JP2010118649A - Liquid resin composition for sealing, and electronic component device using the same - Google Patents

Liquid resin composition for sealing, and electronic component device using the same Download PDF

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Publication number
JP2010118649A
JP2010118649A JP2009233637A JP2009233637A JP2010118649A JP 2010118649 A JP2010118649 A JP 2010118649A JP 2009233637 A JP2009233637 A JP 2009233637A JP 2009233637 A JP2009233637 A JP 2009233637A JP 2010118649 A JP2010118649 A JP 2010118649A
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JP
Japan
Prior art keywords
sealing
resin composition
liquid resin
sh
eh
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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JP2009233637A
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Japanese (ja)
Inventor
Daisuke Kiba
Atsushi Kuwano
Naoya Suzuki
大輔 木庭
敦司 桑野
直也 鈴木
Original Assignee
Hitachi Chem Co Ltd
日立化成工業株式会社
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Publication date
Priority to JP2008267398 priority Critical
Application filed by Hitachi Chem Co Ltd, 日立化成工業株式会社 filed Critical Hitachi Chem Co Ltd
Priority to JP2009233637A priority patent/JP2010118649A/en
Publication of JP2010118649A publication Critical patent/JP2010118649A/en
Pending legal-status Critical Current

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