半導体チップパッケージは、上記いず
れかのエポキシ封止用樹脂組成物をフリップチップのア
ンダーフィル材として用いてなることを特徴とするもの
である。そして本発明の半導体チップモジュールは、上
記いずれかのエポキシ封止用樹脂組成物をフリップチッ
プのアンダーフィル材として用いてなることを特徴とす
るものである。A semiconductor device according to the present invention is characterized in that any one of the above-mentioned epoxy sealing resin compositions is used as an underfill material for a flip chip. The semiconductor chip package of the present invention is characterized by using any one of the above-mentioned epoxy sealing resin compositions as an underfill material of a flip chip. The semiconductor chip module according to the present invention is characterized in that any one of the above-described epoxy sealing resin compositions is used as an underfill material of a flip chip.
【００２０】本発明により、半導体装置、半導体チップ
パッケージや半導体チップモジュールにおいて、半導体
チップと基板の間への樹脂の充填性が向上して良好に封
止されるので、耐湿性を向上させることができ、信頼性
の向上が得られる。According to the present invention, in a semiconductor device, a semiconductor chip package or a semiconductor chip module, the resin filling property between the semiconductor chip and the substrate is improved and the resin is sealed well, so that the moisture resistance can be improved. And improved reliability can be obtained.
【００２１】本発明に使用する平均粒径１〜５μｍ且つ
最大粒径２０μｍ以下の球状シリカ粉末はとくに制限さ
れないが、平均粒径と最大粒径がこれら条件を満たすシ
リカ粉末が好適に使用でき、２種以上を任意の量混合し
て用いることもできる。例えば溶融シリカが好適に使用
できる。The spherical silica powder having an average particle diameter of 1 to 5 μm and a maximum particle diameter of 20 μm or less used in the present invention is not particularly limited, but a silica powder having an average particle diameter and a maximum particle diameter satisfying these conditions can be preferably used. Two or more kinds may be used in an arbitrary mixture. For example, fused silica can be suitably used.
【００２２】本発明に用いる平均粒径１〜５μｍ、最大
粒径２０μｍ以下の球状シリカ粉末は、溶融シリカの具
体的銘柄として、例えばＭＫ−０４（日本化学工業社
製、商品名）、ＳＥ−５（トクヤマ社製、商品名）、Ｓ
Ｐ−３Ｂ（扶桑シルテックス社製、商品名）、Ａ．Ｆ
ＳＯ−２５Ｒ（龍森社製、商品名）などが挙げられる。
本発明に用いるイミダゾール系カプセル型硬化剤は、特
に制限されずいずれも使用でき、単独または２種以上を
混合して使用することができる。The spherical silica powder having an average particle diameter of 1 to 5 μm and a maximum particle diameter of 20 μm or less used in the present invention is a specific brand of fused silica, for example, MK-04 (trade name, manufactured by Nippon Chemical Industry Co., Ltd.), SE- 5 (Tokuyama, product name), S
P-3B (made by Fuso Siltex Co., Ltd., trade name); F
SO-25R (trade name, manufactured by Tatsumori Corporation) and the like.
The imidazole-based capsule-type curing agent used in the present invention is not particularly limited, and any of them can be used, and they can be used alone or in combination of two or more.
【００２３】本発明に用いるグリシジルエーテル型エポ
キシ樹脂としては、特に制限されないが、低粘度かつ硬
化性が良好であることが望ましく、例えばエポキシビス
フェノールＦジグリシジルエーテル型エポキシ樹脂が好
ましく用いられる。The glycidyl ether type epoxy resin used in the present invention is not particularly limited, but preferably has low viscosity and good curability. For example, epoxy bisphenol F diglycidyl ether type epoxy resin is preferably used.
【００２４】本発明に用いるエポキシビスフェノールＦ
ジグリシジルエーテル型エポキシ樹脂としては、１分子
中に２個以上のエポキシ基を有し、硬化可能であればよ
く、液状、固形など特に制限なく使用することができ
る。具体的銘柄として、例えばＲＥ３０３Ｓ（日本化薬
社製、商品名）が挙げられる。Epoxy bisphenol F used in the present invention
As the diglycidyl ether type epoxy resin, any one may be used as long as it has two or more epoxy groups in one molecule and is curable. As a specific brand, for example, RE303S (trade name, manufactured by Nippon Kayaku Co., Ltd.) can be mentioned.
【００２５】また、本発明に用いるｐ−アミノフェノー
ル型エポキシ樹脂も同様であって、液状、固形など特に
制限なく使用することができる。具体的銘柄として、例
えばエピコート６３０（油化シェルエポキシ社製、商品
名）が挙げられる。The same applies to the p-aminophenol type epoxy resin used in the present invention, and it can be used without any particular limitation such as liquid or solid. A specific brand is, for example, Epicoat 630 (trade name, manufactured by Yuka Shell Epoxy Co., Ltd.).
【００２６】そしてこれらのエポキシ樹脂に、必要に応
じて例えば液状のモノエポキシ樹脂などを併用すること
ができる。If necessary, for example, a liquid monoepoxy resin can be used in combination with these epoxy resins.
【００２７】本発明のエポキシ封止用樹脂組成物には、
本発明の目的に反しない範囲において、その他無機充填
剤、カップリング剤、消泡剤、顔料、その他の成分を添
加配合することができる。そして無機充填剤としては、
例えばタルク、炭酸カルシウム、水酸化アルミニウムな
どを単独または２種以上混合して使用することができ
る。The epoxy sealing resin composition of the present invention includes:
Other inorganic fillers, coupling agents, defoamers, pigments, and other components can be added and compounded within a range not inconsistent with the object of the present invention. And as the inorganic filler,
For example, talc, calcium carbonate, aluminum hydroxide and the like can be used alone or in combination of two or more.
【００２８】本発明の一液性エポキシ封止用樹脂組成物
は、上記各エポキシ樹脂、イミダゾール系カプセル型硬
化剤および球状シリカ粉末を含む各成分を、常法により
混合し、撹拌することによって容易に製造することがで
きる。The one-pack type epoxy resin encapsulating composition of the present invention can be easily prepared by mixing the above-mentioned epoxy resin, imidazole-based capsule-type curing agent, and spherical silica powder in a conventional manner, followed by stirring. Can be manufactured.
【００２９】[0029]
【発明の実施の形態】次に、本発明の実施の形態を実施
例に基づいて具体的に説明する。なお、以下の組成比に
おいて、「部」とあるのはいずれも「重量部」を意味し
ている。Next, embodiments of the present invention will be specifically described based on examples. In the following composition ratios, “parts” means “parts by weight”.
【００３０】（実施例１）次の組成により、一液性エポ
キシ封止用樹脂組成物を製造した。Example 1 A one-part resin composition for epoxy encapsulation was prepared according to the following composition.
【００３１】 ビスフェノールＦ型エポキシ樹脂 ＲＥ３０３Ｓ（日本化薬社製、商品名） ７０部 ｐ−アミノフェノール型エポキシ樹脂 エピコート６３０（油化シェルエポキシ社製、商品名） ３０部 溶融シリカ 平均粒径３μｍ ＳＰ−３Ｂ（フソウシルテックス社製、商品名） ２２０部 Ａ．Ｆ ＳＯ−２５Ｒ（龍森社製、商品名） ９０部 イミダゾール系カプセル型硬化剤 ＨＸ−３９２１ＨＰ（旭化成工業社製、商品名） ５０部 添加剤 カップリング剤Ａ−１８７（日本ユニカー社製、商品名） ３．０部 （実施例２）次の組成により、一液性エポキシ封止用樹
脂組成物を製造した。Bisphenol F type epoxy resin RE303S (manufactured by Nippon Kayaku Co., Ltd., trade name) 70 parts p-aminophenol type epoxy resin Epicoat 630 (manufactured by Yuka Shell Epoxy Co., Ltd.) 30 parts fused silica Average particle diameter 3 μm SP -3B (manufactured by FUSO SILTECHS, trade name) 220 parts A. F SO-25R (trade name, manufactured by Tatsumori) 90 parts Imidazole-based capsule-type curing agent HX-3921HP (trade name, manufactured by Asahi Kasei Corporation) 50 parts Additive Coupling agent A-187 (trade name, manufactured by Nippon Unicar, product) (Name) 3.0 parts (Example 2) A one-part resin composition for epoxy sealing was produced with the following composition.
【００３２】 ビスフェノールＦ型エポキシ樹脂 ＲＥ３０３Ｓ（日本化薬社製、商品名） ８０部 ｐ−アミノフェノール型エポキシ樹脂 エピコート６３０（油化シェルエポキシ社製、商品名） ２０部 溶融シリカ 平均粒径４μｍ ＳＰ−４Ｂ（フソウシルテックス社製、商品名） ２１０部 Ａ．Ｆ ＳＯ−２５Ｒ（龍森社製、商品名） １００部 イミダゾール系カプセル型硬化剤 ＨＸ−３９２１ＨＰ（旭化成工業社製、商品名） ４０部 添加剤 カップリング剤Ａ−１８７（日本ユニカー社製、商品名） ３．０部 （比較例１）次の組成を配合し、この配合組成に、硬化
促進剤ノバキュアＨＸ−３１４１（旭化成社製、商品
名）６部を加え、均一に混合し、減圧脱泡処理して一液
性エポキシ封止用樹脂組成物を製造した。Bisphenol F type epoxy resin RE303S (trade name, manufactured by Nippon Kayaku Co., Ltd.) 80 parts p-aminophenol type epoxy resin Epicoat 630 (trade name, manufactured by Yuka Shell Epoxy Co., Ltd.) 20 parts Fused silica Average particle size 4 μm SP -4B (manufactured by FUSO SILTECHS, trade name) 210 parts A. F SO-25R (trade name, manufactured by Tatsumori Co., Ltd.) 100 parts Imidazole-based capsule-type curing agent HX-3921HP (trade name, manufactured by Asahi Kasei Corporation) 40 parts Additive Coupling agent A-187 (trade name, manufactured by Nippon Unicar, product) Name) 3.0 parts (Comparative Example 1) The following composition was blended, and 6 parts of a curing accelerator Novacure HX-3141 (trade name, manufactured by Asahi Kasei Corporation) was added to this blended composition, mixed uniformly, and decompressed under reduced pressure. Foaming was performed to produce a one-part epoxy resin composition for encapsulation.
【００３３】 ビスフェノールＦタイプ型エポキシ樹脂 エピコートＲＥ３０３Ｓ（油化シェルエポキシ社製、商品名） ８０部 ノボラック型エポキシ樹脂 ＥＰＰＮ５０１ＨＹ（大日本インキ社製、商品名） ２０部 シリカ粉末 ＦＢ−６Ｓ（電気化学工業社製、商品名） （平均粒径１０μｍ、最大粒子径１３０μｍ） ２８５部 硬化剤（メチルテトラヒドロ無機フタル酸） ＱＨ２００（日本ゼオン社製、商品名） ９０部 （比較例２）次の組成を配合し、この配合組成に、硬化
促進剤ノバキュアＨＸ−３１４１（旭化成社製、商品
名）６部を加え、均一に混合し、減圧脱泡処理して一液
性エポキシ封止用樹脂組成物を製造した。Bisphenol F type epoxy resin Epicoat RE303S (trade name, manufactured by Yuka Shell Epoxy Co., Ltd.) 80 parts Novolak type epoxy resin EPPN501HY (trade name, manufactured by Dainippon Ink Co., Ltd.) 20 parts Silica powder FB-6S (Denki Kagaku Kogyo Co., Ltd.) (Average particle size: 10 μm, maximum particle size: 130 μm) 285 parts Curing agent (methyltetrahydro inorganic phthalic acid) QH200 (manufactured by Nippon Zeon Co., Ltd.) 90 parts (Comparative Example 2) The following composition was added. Then, 6 parts of a curing accelerator Novacure HX-3141 (trade name, manufactured by Asahi Kasei Corporation) is added to this composition, mixed uniformly, and subjected to defoaming under reduced pressure to produce a one-part epoxy sealing resin composition. did.
【００３４】 ビスフェノールＦ型エポキシ樹脂 エピコートＲＥ３０３Ｓ（油化シェルエポキシ社製、商品名） ７０部 ノボラック型エポキシ樹脂 ＥＰＰＮ５０１ＨＹ（大日本インキ社製、商品名） ８０部 シリカ粉末 ＦＢ−６Ｓ（電気化学工業社製、商品名） （平均粒径１０μｍ、最大粒子径１３０μｍ） ２８５部 硬化剤（メチルテトラヒドロ無水フタル酸） ＱＨ２００（日本ゼオン社製、商品名） ９０部 実施例１〜２および比較例１〜２によって製造した一液
性エポキシ封止用樹脂組成物について、液状特性および
硬化物特性を調べた。結果を表１に示す。Bisphenol F type epoxy resin Epicoat RE303S (product name, manufactured by Yuka Shell Epoxy Co., Ltd.) 70 parts Novolak type epoxy resin EPPN501HY (product name, manufactured by Dainippon Ink Co., Ltd.) 80 parts Silica powder FB-6S (Denki Kagaku Kogyo Co., Ltd.) (Average particle size: 10 μm, maximum particle size: 130 μm) 285 parts Curing agent (methyltetrahydrophthalic anhydride) QH200 (manufactured by Zeon Corporation, trade name) 90 parts Examples 1-2 and Comparative Examples 1-2 The liquid properties and the cured properties of the one-component epoxy sealing resin composition manufactured by the above method were examined. Table 1 shows the results.
【００３５】[0035]
【表１】 表１によって明らかなように、本発明の実施例１および
２の一液性エポキシ封止用樹脂組成物は、空隙への浸透
が早く、チップと基板の間への充填性が良好であるこ
と、粘度は適正値であって作業性を損なうことがないこ
と、またガラス転移点、線膨脹係数、弾性率および体積
抵抗率の各物性値は適正であること、そして耐湿性が良
好であることが確認された。[Table 1] As is evident from Table 1, the one-pack type epoxy resin compositions for Examples 1 and 2 of the present invention have a rapid penetration into voids and a good filling property between the chip and the substrate. The viscosity is an appropriate value and does not impair workability.The physical properties such as glass transition point, linear expansion coefficient, elastic modulus and volume resistivity are appropriate, and moisture resistance is good. Was confirmed.
【００３６】[0036]
【発明の効果】以上によって明かなように、本発明の封
止用樹脂組成物を使用すれば、半導体などのチップと基
板との間への充填性すなわちアンダーフィル性が良好で
あり、しかも耐湿性が良好であって、さらには封止の作
業性の向上が得られる。As is apparent from the above, the use of the encapsulating resin composition of the present invention makes it possible to obtain a good filling property between a chip such as a semiconductor and a substrate, that is, an underfill property, and also to provide a moisture-resistant material. The sealing property is good, and the workability of the sealing is further improved.
【００３７】そして本発明の封止用樹脂組成物を半導体
装置、半導体チップモジュールや半導体チップパッケー
ジに使用することにより、耐湿性が向上してより高い信
頼性が得られる。By using the sealing resin composition of the present invention in a semiconductor device, a semiconductor chip module or a semiconductor chip package, the moisture resistance is improved and higher reliability is obtained.
【００３８】[0038]
Claims (9)
化剤、および平均粒径１〜５μｍ且つ最大粒径２０μｍ
以下の球状シリカ粉末を含有することを特徴とするエポ
キシ封止用樹脂組成物。1. A glycidyl ether type epoxy resin, a curing agent, and an average particle diameter of 1 to 5 μm and a maximum particle diameter of 20 μm.
A resin composition for epoxy encapsulation, comprising the following spherical silica powder.
ミダゾール系カプセル型硬化剤、および球状シリカ粉末
を含有することを特徴とするエポキシ封止用樹脂組成
物。2. An epoxy encapsulating resin composition comprising a glycidyl ether type epoxy resin, an imidazole capsule type curing agent, and a spherical silica powder.
リジシルアミン型エポキシ樹脂、イミダゾール系カプセ
ル型硬化剤、および平均粒径１〜５μｍ且つ最大粒径２
０μｍ以下の球状シリカ粉末を含有することを特徴とす
るエポキシ封止用樹脂組成物。3. A glycidyl ether type epoxy resin, a glycidylamine type epoxy resin, an imidazole type capsule type curing agent, an average particle size of 1 to 5 μm and a maximum particle size of 2.
A resin composition for epoxy sealing, comprising a spherical silica powder of 0 μm or less.
型エポキシ樹脂、ｐ−アミノフェノール型エポキシ樹
脂、イミダゾール系カプセル型硬化剤、および平均粒径
１〜５μｍ且つ最大粒径２０μｍ以下の球状シリカ粉末
を含有することを特徴とする一液性エポキシ封止用樹脂
組成物。4. It contains bisphenol F diglycidyl ether type epoxy resin, p-aminophenol type epoxy resin, imidazole type capsule type curing agent, and spherical silica powder having an average particle size of 1 to 5 μm and a maximum particle size of 20 μm or less. A one-part epoxy resin composition for sealing epoxy.
あることを特徴とする請求項１ないし請求項４のいずれ
か１項記載のエポキシ封止用樹脂組成物。5. The epoxy sealing resin composition according to claim 1, wherein said spherical silica powder is a fused silica powder.
リカ以外の無機充填材、カップリング材、消泡材、顔料
および染料の各添加剤のうち少なくとも１種を含有する
ことを特徴とする請求項１ないし請求項５のいずれか１
項記載のエポキシ封止用樹脂組成物。6. The epoxy sealing resin composition contains at least one of inorganic fillers other than spherical silica, coupling agents, defoamers, and additives of pigments and dyes. Any one of claims 1 to 5
Item 10. The resin composition for epoxy encapsulation according to Item 1.
記載のエポキシ封止用樹脂組成物をフリップチップのア
ンダーフィル材として用いてなることを特徴とする半導
体装置。7. A semiconductor device comprising the epoxy sealing resin composition according to claim 1 as an underfill material for a flip chip.
記載のエポキシ封止用樹脂組成物をフリップチップのア
ンダーフィル材として用いてなることを特徴とする半導
体チップモジュール。8. A semiconductor chip module using the epoxy sealing resin composition according to claim 1 as an underfill material of a flip chip.
記載のエポキシ封止用樹脂組成物をフリップチップのア
ンダーフィル材として用いてなることを特徴とする半導
体チップパッケージ。9. A semiconductor chip package comprising the epoxy encapsulating resin composition according to claim 1 as an underfill material for a flip chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14171998A JP3819148B2 (en) | 1998-05-22 | 1998-05-22 | Epoxy sealing resin composition, semiconductor device using the same, semiconductor chip module, and semiconductor chip package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14171998A JP3819148B2 (en) | 1998-05-22 | 1998-05-22 | Epoxy sealing resin composition, semiconductor device using the same, semiconductor chip module, and semiconductor chip package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11335443A true JPH11335443A (en) | 1999-12-07 |
| JP3819148B2 JP3819148B2 (en) | 2006-09-06 |
Family
ID=15298618
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14171998A Expired - Fee Related JP3819148B2 (en) | 1998-05-22 | 1998-05-22 | Epoxy sealing resin composition, semiconductor device using the same, semiconductor chip module, and semiconductor chip package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3819148B2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002226676A (en) * | 2001-02-07 | 2002-08-14 | Mitsui Chemicals Inc | Epoxy resin composition and accurately formed article |
| JP2005350552A (en) * | 2004-06-10 | 2005-12-22 | Nippon Kayaku Co Ltd | Liquid epoxy resin, epoxy resin composition and cured product thereof |
| JP2007291407A (en) * | 2007-06-25 | 2007-11-08 | Shin Etsu Chem Co Ltd | Liquid epoxy resin composition and flip chip type semiconductor device |
| EP2258757A1 (en) * | 2009-06-01 | 2010-12-08 | Shin-Etsu Chemical Co., Ltd. | Dam composition for use with multilayer semiconductor package underfill material, and fabrication of multilayer semiconductor package using the same |
| JP2011054726A (en) * | 2009-09-01 | 2011-03-17 | Kyocera Chemical Corp | Electric double-layer capacitor |
| JP2014148586A (en) * | 2013-01-31 | 2014-08-21 | Sumitomo Bakelite Co Ltd | Epoxy resin composition for sealing, electronic device, automobile, and method for manufacturing electronic device |
| WO2024055959A1 (en) * | 2022-09-15 | 2024-03-21 | 华为技术有限公司 | Resin composition and use thereof |
-
1998
- 1998-05-22 JP JP14171998A patent/JP3819148B2/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002226676A (en) * | 2001-02-07 | 2002-08-14 | Mitsui Chemicals Inc | Epoxy resin composition and accurately formed article |
| JP2005350552A (en) * | 2004-06-10 | 2005-12-22 | Nippon Kayaku Co Ltd | Liquid epoxy resin, epoxy resin composition and cured product thereof |
| JP2007291407A (en) * | 2007-06-25 | 2007-11-08 | Shin Etsu Chem Co Ltd | Liquid epoxy resin composition and flip chip type semiconductor device |
| JP4697476B2 (en) * | 2007-06-25 | 2011-06-08 | 信越化学工業株式会社 | Liquid epoxy resin composition and flip chip type semiconductor device |
| EP2258757A1 (en) * | 2009-06-01 | 2010-12-08 | Shin-Etsu Chemical Co., Ltd. | Dam composition for use with multilayer semiconductor package underfill material, and fabrication of multilayer semiconductor package using the same |
| US8828806B2 (en) | 2009-06-01 | 2014-09-09 | Shin-Etsu Chemical Co., Ltd. | Dam composition for use with multilayer semiconductor package underfill material, and fabrication of multilayer semiconductor package using the same |
| JP2011054726A (en) * | 2009-09-01 | 2011-03-17 | Kyocera Chemical Corp | Electric double-layer capacitor |
| JP2014148586A (en) * | 2013-01-31 | 2014-08-21 | Sumitomo Bakelite Co Ltd | Epoxy resin composition for sealing, electronic device, automobile, and method for manufacturing electronic device |
| WO2024055959A1 (en) * | 2022-09-15 | 2024-03-21 | 华为技术有限公司 | Resin composition and use thereof |
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|---|---|
| JP3819148B2 (en) | 2006-09-06 |
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