JP2002145985A - Liquid sealing resin composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid sealing resin composition which gives a cured product having a low glass transition point and a low elastic modulus, can reduce the warpage of the cured product, and is suitable for the liquid sealing of semiconductors. SOLUTION: This liquid sealing resin composition is characterized by containing as essential components (A) an epoxy resin containing an alkyl type bifunctional epoxy resin, a such as 1,6-hexanediol diglycidyl ether, (B) a curing agent such as a novolak phenolic resin, (C) a curing accelerator, and (D) a filler. The alkyl type bifuncitonal epoxy resin is preferably added in an amount of 5 to 40 wt.% in (A) the epoxy resin.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a one-part liquid sealing resin composition suitably used for liquid sealing of semiconductors and the like.

[0002]

2. Description of the Related Art In recent years, the form of sealing and mounting a semiconductor package has been tending to be light and thin. Accordingly, BGA and CSP have been developed in order to further reduce the size of the package from QFP and SOP. Unlike QFPs and SOPs which are transfer-molded, BGAs have single-sided sealing, so that package warpage is likely to occur. If the package warps, there is a problem that mounting reliability is inferior. Further, in a molding method called MAP (matrix array package), which is recently studied, in which a large number of chips are collectively sealed and cut later, the package warpage becomes more severe.

[0003]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and reduces the internal stress in the cooling process after heat-curing of a resin by lowering the glass transition point of the resin. An object of the present invention is to provide a liquid encapsulating resin composition that provides a small amount of semiconductor package.

[0004]

Means for Solving the Problems As a result of diligent research aimed at achieving the above object, the present inventor has found that by using an epoxy resin mixed with an alkyl-type bifunctional epoxy resin at an arbitrary ratio, The inventors have found that the above objects can be achieved, and have completed the present invention.

That is, the present invention is characterized in that (A) an epoxy resin containing an alkyl-type bifunctional epoxy resin, (B) a curing agent, (C) a curing accelerator and (D) a filler are essential components. It is a one-part liquid sealing resin composition.

Hereinafter, the present invention will be described in detail.

The alkyl type bifunctional epoxy resin contained in the epoxy resin (A) used in the present invention is an epoxy resin which is an alkanediol diglycidyl ether, for example, 1,6-hexanediol diglycidyl ether,
Neopentanediol diglycidyl ether, (poly)
Examples include ethylene glycol diglycidyl ether and (poly) propylene glycol diglycidyl ether.

The mixing ratio of these alkyl-type bifunctional epoxy resins is preferably 5 to 40% by weight in the epoxy resin (A). When the proportion of the alkyl-type bifunctional epoxy resin is less than 5% by weight, the effect of reducing the internal stress is small, and when it exceeds 40% by weight, the curing speed of the resin becomes extremely slow, which is not preferable.

The epoxy resin other than the alkyl type bifunctional epoxy resin in the epoxy resin (A) used in the present invention may be a curable liquid epoxy resin having two or more epoxy groups in one molecule. For example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AD type epoxy resin, novolak type epoxy resin, glycidyl ester type epoxy resin, alicyclic epoxy resin and the like are preferable, and these epoxy resins are preferably They can be used alone or in combination of two or more.

In addition to the above-mentioned epoxy resins, a reaction between a heterocyclic epoxy resin, a hydrogenated bisphenol A type epoxy resin, an aliphatic epoxy resin, an aromatic, aliphatic or alicyclic carboxylic acid and epichlorohydrin. The epoxy resin, spiro ring-containing epoxy resin and the like obtained by the above method may be used in combination as appropriate.

As the curing agent (B) used in the present invention, any curing agent capable of reacting with the above-mentioned (A) epoxy resin and curing can be used, for example, methylhexahydrophthalic anhydride, Novolak-type phenol resins, phthalic anhydride derivatives, and the like. These can be used alone or as a mixture of two or more as long as curing is not inhibited.

The (C) curing accelerator used in the present invention includes 1-benzyl-2-phenylimidazole, 2-heptadecylimidazole, 2-phenyl-4,5-dihydroxyimidazole, 2-phenyl-4-methyl- 5
-Hydroxymethylimidazole, 2,4-diamino-
6- [2-methylimidazolyl- (1)]-ethyl-s
-Triazine, 1-cyanoethyl-2-undecylimidazole, 2-ethyl-4-methylimidazole, 1,
Amine compounds such as 8-diazabicyclo [5,4,0] undecene-7, triphenylphosphine, tris-
And phosphine-based compounds such as (2,6-dimethoxyphenyl) phosphine.

As the filler (E) used in the present invention, fused silica, pulverized silica, talc, calcium carbonate, aluminum hydroxide and the like can be mentioned. Silica is desirable, and these can be used alone or as a mixture of two or more kinds in an arbitrary amount.

The liquid sealing resin composition of the present invention comprises, as essential components, an epoxy resin containing the above-mentioned alkyl type bifunctional epoxy resin, a curing agent, a curing accelerator and a filler. A flame retardant, a coupling agent, an antifoaming agent, a pigment, a dye, and other components can be appropriately added and blended within a range that does not impair.

The resin composition for liquid encapsulation of the present invention is prepared by thoroughly mixing the above-mentioned components, kneading with a three-roll mill, and vacuum-mixing with a universal mixer or the like according to a conventional method. And can be easily manufactured.

[0016]

The liquid encapsulating resin composition of the present invention can be used conventionally by using an epoxy resin containing the above-mentioned alkyl-type bifunctional epoxy resin, a curing agent, a curing accelerator and a filler as essential components. It has become possible to provide a liquid sealing resin composition having a smaller amount of warpage than a general-purpose resin composition.

[0017]

Next, the present invention will be specifically described with reference to examples. The present invention is not limited by these examples. In the following Examples and Comparative Examples, “parts” means “parts by weight”.

Example 1 Bisphenol F type epoxy resin YL983U (trade name, manufactured by Yuka Shell Co., Ltd.) 80 parts, 1,6-hexanediol diglycidyl ether 20 parts, phenol resin MEH
8000 (manufactured by Meiwa Kasei Co., Ltd., 83 parts), fused silica (average particle size: 7 μm) 200 parts, coupling agent A-18
7 (manufactured by Nippon Unicar, trade name) and 10 parts of a curing accelerator Novacure HX3941 (manufactured by Asahi Chemical Industry Co., Ltd.) were kneaded and vacuum degassed to produce a liquid sealing resin composition. .

Example 2 100 parts of bisphenol F type epoxy resin YL983U (trade name, manufactured by Yuka Shell Co., Ltd.), 20 parts of polypropylene glycol diglycidyl ether, ME of phenol resin
83 parts of H8000 (trade name, manufactured by Meiwa Kasei Co., Ltd.), 200 parts of fused silica (average particle size: 7 μm), coupling agent A-1
87 (manufactured by Nippon Unicar Co., Ltd., 2.0 parts) and 10 parts of a hardening accelerator Novacure HX3941 (manufactured by Asahi Kasei Kogyo Co., Ltd.) were kneaded, and vacuum degassed to produce a liquid sealing resin composition. .

Comparative Example 1 100 parts of bisphenol F type epoxy resin YL983U (trade name, manufactured by Yuka Shell Co., Ltd.) and MEH of phenol resin
8000 (manufactured by Meiwa Kasei Co., Ltd., 83 parts), fused silica (average particle size: 7 μm) 200 parts, coupling agent A-18
7 (manufactured by Nippon Unicar, trade name) and 10 parts of a curing accelerator Novacure HX3941 (manufactured by Asahi Chemical Industry Co., Ltd.) were kneaded and vacuum degassed to produce a liquid sealing resin composition. .

The liquid sealing resin compositions prepared in Examples 1 and 2 and Comparative Example 1 were cured by heating. The properties of these liquid and cured products (viscosity, glass transition point, elastic modulus, warpage) were tested. A 15 mm square chip having a thickness of 350 μm or 3 mm
A 0 mm square, 0.4 mm thick FR-5 substrate was applied and cured by heating (150 ° C. × 1 hr). After cooling, the amount of warpage was measured. Table 1 summarizes these evaluation results.

[0022]

[Table 1] From Table 1, the liquid sealing resin composition obtained in the examples,
It was confirmed that a cured product having a lower glass transition point and a lower elastic modulus than that of the comparative example was obtained, and the amount of warpage could be reduced.

[0023]

As apparent from the above description and Table 1, the liquid encapsulating resin composition of the present invention has a small warpage due to the compounding of the alkyl type bifunctional epoxy resin. A composition could be obtained. Therefore, according to the liquid sealing resin composition of the present invention, a highly reliable semiconductor device can be obtained.

Continued on the front page F-term (reference) 4J002 CC033 CD01X CD05W DE148 DE238 DJ018 DJ048 EL136 EU117 EU137 EU187 EW147 FA088 FD018 FD143 FD146 FD157 GQ05 4J036 AA01 AA05 AB01 AB10 AD08 DB21 DB22 DC40 DC45 DC46 DD07 FA03 FA05 FB08 JA03 4 EB04 EB13 EC04

Claims (1)

[Claims] 1. A liquid sealing composition comprising (A) an epoxy resin containing an alkyl type bifunctional epoxy resin, (B) a curing agent, (C) a curing accelerator, and (D) a filler as essential components. Resin composition.