JP2933243B2 - Liquid epoxy resin composition - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an epoxy resin composition. More specifically, the present invention relates to an epoxy resin composition as a semiconductor encapsulant for COG (chip on glass) and a cured product thereof.

[0002]

2. Description of the Related Art Conventionally, a driving LSI for a liquid crystal panel has been
AB (Tape Automated Bonding) mounting was often used, but as the density has increased in recent years, LS
COG (chip-on-glass) mounting, in which I is directly mounted on a glass substrate, has been studied and some of them have been put to practical use. This COG mounting is LSI with bump (projection electrode)
By connecting the (flip chip) and the transparent electrode on the glass substrate with a conductive adhesive, a gap is formed between the glass substrate and the LSI by the height of the bump. Usually this gap is 2
0-100 microns. In order to fix the LSI and protect it from moisture and the like, a method of sealing the gap with a sealing agent such as an epoxy resin has been adopted. However, conventional semiconductor encapsulants generally have high viscosities and are difficult to completely flow into small gaps, and are not suitable for such purposes.
In addition, even in the case of a low-viscosity epoxy resin, entrapment of air bubbles is apt to occur, and a cured product having resistance to moisture and heat shock has not been obtained.

[0003]

It is desired to develop a resin which is excellent in moisture resistance and heat shock of a cured product and is suitable for a sealant for COG mounting.

[0004]

Means for Solving the Problems The present inventors have made intensive studies to solve the above-mentioned problems, and as a result, have completed the present invention. That is, the present invention provides: a. Resorcinol diglycidyl ether 30-7
0% by weight Alicyclic diepoxycarboxylate 30
Epoxy resin consisting of ~ 70 wt% b. Acid anhydride curing agent c. An epoxy resin composition containing spherical silica having an average particle diameter of 0.1 to 5 microns and a cured product obtained by curing the same.

[0005] The epoxy resin used in the present invention comprises a mixture of resorcinol diglycidyl ether and alicyclic diepoxycarboxylate as described above. Alicyclic diepoxy carboxylate is commercially available, for example, under the trade name Celloxide (manufactured by Daicel Chemical Industries, Ltd.). Both epoxy resins are low-viscosity epoxy resins that show relatively excellent cured physical properties, but the former are heat-resistant,
The latter has some difficulty in moisture resistance, and the latter has excellent heat resistance and moisture resistance, but has poor heat shock resistance. It has been found that by mixing the two at the above-mentioned ratio, the disadvantage can be improved without impairing the advantages. The mixing ratio of the two is arbitrary within the above-described range, but preferably a mixture of the two at a ratio of 1: 1 is preferable as the epoxy resin for the COG sealant.

Next, examples of the acid anhydride curing agent used in the present invention include, for example, methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methylnadic anhydride, and the like. . The amount of the acid anhydride curing agent used is usually 0.8 to 1.1 chemical equivalents to the epoxy resin, preferably 0.9 to 1.1.
1.0 chemical equivalent.

Next, the spherical silica used in the present invention has an average particle size of 5 to 0.1 micron, preferably 0.5 to 2 micron. Spherical silica is used in the epoxy resin composition of the present invention so as to preferably contain 25 to 50% by weight, more preferably 30 to 40% by weight. If the amount of the spherical silica used is larger than the above-mentioned amount, the viscosity of the epoxy resin composition becomes high, the flowability becomes insufficient, and the operation becomes slightly difficult. On the other hand, when the amount is less than the above-mentioned amount, the cured product of the epoxy resin composition of the present invention is unfavorably reduced in moisture resistance.

[0008] The epoxy resin composition of the present invention is usually cured using a curing accelerator. Examples of the curing accelerator include imidazoles, trisdimethylaminomethylphenol, triphenylphosphine, 1,8-diazabicyclo (5,
4,0) undecene-7 (DBU) and salts thereof can be used in any amount, but it is usually used in an amount of 0.5 to 5.0, preferably 1 to 3 parts by weight per 100 parts of the epoxy resin.

The epoxy resin composition of the present invention is characterized in that
It can be easily produced by uniformly stirring a predetermined amount of a resin composed of a kind of epoxy compound and predetermined amounts of an acid anhydride curing agent, silica powder and a curing accelerator with a vacuum kneader or the like. The cured product of the epoxy resin composition of the present invention can be obtained by curing at 80 to 170C, preferably 100 to 150C for 1 to 6 hours.

[0010]

The present invention will be described in more detail with reference to the following examples. Example 1 Resosilcinol diglycidyl ether (RGE-H,
Nippon Kayaku Co., Ltd., epoxy equivalent 122) 50g, alicyclic diepoxycarboxylate (celloxide,
50 g, Epoxy equivalent 135, manufactured by Daicel Chemical Co., Ltd., methylhexahydrophthalic anhydride (Ricacid MH-70)
0, manufactured by Shin-Nippon Rika Co., Ltd.) and 1.0 g of trisdimethylaminomethylphenol were uniformly mixed with a vacuum kneader. Next, 96 g of spherical silica having an average particle size of 0.5 μm (Esquares 20005, manufactured by Nippon Steel Chemical Co., Ltd.) was added thereto, and the mixture was stirred while being degassed under vacuum until uniform, to obtain 300 g of the epoxy resin composition of the present invention. (Viscosity 2500 centipoise at 25 ° C)

Performance test Using an LSI flip chip (5 mm × 10 mm, pump height: 50 μm) mounted on a glass substrate, sealing with the epoxy resin composition obtained above, the glass substrate and the LSI flip chip Resistance test (humidity 85%, temperature 85 ° C, 500 hours) and heat cycle test (125 ° C to -55 ° C,
(Repeated 1000 times). As a result, the flowability into the gap was good and no entrapment of air bubbles was observed. No abnormality was observed in both the moisture resistance test and the heat cycle test.

Example 2 Methylhexahydrophthalic anhydride 1 used in Example 1
Using 132 g of methylnadic anhydride instead of 20 g,
Otherwise in the same manner as in Example 1, 310 g of the epoxy resin composition of the present invention was obtained. (A viscosity of 9000 centipoise at 25 ° C.) A performance test was performed in the same manner as in Example 1 using the epoxy resin composition thus obtained. As a result, the flowability into the gap was good, and no entrapment of air bubbles was observed. There were no abnormalities in both the moisture resistance test and the heat cycle test.

Example 3 An epoxy resin composition of 300 g was prepared in the same manner as in Example 1 except that the amount of the epoxy resin used in Example 1 was changed to 70 g of resorcinol diglycidyl ether and 30 g of alicyclic diepoxycarboxylate. (2
(Viscosity at 5 ° C., 2900 centipoise) As a result of performing the same performance test as in Example 1, the flowability into the gap was good, and there was no abnormality in the moisture resistance and the heat cycle test.

Example 4 Methylhexahydrophthalic anhydride 1 used in Example 1
Instead of 20 g, 125 g of methyltetrahydrophthalic anhydride (pentahard 5000, manufactured by Tonenka Chemical Co., Ltd.), and 96 g of spherical silica having an average particle size of 0.5 μm, and an average particle size of 1
315 g of an epoxy resin composition of the present invention was obtained in the same manner as in Example 1 except that 100 g of micron spherical silica (Esquares 2001, manufactured by Nippon Steel Chemical Co., Ltd.) was used. (25 ° C
As a result of performing the same performance test as in Example 1, the flowability into the gap was good, and there was no difference between the moisture resistance and the heat cycle test.

Comparative Example 1 In place of the epoxy resin used in Example 1, 100 g of bisphenol A diglycidyl ether (Epicoat 828, manufactured by Yuka Shell Co., epoxy equivalent: 185) was added to 90 g of 120 g of methylhexahydrophthalic anhydride, An epoxy resin composition (250 g) was obtained in the same manner as in Example 1 except that the spherical silica (96 g) was changed to 81 g. (25 ° C viscosity 2
(5,000 centipoise) An attempt was made to perform a performance test in the same manner as in Example 1. However, the flow into the gap was poor, and sealing could not be performed.

[0016]

The epoxy resin composition of the present invention has a viscosity of C.I. O. G. FIG. It is suitable as a sealant for mounting, and flows well during sealing and does not generate bubbles. Further, the cured product has excellent moisture resistance and heat shock resistance.

──────────────────────────────────────────────────の Continuation of the front page (51) Int.Cl. ⁶ Identification code FI H01L 23/31 (56) References JP-A-3-9920 (JP, A) JP-A-62-164675 (JP, A) JP-A-63-12623 (JP, A) JP-A-63-15817 (JP, A) Epoxy resin handbook, edited by Masaki Shinbo (1st edition first edition issued on December 25, 1987) Nikkan Kogyo Shimbun, No. 77 ~ 81 pages (58) Investigated field (Int.Cl. ⁶ , DB name) C08G 59/24 C08G 59/42 C08L 63/00-63/10 C08K 3/36 H01L 23/29

Claims (2)

(57) [Claims] 1. A method according to claim 1, Resorcinol diglycidyl ether 30-70% by weight Alicyclic diepoxycarboxylate 30-7
Epoxy resin consisting of 0% by weight b. Acid anhydride curing agent c. An epoxy resin composition containing spherical silica having an average particle size of 0.1 to 5 microns. 2. A cured product obtained by curing the epoxy resin composition according to claim 1.