CN112029459A - Single-component low-temperature curing epoxy adhesive for waterproof sealing and preparation method thereof - Google Patents
Single-component low-temperature curing epoxy adhesive for waterproof sealing and preparation method thereof Download PDFInfo
- Publication number
- CN112029459A CN112029459A CN202010850490.XA CN202010850490A CN112029459A CN 112029459 A CN112029459 A CN 112029459A CN 202010850490 A CN202010850490 A CN 202010850490A CN 112029459 A CN112029459 A CN 112029459A
- Authority
- CN
- China
- Prior art keywords
- percent
- temperature
- waterproof sealing
- epoxy adhesive
- agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/66—Mercaptans
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/72—Complexes of boron halides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Sealing Material Composition (AREA)
Abstract
The invention discloses a single-component low-temperature curing epoxy adhesive for waterproof sealing and a preparation method thereof. The epoxy adhesive comprises the following components in percentage by mass: 30 to 36 percent of epoxy resin, 8 to 14 percent of toughening resin, 34 to 40 percent of curing agent, 5 to 10 percent of accelerant, 3 to 5 percent of stabilizing agent, 0.1 to 0.5 percent of flatting agent, 0.1 to 0.4 percent of defoaming agent, 0.4 to 0.8 percent of coupling agent, 0.7 to 1.1 percent of pigment and 4 to 10 percent of filler; the preparation method comprises stirring the above components at constant temperature of 15 deg.C and rotation speed of 500r/min for 20 min. The single-component low-temperature curing epoxy adhesive disclosed by the invention can be cured at a low temperature, is waterproof and sealed, and has good adhesion.
Description
Technical Field
The invention belongs to the technical field of epoxy resin adhesives, and particularly relates to a single-component low-temperature curing epoxy adhesive for waterproof sealing and a preparation method thereof.
Background
With the development of science and technology, various epoxy resin adhesives are widely used. In particular, in the rapidly developing electronic communication industry, epoxy resin adhesives are used for bonding materials and components, sealing liquids, and the like in all directions. The existing single-component epoxy adhesive has high curing temperature, can be cured at the temperature of more than 70-80 ℃, is brittle after being cured, has poor air tightness and cannot be used for bonding and sealing materials with poor temperature resistance.
Disclosure of Invention
The invention provides a preparation method of a single-component low-temperature curing epoxy adhesive for waterproof sealing, which has low curing temperature and good waterproof sealing performance and aims to solve the problems that the existing single-component epoxy adhesive is high in curing temperature, brittle after curing, poor in air tightness and incapable of being used for bonding and sealing materials with poor temperature resistance.
The invention provides a single-component low-temperature curing epoxy adhesive for waterproof sealing, which consists of the following components in percentage by mass: 30 to 36 percent of epoxy resin, 8 to 14 percent of toughening resin, 34 to 40 percent of curing agent, 5 to 10 percent of accelerant, 3 to 5 percent of stabilizing agent, 0.1 to 0.5 percent of flatting agent, 0.1 to 0.4 percent of defoaming agent, 0.4 to 0.8 percent of coupling agent, 0.7 to 1.1 percent of pigment and 4 to 10 percent of filler.
Preferably, the epoxy resin is at least one of bisphenol a type glycidyl ether, bisphenol F type glycidyl ether or aliphatic glycidyl ether.
Preferably, the toughening resin is at least one of polyurethane modified epoxy resin, polybutadiene modified epoxy resin or liquid nitrile rubber.
Preferably, the curing agent is at least one of a mercapto ester, a modified amine or a modified imidazole.
Preferably, the accelerator is at least one of a tertiary amine, a modified imidazole, or a boron trifluoride amine complex.
Preferably, the stabilizer is at least one of hydroquinone, p-benzoquinone or p-tert-butylcatechol.
Preferably, the leveling agent is at least one of polydimethylsiloxane, polyether polyester modified organic siloxane or alkyl modified organic siloxane.
Preferably, the defoaming agent is polysiloxane and/or silyl ether grafted defoaming agent. The pigment is color paste and/or toner.
Preferably, the coupling agent is an organosilane and/or a titanate. The filler is at least one of calcium carbonate, alumina or gas silicon.
The invention also provides a preparation method of the single-component low-temperature curing epoxy adhesive for waterproof sealing, which comprises the following steps:
weighing the components according to the component proportion of the single-component low-temperature curing epoxy adhesive for waterproof sealing; firstly, stirring, mixing and dispersing the epoxy resin, the toughening resin and the pigment for 8min to obtain a secondary mixture; adding the flatting agent, the defoaming agent, the coupling agent and the stabilizing agent into the primary mixture, and stirring, mixing and dispersing for 8min to obtain a primary mixture; and then adding the curing agent, the accelerator and the filler into the secondary mixture, and mixing and dispersing for 20min at a constant temperature of 15 ℃ to prepare the single-component low-temperature curing epoxy adhesive for waterproof sealing.
The single-component low-temperature curing epoxy adhesive for waterproof sealing can be cured at low temperature, namely can be cured at 55 ℃, and has good waterproof sealing and bonding properties. The epoxy resin adopted by the epoxy adhesive has adhesiveness and hydrophobicity, so that the adhesive property and the water resistance of the adhesive are good; the toughened resin has flexibility and good adhesive property to a base material; the curing agent can enable the glue to be cured and molded at a lower temperature; the accelerator has the function of accelerating the curing reaction and can reduce the curing temperature of the glue; the stabilizer can prevent the resin and the curing agent from reacting at normal temperature or low temperature, and the service life of the glue is prolonged; the leveling agent can enable the glue to fully fill the pores, prevent external water or water vapor from entering and enable the glue to have a waterproof effect; the defoaming agent can eliminate bubbles, prevent air holes from being generated during glue solidification and facilitate the waterproof function of the glue; the coupling agent can enable the glue and the material to be better bonded, and the bonding property is improved; the pigment is favorable for dyeing; the filler can improve the viscosity and thixotropy of the watering and prevent glue overflow.
Detailed Description
The present invention will be further described with reference to the following examples.
The invention provides a single-component low-temperature curing epoxy adhesive for waterproof sealing, which consists of the following components in percentage by mass: 30 to 36 percent of epoxy resin, 8 to 14 percent of toughening resin, 34 to 40 percent of curing agent, 5 to 10 percent of accelerant, 3 to 5 percent of stabilizing agent, 0.1 to 0.5 percent of flatting agent, 0.1 to 0.4 percent of defoaming agent, 0.4 to 0.8 percent of coupling agent, 0.7 to 1.1 percent of pigment and 4 to 10 percent of filler.
According to different actual requirements, the single-component low-temperature curing epoxy adhesive for waterproof sealing can be prepared by selecting the mixture ratio of different components. For example, the components of different embodiments shown in the following table 1 may be selected according to the mass percentage:
TABLE 1
In addition to the component ratios of the different embodiments given in table 1 above, other component ratios may be selected as desired.
The components for preparing the epoxy adhesive can be selected according to different requirements as follows, wherein:
the epoxy resin is any one or a mixture of more of bisphenol A type glycidyl ether, bisphenol F type glycidyl ether or aliphatic glycidyl ether. The bisphenol A type glycidyl ether and the bisphenol F type glycidyl ether enable the adhesive to have good bonding performance, and the bisphenol F type glycidyl ether and the aliphatic glycidyl ether help the moisture resistance of the adhesive. Bisphenol a type glycidyl ethers are preferred.
The toughening resin is any one or a mixture of more of polyurethane modified epoxy resin, polybutadiene modified epoxy resin or liquid nitrile rubber. The toughening resin can make the adhesive property of the glue better. Polyurethane modified epoxy resins are preferred.
The curing agent is any one or a mixture of more of mercaptoester, modified amine or modified imidazole, wherein the mercaptoester and the modified imidazole enable the adhesive to have low-temperature curing performance. Mercaptoesters are preferred.
The accelerant is any one or a mixture of more of tertiary amine, modified imidazole or boron trifluoride amine complex. The tertiary amine, the modified imidazole and the boron trifluoride amine complex can reduce the curing temperature of the adhesive. The modified imidazole is preferable, the effect of reducing the curing temperature of the adhesive is better, and the curing temperature of the system can be reduced by about 20 ℃ by 10 percent of the addition amount of the modified imidazole.
The stabilizer is any one or a mixture of more of hydroquinone, p-benzoquinone or p-tert-butylcatechol, and preferably the p-benzoquinone.
The leveling agent is one or a mixture of more of polydimethylsiloxane, polyether polyester modified organic siloxane or alkyl modified organic siloxane. The leveling agent can enable glue to permeate into pores, and is helpful for water prevention. Polydimethylsiloxane is preferred.
The defoaming agent is polysiloxane and/or silicon ether grafted defoaming agent, preferably silicon ether grafted defoaming agent. The defoaming agent can prevent air holes from being generated after glue is solidified, and is helpful for water prevention.
The pigment is color paste and/or toner.
The coupling agent is organic silane and/or titanate, and the coupling agent can enable the adhesive property of the glue to be better. Organosilanes are preferred.
The filler is at least one of calcium carbonate, alumina or gas silicon.
The components of the invention can be purchased from the market.
The epoxy resin adopted by the invention has adhesiveness and hydrophobicity, so that the adhesive property and water resistance of the glue are good; the curing agent can enable the glue to be cured and molded at a lower temperature; the accelerator has the function of accelerating the curing reaction and can reduce the curing temperature of the glue; the stabilizer can prevent the resin and the curing agent from reacting at normal temperature or low temperature, and the service life of the glue is prolonged; the leveling agent can enable the glue to fully fill the pores, prevent external water or water vapor from entering and enable the glue to have a waterproof effect; the defoaming agent can eliminate bubbles, prevent air holes from being generated during glue solidification and facilitate the waterproof function of the glue; the coupling agent can enable the glue and the material to be better bonded, and the bonding property is improved; the pigment is favorable for dyeing; the filler can improve the viscosity and thixotropy of the watering and prevent glue overflow.
According to the component ratios of the examples and comparative examples of table 2 below, a one-component low-temperature-curing epoxy adhesive for waterproof sealing was prepared by the following method:
step 1: weighing the components according to the component proportion of the single-component low-temperature curing epoxy adhesive for waterproof sealing;
step 2: firstly, stirring, mixing and dispersing the epoxy resin, the toughening resin and the pigment for 8min to obtain a secondary mixture; and step 3: then adding the leveling agent, the defoaming agent, the coupling agent and the stabilizing agent into the primary mixture, and mixing
Dispersing for 8min to obtain primary mixture;
and 4, step 4: then adding the curing agent, the accelerator and the filler into the secondary mixture, and mixing at a constant temperature of 15 DEG C
Dispersing for 20min to obtain the single-component low-temperature curing epoxy adhesive for waterproof sealing.
The comparative column is the same as the preparation procedure of the example.
TABLE 2
The invention relates to a main test method of a single-component low-temperature curing epoxy adhesive for waterproof sealing, which comprises the following steps:
(1) adhesion test
The test was carried out using a tensile tester, reference standard: GB 7124-.
(2) Hardness of curing
Vertically pressing on the colloid flat surface baked at 55 ℃ for 30 minutes by using a Shore D hardness tester, and referring to the standard: GB 2411-1980.
(3) Water resistance test
Testing was performed using a water repellency detector, reference standard: GB 4208-.
(4) Environment protection test (RoHS \ Reach)
The method comprises the following steps of performing related environment-friendly tests by using a dispersion spectrometer, a gas chromatography-mass spectrometer, an ultraviolet visible spectrum method, an ion chromatography method, a high performance liquid chromatography method, a liquid chromatography-mass spectrometry method, a gas chromatography hydrogen flame ionization detector and an inductively coupled plasma emission spectrometry method, wherein the reference standard is as follows: US EPA 3052: 1996, US EPA3050B:1996, US EPA3060A:1996, US EPA3550C:2007, US EPA3540C:1996, ISO 17353: 2004(E), EN 14582: 2016.
according to the test of the method, the performance indexes of the single-component low-temperature curing epoxy adhesive for waterproof sealing provided by the invention are as follows:
the performance indexes can be obtained according to the embodiment and the test method. Under the low-temperature curing condition of 55 ℃ for 30 minutes, the hardness of more than 80D can be achieved in the four embodiments, which shows that the adhesive is completely cured at the low temperature of 55 ℃. The hardness of 70D of the comparative example I and the comparative example II can not be achieved, which indicates that the comparative example I and the comparative example II can not be completely cured at the low temperature of 55 ℃; the four embodiments all achieve IPX7 and above, indicating that the adhesive is waterproof and hermetic. Compared with the first comparative example and the second comparative example, the waterproofness can only reach IPX5, which shows that the waterproofness and the sealability of the first comparative example and the second comparative example are not good; the four examples can reach 15MPa or more of the bonding strength with stainless steel, while the first comparative example and the second comparative example can only reach 10MPa of the bonding strength with stainless steel, which shows that the four examples have better bonding property than the first comparative example and the second comparative example.
From the above, the single-component low-temperature curing epoxy adhesive for waterproof sealing provided by the invention can be cured at low temperature, namely, can be cured at 55 ℃, and has good waterproof sealing and bonding properties.
The above-mentioned embodiments are mainly intended to illustrate the inventive concept, and it should be noted that those skilled in the art may make various changes and modifications without departing from the inventive concept, and all such changes and modifications are within the scope of the present invention.
Claims (10)
1. The single-component low-temperature curing epoxy adhesive for waterproof sealing is characterized by comprising the following components in parts by weight: the composite material comprises the following components in percentage by mass: 30 to 36 percent of epoxy resin, 8 to 14 percent of toughening resin, 34 to 40 percent of curing agent and 5 to 10 percent of accelerant,
3 to 5 percent of stabilizing agent, 0.1 to 0.5 percent of flatting agent, 0.1 to 0.4 percent of defoaming agent, 0.4 to 0.8 percent of coupling agent and 0.7 to 1.1 percent of pigment,
4 to 10 percent of filler.
2. The one-component low-temperature-curing epoxy adhesive for waterproof sealing according to claim 1, characterized in that: the epoxy resin is at least one of bisphenol A type glycidyl ether, bisphenol F type glycidyl ether or aliphatic glycidyl ether.
3. The one-component low-temperature-curing epoxy adhesive for waterproof sealing according to claim 1, characterized in that: the toughening resin is at least one of polyurethane modified epoxy resin, polybutadiene modified epoxy resin or liquid nitrile rubber.
4. The one-component low-temperature-curing epoxy adhesive for waterproof sealing according to claim 1, characterized in that: the fixing part
The oxidant is at least one of mercapto ester, modified amine or modified imidazole.
5. The one-component low-temperature-curing epoxy adhesive for waterproof sealing according to claim 1, characterized in that: the accelerant is at least one of tertiary amine, modified imidazole or boron trifluoride amine complex.
6. The one-component low-temperature-curing epoxy adhesive for waterproof sealing according to claim 1, characterized in that: the stabilizer is at least one of hydroquinone, p-benzoquinone or p-tert-butylcatechol.
7. The one-component low-temperature-curing epoxy adhesive for waterproof sealing according to claim 1, characterized in that: the leveling agent is at least one of polydimethylsiloxane, polyether polyester modified organic siloxane or alkyl modified organic siloxane.
8. The one-component low-temperature-curing epoxy adhesive for waterproof sealing according to claim 1, characterized in that: the defoaming agent is polysiloxane and/or silicon ether grafted defoaming agent; the pigment is color paste and/or toner.
9. The one-component low-temperature-curing epoxy adhesive for waterproof sealing according to claim 1, characterized in that: the coupling agent is organosilane and/or titanate; the filler is at least one of calcium carbonate, alumina or gas silicon.
10. The method for preparing the one-pack low-temperature curing epoxy adhesive for waterproof sealing according to any one of claims 1 to 9, comprising the steps of:
weighing the components according to the component proportion of the single-component low-temperature curing epoxy adhesive for waterproof sealing; firstly, stirring, mixing and dispersing the epoxy resin, the toughening resin and the pigment for 8min to obtain a secondary mixture; adding the flatting agent, the defoaming agent, the coupling agent and the stabilizing agent into the primary mixture, and stirring, mixing and dispersing for 8min to obtain a primary mixture; and then adding the curing agent, the accelerator and the filler into the secondary mixture, and mixing and dispersing for 20min at a constant temperature of 15 ℃ to prepare the single-component low-temperature curing epoxy adhesive for waterproof sealing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010850490.XA CN112029459A (en) | 2020-08-21 | 2020-08-21 | Single-component low-temperature curing epoxy adhesive for waterproof sealing and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010850490.XA CN112029459A (en) | 2020-08-21 | 2020-08-21 | Single-component low-temperature curing epoxy adhesive for waterproof sealing and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112029459A true CN112029459A (en) | 2020-12-04 |
Family
ID=73581768
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010850490.XA Pending CN112029459A (en) | 2020-08-21 | 2020-08-21 | Single-component low-temperature curing epoxy adhesive for waterproof sealing and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112029459A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114262592A (en) * | 2021-12-10 | 2022-04-01 | 深圳斯多福新材料科技有限公司 | Single-component low-temperature curing epoxy adhesive with high adhesive force on polyester material |
| CN114395219A (en) * | 2022-01-17 | 2022-04-26 | 南通中集能源装备有限公司 | Hydrogen storage bottle, liquid epoxy resin system wound by wet method and preparation method thereof |
| CN114574137A (en) * | 2022-02-26 | 2022-06-03 | 东莞市恒尔朗实业有限公司 | Packaging adhesive for bonding PC (polycarbonate) material of relay and preparation method thereof |
| CN116515410A (en) * | 2023-05-05 | 2023-08-01 | 江西江远材料科技有限公司 | Waterproof sealing adhesive tape of butyl rubber and preparation method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104152089A (en) * | 2013-09-17 | 2014-11-19 | 厦门三顶新材料科技有限公司 | Preparation method of single-segmented epoxy chip packaging sealant |
-
2020
- 2020-08-21 CN CN202010850490.XA patent/CN112029459A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104152089A (en) * | 2013-09-17 | 2014-11-19 | 厦门三顶新材料科技有限公司 | Preparation method of single-segmented epoxy chip packaging sealant |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114262592A (en) * | 2021-12-10 | 2022-04-01 | 深圳斯多福新材料科技有限公司 | Single-component low-temperature curing epoxy adhesive with high adhesive force on polyester material |
| CN114395219A (en) * | 2022-01-17 | 2022-04-26 | 南通中集能源装备有限公司 | Hydrogen storage bottle, liquid epoxy resin system wound by wet method and preparation method thereof |
| CN114574137A (en) * | 2022-02-26 | 2022-06-03 | 东莞市恒尔朗实业有限公司 | Packaging adhesive for bonding PC (polycarbonate) material of relay and preparation method thereof |
| CN116515410A (en) * | 2023-05-05 | 2023-08-01 | 江西江远材料科技有限公司 | Waterproof sealing adhesive tape of butyl rubber and preparation method thereof |
| CN116515410B (en) * | 2023-05-05 | 2024-05-28 | 江西江远材料科技有限公司 | Waterproof sealing adhesive tape of butyl rubber and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112029459A (en) | Single-component low-temperature curing epoxy adhesive for waterproof sealing and preparation method thereof | |
| CN109401723B (en) | Solvent-free organic silicon pouring sealant for LED screen packaging protection and preparation method and application thereof | |
| US20040000712A1 (en) | Interface adhesive | |
| KR20140009296A (en) | Epoxy resin composition and semiconductor sealing material using same | |
| WO2004039885A1 (en) | Sealant composition for liquid crystal and process for producing liquid-crystal display panel with the same | |
| CN109705784A (en) | A kind of high-peeling strength epoxy construction adhesive and preparation method thereof | |
| CN103361018B (en) | A kind of LED of high-seal | |
| CN109054711A (en) | A kind of flexible screen frame envelope frame Wear Characteristics of Epoxy Adhesive mixture and preparation method thereof | |
| CN110205082A (en) | Double curing adhesives of a kind of flame retardant type and preparation method thereof | |
| CN111592849A (en) | Semi-cured epoxy adhesive film and preparation method thereof | |
| CN107163896A (en) | Silicane-modified polyurethane Conductive sealant and preparation method thereof | |
| CN110734728A (en) | modified epoxy structural adhesive for plastic part bonding and preparation method thereof | |
| CN114989757B (en) | Low-temperature rapid-curing moisture-heat-resistant epoxy adhesive and preparation method and application thereof | |
| US20020192477A1 (en) | Silicone-modified epoxy or phenolic resin compositions and semiconductor devices sealed therewith | |
| CN116836664A (en) | High-temperature-resistant underfill epoxy adhesive and preparation method and application thereof | |
| CN113462261A (en) | Semitransparent closed solvent-free epoxy primer coating compound | |
| CN115160963A (en) | High-temperature-resistant low-thermal-expansion-coefficient filling adhesive and preparation method thereof | |
| CN113736403B (en) | Single-component heat-resistant epoxy resin composition and preparation method and application thereof | |
| WO2015080059A1 (en) | Liquid epoxy resin composition | |
| KR101329695B1 (en) | Reworkable epoxy resin composition | |
| CN112694859B (en) | Two-component epoxy floor glue with self-defoaming capability after mixing and preparation method thereof | |
| CN110205084A (en) | A kind of expediting setting type organosilicon sealant | |
| CN117603642A (en) | Preparation method of modified epoxy electronic adhesive | |
| CN117363296A (en) | High-strength equal-proportion type double-component silane modified adhesive and preparation method thereof | |
| CN112823177B (en) | Resin composition |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20201204 |