JPH04337317A - Liquid epoxy resin composition - Google Patents
Liquid epoxy resin compositionInfo
- Publication number
- JPH04337317A JPH04337317A JP13867791A JP13867791A JPH04337317A JP H04337317 A JPH04337317 A JP H04337317A JP 13867791 A JP13867791 A JP 13867791A JP 13867791 A JP13867791 A JP 13867791A JP H04337317 A JPH04337317 A JP H04337317A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- silica powder
- diglycidyl ether
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 26
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 title abstract 2
- 239000003822 epoxy resin Substances 0.000 claims abstract description 32
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 32
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 28
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 13
- 239000000843 powder Substances 0.000 claims abstract description 9
- 125000002723 alicyclic group Chemical group 0.000 claims abstract description 8
- 150000008065 acid anhydrides Chemical class 0.000 claims abstract description 7
- UUODQIKUTGWMPT-UHFFFAOYSA-N 2-fluoro-5-(trifluoromethyl)pyridine Chemical compound FC1=CC=C(C(F)(F)F)C=N1 UUODQIKUTGWMPT-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000002245 particle Substances 0.000 claims abstract description 6
- 150000007942 carboxylates Chemical class 0.000 claims description 5
- LYWVNPSVLAFTFX-UHFFFAOYSA-N 4-methylbenzenesulfonate;morpholin-4-ium Chemical compound C1COCCN1.CC1=CC=C(S(O)(=O)=O)C=C1 LYWVNPSVLAFTFX-UHFFFAOYSA-N 0.000 claims description 2
- 239000011521 glass Substances 0.000 abstract description 8
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 abstract description 6
- 239000000758 substrate Substances 0.000 abstract description 6
- 239000003795 chemical substances by application Substances 0.000 abstract description 5
- XYXBMCIMPXOBLB-UHFFFAOYSA-N 3,4,5-tris(dimethylamino)-2-methylphenol Chemical compound CN(C)C1=CC(O)=C(C)C(N(C)C)=C1N(C)C XYXBMCIMPXOBLB-UHFFFAOYSA-N 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 239000011342 resin composition Substances 0.000 abstract 1
- 239000003566 sealing material Substances 0.000 abstract 1
- 238000012360 testing method Methods 0.000 description 8
- 238000011056 performance test Methods 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 230000005856 abnormality Effects 0.000 description 4
- 239000000565 sealant Substances 0.000 description 4
- 230000035939 shock Effects 0.000 description 4
- LTVUCOSIZFEASK-MPXCPUAZSA-N (3ar,4s,7r,7as)-3a-methyl-3a,4,7,7a-tetrahydro-4,7-methano-2-benzofuran-1,3-dione Chemical compound C([C@H]1C=C2)[C@H]2[C@H]2[C@]1(C)C(=O)OC2=O LTVUCOSIZFEASK-MPXCPUAZSA-N 0.000 description 2
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- FKBMTBAXDISZGN-UHFFFAOYSA-N 5-methyl-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1C(C)CCC2C(=O)OC(=O)C12 FKBMTBAXDISZGN-UHFFFAOYSA-N 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、エポキシ樹脂組成物に
関する。更に詳しくはＣＯＧ（チップオングラス）用半
導体封止剤としてのエポキシ樹脂組成物及びその硬化物
に関する。FIELD OF THE INVENTION This invention relates to epoxy resin compositions. More specifically, the present invention relates to an epoxy resin composition as a semiconductor encapsulant for COG (chip-on-glass) and a cured product thereof.
【０００２】0002
【従来の技術】液晶パネルの駆動ＬＳＩの実装は従来Ｔ
ＡＢ（テープオートメーテイドボンデイング）実装が多
く採用されていたが、近年高密度化が進むにれて、ＬＳ
Ｉを直接ガラス基板に実装するＣＯＧ（チップオングラ
ス）実装が検討されるようになり一部実用化されている
。このＣＯＧ実装はバンプ（突起電極）付きＬＳＩ（フ
リップチップ）とガラス基板上の透明電極とを導電性接
着剤で接続する方法で、ガラス基板とＬＳＩとの間にバ
ンプの高さだけの隙間を生ずる。通常この隙間は２０〜
１００ミクロンである。ＬＳＩの固定と湿気等から保護
するためこの隙間をエポキシ樹脂等の封止剤で封止する
方法がとられている。しかしながら、従来の半導体封止
剤では、一般に粘度が高く、小さな隙間に完全に流し込
むことが困難でこのような目的の為には適さない。
また低粘度のエポキシ樹脂の場合にも気泡の巻込みが生
じ易く、又その硬化物が耐湿性やヒートショックに耐え
るものが得られていない。[Prior art] The mounting of the driving LSI for the liquid crystal panel is conventional
AB (tape automated bonding) mounting was often used, but as density increases in recent years, LS
COG (chip-on-glass) mounting, in which I is directly mounted on a glass substrate, has been considered and has been put into practical use in some cases. This COG mounting is a method of connecting an LSI (flip chip) with bumps (protruding electrodes) and transparent electrodes on a glass substrate using conductive adhesive, leaving a gap equal to the height of the bumps between the glass substrate and the LSI. arise. Usually this gap is 20~
It is 100 microns. In order to fix the LSI and protect it from moisture, etc., this gap is sealed with a sealant such as epoxy resin. However, conventional semiconductor encapsulants generally have a high viscosity and are difficult to completely pour into small gaps, making them unsuitable for such purposes. Furthermore, even in the case of a low-viscosity epoxy resin, air bubbles are likely to be trapped, and the cured product thereof has not been found to be moisture resistant or resistant to heat shock.
【０００３】0003
【発明が解決しようとする課題】硬化物の耐湿性、ヒー
トショック性が優れＣＯＧ実装用封止剤に適した樹脂の
開発が望まれている。Problems to be Solved by the Invention There is a desire for the development of a resin that has excellent moisture resistance and heat shock resistance as a cured product and is suitable as a sealant for COG mounting.
【０００４】0004
【課題を解決するための手段】本発明者らは前記した課
題を解決すべく鋭意研究を重ねた結果、本発明を完成さ
せたものである。即ち本発明は
ａ．レゾルシノールジグリシジルエーテル
３０〜７０重量％ アリサイクリックジエポ
キシカルボキシレート ３０〜７０重量％
からなるエポキシ樹脂
ｂ．酸無水物硬化剤ｃ．平均粒径０．１〜５ミクロンの
シリカ粉末を含有するエポキシ樹脂組成物及びこれを硬
化して得られる硬化物を提供するものである。[Means for Solving the Problems] The present inventors have completed the present invention as a result of extensive research to solve the above-mentioned problems. That is, the present invention has the following features: a. Resorcinol diglycidyl ether
30-70% by weight Alicyclic diepoxy carboxylate 30-70% by weight
an epoxy resin consisting of b. Acid anhydride curing agent c. The present invention provides an epoxy resin composition containing silica powder with an average particle size of 0.1 to 5 microns, and a cured product obtained by curing the same.
【０００５】本発明で使用するエポキシ樹脂は前記した
ようにレゾルシノールジグリシジルエーテルとアリサイ
クリックジエポキシカルボキシレートの混合物からなる
。アリサイクリックジエポキシカボキシレートは例えば
商品名セロキサイド（ダイセル化学社製）の名で市販さ
れている。両エポキシ樹脂とも低粘度で比較的優れた硬
化物性を示すエポキシ樹脂であるが、前者は耐熱性、耐
湿性にやや難があり、後者は耐熱性及び耐湿性には優れ
るものの耐ヒートショック性に難がある。両者を前記し
た比率で混合することにより長所を損なうことなく欠点
を改良できることが判った。両者の混合比率は前記した
範囲で任意であるが、好ましくは１：１の比率で混合し
たものがＣＯＧ用封止剤用エポキシ樹脂として好ましい
。As mentioned above, the epoxy resin used in the present invention is composed of a mixture of resorcinol diglycidyl ether and alicyclic diepoxy carboxylate. Alicyclic diepoxy carboxylate is commercially available, for example, under the trade name Celoxide (manufactured by Daicel Chemical Co., Ltd.). Both epoxy resins have low viscosity and relatively excellent cured properties, but the former has some difficulty in heat resistance and moisture resistance, and the latter has excellent heat and moisture resistance, but has poor heat shock resistance. There is a problem. It has been found that by mixing both in the above-mentioned ratio, the defects can be improved without sacrificing the advantages. Although the mixing ratio of both is arbitrary within the above-mentioned range, a mixture of the two at a ratio of 1:1 is preferable as the epoxy resin for the sealant for COG.
【０００６】次に本発明で使用する酸無水物硬化剤の例
としては例えばメチルヘキサヒドロ無水フタル酸、メチ
ルテトラヒドロ無水フタル酸、テトラヒドロ無水フタル
酸ヘキサヒドロ無水フタル酸、無水メチルナジック酸等
が挙げられる。酸無水物硬化剤の使用量は通常エポキシ
樹脂に対し０．８〜１．１化学当量好ましくは０．９〜
１．０化学当量である。Examples of acid anhydride curing agents used in the present invention include methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, and methylnadic anhydride. . The amount of acid anhydride curing agent used is usually 0.8 to 1.1 chemical equivalent to the epoxy resin, preferably 0.9 to 1.1.
It is 1.0 chemical equivalent.
【０００７】次に本発明で使用するシリカ粉末は平均粒
径５〜０．１ミクロン好ましくは０．５〜２ミクロンの
平均粒径を有するシリカ粉末で前記した隙間への流れ込
み性から球状シリカが好ましい。シリカ粉末は本発明の
エポキシ樹脂組成物の中に好ましくは２５〜５０重量％
より好ましくは３０〜４０重量％含まれるように使用さ
れる。使用するシリカ粉末の使用量が前記した量より多
い場合エポキシ樹脂組成物の粘度が高くなり流れ込み性
が不充分となり作業がやや困難になる。また使用量が前
記した量より少ない場合、本発明のエポキシ樹脂組成物
の硬化物の耐湿性の低下が認められ好ましくない。Next, the silica powder used in the present invention has an average particle size of 5 to 0.1 microns, preferably 0.5 to 2 microns, and the spherical silica powder has the ability to flow into the gaps described above. preferable. The silica powder is preferably 25 to 50% by weight in the epoxy resin composition of the present invention.
More preferably, it is used in an amount of 30 to 40% by weight. If the amount of silica powder used is greater than the above-mentioned amount, the viscosity of the epoxy resin composition will increase, resulting in insufficient flowability and making work somewhat difficult. Moreover, if the amount used is less than the above-mentioned amount, a decrease in moisture resistance of the cured product of the epoxy resin composition of the present invention is observed, which is not preferable.
【０００８】本発明のエポキシ樹脂組成物は通常硬化促
進剤を用いて硬化する。硬化促進剤の例としてはイミダ
ゾール類、トリスジメチルアミノメチルフェノール、ト
リフェニルホスフィン、１，８−ジアザビシクロ（５，
４，０）ウンデセン−７ （ＤＢＵ）及びその塩類が挙
げられ、使用量は任意であるが通常エポキシ樹脂１００
部に対し０．５〜５．０好ましくは１〜３重量部用いる
。The epoxy resin composition of the present invention is usually cured using a curing accelerator. Examples of curing accelerators include imidazoles, trisdimethylaminomethylphenol, triphenylphosphine, 1,8-diazabicyclo(5,
4,0) Undecene-7 (DBU) and its salts are mentioned, and the amount used is arbitrary, but usually epoxy resin 100
0.5 to 5.0 parts by weight, preferably 1 to 3 parts by weight.
【０００９】本発明のエポキ樹脂組成物は、前記した２
種のエポキシ化合物からなる樹脂の所定量と酸無水物硬
化剤、シリカ粉末及び硬化促進剤の所定量を真空ニーダ
等で均一に攪拌することにより容易に製造できる。本発
明のエポキシ樹脂組成物の硬化物は８０〜１７０℃、好
ましくは１００〜１５０℃で１〜６時間で硬化すること
によってえることが出来る。The epoxy resin composition of the present invention has the above-mentioned 2 properties.
It can be easily produced by uniformly stirring a predetermined amount of a resin made of a certain epoxy compound, an acid anhydride curing agent, a silica powder, and a curing accelerator using a vacuum kneader or the like. A cured product of the epoxy resin composition of the present invention can be obtained by curing at 80 to 170°C, preferably 100 to 150°C, for 1 to 6 hours.
【００１０】0010
【実施例】以下に実施例をあげ本発明を更に詳しく説明
する。
実施例１
レゾシルシノールジグリシジルエーテル（ＲＧＥ−Ｈ、
日本化薬社製、エポキシ当量１２２）５０ｇ、アリサイ
クリックジエポキシカルボキシレート（セロキサイド、
ダイセル化学社製、エポキシ当量１３５）５０ｇ、メチ
ルヘキサヒドロ無水フタル酸（リカシッドＭＨ−７００
、新日本理化社製）１２０ｇ、及びトリスジメチルアミ
ノメチルフェノール１．０ｇを真空ニーダで均一に混合
した。次いで平均粒径０．５ミクロンの球状シリカ（エ
スクオーツ２０００５、新日鉄化学社製）９６ｇを加え
真空で脱気しながら均一になるまで攪拌して本発明のエ
ポキシ樹脂組成物３００ｇを得た。（２５℃の粘度２５
００センチポイズ）[Examples] The present invention will be explained in more detail with reference to Examples below. Example 1 Resosircinol diglycidyl ether (RGE-H,
Nippon Kayaku Co., Ltd., epoxy equivalent 122) 50g, alicyclic diepoxycarboxylate (celloxide,
Daicel Chemical Co., Ltd., epoxy equivalent: 135) 50g, methylhexahydrophthalic anhydride (Rikacid MH-700)
(manufactured by Shin Nihon Rika Co., Ltd.) and 1.0 g of trisdimethylaminomethylphenol were uniformly mixed in a vacuum kneader. Next, 96 g of spherical silica (S-QUARTZ 20005, manufactured by Nippon Steel Chemical Co., Ltd.) having an average particle size of 0.5 microns was added and stirred until uniform while degassing in a vacuum to obtain 300 g of the epoxy resin composition of the present invention. (Viscosity at 25℃ 25
00 centipoise)
【００１１】性能試験ガラス基板上に搭載したＬＳＩフ
リップチップ（５ｍｍ×１０ｍｍ、パンプの高さ５０ミ
クロン）を用いて上記で得られたエポキシ樹脂組成物で
封止を行い、ガラス基板とＬＳＩフリップチップとの隙
間への流れ込みの状態及び１２０℃で５時間硬化した硬
化物の耐湿試験（湿度８５％、温度８５℃、５００時間
）及びヒートサイクルテスト（１２５℃〜−５５℃、１
０００回くり返し）を行った。その結果隙間への流れ込
み性は良好で気泡の巻き込みは認められなかった。また
耐湿試験、ヒートサイクルテストとも異状は認められな
かった。Performance test An LSI flip chip (5 mm x 10 mm, pump height 50 microns) mounted on a glass substrate was sealed with the epoxy resin composition obtained above, and the glass substrate and LSI flip chip were sealed. moisture resistance test (humidity 85%, temperature 85°C, 500 hours) and heat cycle test (125°C to -55°C, 1
000 times) was performed. As a result, the flowability into the gaps was good, and no air bubbles were observed. Further, no abnormalities were observed in the moisture resistance test and heat cycle test.
【００１２】実施例２
実施例１で使用したメチルヘキサヒドロ無水フタル酸１
２０ｇの代りに無水メチルナジック酸１３２ｇを用い、
他は実施例１と同様にして本発明のエポキシ樹脂組成物
３１０ｇを得た。（２５℃の粘度９０００センチポイズ
）こうして得られたエポキシ樹脂組成物を用い実施例１
と同様にして、性能試験を行った。その結果、隙間への
流れ込み性は良好で気泡の巻込みは認められなかった。
また耐湿試験、ヒートサイクルテストとも異状はなかっ
た。Example 2 Methylhexahydrophthalic anhydride 1 used in Example 1
Using 132 g of methylnadic anhydride instead of 20 g,
Otherwise, 310 g of the epoxy resin composition of the present invention was obtained in the same manner as in Example 1. (Viscosity at 25°C: 9000 centipoise) Using the epoxy resin composition thus obtained, Example 1
A performance test was conducted in the same manner. As a result, the flowability into the gaps was good, and no air bubbles were observed. Further, there were no abnormalities in the moisture resistance test and heat cycle test.
【００１３】実施例３
実施例１で使用したエポキシ樹脂の使用量をレゾルシノ
ールジグリシジルエーテル７０ｇ、アリサイクリックジ
エポキシカルボキシレート３０ｇに代えた他は、実施例
１と同様にしてエポキシ樹脂組成物３００ｇを得た（２
５℃の粘度２９００センチポイズ）実施例１と同様の性
能試験を行った結果、隙間への流れ込み性は良好で耐湿
性及びヒートサイクルテストとも異状はなかった。Example 3 300 g of an epoxy resin composition was prepared in the same manner as in Example 1, except that the amount of epoxy resin used in Example 1 was replaced with 70 g of resorcinol diglycidyl ether and 30 g of alicyclic diepoxy carboxylate. I got (2
As a result of performing the same performance test as in Example 1 (viscosity at 5° C.: 2900 centipoise), the flowability into the gaps was good, and there were no abnormalities in the moisture resistance and heat cycle tests.
【００１４】実施例４
実施例１で使用したメチルヘキサヒドロ無水フタル酸１
２０ｇの代りにメチルテトラヒドロ無水フタル酸（ペン
タハード５０００、東燃石化社製）１２５ｇ、平均粒径
０．５ミクロンの球状シリカ９６ｇの代りに平均粒径１
ミクロンの球状シリカ（エスクオーツ２００１、新日鉄
化学社製）１００ｇを用いた他は実施例１と同様にして
本発明のエポキシ樹脂組成物３１５ｇを得た。（２５℃
の粘度２５００センチポイズ）実施例１と同様の性能試
験を行った結果、隙間への流れ込み性は良好で、耐湿性
及びヒートサイクルテストとも異状なかった。Example 4 Methylhexahydrophthalic anhydride 1 used in Example 1
125 g of methyltetrahydrophthalic anhydride (Pentahard 5000, manufactured by Tonen Seika Co., Ltd.) instead of 20 g, and 125 g of spherical silica with an average particle size of 1
315 g of the epoxy resin composition of the present invention was obtained in the same manner as in Example 1, except that 100 g of micron spherical silica (S-Quartz 2001, manufactured by Nippon Steel Chemical Co., Ltd.) was used. (25℃
As a result of performing the same performance test as in Example 1 (viscosity of 2500 centipoise), the flowability into the gaps was good, and there were no abnormalities in the moisture resistance and heat cycle tests.
【００１５】比較例１
実施例１で使用したエポキシ樹脂の代りにビスフェノー
ルＡジグリシジルエーテル（エピコート８２８、油化シ
ェル社製、エポキシ当量１８５）１００ｇをメチルヘキ
サヒドロ無水フタル酸１２０ｇを９０ｇに、また球状シ
リカ９６ｇを８１ｇに代えた他は実施例１と同様にして
エポキシ樹脂組成物２５０ｇを得た。（２５℃粘度
２５０００センチポイズ）実施例１と同様の性能テスト
を行おうとしたが、隙間への流れ込みが不良で、封止す
ることができなかった。Comparative Example 1 Instead of the epoxy resin used in Example 1, 100 g of bisphenol A diglycidyl ether (Epicote 828, manufactured by Yuka Shell Co., Ltd., epoxy equivalent: 185) was added to 120 g of methylhexahydrophthalic anhydride, and 90 g of methylhexahydrophthalic anhydride was added. 250 g of an epoxy resin composition was obtained in the same manner as in Example 1 except that 96 g of spherical silica was replaced with 81 g. (25℃ viscosity
25,000 centipoise) An attempt was made to perform the same performance test as in Example 1, but the flow into the gap was poor and sealing could not be achieved.
【００１６】[0016]
【発明の効果】本発明のエポキシ樹脂組成物は粘度がＣ
．Ｏ．Ｇ．実装用封止剤として好適であり、封止時の流
れ込みがよく又気泡も生じない。またその硬化物の耐湿
性、耐ヒートショック性がすぐれている。Effect of the invention: The epoxy resin composition of the present invention has a viscosity of C
．． O. G. It is suitable as a sealant for mounting, flows well during sealing, and does not generate bubbles. Moreover, the cured product has excellent moisture resistance and heat shock resistance.
Claims (2)
３０〜７０重量％アリサイクリックジエポキシカルボキ
シレート３０〜７０重量％からなるエポキシ樹脂ｂ．酸
無水物硬化剤 ｃ．平均粒径０．１〜５ミクロンのシリカ粉末を含有す
るエポキシ樹脂組成物。[Claim 1] a. Epoxy resin consisting of 30-70% by weight of resorcinol diglycidyl ether and 30-70% by weight of alicyclic diepoxy carboxylate b. Acid anhydride curing agent c. An epoxy resin composition containing silica powder with an average particle size of 0.1 to 5 microns.
して得られる硬化物。2. A cured product obtained by curing the epoxy resin composition according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13867791A JP2933243B2 (en) | 1991-05-15 | 1991-05-15 | Liquid epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13867791A JP2933243B2 (en) | 1991-05-15 | 1991-05-15 | Liquid epoxy resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04337317A true JPH04337317A (en) | 1992-11-25 |
| JP2933243B2 JP2933243B2 (en) | 1999-08-09 |
Family
ID=15227528
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13867791A Expired - Lifetime JP2933243B2 (en) | 1991-05-15 | 1991-05-15 | Liquid epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2933243B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5880179A (en) * | 1994-03-04 | 1999-03-09 | Mitsubishi Denki Kabushiki Kaisha | Molded products for high voltage apparatus comprising brominated epoxy resins |
| JP2012136577A (en) * | 2010-12-24 | 2012-07-19 | Nippon Zeon Co Ltd | Semiconductor-sealing material and semiconductor device |
| US20140377539A1 (en) * | 2012-02-17 | 2014-12-25 | Hitachi,Ltd. | Electrical Insulation Resin Composition, Cured Product Thereof, Methods of Preparing the Composition and the Product, and High Voltage Apparatuses and Power Transmission and Distribution Apparatuses Using the Composition and the Product |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020111420A1 (en) * | 2001-02-12 | 2002-08-15 | International Business Machines Corporation | Underfill compositions |
-
1991
- 1991-05-15 JP JP13867791A patent/JP2933243B2/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5880179A (en) * | 1994-03-04 | 1999-03-09 | Mitsubishi Denki Kabushiki Kaisha | Molded products for high voltage apparatus comprising brominated epoxy resins |
| US5939472A (en) * | 1994-03-04 | 1999-08-17 | Mitsubishi Denki Kabushiki Kaisha | Epoxy resin composition for molding having improved mechanical properties and crack resistance |
| JP2012136577A (en) * | 2010-12-24 | 2012-07-19 | Nippon Zeon Co Ltd | Semiconductor-sealing material and semiconductor device |
| US20140377539A1 (en) * | 2012-02-17 | 2014-12-25 | Hitachi,Ltd. | Electrical Insulation Resin Composition, Cured Product Thereof, Methods of Preparing the Composition and the Product, and High Voltage Apparatuses and Power Transmission and Distribution Apparatuses Using the Composition and the Product |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2933243B2 (en) | 1999-08-09 |
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