JP2975348B1 - Liquid sealing resin composition - Google Patents
Liquid sealing resin compositionInfo
- Publication number
- JP2975348B1 JP2975348B1 JP23492598A JP23492598A JP2975348B1 JP 2975348 B1 JP2975348 B1 JP 2975348B1 JP 23492598 A JP23492598 A JP 23492598A JP 23492598 A JP23492598 A JP 23492598A JP 2975348 B1 JP2975348 B1 JP 2975348B1
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- JP
- Japan
- Prior art keywords
- resin composition
- resin
- epoxy resin
- spherical silica
- particle size
- Prior art date
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
【要約】
【課題】 作業性を損なうことなく、フリップチップの
ギャップへの充填性（アンダーフィル性）を向上し、し
かも広いチップ面範囲にわたって均一に硬化すること
で、信頼性の高いフリップチップパッケージを与える一
液性エポキシ樹脂組成物を提供する。
【解決手段】 本発明は、（Ａ）エポキシ樹脂、（Ｂ）
硬化剤および（Ｃ）平均粒径0.5 〜3 μｍ、かつ最大粒
径10μｍ以下の球状シリカ粉末を必須成分とし、樹脂
［（Ａ）＋（Ｂ）］に対して（Ｃ）の球状シリカ粉末を
150 〜400 重量％含有し、フリップチップの樹脂封止に
使用することを特徴とする液状封止用樹脂組成物であ
る。Abstract: PROBLEM TO BE SOLVED: To improve the filling property (underfill property) of a flip chip into a gap without impairing workability and to cure uniformly over a wide chip surface area, thereby providing a highly reliable flip chip package. A one-part epoxy resin composition which provides The present invention provides (A) an epoxy resin, (B)
The hardener and (C) spherical silica powder having an average particle diameter of 0.5 to 3 μm and a maximum particle diameter of 10 μm or less are essential components, and the spherical silica powder of (C) is added to the resin [(A) + (B)].
A liquid sealing resin composition containing 150 to 400% by weight and used for flip chip resin sealing.
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、フリップチップ接
続部の封止に使用されるアンダーフィル材で、作業性、
保存安定性、製品の信頼性に優れた好適な一液性エポキ
シ樹脂の液状封止用樹脂組成物に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an underfill material used for sealing a flip chip connecting portion, and has a workability,
The present invention relates to a suitable one-part epoxy resin liquid sealing resin composition having excellent storage stability and product reliability.
【０００２】[0002]
【従来の技術】従来のチップオンボードは、フェイスア
ップに置いたチップを基板に接着し、チップの電極と基
板上の電極とをボンディングワイヤーで導通させ、しか
る後に樹脂で封止する実装方式である。2. Description of the Related Art A conventional chip-on-board is a mounting method in which a chip placed face-up is bonded to a substrate, electrodes of the chip and electrodes on the substrate are electrically connected by bonding wires, and then sealed with a resin. is there.
【０００３】これに対してフリップチップは、フェイス
ダウンに置いたチップの電極と基板上の電極とをバンプ
で導通させ、チップと基板の間に樹脂を充填させること
で封止する実装方式である。On the other hand, a flip chip is a mounting method in which electrodes of a chip placed face down and electrodes on a substrate are electrically connected by bumps, and a resin is filled between the chip and the substrate for sealing. .
【０００４】封止用樹脂には、基板と樹脂の熱線膨係数
の差から生じる応力ひずみを低下させるために、シリカ
粉末を代表とする無機質充填剤が配合されているが、従
来のチップオンボード用樹脂は、封止する場所がチップ
上であるため、シリカ粒径について特に限定しなくても
問題はなかった。The sealing resin contains an inorganic filler typified by silica powder in order to reduce the stress and strain caused by the difference in the coefficient of thermal expansion between the substrate and the resin. Since the place for sealing the resin for use is on the chip, there is no problem even if the silica particle size is not particularly limited.
【０００５】ところが、フリップチップを封止する場
合、そのチップ−基板間の間隔（以下、ギャップとす
る）が100 μｍ以下と狭いため、従来のチップオンボー
ド用樹脂は、フリップチップのギャップへの樹脂充填性
が悪く、その封止には使用できない。However, when a flip chip is sealed, the gap between the chip and the substrate (hereinafter referred to as a gap) is as small as 100 μm or less. It has poor resin filling properties and cannot be used for sealing.
【０００６】また、最近では、ギャップは約20μｍまで
狭まっており、チップサイズも大型化傾向にあるため、
より充填性に優れ、均一に硬化する封止樹脂が必要とさ
れている。Recently, the gap has been reduced to about 20 μm, and the chip size has been increasing.
There is a need for a sealing resin that is more excellent in filling properties and that cures uniformly.
【０００７】[0007]
【発明が解決しようとする課題】本発明は、上記の事情
に鑑みてなされたもので、作業性を損なうことなく、フ
リップチップのギャップへの充填性（アンダーフィル
性）を向上し、しかも広いチップ面範囲にわたって均一
に硬化することで、信頼性の高いフリップチップパッケ
ージを与える一液性エポキシ樹脂組成物を提供しようと
するものである。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has an improved filling property (underfill property) in a gap of a flip chip without impairing workability, and has a wide area. It is an object of the present invention to provide a one-part epoxy resin composition that cures uniformly over a chip surface area to provide a highly reliable flip chip package.
【０００８】[0008]
【課題を解決するための手段】本発明者は、上記の目的
を達成しようと鋭意研究を進めた結果、無機充填材の粒
径を制御した、後述する組成の一液性エポキシ樹脂組成
物をフリップチップのアンダーフィル材として用いるこ
とによって上記の目的を達成できることを見いだし、本
発明を完成したもである。Means for Solving the Problems As a result of diligent research aimed at achieving the above-mentioned object, the present inventor has developed a one-part epoxy resin composition having a composition described below, in which the particle size of the inorganic filler is controlled. It has been found that the above object can be achieved by using the underfill material of a flip chip, and the present invention has been completed.
【０００９】即ち、本発明は、 （Ａ）エポキシ樹脂、 （Ｂ）酸無水物硬化剤および （Ｃ）平均粒径0.5 〜3 μｍ、かつ最大粒径10μｍ以下
の球状シリカ粉末を必須成分とし、樹脂［（Ａ）＋
（Ｂ）］に対して（Ｃ）の球状シリカ粉末を150 〜400
重量％含有し、フリップチップの樹脂封止に使用するこ
とを特徴とする液状封止用樹脂組成物である。また、必
要に応じて難燃剤、着色剤などが添加されることのある
液状封止用樹脂組成物である。That is, the present invention comprises, as essential components, (A) an epoxy resin, (B) an acid anhydride curing agent, and (C) a spherical silica powder having an average particle size of 0.5 to 3 μm and a maximum particle size of 10 μm or less. Resin [(A) +
(B)] with respect to 150 to 400 spherical silica powder of (C).
It is a resin composition for liquid encapsulation, characterized in that it is contained in an amount of 0.1% by weight and used for resin encapsulation of a flip chip. It is a liquid sealing resin composition to which a flame retardant, a coloring agent, and the like may be added as needed.
【００１０】以下、本発明を詳細に説明する。Hereinafter, the present invention will be described in detail.
【００１１】本発明に用いるエポキシ樹脂としては、1
分子中に2 個以上のエポキシ基を有する、硬化可能な液
状エポキシ樹脂であればよく、例えば、ビスフェノール
Ａ型エポキシ樹脂、ビスフェノールＦ型エポキシ樹脂、
ビスフェノールＡＤ型エポキシ樹脂、ノボラック型エポ
キシ樹脂、グリシジルエステル型エポキシ樹脂、脂環式
エポキシ樹脂等が挙げられ、これらはクロルイオンやナ
トリウムイオンの少ないものが好ましい。これらの液状
エポキシ樹脂は、単独又は2 種以上混合して使用するこ
とができる。また、これらのエポキシ樹脂の他にフェノ
ールノボラック型エポキシ樹脂、クレゾールノボラック
型エポキシ樹脂、含複素環エポキシ樹脂、水添型ビスフ
ェノールＡ型エポキシ樹脂、脂肪族エポキシ樹脂、芳香
族、脂肪族もしくは脂環式のカルボン酸とエピクロルヒ
ドリンとの反応によって得られるエポキシ樹脂、スピロ
環含有エポキシ樹脂等を適宜併用することができる。The epoxy resin used in the present invention includes:
Any curable liquid epoxy resin having two or more epoxy groups in the molecule may be used, such as bisphenol A epoxy resin, bisphenol F epoxy resin,
Bisphenol AD type epoxy resin, novolak type epoxy resin, glycidyl ester type epoxy resin, alicyclic epoxy resin and the like are preferable, and those having little chloro ion or sodium ion are preferable. These liquid epoxy resins can be used alone or in combination of two or more. In addition to these epoxy resins, phenol novolak type epoxy resin, cresol novolak type epoxy resin, heterocyclic epoxy resin, hydrogenated bisphenol A type epoxy resin, aliphatic epoxy resin, aromatic, aliphatic or alicyclic resin An epoxy resin obtained by the reaction of carboxylic acid with epichlorohydrin, a spiro ring-containing epoxy resin, and the like can be appropriately used in combination.
【００１２】本発明に用いる（Ｂ）エポキシ樹脂の硬化
剤としては、前記した（Ａ）エポキシ樹脂と反応し硬化
可能な酸無水物硬化剤であれば、いかなるものでも使用
することができ、例えば、メチルヘキサヒドロフタル酸
無水物、無水フタル酸誘導体等が挙げられる。これらの
硬化剤は、単独であるいは硬化を阻害しない範囲におい
て2 種以上混合して使用することができる。As the epoxy resin curing agent (B) used in the present invention, any acid anhydride curing agent capable of reacting with the epoxy resin (A) and curing can be used. , Methyl hexahydrophthalic anhydride, a phthalic anhydride derivative, and the like . These curing agents can be used alone or as a mixture of two or more kinds as long as the curing is not inhibited.
【００１３】本発明に用いる（Ｃ）のシリカ粉末として
は、その形状として球状のシリカを用いる。球状シリカ
は一般に使用されている球状シリカ粉末が広く使用でき
るが、それらのなかでも不純物濃度が低いものが望まし
い。（Ｃ）球状シリカ粉末の平均粒径は、0.5 〜3 μｍ
であって、最大粒径10μｍ以下としなければならない。
平均粒径が3 μｍを超え、あるいは最大粒径が10μｍを
超えると、充填、硬化が不均一になり、また平均粒径が
0.5 μｍ未満であると、アンダーフィル性が悪くなるの
で好ましくない。球状シリカの具体的なものとしては、
例えば、ＳＰ−３Ｂ（扶桑シルテックス社製、商品
名）、Ａ. ＦＳＯ−Ｅ５，Ａ. ＦＳＯ−Ｅ２（龍森社
製、商品名）等が挙げられる。As the silica powder (C) used in the present invention, spherical silica is used. As the spherical silica, generally used spherical silica powder can be widely used, and among them, those having a low impurity concentration are desirable. (C) The average particle size of the spherical silica powder is 0.5 to 3 μm
And the maximum particle size must be 10 μm or less.
If the average particle size exceeds 3 μm or the maximum particle size exceeds 10 μm, the filling and curing become uneven, and the average particle size increases.
When the thickness is less than 0.5 μm, the underfill property deteriorates, which is not preferable. Specific examples of spherical silica include:
For example, SP-3B (made by Fuso Siltex Co., Ltd., trade name), A. FSO-E5, A. FSO-E2 (made by Tatsumori Co., Ltd.) and the like can be mentioned.
【００１４】また（Ｃ）の球状シリカ粉末の配合量は、
樹脂分、すなわち（Ａ）成分と（Ｂ）成分の合計量に対
して、150 〜400 重量％となる量とすることができる。
150重量％未満であると所期の応力低下に効果なく、ま
た400 重量％を超えると充填性を極端に低下させる。The amount of the spherical silica powder (C) is as follows:
The amount may be 150 to 400% by weight based on the resin component, that is, the total amount of the components (A) and (B).
If it is less than 150% by weight, the effect of reducing the expected stress is not obtained, and if it exceeds 400% by weight, the filling property is extremely reduced.
【００１５】本発明の液状封止用樹脂組成物には、本発
明の目的に反しない範囲において、その他無機充填剤、
カップリング剤、消泡剤、顔料、染料、硬化促進剤その
他の成分を適宜添加配合することができる。無機充填剤
としては、タルク、炭酸カルシウム、水酸化アルミニウ
ム等が挙げられ、これらは単独又は2 種以上混合して使
用することができる。The liquid sealing resin composition of the present invention contains other inorganic fillers within a range not inconsistent with the object of the present invention.
Coupling agents, defoamers, pigments, dyes, curing accelerators and other components can be appropriately added and blended. Examples of the inorganic filler include talc, calcium carbonate, aluminum hydroxide and the like, and these can be used alone or in combination of two or more.
【００１６】本発明の液状封止用樹脂組成物は、常法に
従い、上述した各成分を十分混合した後、更に三本ロー
ルにより混練処理を行い、その後、万能混合器により真
空混合処理して、容易に製造することができる。The resin composition for liquid encapsulation of the present invention is prepared by thoroughly mixing the above-mentioned components, kneading with a three-roll mill, and vacuum-mixing with a universal mixer in a conventional manner. , Can be easily manufactured.
【００１７】[0017]
【作用】本発明の液状封止用樹脂組成物は、 低粘度
である酸無水物硬化剤の採用、特定の平均粒径の、
特定の最大粒径の、球状のシリカ粉末、その特定の
配合量というの５要件の結合によって、ギャップへの樹
脂の充填性を向上し、信頼性の高いフリップチップパッ
ケージを与えるものである。The liquid sealing resin composition of the present invention has a low viscosity.
Adoption of an acid anhydride curing agent, of a specific average particle size,
Spherical silica powder of a certain maximum particle size,
By combining the five requirements of the blending amount, the filling property of the resin into the gap is improved, and a highly reliable flip chip package is provided.
【００１８】[0018]
【発明の実施の形態】次に、本発明を実施例によって具
体的に説明する。本発明は、これらの実施例によって限
定されるものではない。以下の実施例および比較例にお
いて「部」とは「重量部」を意味する。Next, the present invention will be specifically described with reference to examples. The present invention is not limited by these examples. In the following Examples and Comparative Examples, “parts” means “parts by weight”.
【００１９】実施例１ ビスフェノールＦ型エポキシ樹脂のエピコートＹＬ９８
３Ｕ（油化シェルエポキシ社製、商品名）100 部、メチ
ルテトラヒドロ無水フタル酸のＱＨ２００（日本ゼオン
社製、商品名）100 部、球状シリカとして、平均粒径3
μｍ、最大粒径10μｍのＳＰ−３Ｂ（扶桑シルテックス
社製、商品名）210 部と平均粒径0.5 μｍ、最大粒径3
μｍのＡ．ＦＳＯ−Ｅ２（龍森社製、商品名）90部、カ
ップリング剤Ａ−１８７（日本ユニカー社製、商品名）
2.0 部、および硬化促進剤ノバキュアーＨＸ３９４１
（旭化成工業社製、商品名）10部を加えて液状封止用樹
脂組成物を製造した。Example 1 Epicoat YL98 of bisphenol F type epoxy resin
100 parts of 3U (trade name, manufactured by Yuka Shell Epoxy Co., Ltd.), 100 parts of QH200 of methyltetrahydrophthalic anhydride (trade name, manufactured by Zeon Corporation), spherical silica having an average particle size of 3
μm, 210 parts of SP-3B (trade name, manufactured by Fuso Siltex Co., Ltd.) having a maximum particle size of 10 μm, an average particle size of 0.5 μm, and a maximum particle size of 3
μm A. 90 parts of FSO-E2 (trade name, manufactured by Tatsumori), coupling agent A-187 (trade name, manufactured by Nippon Unicar)
2.0 parts and the curing accelerator Novacur HX3941
A liquid encapsulating resin composition was manufactured by adding 10 parts (trade name, manufactured by Asahi Kasei Corporation).
【００２０】実施例２ ビスフェノールＦ型エポキシ樹脂のＲＥ−３０３Ｓ（日
本化薬社製、商品名）100 部、メチルヘキサヒドロ無水
フタル酸のＭＨ７００（新日本理化社製、商品名） 100
部、球状シリカとして、平均粒径1.5 μｍ、最大粒径5
μｍのＡ．ＦＳＯ−Ｅ５（龍森社製、商品名）240 部と
平均粒径0.5 μｍ、最大粒径3 μｍのＡ．ＦＳＯ−Ｅ２
（龍森社製、商品名）90部、カップリング剤Ａ−１８７
（日本ユニカー社製、商品名）2.0 部、および硬化促進
剤ノバキュアーＨＸ３９４１（旭化成工業社製、商品
名）10部を加えて液状封止用樹脂組成物を製造した。EXAMPLE 2 100 parts of RE-303S, a bisphenol F type epoxy resin (trade name, manufactured by Nippon Kayaku Co., Ltd.), MH700 of methyl hexahydrophthalic anhydride (trade name, manufactured by Shin Nippon Rika Co., Ltd.) 100
Part, spherical silica, average particle size 1.5 μm, maximum particle size 5
μm A. A. FSO-E5 (trade name, manufactured by Tatsumori Co., Ltd.) having 240 parts, an average particle size of 0.5 μm, and a maximum particle size of 3 μm FSO-E2
(Tatsumori Co., trade name) 90 parts, coupling agent A-187
A liquid encapsulating resin composition was produced by adding 2.0 parts (trade name, manufactured by Nippon Unicar Co., Ltd.) and 10 parts of Novacur HX3941 (trade name, manufactured by Asahi Kasei Kogyo Co., Ltd.).
【００２１】比較例１ ビスフェノールＦ型エポキシ樹脂のエピコートＹＬ９８
３Ｕ（油化シェルエポキシ社製、商品名）100 部、メチ
ルテトラヒドロ無水フタル酸のＱＨ２００（日本ゼオン
社製、商品名）100 部、球状シリカとして、平均粒径6
μｍ、最大粒径20μｍのＳＰ−６Ｂ（扶桑シルテックス
社製、商品名）210 部と平均粒径1.5 μｍ、最大粒径5
μｍのＡ．ＦＳＯ−Ｅ５（龍森社製、商品名）90部、カ
ップリング剤Ａ−１８７（日本ユニカー社製、商品名）
2.0 部、および硬化促進剤ノバキュアーＨＸ３９４１
（旭化成工業社製、商品名）10部を加えて液状封止用樹
脂組成物を製造した。Comparative Example 1 Epicoat YL98 of bisphenol F type epoxy resin
100 parts of 3U (trade name, manufactured by Yuka Shell Epoxy Co., Ltd.), 100 parts of QH200 of methyltetrahydrophthalic anhydride (trade name, manufactured by Zeon Corporation), spherical silica having an average particle size of 6
μm, 210 parts of SP-6B (trade name, manufactured by Fuso Siltex Co., Ltd.) having a maximum particle size of 20 μm, an average particle size of 1.5 μm, and a maximum particle size of 5
μm A. 90 parts of FSO-E5 (trade name, manufactured by Tatsumori), coupling agent A-187 (trade name, manufactured by Nippon Unicar)
2.0 parts and the curing accelerator Novacur HX3941
A liquid encapsulating resin composition was manufactured by adding 10 parts (trade name, manufactured by Asahi Kasei Corporation).
【００２２】比較例２ ビスフェノールＦ型エポキシ樹脂のエピコートＹＬ９８
３Ｕ（油化シェルエポキシ社製、商品名）100 部、メチ
ルテトラヒドロ無水フタル酸のＱＨ２００（日本ゼオン
社製、商品名）100 部、球状シリカとして平均粒径16μ
ｍ、最大粒径60μｍのＦＢ−４８（デンカ社製、商品
名）300 部、カップリング剤Ａ−１８７（日本ユニカー
社製、商品名）2.0 部、および硬化促進剤ノバキュアー
ＨＸ３９４１（旭化成工業社製、商品名）10部を加えて
液状封止用樹脂組成物を製造した。実施例１〜２および
比較例１〜２によって製造した一液性エポキシ樹脂の液
状封止用樹脂組成物を用いて、これらの液状特性（粘
度、ギャップに対する充填性）および硬化物特性（樹脂
とシリカの不均一の有無）を試験したのでその結果を表
１に示す。Comparative Example 2 Epicoat YL98 of bisphenol F type epoxy resin
100 parts of 3U (trade name, manufactured by Yuka Shell Epoxy Co.), 100 parts of QH200 of methyltetrahydrophthalic anhydride (trade name, manufactured by Zeon Corporation), average particle size of 16 μm as spherical silica
m, 300 parts of FB-48 (trade name, manufactured by Denka) having a maximum particle size of 60 μm, 2.0 parts of coupling agent A-187 (trade name, manufactured by Nippon Unicar Co., Ltd.), and Novacur HX3941 (a product of Asahi Kasei Corporation) (Trade name) 10 parts was added to produce a liquid encapsulating resin composition. The liquid properties (viscosity, gap filling property) and the cured properties (resin and resin) of the one-part epoxy resin liquid sealing resin compositions produced in Examples 1 and 2 and Comparative Examples 1 and 2 were used. The results are shown in Table 1.
【００２３】[0023]
【表１】 [Table 1]
【００２４】＊1 ：70℃に維持したチップサイズ15×25
ｍｍ、ギャップ間30μｍに、完全に充填し終える時間を
調査した。* 1: Chip size 15 × 25 maintained at 70 ° C.
The time required to complete filling to 30 mm with a gap of 30 mm was investigated.
【００２５】＊2 ：チップサイズ15×25ｍｍ、ギャップ
間30μｍに充填し、硬化後に不均一部分の面積％を調査
した。* 2: Filled to a chip size of 15 × 25 mm and a gap of 30 μm, and after curing, the area% of the non-uniform portion was investigated.
【００２６】表１から、実施例で得られた液状封止用樹
脂組成物では、比較例の液状封止用樹脂組成物に比べ、
樹脂粘度や充填時間といった作業性に関する特性は同等
であるにもかかわらず、硬化後は樹脂とシリカの不均一
部分が少なく、ギャップにおいて非常に均一な硬化物が
得られることがわかった。From Table 1, it can be seen that the liquid encapsulating resin composition obtained in the example is compared with the liquid encapsulating resin composition of the comparative example.
Although the properties related to workability such as resin viscosity and filling time were the same, it was found that after curing, there were few non-uniform portions of the resin and silica, and a very uniform cured product could be obtained in the gap.
【００２７】[0027]
【発明の効果】以上の説明および表１から明らかなよう
に、本発明の液状封止用樹脂組成物は、従来の充填性を
満足し、かつ、大型のチップに対しても非常に均一な状
態での封止を可能とした。従って、この液状封止用樹脂
組成物を使用することによって、信頼性の高いフリップ
チップパッケージを得ることができる。As apparent from the above description and Table 1, the liquid encapsulating resin composition of the present invention satisfies the conventional filling property and is very uniform even for a large chip. Sealing in a state was made possible. Therefore, a highly reliable flip chip package can be obtained by using this liquid sealing resin composition.
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6，ＤＢ名) C08L 63/00 - 63/10 C08K 3/36 C08G 59/42 H01L 23/29 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. 6 , DB name) C08L 63/00-63/10 C08K 3/36 C08G 59/42 H01L 23/29
Claims (1)
の球状シリカ粉末を必須成分とし、樹脂［（Ａ）＋
（Ｂ）］に対して（Ｃ）の球状シリカ粉末を 150〜400
重量％含有し、フリップチップの樹脂封止に使用するこ
とを特徴とする液状封止用樹脂組成物。1. An epoxy resin, (B) an acid anhydride curing agent, and (C) a spherical silica powder having an average particle diameter of 0.5 to 3 μm and a maximum particle diameter of 10 μm or less are essential components, and a resin [(A ) +
(B)] to 150-400 spherical silica powder of (C).
A liquid sealing resin composition, which is contained in a resin composition of a flip chip by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23492598A JP2975348B1 (en) | 1998-08-06 | 1998-08-06 | Liquid sealing resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23492598A JP2975348B1 (en) | 1998-08-06 | 1998-08-06 | Liquid sealing resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2975348B1 true JP2975348B1 (en) | 1999-11-10 |
| JP2000053844A JP2000053844A (en) | 2000-02-22 |
Family
ID=16978439
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23492598A Expired - Fee Related JP2975348B1 (en) | 1998-08-06 | 1998-08-06 | Liquid sealing resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2975348B1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002270719A (en) * | 2001-03-07 | 2002-09-20 | Sony Corp | Semiconductor device and its manufacturing method |
| JP5167567B2 (en) * | 2001-06-27 | 2013-03-21 | 住友ベークライト株式会社 | Epoxy resin composition and semiconductor device |
| TWI281924B (en) | 2003-04-07 | 2007-06-01 | Hitachi Chemical Co Ltd | Epoxy resin molding material for sealing use and semiconductor device |
-
1998
- 1998-08-06 JP JP23492598A patent/JP2975348B1/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2000053844A (en) | 2000-02-22 |
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