JP4033257B2 - Liquid sealing resin composition and semiconductor sealing device - Google Patents
Liquid sealing resin composition and semiconductor sealing device Download PDFInfo
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- JP4033257B2 JP4033257B2 JP2002104607A JP2002104607A JP4033257B2 JP 4033257 B2 JP4033257 B2 JP 4033257B2 JP 2002104607 A JP2002104607 A JP 2002104607A JP 2002104607 A JP2002104607 A JP 2002104607A JP 4033257 B2 JP4033257 B2 JP 4033257B2
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Description
【０００１】
【発明の属する技術分野】
本発明は、半導体接続部の封止に使用される液状封止用樹脂組成物であって、より詳しくは、作業性、保存安定性、製品の信頼性に優れた、一液性エポキシ封止用樹脂組成物に関する。
【０００２】
【従来の技術】
近年、半導体パッケージは、一段と軽薄短小化の傾向にある。それに伴って半導体接続部の構造は非常に微細化してきており、その封止材として局部的に塗布することができ、かつその形状を維持して硬化することのできる特性を有した液状封止樹脂が必要とされてきている。
【０００３】
これまで、熱硬化性の液状封止材を使用して封止を行うと、硬化時の熱によって封止樹脂が塗布部分より広がったり、にじみが発生したりした。または、その広がりを防止するためにダム枠を設置したりする必要があった。また、上記要因が部品の高密度搭載の妨げとなっていた。
【０００４】
その他に極端に硬化性を速くすることで、広がりを低減する手法をとる場合があるが、主剤と硬化剤を使用前に配合する二液型であったり、常温の粘度上昇が著しく可使時間が短いものであるなど、作業性に優れる材料ではない。
【０００５】
【発明が解決しようとする課題】
本発明の目的は、上記の事情に鑑みてなされたもので、塗布後の形状保持性に優れ、局部的な封止を実現することで、半導体部品の小形化または高密度搭載性を可能とする一液性エポキシ樹脂組成物を提供しようとするものである。
【０００６】
【課題を解決するための手段】
本発明者は、上記の目的を達成しようと鋭意研究を進めた結果、後述する組成の一液性エポキシ樹脂組成物を液状封止材として用いることによって上記の目的を達成できることを見いだし、本発明を完成したもである。
【０００７】
即ち、本発明は、
（Ａ）エポキシ樹脂、
（Ｂ）融点が６０℃以上１００℃以下のエポキシ樹脂アミンアダクト硬化剤、
（Ｃ）平均粒子径が３０ｎｍ以下かつ比表面積が５０ｍ2 ／ｇ以上の金属酸化物の粒子および
（Ｄ）充填剤
を必須成分とすることを特徴とする一液性エポキシ封止用樹脂組成物であり、またその樹脂組成物によって、装置局部が樹脂封止されてなることを特徴とする半導体封止装置である。
【０００８】
以下、本発明を詳細に説明する。
【０００９】
本発明に用いる（Ａ）エポキシ樹脂としては、１分子中に２個以上のエポキシ基を有する、硬化可能なエポキシ樹脂であればよく、例えば、ビスフェノールＡ型エポキシ樹脂、ビスフェノールＦ型エポキシ樹脂、ビスフェノールＡＤ型エポキシ樹脂、ノボラック型エポキシ樹脂、グリシジルエステル型エポキシ樹脂、脂環式エポキシ樹脂等が挙げられ、これらはクロルイオンやナトリウムイオンの少ないものが好ましい。これらのエポキシ樹脂は、単独又は２種以上混合して使用することができる。また、これらのエポキシ樹脂の他に、フェノールノボラック型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、含複素環エポキシ樹脂、水添型ビスフェノールＡ型エポキシ樹脂、脂肪族エポキシ樹脂、芳香族、脂肪族もしくは脂環式のカルボン酸とエピクロルヒドリンとの反応によって得られるエポキシ樹脂、スピロ環含有エポキシ樹脂等も適宜併用することができる。
【００１０】
本発明に用いる（Ｂ）融点が６０℃以上１００℃以下のエポキシ樹脂アミンアダクト硬化剤としては、例えば、ＥＨ４０７０Ｓ（旭電化社製商品名、融点８０℃）、ＥＨ３７３１Ｓ（旭電化社製商品名、融点１００℃）等が挙げられる。融点が１３０℃以上の一般的なエポキシ樹脂アミンアダクトに比べ、本発明で使用したエポキシ樹脂アミンアダクトの融点は低いために、より低温での硬化が可能であり、かつ６０℃以上の融点を有していることから常温での保存安定性も一般的なエポキシ樹脂アミンアダクトと同等の特性を示す。
【００１１】
本発明に用いる（Ｃ）金属酸化物の粒子としては、平均粒子径が３０ｎｍ以下、かつ比表面積が５０ｍ2 ／ｇ以上の金属酸化物の粒子であり、粘性調整剤として使用する。具体的には、例えば、アエロジル２００（日本アエロジル社製、商品名、平均粒子径１２ｎｍ、比表面積２００ｍ2 ／ｇ、成分：ＳｉＯ2 ）、ＲＹ２００Ｓ（日本アエロジル社製、商品名、平均粒子径１５ｎｍ、比表面積８０ｍ2 ／ｇ、成分：ＳｉＯ2 ）、Ｃ（日本アエロジル社製、商品名、平均粒子径１５ｎｍ、比表面積１００ｍ2 ／ｇ、成分：Ａｌ2 Ｏ3 ）、Ｔ８０５（日本アエロジル社製、商品名、平均粒子径２０ｎｍ、比表面積５０ｍ2 ／ｇ、成分：ＴｉＯ2 ）等が挙げられる。
【００１２】
本発明に用いる（Ｄ）充填剤としては、一般に球状のシリカ粉末が広く使用される。また、シリカ粉末以外にも、アルミナ、窒化珪素、窒化ホウ素、炭酸カルシウム、水酸化アルミニウム、タルク等が挙げられ、これらは単独又は２種以上混合して使用することができる。これらは、樹脂組成物中の１〜７５重量％配合することができる。それらのなかでも半導体に悪影響を及ぼす不純物濃度の低いものが望ましく、また近年の半導体封止用途では、充填剤の最大粒径を２０μｍ以下とするのが望ましい。平均粒径が２０μｍを超えると、得られる液状封止材の塗布・充填作業性が悪くなり、好ましくない。
【００１３】
本発明の液状封止用樹脂組成物には、本発明の目的に反しない範囲において、硬化促進剤、難燃剤、顔料、染料、カップリング剤、消泡剤その他の成分を適宜添加配合することができる。
【００１４】
本発明の液状封止用樹脂組成物は、常法に従い、上述した各成分を十分混合した後、更に三本ロールにより混練処理を行い、その後、万能混合器により真空混合処理して、容易に製造することができる。
【００１５】
【作用】
本発明の液状封止用樹脂組成物は、特定のエポキシ樹脂硬化剤である（Ｂ）成分および粘性調整剤である（Ｃ）成分を使用することによって、半導体装置の接続部など非常に局部的な樹脂封止を実現し、小型の半導体部品や半導体の高密度搭載性を得ることができる。
【００１６】
【発明の実施の形態】
次に、本発明を実施例によって具体的に説明する。本発明は、これらの実施例によって限定されるものではない。以下の実施例および比較例において「部」とは「重量部」を意味する。
【００１７】
実施例１
エポキシ樹脂としてビスフェノールＦ型エポキシ樹脂のＹＬ９８３Ｕ（ジャパンエポキシレジン社製、商品名）１００部に対して、エポキシ樹脂硬化剤としてＥＨ４０７０Ｓ（旭電化社製商品名、融点８０℃）５０部、ＲＹ２００Ｓ（日本アエロジル社製商品名、平均粒子径１５ｎｍ、比表面積８０ｍ2 ／ｇ、成分：ＳｉＯ2 ）１０部、充填剤として球状シリカのＳＰ３Ｂ（扶桑化学社製商品名、平均粒子径３μｍ）５０部とを加えて液状封止用樹脂組成物を製造した。
【００１８】
比較例１
エポキシ樹脂としてビスフェノールＦ型エポキシ樹脂のＹＬ９８３Ｕ（ジャパンエポキシレジン社製、商品名）１００部に対して、エポキシ樹脂硬化剤としてＥＨ４０７０Ｓ（旭電化社製商品名、融点８０℃）５０部、充填剤として球状シリカのＳＰ３Ｂ（扶桑化学社製商品名、平均粒子径３μｍ）５０部とを加えて液状封止用樹脂組成物を製造した。
【００１９】
比較例２
エポキシ樹脂としてビスフェノールＦ型エポキシ樹脂のＹＬ９８３Ｕ（ジャパンエポキシレジン社製、商品名）１００部に対して、メチルヘキサヒドロ無水フタル酸のＨＮ５５００（日立化成工業社製、商品名）１００部、ＲＹ２００Ｓ（日本アエロジル社製商品名、平均粒子径１５ｎｍ、比表面積８０ｍ2 ／ｇ、成分：ＳｉＯ2 ）１０部、充填剤として球状シリカのＳＰ３Ｂ（扶桑化学社製商品名、平均粒子径３μｍ）１００部、硬化促進剤として２−エチル−４−メチルイミダゾール１部とを加えて液状封止用樹脂組成物を製造した。
【００２０】
比較例３
エポキシ樹脂としてビスフェノールＦ型エポキシ樹脂のＹＬ９８３Ｕ（ジャパンエポキシレジン社製、商品名）１００部に対して、メチルヘキサヒドロ無水フタル酸のＨＮ５５００（日立化成工業社製、商品名）１００部、充填剤として球状シリカのＳＰ３Ｂ（扶桑化学社製商品名、平均粒子径３μｍ）１００部、硬化促進剤として２−エチル−４−メチルイミダゾール１部とを加えて液状封止用樹脂組成物を製造した。
【００２１】
実施例１および比較例１〜３によって製造した一液性エポキシ樹脂の液状封止用樹脂組成物の特性について試験をし、結果を表１に示す。
【００２２】
【表１】
【００２３】
硬化後の形状変化率＝（硬化後の直径／塗布直後の直径）×１００、
変化のない場合の形状変化率は、１００％とする。
【００２４】
＊２：樹脂硬化物の端部より、さらに広がっている液状樹脂成分のにじみ出した距離を測定した。
【００２５】
＊３：２５℃において初期粘度の２倍まで粘度上昇するのに要した時間。
【００２６】
表１から、実施例１で得られた液状封止用樹脂組成物では、比較例の液状封止用樹脂組成物に比べ、熱硬化時の広がりやにじみが少なく、非常に形状維持性が優れている。また、室温における使用可能時間は、非常に長く作業性に優れる。
【発明の効果】
以上の説明および表１から明らかなように、本発明の液状封止用樹脂組成物によれば、半導体部品の局部的な封止または固着が実現され、半導体部品の高密度搭載を可能とすることができた。。[0001]
BACKGROUND OF THE INVENTION
The present invention is a liquid sealing resin composition used for sealing a semiconductor connection part, and more specifically, a one-component epoxy sealing excellent in workability, storage stability, and product reliability. The present invention relates to a resin composition.
[0002]
[Prior art]
In recent years, semiconductor packages tend to be lighter, thinner, and smaller. Along with that, the structure of the semiconductor connection part has become very fine, and it can be applied locally as its sealing material, and it can be cured while maintaining its shape Resins have been needed.
[0003]
Up to now, when sealing is performed using a thermosetting liquid sealing material, the sealing resin spreads from the coated portion due to heat during curing, or bleeding has occurred. Or it was necessary to install a dam frame to prevent the spread. In addition, the above factors hindered high-density mounting of components.
[0004]
In addition, there are cases where the spread is reduced by making the curability extremely fast, but it is a two-part type in which the main agent and the curing agent are blended before use, and the viscosity rise at room temperature is significant. However, it is not a material with excellent workability.
[0005]
[Problems to be solved by the invention]
The object of the present invention has been made in view of the above circumstances, and is excellent in shape retention after coating, and by realizing local sealing, it is possible to reduce the size of semiconductor parts or mount them at high density. An object of the present invention is to provide a one-part epoxy resin composition.
[0006]
[Means for Solving the Problems]
As a result of diligent research to achieve the above object, the present inventor has found that the above object can be achieved by using a one-component epoxy resin composition having a composition described later as a liquid sealing material. Was completed.
[0007]
That is, the present invention
(A) epoxy resin,
(B) an epoxy resin amine adduct curing agent having a melting point of 60 ° C. or higher and 100 ° C. or lower,
(C) Metal oxide particles having an average particle size of 30 nm or less and a specific surface area of 50 m 2 / g or more and (D) a filler as essential components In addition, a semiconductor sealing device is characterized in that a device local part is resin-sealed by the resin composition.
[0008]
Hereinafter, the present invention will be described in detail.
[0009]
The (A) epoxy resin used in the present invention may be a curable epoxy resin having two or more epoxy groups in one molecule, such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol. An AD type epoxy resin, a novolak type epoxy resin, a glycidyl ester type epoxy resin, an alicyclic epoxy resin and the like can be mentioned, and those having a small amount of chloro ions and sodium ions are preferable. These epoxy resins can be used individually or in mixture of 2 or more types. Besides these epoxy resins, phenol novolac type epoxy resins, cresol novolac type epoxy resins, heterocyclic epoxy resins, hydrogenated bisphenol A type epoxy resins, aliphatic epoxy resins, aromatic, aliphatic or alicyclic An epoxy resin obtained by a reaction of a carboxylic acid of the formula and epichlorohydrin, a spiro ring-containing epoxy resin, or the like can be used in combination as appropriate.
[0010]
Examples of the epoxy resin amine adduct curing agent (B) having a melting point of 60 ° C. or higher and 100 ° C. or lower used in the present invention include EH4070S (trade name, manufactured by Asahi Denka Co., Ltd., melting point 80 ° C.), EH3731S (trade name, manufactured by Asahi Denka Co., Ltd.) Melting point 100 ° C.). Since the melting point of the epoxy resin amine adduct used in the present invention is lower than that of a general epoxy resin amine adduct having a melting point of 130 ° C. or higher, it can be cured at a lower temperature and has a melting point of 60 ° C. or higher. Therefore, the storage stability at room temperature shows the same characteristics as a general epoxy resin amine adduct.
[0011]
The (C) metal oxide particles used in the present invention are metal oxide particles having an average particle diameter of 30 nm or less and a specific surface area of 50 m 2 / g or more, and are used as a viscosity modifier. Specifically, for example, Aerosil 200 (manufactured by Nippon Aerosil Co., Ltd., trade name, average particle diameter 12 nm, specific surface area 200 m 2 / g, component: SiO 2 ), RY200S (manufactured by Nippon Aerosil Co., Ltd., trade name, average particle diameter 15 nm) , Specific surface area 80 m 2 / g, component: SiO 2 ), C (manufactured by Nippon Aerosil Co., Ltd., trade name, average particle diameter 15 nm, specific surface area 100 m 2 / g, component: Al 2 O 3 ), T805 (manufactured by Nippon Aerosil Co., Ltd.) , Trade name, average particle diameter 20 nm, specific surface area 50 m 2 / g, component: TiO 2 ) and the like.
[0012]
In general, spherical silica powder is widely used as the filler (D) used in the present invention. In addition to silica powder, alumina, silicon nitride, boron nitride, calcium carbonate, aluminum hydroxide, talc and the like can be used, and these can be used alone or in combination of two or more. These can be blended in an amount of 1 to 75% by weight in the resin composition. Among them, those having a low impurity concentration that adversely affect the semiconductor are desirable, and in recent semiconductor sealing applications, it is desirable that the maximum particle size of the filler be 20 μm or less. When the average particle diameter exceeds 20 μm, the coating and filling workability of the obtained liquid sealing material is deteriorated, which is not preferable.
[0013]
In the liquid sealing resin composition of the present invention, a curing accelerator, a flame retardant, a pigment, a dye, a coupling agent, an antifoaming agent and other components are appropriately added and blended within the range not contrary to the object of the present invention. Can do.
[0014]
The liquid sealing resin composition of the present invention can be easily mixed according to a conventional method after sufficiently mixing the above-described components, further kneaded with a three-roll, and then vacuum mixed with a universal mixer. Can be manufactured.
[0015]
[Action]
The liquid sealing resin composition of the present invention is extremely localized by using the component (B) which is a specific epoxy resin curing agent and the component (C) which is a viscosity modifier, such as a connection part of a semiconductor device. Resin sealing can be realized, and high-density mountability of small semiconductor components and semiconductors can be obtained.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
Next, the present invention will be specifically described with reference to examples. The present invention is not limited by these examples. In the following Examples and Comparative Examples, “parts” means “parts by weight”.
[0017]
Example 1
As epoxy resin, 100 parts of YL983U (trade name, manufactured by Japan Epoxy Resin Co., Ltd.) as an epoxy resin, 50 parts of EH4070S (trade name, manufactured by Asahi Denka Co., Ltd., melting point: 80 ° C.), RY200S (Japan) Aerosil product name, average particle size 15 nm, specific surface area 80 m 2 / g, component: SiO 2, 10 parts, SP3B of spherical silica as a filler (trade name, average particle size 3 μm) 50 parts of spherical silica. In addition, a liquid sealing resin composition was produced.
[0018]
Comparative Example 1
As an epoxy resin, YL983U (trade name, manufactured by Japan Epoxy Resin Co., Ltd.) of 100 parts of bisphenol F type epoxy resin, 50 parts of EH4070S (trade name, manufactured by Asahi Denka Co., Ltd., melting point 80 ° C.) as a filler, and as a filler A liquid sealing resin composition was produced by adding 50 parts of spherical silica SP3B (trade name, manufactured by Fuso Chemical Co., Ltd., average particle diameter: 3 μm).
[0019]
Comparative Example 2
100 parts of bisphenol F type epoxy resin YL983U (trade name, manufactured by Japan Epoxy Resin Co., Ltd.) and 100 parts of methylhexahydrophthalic anhydride HN5500 (trade name, manufactured by Hitachi Chemical Co., Ltd.), RY200S (Japan) Product name manufactured by Aerosil Co., Ltd., average particle diameter 15 nm, specific surface area 80 m 2 / g, component: SiO 2, 10 parts, spherical silica SP3B as filler (trade name, average particle diameter 3 μm) 100 parts, cured A liquid sealing resin composition was produced by adding 1 part of 2-ethyl-4-methylimidazole as an accelerator.
[0020]
Comparative Example 3
As epoxy resin, 100 parts of bisphenol F type epoxy resin YL983U (trade name, manufactured by Japan Epoxy Resin Co., Ltd.), 100 parts of methylhexahydrophthalic anhydride HN5500 (trade name, manufactured by Hitachi Chemical Co., Ltd.), as filler A liquid sealing resin composition was produced by adding 100 parts of spherical silica SP3B (trade name, manufactured by Fuso Chemical Co., Ltd., average particle diameter: 3 μm) and 1 part of 2-ethyl-4-methylimidazole as a curing accelerator.
[0021]
The properties of the one-part epoxy resin liquid sealing resin composition produced according to Example 1 and Comparative Examples 1 to 3 were tested, and the results are shown in Table 1.
[0022]
[Table 1]
[0023]
Shape change rate after curing = (diameter after curing / diameter immediately after application) × 100,
The shape change rate when there is no change is 100%.
[0024]
* 2: The oozing distance of the liquid resin component spreading further from the end of the cured resin was measured.
[0025]
* 3: Time required for the viscosity to increase to twice the initial viscosity at 25 ° C.
[0026]
From Table 1, the liquid encapsulating resin composition obtained in Example 1 has less spread and blurring at the time of thermosetting and very excellent shape maintainability as compared with the liquid encapsulating resin composition of Comparative Example. ing. Further, the usable time at room temperature is very long and excellent in workability.
【The invention's effect】
As is apparent from the above description and Table 1, according to the liquid sealing resin composition of the present invention, local sealing or fixing of the semiconductor component is realized, and high-density mounting of the semiconductor component is possible. I was able to. .
Claims (2)
装置局部が樹脂封止されてなることを特徴とする半導体封止装置。By the one-component epoxy sealing resin composition according to claim 1,
A semiconductor sealing device, wherein a device local part is resin-sealed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002104607A JP4033257B2 (en) | 2002-04-08 | 2002-04-08 | Liquid sealing resin composition and semiconductor sealing device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002104607A JP4033257B2 (en) | 2002-04-08 | 2002-04-08 | Liquid sealing resin composition and semiconductor sealing device |
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| Publication Number | Publication Date |
|---|---|
| JP2003292579A JP2003292579A (en) | 2003-10-15 |
| JP4033257B2 true JP4033257B2 (en) | 2008-01-16 |
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| JP2002104607A Expired - Fee Related JP4033257B2 (en) | 2002-04-08 | 2002-04-08 | Liquid sealing resin composition and semiconductor sealing device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007077333A (en) * | 2005-09-15 | 2007-03-29 | Hitachi Chem Co Ltd | Manufacturing method of epoxy resin molding material for sealing, epoxy resin molding material for sealing and electronic part unit |
| US20080153963A1 (en) * | 2006-12-22 | 2008-06-26 | 3M Innovative Properties Company | Method for making a dispersion |
| JP2013100403A (en) * | 2011-11-08 | 2013-05-23 | Taoka Chem Co Ltd | One-component epoxy resin composition |
| KR20220152583A (en) | 2016-10-14 | 2022-11-16 | 쇼와덴코머티리얼즈가부시끼가이샤 | Resin composition for sealing, electronic component device and method for producing electronic component device |
| KR20200141990A (en) * | 2018-04-13 | 2020-12-21 | 쇼와덴코머티리얼즈가부시끼가이샤 | Sealing resin composition, electronic component device, and manufacturing method of electronic component device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5742760A (en) * | 1980-08-26 | 1982-03-10 | Nitto Electric Ind Co Ltd | Epoxy resin composition |
| JPH07119273B2 (en) * | 1990-05-30 | 1995-12-20 | ソマール株式会社 | Method for producing epoxy resin composition |
| JP3351060B2 (en) * | 1993-11-09 | 2002-11-25 | 松下電器産業株式会社 | Adhesive for forming electronic circuit and method of applying adhesive |
| JP3195187B2 (en) * | 1994-03-31 | 2001-08-06 | ソマール株式会社 | Epoxy resin composition for dispenser application |
| JP3310557B2 (en) * | 1996-10-28 | 2002-08-05 | 住友ベークライト株式会社 | Liquid resin composition for flow stop frame and semiconductor device using the same |
| JP3887795B2 (en) * | 2000-03-27 | 2007-02-28 | 株式会社アサヒ化学研究所 | Plastisol composition |
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