JPH098178A - Epoxy resin composition for sealing and semiconductor device using it - Google Patents

Abstract

PURPOSE: To obtain an epoxy resin composition by which a moistureproof property and an absorbent solder crack-resistant property are enhanced by a method wherein a specific biphenyl-type epoxy resin and a dicyclopentadiene-based epoxy resin are contained as epoxy resins and chlorinated copper phthalocyanine green and carbon black in respectively specific amounts are contained as pigments. CONSTITUTION: A biphenyl-type epoxy resin expressed by Formula I and/or a dicyclopentadiene-based epoxy resin expressed by Formula II are contained as epoxy resins. Since the biphenyl-type epoxy resin comprises a rigid framework, a sealed product which is obtained has a low modulus of elasticity, its strength is high at a high temperature, and its close contact property is excellent. In addition, the absorbency of a hardened substance is small because the dicyclopentadiene-based epoxy resin is contained. In addition, 0.05 to 1wt.% of chlorinated copper phthalocyanine green with reference to the total amount of a resin component and 0.01 to 0.2wt.% of carbon black with reference to the total amount are contained as pigments. As a result, it is possible to reduce a change of color after a posturing operation.

Description

Detailed Description of the Invention

[0001]

The present invention relates to electric parts, electronic parts,
The present invention relates to a sealing epoxy resin composition for sealing semiconductor elements and the like and a semiconductor device using the same.

[0002]

2. Description of the Related Art Conventionally, as a sealing method for electric / electronic parts such as diodes, transistors and integrated circuits, semiconductor devices, etc., for example, a resin sealing method using epoxy resin or silicon resin, glass, metal, ceramics, etc. The hermetic sealing method using has been adopted, but in recent years, in the sealing method using an epoxy resin, which has advantages in terms of mass production and cost as well as improved reliability, cresol novolac type resin is used as the resin component. In addition, a molding material composed of a composition containing a phenol novolac type resin as a curing agent component is most commonly used.

However, as the density of electronic parts such as ICs, LSIs, VLSIs and semiconductor devices and the density of semiconductor devices have been increased, the molding resin has been made thinner, and the epoxy resin compositions used so far are not always satisfactory. Can no longer respond to. For example, in the case of surface mount devices, the package itself is exposed to a high temperature and harsh environment such as being directly immersed in solder during mounting.
The occurrence of Ji crack is inevitable. That is, moisture absorbed during storage after molding abruptly vaporizes and expands when exposed to high temperatures, and the sealing resin cannot withstand this and cracks occur in the package of the semiconductor device. In addition, although some diodes and transistors use green color, the epoxy resin composition for sealing is generally black. Since green has a good image and is conspicuous, it is desirable to use it as an epoxy resin composition for encapsulation. However, when a normal green pigment is used, there is a problem that the moisture resistance is poor and the color changes after post-cure.

[0004]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to provide excellent moisture resistance, moisture absorption solder crack resistance and adhesion, and to prevent discoloration after post cure. An object of the present invention is to provide a reduced green epoxy resin composition for sealing and a semiconductor device using the same.

[0005]

The epoxy resin composition for encapsulation according to claim 1 of the present invention is an epoxy resin having two or more epoxy groups in one molecule, and 2 in one molecule as a curing agent. In a sealing epoxy resin composition obtained by adding a phenol resin having at least one phenolic hydroxyl group, an inorganic filler, a curing accelerator and a pigment, the epoxy resin is a biphenyl type epoxy represented by the following general formula. Resin and / or dicyclopentadiene-based epoxy resin represented by the following general formula, and chlorinated copper phthalocyanine green is used as the pigment in an amount of 0.05 to 1 with respect to the total amount of the epoxy resin composition for sealing. % By weight and carbon black in an amount of 0.01 to 0.2% by weight based on the total amount of the epoxy resin composition for sealing.

[0006]

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[0007]

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The epoxy resin composition for encapsulation according to claim 2 of the present invention is characterized in that it contains a phenol resin represented by the following general formula as the phenol resin.

[0009]

[Chemical 6]

A semiconductor device according to claim 3 of the present invention is characterized by being sealed with a cured product of the epoxy resin composition for sealing according to claim 1 or 2.

The present invention will be described in detail below. The epoxy resin used in the present invention is an epoxy resin having at least two epoxy groups in one molecule. As the epoxy resin, a biphenyl type epoxy resin represented by the above general formula and / or a epoxy resin represented by the above general formula is used. It is essential to contain the represented dicyclopentadiene epoxy resin. That is, since the biphenyl type epoxy resin has a rigid biphenyl skeleton, the resulting sealed product has a low elastic modulus, high heat strength, and excellent adhesion.
By using the dicyclopentadiene-based epoxy resin, the hygroscopicity of the cured product becomes small. That is, by using the epoxy resin, it is possible to lower the moisture absorption rate, improve the adhesion with the lead frame, and obtain a cured epoxy resin composition having excellent moisture resistance and solder crack resistance. become.

As the curing agent used in the present invention, any curing agent can be used as long as it has at least two phenolic hydroxyl groups in one molecule. For example, phenol novolac resin, cresol novolac resin and There are polyfunctional phenolic resins and the like.

In the present invention, fused silica, crystalline silica, alumina, silicon nitride, etc. can be used as the inorganic filler, and diazabicycloundecene, triphenylphosphine, tetraphenylphosphonium, tetraphenyl as the curing accelerator. Borates, imidazoles and tertiary amines can be used. Further, if necessary, a coupling agent such as epoxysilane, a brominated epoxy resin and a flame retardant such as antimony trioxide, a silicone flexible agent, carnauba wax, and a release agent such as stearic acid can be used.

In the encapsulating epoxy resin composition according to the present invention, it is essential that chlorinated copper phthalocyanine green is contained as a pigment in an amount of 0.05 to 1% by weight based on the total amount of the encapsulating epoxy resin composition. . That is, when the content of chlorinated copper phthalocyanine green is less than 0.05% by weight with respect to the total amount of the encapsulating epoxy resin composition, the green color becomes too thin, and the green color cannot be recognized. If it exceeds 1% by weight, the moisture resistance decreases. Carbon black together with chlorinated copper phthalocyanine green is 0.01% with respect to the total amount of the epoxy resin composition for sealing.
.About.0.2 wt% must be contained. That is, when the content of carbon black is less than 0.01% by weight based on the total amount of the epoxy resin composition for encapsulation, discoloration occurs after post-curing, and when it exceeds 0.2% by weight, green color is generated. Can't be recognized and turns black.

The epoxy resin composition for encapsulation according to the present invention preferably contains a phenol resin represented by the above general formula as a phenol resin which is a curing agent. That is, by using the phenolic resin represented by the above general formula, the hygroscopicity of the cured product becomes small,
It is possible to obtain an epoxy resin composition for encapsulation, which has improved adhesion and excellent moisture resistance and solder crack resistance.

In this way, a curing agent, an inorganic filler, a curing accelerator and a pigment are added to the epoxy resin, and the mixture is mixed, kneaded, pulverized, and further granulated if necessary to obtain an epoxy resin for sealing. Obtain the composition. Further, a semiconductor device is obtained by sealing a semiconductor element by transfer molding or the like using the sealing epoxy resin composition.

As described above, according to the present invention, the moisture resistance,
A green epoxy resin composition for encapsulation, which has excellent resistance to moisture absorption solder cracks and adhesion and reduces discoloration after post-cure, and a semiconductor device using the same.

[0018]

The epoxy resin composition for encapsulation according to claim 1 of the present invention is, as an epoxy resin, a biphenyl type epoxy resin represented by the above general formula and / or a dicyclopentadiene represented by the above general formula. Since the biphenyl type epoxy resin has a rigid biphenyl skeleton because it contains a system epoxy resin, by using the biphenyl type epoxy resin, the resulting encapsulation product has a low elastic modulus and high heat strength, The adhesiveness becomes excellent, and the hygroscopicity of the cured product becomes small by using the dicyclopentadiene epoxy resin. As the pigment, chlorinated copper phthalocyanine green is used in an amount of 0.05 to 1% by weight based on the total amount of the encapsulating epoxy resin composition, and carbon black is included in the amount of 0.01 to the total amount of the encapsulating epoxy resin composition.
Since it is contained in an amount of 0.2% by weight, a green encapsulating epoxy resin composition with reduced discoloration after post-cure can be obtained.

The epoxy resin composition for encapsulation according to claim 2 of the present invention contains, as the phenol resin, the phenol resin represented by the above general formula. And has excellent moisture resistance and solder crack resistance.

Since the semiconductor device according to claim 3 of the present invention is encapsulated with the cured epoxy resin composition according to claim 1 or 2, it has excellent moisture resistance and is green. Discoloration after post cure can be reduced.

[0021]

EXAMPLES The present invention will be specifically described below with reference to examples.

(Examples 1 to 3 and Comparative Examples 1 to 4) The following raw materials were used in the formulations shown in Table 1. As an epoxy resin, an ortho-cresol novolac type epoxy resin having an epoxy equivalent of 195 [manufactured by Sumitomo Chemical Co., Ltd .; product number ESCN195 XL-3] (Epoxy resin A in Table 1)
,), A biphenyl type epoxy resin [manufactured by Yuka Shell Epoxy Co .; product number YX4000H] (described as epoxy resin B in Table 1) or a dicyclopentadiene-based epoxy resin [manufactured by Dainippon Ink and Chemicals, Inc. product number EXA7200].
H] was used. As a curing agent, phenol novolac resin [manufactured by Arakawa Chemical Co., Ltd .; trade name Tamanol 752] (described as curing agent D in Table 1) or a phenol resin represented by the above general formula having a softening point of 80 ° C. (cured in Table 1) (Registered as Agent E)
Was used. As the filler, fused silica that had been coupled with γ-glycidoxypropyltrimethoxysilane (coupling agent) was used. 2 phenylimidazole was used as a curing accelerator, brominated epoxy resin having an epoxy equivalent of 400 as a flame retardant and antimony trioxide, and carnauba wax as a release agent. Carbon black as a pigment, chlorinated copper phthalocyanine green [manufactured by Zeneca;
The product name Binamon Green] was used.

In each of the above-mentioned Examples and Comparative Examples, the blending components were used in the proportions shown in Table 1 and uniformly mixed and dispersed for 3 minutes by a mixer, and then the roll temperature was 100 to 12
The mixture was heated, melted and kneaded with a mixing roll at 0 ° C. This kneaded product was cooled and pulverized to obtain each sealing epoxy resin composition.

Each of the epoxy resin compositions obtained above was molded by a transfer molding machine at a mold temperature of 175 ° C. and a molding pressure of 5
60 QFP after molding the semiconductor element with 0 kg / cm ²
TEG (outer shape: 15 mm × 19 mm × t2.4 mm)
I got Further, under the same molding conditions, a disk for measuring moisture absorption having a diameter of 50 mm × t3 mm and a disk for measuring discoloration after post cure were obtained. Also, φ11.3 mm × t1 for adhesion measurement
A 0 mm pudding-type molded product was obtained.

Moisture absorption rate, adhesive strength, moisture absorption resistance solder crack,
As a result of measuring moisture resistance reliability and discoloration after post-curing, as shown in Table 1, it was confirmed that Examples 1 to 3 are superior to Comparative Examples 1 to 4.

[0026]

[Table 1]

The measured values shown in Table 1 were obtained by the following method. (1) Moisture absorption rate A disk having a diameter of 50 mm and a thickness of 3 mm manufactured according to JIS K 6911 was left in an atmosphere having a temperature of 85 ° C and a relative humidity of 85%, and the weight change after 72 hours was measured. (2) Moisture-absorption-resistant solder crack 60QFP TEG is left in an atmosphere at a temperature of 85 ° C. and a relative humidity of 85% for 72 hours to absorb moisture, and then soldered at 250 ° C. for 10
Immerse for 2 seconds, observe the presence of cracks with a stereoscopic microscope,
The number of packages in which cracks occurred in 10 0QFP was determined. (3) Moisture resistance reliability 60QFP TEG is left in an atmosphere at a temperature of 85 ° C. and a relative humidity of 85%, and after absorbing moisture for 72 hours, it is soldered at 250 ° C. for 10 hours.
Soak for 2 seconds, PCT (pressure cooker test) 1
After leaving in an atmosphere of 33 ° C. and relative humidity of 100%, the presence or absence of open circuit failure (circuit disconnection) of the aluminum circuit after 200 hours and 500 hours was observed, and the number of packages having open circuit failure was calculated out of 10 60QFP. . (4) Adhesiveness The pudding mold cavity is covered with a nickel plate, and the obtained epoxy resin composition for sealing is transfer-injected into a mold heated to 170 ° C. to be cured, and a molded product is formed by transfer molding. Then, the adhesion between the nickel plate and the molded product was measured with a push-pull gauge. (5) Discoloration after post-curing The color difference between before and after post-curing at 175 ° C. for 6 hours was measured by a color difference meter, and the case where the color difference ΔE was 2 or less was good, and the case where it was more than 2 was disapproved.

[0028]

According to the encapsulating epoxy resin composition of the first aspect of the present invention, since the biphenyl type epoxy resin has a rigid biphenyl skeleton, the encapsulating product obtained by using the biphenyl type epoxy resin. Has a low elastic modulus, a high strength at heat, and an excellent adhesive force. By using the dicyclopentadiene-based epoxy resin, the hygroscopicity of the cured product becomes small. Further, as the pigment, chlorinated copper phthalocyanine green is used in an amount of 0.05 to 1% by weight based on the total amount of the encapsulating epoxy resin composition, and carbon black is included in an amount of 0.01 to 0 based on the total amount of the encapsulating epoxy resin composition. Since it is contained in an amount of 0.2% by weight, a green encapsulating epoxy resin composition with reduced discoloration after post-cure can be obtained. That is, it is possible to obtain a green molded article which is excellent in moisture resistance, moisture absorption solder crack resistance, and adhesion, and has reduced discoloration after post-cure.

According to the encapsulating epoxy resin composition of the second aspect of the present invention, a molded article having a reduced hygroscopicity, an improved adhesive force, and excellent moisture resistance and solder crack resistance can be obtained.

According to the semiconductor device of claim 3 of the present invention, the semiconductor device is sealed with the cured product of the epoxy resin composition for sealing according to claim 1 or 2, so that it has excellent moisture resistance.
It is green and can reduce discoloration after post cure.

Front page continued (72) Inventor Hironori Ikeda 1048 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Works Ltd. (72) Inventor, Koji Ikeda 1048, Kadoma, Kadoma City, Osaka Matsushita Electric Works Ltd. (72) Invention Person Hiroshi Yamanaka 1048, Kadoma, Kadoma-shi, Osaka Prefecture Matsushita Electric Works Co., Ltd.

Claims (3)

[Claims] 1. An epoxy resin having two or more epoxy groups in one molecule, a phenol resin having two or more phenolic hydroxyl groups in one molecule, an inorganic filler, a curing accelerator and a pigment as a curing agent. The epoxy resin composition for encapsulation obtained by adding, as the epoxy resin, a biphenyl type epoxy resin represented by the following general formula and / or a dicyclopentadiene epoxy resin represented by the following general formula. And, as the pigment, chlorinated copper phthalocyanine green is 0.05 to 1% by weight based on the total amount of the encapsulating epoxy resin composition, and carbon black is 0.01 to about 1 to the total amount of the encapsulating epoxy resin composition. 0.
An epoxy resin composition for encapsulation, which contains 2% by weight. Embedded image Embedded image 2. The epoxy resin composition for encapsulation according to claim 1, wherein the phenol resin contains a phenol resin represented by the following general formula. Embedded image 3. A semiconductor device, which is encapsulated with a cured product of the epoxy resin composition for encapsulation according to claim 1 or 2.