CN114181656A - Adhesive sealing silicone material for bi-component low-viscosity photovoltaic module and preparation method thereof - Google Patents
Adhesive sealing silicone material for bi-component low-viscosity photovoltaic module and preparation method thereof Download PDFInfo
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- CN114181656A CN114181656A CN202111595955.2A CN202111595955A CN114181656A CN 114181656 A CN114181656 A CN 114181656A CN 202111595955 A CN202111595955 A CN 202111595955A CN 114181656 A CN114181656 A CN 114181656A
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- 239000000463 material Substances 0.000 title claims abstract description 28
- 238000007789 sealing Methods 0.000 title claims abstract description 23
- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 22
- 238000002360 preparation method Methods 0.000 title claims abstract description 13
- 239000000853 adhesive Substances 0.000 title claims description 15
- 230000001070 adhesive effect Effects 0.000 title claims description 15
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 22
- 239000000945 filler Substances 0.000 claims abstract description 22
- 239000004611 light stabiliser Substances 0.000 claims abstract description 17
- 239000003822 epoxy resin Substances 0.000 claims abstract description 16
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 16
- 239000002250 absorbent Substances 0.000 claims abstract description 15
- 230000002745 absorbent Effects 0.000 claims abstract description 15
- 239000004526 silane-modified polyether Substances 0.000 claims abstract description 15
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 14
- 239000003085 diluting agent Substances 0.000 claims abstract description 14
- 239000013008 thixotropic agent Substances 0.000 claims abstract description 14
- 239000004014 plasticizer Substances 0.000 claims abstract description 12
- 238000007599 discharging Methods 0.000 claims description 14
- 238000011049 filling Methods 0.000 claims description 14
- 238000003756 stirring Methods 0.000 claims description 14
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical group CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 claims description 10
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical group C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 claims description 10
- -1 polyethylene Polymers 0.000 claims description 10
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 claims description 8
- 239000000395 magnesium oxide Substances 0.000 claims description 8
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 8
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical group [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 8
- 239000006185 dispersion Substances 0.000 claims description 7
- 238000005303 weighing Methods 0.000 claims description 7
- 239000004698 Polyethylene Substances 0.000 claims description 5
- 229920000573 polyethylene Polymers 0.000 claims description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 4
- 239000004359 castor oil Substances 0.000 claims description 4
- 235000019438 castor oil Nutrition 0.000 claims description 4
- HBGGXOJOCNVPFY-UHFFFAOYSA-N diisononyl phthalate Chemical compound CC(C)CCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC(C)C HBGGXOJOCNVPFY-UHFFFAOYSA-N 0.000 claims description 4
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 claims description 4
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 claims description 4
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 claims description 3
- VMSIYTPWZLSMOH-UHFFFAOYSA-N 2-(dodecoxymethyl)oxirane Chemical compound CCCCCCCCCCCCOCC1CO1 VMSIYTPWZLSMOH-UHFFFAOYSA-N 0.000 claims description 3
- CUGZWHZWSVUSBE-UHFFFAOYSA-N 2-(oxiran-2-ylmethoxy)ethanol Chemical compound OCCOCC1CO1 CUGZWHZWSVUSBE-UHFFFAOYSA-N 0.000 claims description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 2
- 125000003916 ethylene diamine group Chemical group 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- 239000004590 silicone sealant Substances 0.000 claims 4
- 238000000034 method Methods 0.000 claims 1
- 239000003566 sealing material Substances 0.000 abstract description 7
- 238000005457 optimization Methods 0.000 description 7
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 5
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000000565 sealant Substances 0.000 description 3
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 229960001124 trientine Drugs 0.000 description 2
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 2
- 240000000073 Achillea millefolium Species 0.000 description 1
- 235000007754 Achillea millefolium Nutrition 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000003981 vehicle Substances 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/222—Magnesia, i.e. magnesium oxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Sealing Material Composition (AREA)
Abstract
The invention discloses a bonding sealing silicone material for a bi-component low-viscosity photovoltaic module and a preparation method thereof, wherein the bonding sealing silicone material comprises a component A and a component B, wherein the component A comprises the following components in parts by mass: 180 parts of silane modified polyether 150, 70-90 parts of filler, 1-5 parts of ultraviolet absorbent, 1-5 parts of light stabilizer, 2-8 parts of thixotropic agent, 1-5 parts of diluent and 30-50 parts of silane coupling agent; the component B comprises the following components in parts by mass: 50-60 parts of silane coupling agent, 35-40 parts of epoxy resin, 30-40 parts of filler, 1-5 parts of plasticizer and 0.5-5 parts of curing agent. According to the invention, the thixotropic agent and the diluent are added into the component A to ensure the fluidity and the ductility of the material, so that the material has low viscosity, the curing performance of the sealing material can be ensured through the epoxy resin and the curing agent of the component B, and the ultraviolet absorbent and the light stabilizer are added to have better weather resistance and improve the curing stability of the sealing material.
Description
Technical Field
The invention relates to the technical field of processing of sealing silicone materials, in particular to a bonding sealing silicone material for a bi-component low-viscosity photovoltaic module and a preparation method thereof.
Background
The silicone sealing material is a rubber elastomer which takes polysiloxane as a main material, is matched with an inorganic filler, and is in contact with moisture in the air to perform condensation reaction under the action of a crosslinking agent, a coupling agent and the like to form a three-dimensional network structure. Compared with other sealants, the sealant has the characteristics of convenient construction, easy forming, no limitation of shape and size on a joint surface, strong bonding force, good sealing effect, excellent heat resistance, cold resistance, aging resistance, acid and alkali resistance, insulativity, oil resistance, physiological inertia and the like, and is widely suitable for bonding and sealing of vehicle sealing elements, chemical pipelines, mechanical equipment, flange pieces, electronic and electric appliances and the like in the field of sealing and bonding.
Although silicone sealing materials have been developed in various aspects such as adhesiveness, curing speed and flame retardancy, there is a certain contradiction between adhesiveness and curing speed and colloid fluidity (i.e. uniform coating property), i.e. good adhesiveness, poor fluidity and poor uniform coating property when curing is fast, so how to coordinate solving the problem of uniform coating without affecting surface drying time is a problem to be solved by developing divination by means of the milfoil sealants.
Disclosure of Invention
The invention aims to provide a two-component low-viscosity adhesive sealing silicone material for a photovoltaic module and a preparation method thereof, so as to solve the problems in the background technology.
In order to achieve the purpose, the invention adopts the technical scheme that: the adhesive sealing silicone material for the bi-component low-viscosity photovoltaic module comprises a component A and a component B, wherein the component A comprises the following components in parts by mass: 180 parts of silane modified polyether 150, 70-90 parts of filler, 1-5 parts of ultraviolet absorbent, 1-5 parts of light stabilizer, 2-8 parts of thixotropic agent, 1-5 parts of diluent and 30-50 parts of silane coupling agent; the component B comprises the following components in parts by mass: 50-60 parts of silane coupling agent, 35-40 parts of epoxy resin, 30-40 parts of filler, 1-5 parts of plasticizer and 0.5-5 parts of curing agent.
As a further optimization, the filler is magnesium oxide, aluminum oxide or calcium carbonate.
As a further optimization, the thixotropic agent is hydrogenated castor oil or polyethylene wax.
As a further optimization, the diluent is diallyl glycidyl ether, dodecyl glycidyl ether or ethylene glycol glycidyl ether.
As a further optimization, the silane coupling agent is hexamethyldisiloxane or gamma- [2, 3-glycidoxy ] propyl trimethoxy silane.
As a further optimization, the epoxy resin is bisphenol a type epoxy resin.
As a further optimization, the plasticizer is di (2-ethylhexyl) phthalate or diisononyl phthalate.
As a further optimization, the curing agent is ethylenediamine, hexamethylenediamine or triethylene tetramine.
The invention also provides a preparation method of the adhesive sealing silicone material for the bi-component low-viscosity photovoltaic module, which comprises the following steps,
s1) accurately weighing each component;
s1) preparation of component a: adding silane modified polyether, filler, ultraviolet absorbent, light stabilizer, thixotropic agent, diluent and silane coupling agent into a stirrer for dispersion stirring, discharging and filling to obtain a component A;
s2) preparing a component B, putting the silane coupling agent, the epoxy resin, the filler, the plasticizer and the curing agent into a planetary stirrer for further stirring, discharging and filling to obtain the component B.
Compared with the prior art, the invention has the beneficial effects that:
1. the material has low viscosity by adding a thixotropic agent and a diluent into the component A to ensure the fluidity and the ductility of the material; the curing performance of the sealing material can be ensured by the epoxy resin and the curing agent of the component B;
2. by adding the ultraviolet absorber and the light stabilizer, the sealing material has better weather resistance and the curing stability of the sealing material is improved.
Detailed Description
The following are specific examples of the present invention and further describe the technical solutions of the present invention, but the present invention is not limited to these examples.
Example 1
The adhesive sealing silicone material for the bi-component low-viscosity photovoltaic module comprises a component A and a component B, wherein the component A comprises the following components in parts by mass: 158 parts of silane modified polyether, 85 parts of magnesium oxide, 3 parts of ultraviolet absorbent, 2 parts of light stabilizer, 6 parts of hydrogenated castor oil, 4 parts of diallyl glycidyl ether and 42 parts of hexamethyldisiloxane; the component B comprises the following components in parts by mass: 58 parts of gamma- [2, 3-glycidoxy ] propyl trimethoxy silane, 36 parts of bisphenol A epoxy resin, 38 parts of magnesium oxide, 4 parts of diisononyl phthalate and 3 parts of ethylenediamine.
The preparation method comprises the following steps: accurately weighing each component; preparing a component A: adding silane modified polyether, filler, ultraviolet absorbent, light stabilizer, thixotropic agent, diluent and silane coupling agent into a stirrer for dispersion stirring, discharging and filling to obtain a component A; and (3) preparing a component B, namely putting the silane coupling agent, the epoxy resin, the filler, the plasticizer and the curing agent into a planetary stirrer for further stirring, discharging and filling to obtain the component B.
Example 2
The adhesive sealing silicone material for the bi-component low-viscosity photovoltaic module comprises a component A and a component B, wherein the component A comprises the following components in parts by mass: 152 parts of silane modified polyether, 72 parts of magnesium oxide, 4 parts of ultraviolet absorbent, 4 parts of light stabilizer, 3 parts of hydrogenated castor oil, 4 parts of glycol glycidyl ether and 48 parts of gamma- [2, 3-glycidoxy ] propyl trimethoxy silane; the component B comprises the following components in parts by mass: 51 parts of hexamethyldisiloxane, 40 parts of bisphenol A epoxy resin, 33 parts of alumina, 2 parts of di (2-ethylhexyl) phthalate and 1 part of ethylenediamine.
The preparation method comprises the following steps: accurately weighing each component; preparing a component A: adding silane modified polyether, filler, ultraviolet absorbent, light stabilizer, thixotropic agent, diluent and silane coupling agent into a stirrer for dispersion stirring, discharging and filling to obtain a component A; and (3) preparing a component B, namely putting the silane coupling agent, the epoxy resin, the filler, the plasticizer and the curing agent into a planetary stirrer for further stirring, discharging and filling to obtain the component B.
Example 3
The adhesive sealing silicone material for the bi-component low-viscosity photovoltaic module comprises a component A and a component B, wherein the component A comprises the following components in parts by mass: 176 parts of silane modified polyether, 88 parts of alumina, 2 parts of ultraviolet absorber, 3 parts of light stabilizer, 7 parts of polyethylene wax, 2 parts of glycol glycidyl ether and 46 parts of hexamethyldisiloxane; the component B comprises the following components in parts by mass: 52 parts of hexamethyldisiloxane, 36 parts of bisphenol A epoxy resin, 37 parts of magnesium oxide, 3 parts of diisononyl phthalate and 3.5 parts of hexamethylene diamine.
The preparation method comprises the following steps: accurately weighing each component; preparing a component A: adding silane modified polyether, filler, ultraviolet absorbent, light stabilizer, thixotropic agent, diluent and silane coupling agent into a stirrer for dispersion stirring, discharging and filling to obtain a component A; and (3) preparing a component B, namely putting the silane coupling agent, the epoxy resin, the filler, the plasticizer and the curing agent into a planetary stirrer for further stirring, discharging and filling to obtain the component B.
Example 4
The adhesive sealing silicone material for the bi-component low-viscosity photovoltaic module comprises a component A and a component B, wherein the component A comprises the following components in parts by mass: 166 parts of silane modified polyether, 79 parts of magnesium oxide, 2 parts of ultraviolet absorbent, 1 part of light stabilizer, 5 parts of polyethylene wax, 2 parts of dodecyl glycidyl ether and 41 parts of hexamethyldisiloxane; the component B comprises the following components in parts by mass: 52 parts of hexamethyldisiloxane, 37 parts of bisphenol A epoxy resin, 32 parts of magnesium oxide, 3 parts of di (2-ethylhexyl) phthalate and 2 parts of hexamethylene diamine.
The preparation method comprises the following steps: accurately weighing each component; preparing a component A: adding silane modified polyether, filler, ultraviolet absorbent, light stabilizer, thixotropic agent, diluent and silane coupling agent into a stirrer for dispersion stirring, discharging and filling to obtain a component A; and (3) preparing a component B, namely putting the silane coupling agent, the epoxy resin, the filler, the plasticizer and the curing agent into a planetary stirrer for further stirring, discharging and filling to obtain the component B.
Example 5
The adhesive sealing silicone material for the bi-component low-viscosity photovoltaic module comprises a component A and a component B, wherein the component A comprises the following components in parts by mass: 172 parts of silane modified polyether, 83 parts of alumina, 2 parts of ultraviolet absorbent, 3 parts of light stabilizer, 5 parts of polyethylene wax, 4 parts of diallyl glycidyl ether and 33 parts of hexamethyldisiloxane; the component B comprises the following components in parts by mass: 56 parts of hexamethyldisiloxane, 35 parts of bisphenol A epoxy resin, 40 parts of alumina, 3 parts of di (2-ethylhexyl) phthalate and 2 parts of triethylene tetramine.
The preparation method comprises the following steps: accurately weighing each component; preparing a component A: adding silane modified polyether, filler, ultraviolet absorbent, light stabilizer, thixotropic agent, diluent and silane coupling agent into a stirrer for dispersion stirring, discharging and filling to obtain a component A; and (3) preparing a component B, namely putting the silane coupling agent, the epoxy resin, the filler, the plasticizer and the curing agent into a planetary stirrer for further stirring, discharging and filling to obtain the component B.
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications or additions may be made to the described embodiments or alternatives may be employed by those skilled in the art without departing from the spirit or ambit of the invention as defined in the appended claims.
Claims (9)
1. The adhesive sealing silicone material for the bi-component low-viscosity photovoltaic module is characterized by comprising a component A and a component B, wherein the component A comprises the following components in parts by mass: 180 parts of silane modified polyether 150, 70-90 parts of filler, 1-5 parts of ultraviolet absorbent, 1-5 parts of light stabilizer, 2-8 parts of thixotropic agent, 1-5 parts of diluent and 30-50 parts of silane coupling agent; the component B comprises the following components in parts by mass: 50-60 parts of silane coupling agent, 35-40 parts of epoxy resin, 30-40 parts of filler, 1-5 parts of plasticizer and 0.5-5 parts of curing agent.
2. The two-component low viscosity silicone sealant material for photovoltaic modules according to claim 1, wherein the filler is magnesium oxide, aluminum oxide or calcium carbonate.
3. The two-component low-viscosity adhesive sealing silicone material for photovoltaic modules according to claim 1, wherein the thixotropic agent is hydrogenated castor oil or polyethylene wax.
4. The two-component low viscosity silicone sealant material for photovoltaic modules according to claim 1, wherein the diluent is diallyl glycidyl ether, dodecyl glycidyl ether or ethylene glycol glycidyl ether.
5. The two-component low viscosity silicone sealant material for photovoltaic modules according to claim 1, wherein the silane coupling agent is hexamethyldisiloxane or γ - [2, 3-glycidoxy ] propyltrimethoxysilane.
6. The silicone material for adhesive sealing of a two-component low-viscosity photovoltaic module according to claim 1, wherein the epoxy resin is a bisphenol a type epoxy resin.
7. The two-component low viscosity silicone sealant material for photovoltaic modules according to claim 1, wherein the plasticizer is di (2-ethylhexyl) phthalate or diisononyl phthalate.
8. The two-component low-viscosity silicone material for adhesive sealing of photovoltaic modules according to claim 1, wherein the curing agent is ethylenediamine, hexamethylenediamine or triethylenetetramine.
9. A method for preparing the adhesive sealing silicone material for the two-component low-viscosity photovoltaic module according to any one of claims 1 to 8, comprising the steps of,
s1) accurately weighing each component;
s1) preparation of component a: adding silane modified polyether, filler, ultraviolet absorbent, light stabilizer, thixotropic agent, diluent and silane coupling agent into a stirrer for dispersion stirring, discharging and filling to obtain a component A;
s2) preparing a component B, putting the silane coupling agent, the epoxy resin, the filler, the plasticizer and the curing agent into a planetary stirrer for further stirring, discharging and filling to obtain the component B.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023208421A1 (en) | 2022-04-28 | 2023-11-02 | H. K. Wentworth Limited | Two-component gap filler composition |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112980374A (en) * | 2021-03-24 | 2021-06-18 | 杭州之江新材料有限公司 | Two-component silane modified sealant and preparation method thereof |
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| CN112980374A (en) * | 2021-03-24 | 2021-06-18 | 杭州之江新材料有限公司 | Two-component silane modified sealant and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023208421A1 (en) | 2022-04-28 | 2023-11-02 | H. K. Wentworth Limited | Two-component gap filler composition |
| GB2618768A (en) * | 2022-04-28 | 2023-11-22 | H K Wentworth Ltd | Two-component gap filler composition |
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Application publication date: 20220315 |