CN107163896A - Silicane-modified polyurethane Conductive sealant and preparation method thereof - Google Patents
Silicane-modified polyurethane Conductive sealant and preparation method thereof Download PDFInfo
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- CN107163896A CN107163896A CN201710552508.6A CN201710552508A CN107163896A CN 107163896 A CN107163896 A CN 107163896A CN 201710552508 A CN201710552508 A CN 201710552508A CN 107163896 A CN107163896 A CN 107163896A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Adhesives Or Adhesive Processes (AREA)
- Sealing Material Composition (AREA)
Abstract
The present invention be on a kind of silicane-modified polyurethane Conductive sealant and preparation method thereof, silicane-modified polyurethane Conductive sealant in parts by weight, including：Silicane-modified polyurethane prepolymer：100 parts；Initial bonding strength accelerator：15 20 parts；Reactive diluent：25 parts；Plasticizer：20 30 parts；Conductive black：8 15 parts；Gas-phase silica：5 10 parts；Thixotropic agent：12 parts；Light stabilizer：12 parts；Heat stabilizer：12 parts；Deicer：23 parts；Adhesion promoters：24 parts；Catalyst：0.2 0.5 parts.The silicane-modified polyurethane Conductive sealant of the present invention is one pack system, cold curing, electric conductivity are excellent, and surface drying speed is fast, initial bonding strength is formed soon, and is constructed without primary coat, has preferable heatproof, water-fast, ageing-resistant and higher physical and mechanical property after solidification.
Description
Technical field
The present invention relates to a kind of fluid sealant and preparation method thereof, more particularly to a kind of silicane-modified polyurethane conductive seal
Glue and preparation method thereof.
Background technology
The electric conductivity of fluid sealant, which improves, enables its application field to extend, and is obtained in the field such as antistatic and electronic equipment
It is widely applied.At present, fluid sealant generally comprises several classes such as epoxy resin, organosilicon, phenolic resin, polyurethane；Conduction is filled out
Material is based on silver powder, graphene, CNT, conductive black, electrically conductive graphite；In polyurethane sealant-NCO group is to moisture
It is very sensitive, easily influence the bin stability of system.Universal polyurethane sealant is present is bonded poor, heat resistance not without primary coat
Foot, and fluid sealant surface drying time it is longer the shortcomings of；And organosilicon sealant then exists not in terms of adhesive strength, curing rate
Foot.
Silicane-modified polyurethane elastic sealant new in recent years is industrially used widely rapidly, in system
Si-O-Si keys have excellent weather-proof, anti-aging property.The network structure formed after the sealing glue solidifying is because with polyurethane
The double grading of chain and Si-O-Si keys, therefore in universalities such as mechanical property, weather resistance, ageing-resistant performance, storage stabilizations
It can be balanced between polyurethane and organosilicon sealant, and overcome both shortcomings.Silicane-modified polyurethane (SPU)
Fluid sealant is solidified by end siloxanes hydrolytic crosslinking, because contained Si-O-C keys have hydrophobicity, makes SPU fluid sealants than common
Polyurethane sealant system to moisture have lower sensitiveness, causing the bin stability of fluid sealant has larger improvement.
In addition, the common room temperature moisture-curable electric silica gel used at present, in use because the initial bonding force formed after surface drying is weak,
It must for a long time place or increase mould positioning, be not suitable for sharp work.
The content of the invention
The invention aims to solve shortcoming present in prior art, and propose it is a kind of new silane-modified
Conductive polyurethane fluid sealant and preparation method thereof.
To achieve these goals, present invention employs following technical scheme：One kind proposed by the present invention is silane-modified poly-
Urethane Conductive sealant, in parts by weight, it includes：
Silicane-modified polyurethane prepolymer：100 parts；
Initial bonding strength accelerator：15-20 parts；
Reactive diluent：2-5 parts；
Plasticizer：20-30 parts；
Conductive black：8-15 parts；
Gas-phase silica：5-10 parts；
Thixotropic agent：1-2 parts；
Light stabilizer：1-2 parts；
Heat stabilizer：1-2 parts；
Deicer：2-3 parts；
Adhesion promoters：2-4 parts；
Catalyst：0.2-0.5 parts.
It is preferred that, foregoing silicane-modified polyurethane Conductive sealant, wherein described silicane-modified polyurethane prepolymer
Viscosity be 40-50Pas；
Described initial bonding strength accelerator be liquid rosin resin, liquid terpene resins and aromatic modified terpene resin in extremely
Few one kind；
Described reactive diluent is single-ended alkoxy silane based polyurethanes or single-ended alkoxysilane group polyethers；
Described plasticizer is at least one of phthalate organic compound and PPG；
Described conductive black is amino silane modified conductive black, alkyl-modified conductive black and isocyanate-modified led
At least one of electric carbon black；
Described gas-phase silica is hydrophabic silica, and specific surface area is 100-250cm2/g；
Described thixotropic agent is at least one of polyamide wax, rilanit special and organobentonite；
Described light stabilizer is at least one of benzophenone class, benzotriazole and hindered amines；
Described heat stabilizer is Hinered phenols antioxidant；
Described deicer is high activity functional silanes, is vinyltrimethoxy silane, vinyl triethoxyl silicon
Alkane or 3- NCO propyl trimethoxy silicanes；
Described adhesion promoters are alkoxy silane；
Described catalyst is organic tin compound.
It is preferred that, foregoing silicane-modified polyurethane Conductive sealant, wherein described reactive diluent is (R1O)3-Si-
(CH2O)n-R2Or (R1O)3-Si-(NH-COO)n-R2；Wherein R1、R2For-CH3Or-C2H5, n is 1-3.
It is preferred that, foregoing silicane-modified polyurethane Conductive sealant, wherein described plasticizer is phthalic acid two
At least one of butyl ester, dioctyl phthalate, didecyl phthalate and polypropylene glycol.
It is preferred that, foregoing silicane-modified polyurethane Conductive sealant, wherein described heat stabilizer is 2,6- butyl -4-
Methylphenol or double (3,5- butyl -4- hydroxy phenyls) thioethers.
It is preferred that, foregoing silicane-modified polyurethane Conductive sealant, wherein described adhesion promoters are N- (β-ammonia second
Base)-γ-aminopropyltrimethoxysilane, gamma-aminopropyl-triethoxy-silane or γ-(2,3- the third oxygen of epoxy) propyl group trimethoxy
Base silane.
It is preferred that, foregoing silicane-modified polyurethane Conductive sealant, wherein described catalyst is the fourth of tin dilaurate two
At least one of Ji Xi, stannous octoate, bis-acetylacetonate base dibutyl tin.
To achieve these goals, present invention employs following technical scheme：One kind proposed by the present invention is silane-modified poly-
The preparation method of urethane Conductive sealant, it includes：
1) by 100 parts of silicane-modified polyurethane prepolymer, 15-20 parts of initial bonding strength accelerator, 2-5 parts of reactive diluent increases
20-30 parts of agent is moulded, 8-15 parts of conductive black, 5-10 parts of gas-phase silica, 1-2 parts of thixotropic agent, 1-2 parts of light stabilizer is thermally-stabilised
1-2 parts of agent and 1-2 parts of deicer, the hybrid reaction in power mixer；0.09-0.1MPa is evacuated to, stirring dehydration is obtained
Mixture；
2) mixture of stating is cooled to less than 40 DEG C and is filled with nitrogen, add 1-2 parts of deicer, initial bonding strength accelerator
2-4 parts, 0.2-0.5 parts of catalyst, after mixing under vacuum, are filled with nitrogen, obtain silicane-modified polyurethane conductive seal
Glue.
It is preferred that, the preparation method of foregoing silicane-modified polyurethane Conductive sealant, wherein it is described the step of 1) in
Reaction temperature is 55-65 DEG C, and the reaction time is 0.5-1.5h；It is 85-95 DEG C to stir dehydration temperaturre, and stirring dewatering time is 1.5-
2.5h；
Described step 2) incorporation time be 0.5-1h.
It is preferred that, the preparation method of foregoing silicane-modified polyurethane Conductive sealant, wherein described is silane-modified poly-
The viscosity of urethane prepolymer is 40-50Pas；
Described initial bonding strength accelerator be liquid rosin resin, liquid terpene resins and aromatic modified terpene resin in extremely
Few one kind；
Described reactive diluent is single-ended alkoxy silane based polyurethanes or single-ended alkoxysilane group polyethers；
Described plasticizer is at least one of phthalate organic compound and PPG；
Described conductive black is amino silane modified conductive black, alkyl-modified conductive black and isocyanate-modified led
At least one of electric carbon black；
Described gas-phase silica is hydrophabic silica, and specific surface area is 100-250cm2/g；
Described thixotropic agent is at least one of polyamide wax, rilanit special and organobentonite；
Described light stabilizer is at least one of benzophenone class, benzotriazole and hindered amines；
Described heat stabilizer is Hinered phenols antioxidant；
Described deicer is high activity functional silanes, is vinyltrimethoxy silane, vinyl triethoxyl silicon
Alkane or 3- NCO propyl trimethoxy silicanes；
Described adhesion promoters are alkoxy silane；
Described catalyst is organic tin compound.
Compared with prior art, the beneficial effects of the invention are as follows：
Silicane-modified polyurethane Conductive sealant of the present invention is that one pack system, cold curing, electric conductivity are excellent, and during surface drying
Between be less than 15min, initial bonding strength formed soon, and constructed without primary coat, after solidification with preferable heatproof, it is water-fast, ageing-resistant and compared with
High physical and mechanical property.
Embodiment
The technical scheme in the embodiment of the present invention will be clearly and completely described below, it is clear that described implementation
Example only a part of embodiment of the invention, rather than whole embodiments.In addition, the specific spy in one or more embodiments
Levy, structure or feature can be combined by any suitable form.
A kind of silicane-modified polyurethane Conductive sealant that one embodiment of the present of invention is proposed, in parts by weight, it is wrapped
Include：
Silicane-modified polyurethane prepolymer：100 parts；
Initial bonding strength accelerator：15-20 parts；
Reactive diluent：2-5 parts；
Plasticizer：20-30 parts；
Conductive black：8-15 parts；
Gas-phase silica：5-10 parts；
Thixotropic agent：1-2 parts；
Light stabilizer：1-2 parts；
Heat stabilizer：1-2 parts；
Deicer：2-3 parts；
Adhesion promoters：2-4 parts；
Catalyst：0.2-0.5 parts.
It is preferred that, silicane-modified polyurethane base polymer is that the trade mark trade mark that Mitugao New Material Group is produced is
SPUR1015M silicane-modified polyurethane prepolymer, viscosity is 45-55Pas, is used as product material of main part.
It is preferred that, initial bonding strength accelerator is in liquid rosin resin, liquid terpene resins and aromatic modified terpene resin
At least one, for improving initial bonding strength.
It is preferred that, reactive diluent is single-ended alkoxy silane based polyurethanes or single-ended alkoxysilane group polyethers, molecule
Formula is (R1O)3-Si-(CH2O)n-R2Or (R1O)3-Si-(NH-COO)n-R2；Wherein R1、R2For-CH3Or-C2H5, n is the whole of 1-3
Number, reduces product viscosity, and cross-linking and curing reaction is played with matrix resin.
It is preferred that, plasticizer is at least one of phthalate organic compound and PPG, including
Dibutyl phthalate, dioctyl phthalate, didecyl phthalate and polypropylene glycol, reduce product viscosity, carry
High product elongation at break.
It is preferred that, conductive black is amino silane modified conductive black, alkyl-modified conductive black and isocyanate-modified
At least one of conductive black；Preferably isocyanate-modified conductive black, as conductive filler, makes product conductive
Energy.
It is preferred that, gas-phase silica is hydrophabic silica, and specific surface area is 100-250cm2/g；；Preferably 150cm2/
G hydrophabic silica, as reinforced filling, improves product ontology intensity.
It is preferred that, thixotropic agent is at least one of polyamide wax, rilanit special and organobentonite；Preferably polyamides
Amine wax, improves product thixotropic property.
It is preferred that, light stabilizer is at least one of benzophenone class, benzotriazole and hindered amines；Preferably benzo three
Azole, improves product light stability.
It is preferred that, heat stabilizer is Hinered phenols antioxidant, is 6- butyl -4- methylphenols or double (3,5- butyl -4- hydroxyls
Base phenyl) thioether, improves product heat endurance.
Described deicer is high activity functional silanes, is vinyltrimethoxy silane, vinyl triethoxyl silicon
Alkane or 3- NCO propyl trimethoxy silicanes, remove the micro-moisture in product, improve product storage stability.
Described adhesion promoters be alkoxy silane, be N- (β-aminoethyl)-γ-aminopropyltrimethoxysilane, γ-
Aminopropyl triethoxysilane or γ-(2,3- the third oxygen of epoxy) propyl trimethoxy silicane, improve cohesive force of the product to base material.
Described catalyst is organic tin compound, is dibutyl tin laurate, stannous octoate, bis-acetylacetonate base
At least one of dibutyl tin, improves product crosslinking curing speed.
Silicane-modified polyurethane Conductive sealant in the presence of reactive diluent, initial bonding strength accelerator, adhesion promoters,
Wetability of the fluid sealant to substrate surface is further enhanced, the crosslink density after surface drying time, and initial solidification is improved,
Therefore it has been obviously improved the initial bonding strength of colloid.
Another embodiment of the present invention proposes a kind of preparation method of silicane-modified polyurethane Conductive sealant, and it includes：
1) by 100 parts of silicane-modified polyurethane prepolymer, 15-20 parts of initial bonding strength accelerator, 2-5 parts of reactive diluent increases
20-30 parts of agent is moulded, 8-15 parts of conductive black, 5-10 parts of gas-phase silica, 1-2 parts of thixotropic agent, 1-2 parts of light stabilizer is thermally-stabilised
1-2 parts of 1-2 parts of agent and deicer, mix 55-65 DEG C of reaction 0.5-1.5h in power mixer；It is evacuated to 0.09-
0.1MPa, 85-95 DEG C of stirring dehydration 1.5-2.5h, obtain mixture；
2) mixture of stating is cooled to less than 40 DEG C and is filled with nitrogen, add 1-2 parts of deicer, initial bonding strength accelerator
2-4 parts, 0.2-0.5 parts of catalyst, are evacuated under the conditions of -0.1mpa and mix 0.5-1h, after be filled with nitrogen and release vacuum to normal
Pressure, obtains silicane-modified polyurethane Conductive sealant.
Wherein, conductive black, gas-phase silica are in 130-150 DEG C of dry more than 8h.
Embodiment 1
One embodiment of the invention proposes a kind of preparation method of silicane-modified polyurethane Conductive sealant, and it includes：
1) by 100 parts of silicane-modified polyurethane prepolymer, 15 parts of initial bonding strength accelerator, 2 parts of reactive diluent, plasticizer 20
1 part of part, 8 parts of conductive black, 5 parts of gas-phase silica, 1 part of thixotropic agent, 1 part of light stabilizer, 1 part of heat stabilizer and deicer,
60 DEG C of reaction 1h are mixed in power mixer；0.09MPa, 85 DEG C of stirring dehydration 2h are evacuated to, mixture is obtained；
2) mixture of stating is cooled to less than 40 DEG C and is filled with nitrogen, add 1 part of deicer, initial bonding strength accelerator 2
Part, 0.2 part of catalyst, be evacuated under the conditions of -0.1mpa and mix 0.5h, nitrogen is filled with after filling and releases vacuum to normal pressure, is obtained
Silicane-modified polyurethane Conductive sealant.
Another embodiment of the present invention proposes a kind of silicane-modified polyurethane Conductive sealant, prepared by the above method and
, in parts by weight, it includes：
Silicane-modified polyurethane prepolymer：100 parts, be SPUR1050MM；
Initial bonding strength accelerator：15 parts, be liquid rosin resin；
Reactive diluent：2 parts, be single-ended alkoxy silane based polyurethanes；
Plasticizer：20 parts, be dibutyl phthalate；
Conductive black：8 parts, be isocyanate-modified conductive black；
Gas-phase silica：5 parts, be hydrophabic silica of the specific surface area in 100cm2/g；
Thixotropic agent：1 part, be polyamide wax；
Light stabilizer：1 part, be benzophenone class；
Heat stabilizer：1 part, be 2,6- butyl -4- methylphenols；
Deicer：2 parts, be vinyltrimethoxy silane；
Adhesion promoters：2 parts, be N- (β-aminoethyl)-γ-aminopropyltrimethoxysilane；
Catalyst：0.2 part, be dibutyl tin laurate.
Embodiment 2
One embodiment of the invention proposes a kind of preparation method of silicane-modified polyurethane Conductive sealant, and it includes：
1) by 100 parts of silicane-modified polyurethane prepolymer, 20 parts of initial bonding strength accelerator, 5 parts of reactive diluent, plasticizer 30
2 parts of part, 15 parts of conductive black, 10 parts of gas-phase silica, 2 parts of thixotropic agent, 2 parts of light stabilizer, 2 parts of heat stabilizer and deicer,
55 DEG C of reaction 1.5h are mixed in power mixer；0.1MPa, 95 DEG C of stirring dehydration 2h are evacuated to, mixture is obtained；
2) mixture of stating is cooled to less than 40 DEG C and is filled with nitrogen, add 1 part of deicer, initial bonding strength accelerator 4
Part, 0.5 part of catalyst, 1h is mixed under -0.1mpa vacuum conditions, and nitrogen is filled with after filling and releases vacuum to normal pressure, silane is obtained
Modified polyurethane Conductive sealant.
Another embodiment of the present invention proposes a kind of silicane-modified polyurethane Conductive sealant, prepared by the above method and
, in parts by weight, it includes：
Silicane-modified polyurethane prepolymer：100 parts, be SPUR1050MM；
Initial bonding strength accelerator：20 parts, be liquid terpene resins；
Reactive diluent：5 parts, be single-ended alkoxysilane group polyethers；
Plasticizer：30 parts, be dioctyl phthalate；
Conductive black：15 parts, be alkyl-modified conductive black；
Gas-phase silica：10 parts, be hydrophabic silica of the specific surface area in 150cm2/g；
Thixotropic agent：2 parts, be rilanit special；
Light stabilizer：2 parts, be benzotriazole；
Heat stabilizer：2 parts, be double (3,5- butyl -4- hydroxy phenyls) thioethers；
Deicer：3 parts, be VTES；
Adhesion promoters：4 parts, be gamma-aminopropyl-triethoxy-silane；
Catalyst：0.5 part, be stannous octoate.
Embodiment 3
One embodiment of the invention proposes a kind of preparation method of silicane-modified polyurethane Conductive sealant, and it includes：
1) by 100 parts of silicane-modified polyurethane prepolymer, 18 parts of initial bonding strength accelerator, 4 parts of reactive diluent, plasticizer 25
1 part of part, 10 parts of conductive black, 8 parts of gas-phase silica, 1 part of thixotropic agent, 2 parts of light stabilizer, 1 part of heat stabilizer and deicer,
65 DEG C of reaction 0.5h are mixed in power mixer；0.09MPa, 90 DEG C of stirring dehydration 2h are evacuated to, mixture is obtained；
2) mixture of stating is cooled to less than 40 DEG C and is filled with nitrogen, add 1 part of deicer, initial bonding strength accelerator 3
Part, 0.3 part of catalyst, 1h is mixed under -0.1mpa vacuum conditions, and nitrogen is filled with after filling and releases vacuum to normal pressure, silane is obtained
Modified polyurethane Conductive sealant.
Another embodiment of the present invention proposes a kind of silicane-modified polyurethane Conductive sealant, prepared by the above method and
, in parts by weight, it includes：
Silicane-modified polyurethane prepolymer：100 parts, be SPUR1050MM；
Initial bonding strength accelerator：18 parts, be liquid terpene resins and aromatic modified terpene resin；
Reactive diluent：4 parts, be single-ended alkoxy silane based polyurethanes；
Plasticizer：25 parts, be didecyl phthalate and polypropylene glycol；
Conductive black：10 parts, be amino silane modified conductive black and alkyl-modified conductive black；
Gas-phase silica：8 parts are specific surface area in 150cm2/ g hydrophabic silica；
Thixotropic agent：1 part, be rilanit special and organobentonite；
Light stabilizer：2 parts, be benzotriazole and hindered amines；
Heat stabilizer：1 part, be 2,6- butyl -4- methylphenols；
Deicer：2 parts, be 3- NCO propyl trimethoxy silicanes；
Adhesion promoters：3 parts, be γ-(2,3- the third oxygen of epoxy) propyl trimethoxy silicane；
Catalyst：0.3 part, be sour stannous and bis-acetylacetonate base dibutyl tin.
Comparative example 1 provides a kind of silicane-modified polyurethane Conductive sealant, its primary raw material composition and the phase of case study on implementation 1
Together, difference is to be not added with liquid rosin resin.
Comparative example 2 provides a kind of silicane-modified polyurethane Conductive sealant, its primary raw material composition and the phase of case study on implementation 1
Together, difference is to be not added with reactive diluent.
Embodiment 1-3 and comparative example 1-2 silicane-modified polyurethane Conductive sealant are tested.Surface drying time according to
GB/T13477 is tested；Tensile strength and elongation at break are detected according to GB/528；Shear strength is according to GB/T
7124 are tested；Initial bonding strength is tested：Silane is changed into new polyether seal glue sample and butchers rapid according to GB/ on polyurethane film
4852 are tested.Test result is as shown in table 1.
The silicane-modified polyurethane Conductive sealant test result of the embodiment of table 1 and comparative example
It was found from the data of table 1, by by the reactive diluent of initial bonding strength accelerator and single-ended alkoxy silane based polyurethanes
Addition use, hence it is evident that improve the initial bonding strength of silicane-modified polyurethane, and mechanics is excellent.
The foregoing is only a preferred embodiment of the present invention, but protection scope of the present invention be not limited thereto,
Any one skilled in the art the invention discloses technical scope in, technique according to the invention scheme and its
Inventive concept is subject to equivalent substitution or change, should all be included within the scope of the present invention.
Claims (10)
1. a kind of silicane-modified polyurethane Conductive sealant, it is characterised in that in parts by weight, it includes：
Silicane-modified polyurethane prepolymer：100 parts；
Initial bonding strength accelerator：15-20 parts；
Reactive diluent：2-5 parts；
Plasticizer：20-30 parts；
Conductive black：8-15 parts；
Gas-phase silica：5-10 parts；
Thixotropic agent：1-2 parts；
Light stabilizer：1-2 parts；
Heat stabilizer：1-2 parts；
Deicer：2-3 parts；
Adhesion promoters：2-4 parts；
Catalyst：0.2-0.5 parts.
2. silicane-modified polyurethane Conductive sealant according to claim 1, it is characterised in that described is silane-modified poly-
The viscosity of urethane prepolymer is 40-50Pas；
Described initial bonding strength accelerator is at least one in liquid rosin resin, liquid terpene resins and aromatic modified terpene resin
Kind；
Described reactive diluent is single-ended alkoxy silane based polyurethanes or single-ended alkoxysilane group polyethers；
Described plasticizer is at least one of phthalate organic compound and PPG；
Described conductive black is amino silane modified conductive black, alkyl-modified conductive black and isocyanate-modified conductive charcoal
It is at least one of black；
Described gas-phase silica is hydrophabic silica, and specific surface area is 100-250cm2/g；
Described thixotropic agent is at least one of polyamide wax, rilanit special and organobentonite；
Described light stabilizer is at least one of benzophenone class, benzotriazole and hindered amines；
Described heat stabilizer is Hinered phenols antioxidant；
Described deicer be high activity functional silanes, be vinyltrimethoxy silane, VTES or
3- NCO propyl trimethoxy silicanes；
Described adhesion promoters are alkoxy silane；
Described catalyst is organic tin compound.
3. silicane-modified polyurethane Conductive sealant according to claim 2, it is characterised in that described reactive diluent
For (R1O)3-Si-(CH2O)n-R2Or (R1O)3-Si-(NH-COO)n-R2；Wherein R1、R2For-CH3Or-C2H5, n is 1-3.
4. silicane-modified polyurethane Conductive sealant according to claim 2, it is characterised in that described plasticizer is neighbour
At least one of dibatyl phithalate, dioctyl phthalate, didecyl phthalate and polypropylene glycol.
5. silicane-modified polyurethane Conductive sealant according to claim 2, it is characterised in that described heat stabilizer is
2,6- butyl -4- methylphenols or double (3,5- butyl -4- hydroxy phenyls) thioethers.
6. silicane-modified polyurethane Conductive sealant according to claim 2, it is characterised in that described adhesion promoters
For N- (β-aminoethyl)-γ-aminopropyltrimethoxysilane, gamma-aminopropyl-triethoxy-silane or γ-(2,3- the third oxygen of epoxy)
Propyl trimethoxy silicane.
7. silicane-modified polyurethane Conductive sealant according to claim 2, it is characterised in that described catalyst is two
At least one of dibutyl tin laurate, stannous octoate, bis-acetylacetonate base dibutyl tin.
8. a kind of preparation method of silicane-modified polyurethane Conductive sealant, it is characterised in that it includes：
1) by 100 parts of silicane-modified polyurethane prepolymer, 15-20 parts of initial bonding strength accelerator, 2-5 parts of reactive diluent, plasticizer
20-30 parts, 8-15 parts of conductive black, 5-10 parts of gas-phase silica, 1-2 parts of thixotropic agent, 1-2 parts of light stabilizer, heat stabilizer 1-2
Part and 1-2 parts of deicer, the hybrid reaction in power mixer；0.09-0.1MPa is evacuated to, stirring dehydration is mixed
Thing；
2) mixture of stating is cooled to less than 40 DEG C and is filled with nitrogen, add 1-2 parts of deicer, initial bonding strength accelerator 2-4
Part, 0.2-0.5 parts of catalyst, after mixing under vacuum, are filled with nitrogen, obtain silicane-modified polyurethane Conductive sealant.
9. the preparation method of silicane-modified polyurethane Conductive sealant according to claim 8, it is characterised in that described
Step 1) in reaction temperature be 55-65 DEG C, the reaction time is 0.5-1.5h；It is 85-95 DEG C to stir dehydration temperaturre, stirring dehydration
Time is 1.5-2.5h；
Described step 2) incorporation time be 0.5-1h.
10. the preparation method of silicane-modified polyurethane Conductive sealant according to claim 8, it is characterised in that described
Silicane-modified polyurethane prepolymer viscosity be 40-50Pas；
Described initial bonding strength accelerator is at least one in liquid rosin resin, liquid terpene resins and aromatic modified terpene resin
Kind；
Described reactive diluent is single-ended alkoxy silane based polyurethanes or single-ended alkoxysilane group polyethers；
Described plasticizer is at least one of phthalate organic compound and PPG；
Described conductive black is amino silane modified conductive black, alkyl-modified conductive black and isocyanate-modified conductive charcoal
It is at least one of black；
Described gas-phase silica is hydrophabic silica, and specific surface area is 100-250cm2/g；
Described thixotropic agent is at least one of polyamide wax, rilanit special and organobentonite；
Described light stabilizer is at least one of benzophenone class, benzotriazole and hindered amines；
Described heat stabilizer is Hinered phenols antioxidant；
Described deicer be high activity functional silanes, be vinyltrimethoxy silane, VTES or
3- NCO propyl trimethoxy silicanes；
Described adhesion promoters are alkoxy silane；
Described catalyst is organic tin compound.
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107936882A (en) * | 2017-09-22 | 2018-04-20 | 江苏昶浩建材有限公司 | A kind of decoration composite plate hot melt adhesive |
| CN110256995A (en) * | 2019-06-19 | 2019-09-20 | 烟台泰盛精化科技有限公司 | A kind of flame-retardant double-component polyethers adhesive and preparation method thereof |
| CN110281504A (en) * | 2019-06-27 | 2019-09-27 | 广州市白云化工实业有限公司 | A kind of silane-modified sealing material continuous production device and method |
| CN110527474A (en) * | 2019-09-06 | 2019-12-03 | 武汉奥克特种化学有限公司 | A kind of silane modified polyether Conductive sealant and preparation method thereof |
| CN110922936A (en) * | 2019-12-13 | 2020-03-27 | 东莞市博君来胶粘材料科技有限公司 | Dealcoholized silicone adhesive and preparation method and application thereof |
| CN112920739A (en) * | 2021-01-28 | 2021-06-08 | 深圳市中欧新材料有限公司 | Silane modified polyurethane conductive sealant and preparation method thereof |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102504750A (en) * | 2011-11-22 | 2012-06-20 | 东莞市普赛达密封粘胶有限公司 | Polyurethane sealant with good initial adhesion |
| CN102504748A (en) * | 2011-11-07 | 2012-06-20 | 广州机械科学研究院有限公司 | Silane modified polyurethane sealing glue with quick surface dry as well as preparation and application thereof |
| CN106634771A (en) * | 2016-12-23 | 2017-05-10 | 广州市白云化工实业有限公司 | Silane modified polyether sealant and preparation method thereof |
-
2017
- 2017-07-07 CN CN201710552508.6A patent/CN107163896A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102504748A (en) * | 2011-11-07 | 2012-06-20 | 广州机械科学研究院有限公司 | Silane modified polyurethane sealing glue with quick surface dry as well as preparation and application thereof |
| CN102504750A (en) * | 2011-11-22 | 2012-06-20 | 东莞市普赛达密封粘胶有限公司 | Polyurethane sealant with good initial adhesion |
| CN106634771A (en) * | 2016-12-23 | 2017-05-10 | 广州市白云化工实业有限公司 | Silane modified polyether sealant and preparation method thereof |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107936882A (en) * | 2017-09-22 | 2018-04-20 | 江苏昶浩建材有限公司 | A kind of decoration composite plate hot melt adhesive |
| CN110256995A (en) * | 2019-06-19 | 2019-09-20 | 烟台泰盛精化科技有限公司 | A kind of flame-retardant double-component polyethers adhesive and preparation method thereof |
| CN110256995B (en) * | 2019-06-19 | 2021-08-13 | 烟台泰盛精化科技有限公司 | Flame-retardant two-component polyether adhesive and preparation method thereof |
| CN110281504A (en) * | 2019-06-27 | 2019-09-27 | 广州市白云化工实业有限公司 | A kind of silane-modified sealing material continuous production device and method |
| WO2020258788A1 (en) * | 2019-06-27 | 2020-12-30 | 广州市白云化工实业有限公司 | Continuous production device and method for silane-modified sealing material |
| US20220106484A1 (en) * | 2019-06-27 | 2022-04-07 | Guangzhou Baiyun Chemical Industry Co., Ltd. | Continuous Production Device and Method for Silane-Modified Sealing Material |
| CN110527474A (en) * | 2019-09-06 | 2019-12-03 | 武汉奥克特种化学有限公司 | A kind of silane modified polyether Conductive sealant and preparation method thereof |
| CN110922936A (en) * | 2019-12-13 | 2020-03-27 | 东莞市博君来胶粘材料科技有限公司 | Dealcoholized silicone adhesive and preparation method and application thereof |
| CN112920739A (en) * | 2021-01-28 | 2021-06-08 | 深圳市中欧新材料有限公司 | Silane modified polyurethane conductive sealant and preparation method thereof |
| CN116285851A (en) * | 2023-04-07 | 2023-06-23 | 深圳市齐进建筑工程有限公司 | Building joint sealing material and preparation process thereof |
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Application publication date: 20170915 |