CN103540285B - A kind of epoxyn for Intelligent card package - Google Patents
A kind of epoxyn for Intelligent card package Download PDFInfo
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Abstract
The invention discloses a kind of epoxyn for Intelligent card package, such epoxyn is non-conductive adhesive and electro-conductive adhesive, and it comprises following composition according to weight percent: the filler of the coupling agent of the amine curing agent of the epoxy resin of 20-40%, the thinner of 5-20%, 4-8%, the curing catalyst of 4-8%, 0.1-1%, the tensio-active agent of 0.1-1%, the glass microballon of 1-5% and 20-40%.Epoxyn is obtained by specifically preparing sequential system.Adding by tensio-active agent, resin is effectively inhibit to overflow, the reliability of product is ensure that while improve routing yield, by adding glass microballon, effectively control bondline thickness, after making paster, glue-line can not be crossed thin or blocked up, ensure that the reliability of the rear product of encapsulation, reduce corner difference of altitude simultaneously, improve routing yield and efficiency.
Description
Technical field
The present invention relates to the epoxyn for Intelligent card package, particularly relate to a kind of tackiness agent bonding with flexible substrates framework or carrier band for intelligent card chip.
Background technology
The utilization of smart card has become the important component part of the industries such as world today's banking industry, communications and mobile communication access.In daily life, the smart card that we see usually is the compact SIM card in phonecard and mobile phone.Certainly, as everyone knows, smart card also has many widespread uses, and its development prospect is very wide.The Sustainable development of global economic integration and Chinese national economy all will make China become maximum application of IC cards market, the whole world.Domestic smart card has good development prospect, especially fairly obvious to the demand of lower cost, high reliability, flexibility, thin card.
At present, the intelligent card chip adhesive for packaging on market has serious resin spillover on the flexible carrier band of smart card, overflows area covering routing position, often causes routing yield low, also cause serious impact simultaneously on the reliability of plastic packaged products; And smart card module requires to control the thickness of integral module, to ensure the thin card demand of smart card, and tackiness agent of the prior art usually there is paster after glue-line cross thin or blocked up phenomenon, cause integral module thickness not reach requirement.
Therefore, prior art needs further to improve and develop.
Summary of the invention
In view of above-mentioned the deficiencies in the prior art, the object of the present invention is to provide a kind of low resin to overflow, the epoxyn of the Intelligent card package of controlled glue layer thickness, comprises non-conductive adhesive and electro-conductive adhesive.
Technical scheme of the present invention is as follows:
For an epoxy resin non-conductive adhesive for Intelligent card package, it comprises following composition according to weight percent:
Described epoxy resin non-conductive adhesive, wherein, described epoxy resin is one in bisphenol A epoxide resin, bisphenol F epoxy resin, novolac epoxy or its mixture, has both been matrix resin in formula, increases again the thixotropy of tackiness agent simultaneously.Described thinner is the BDDE of quality purity more than 92%; Described amine curing agent is one in Dyhard RU 100, polyetheramine, diaminodiphenylsulfone(DDS), polymeric amide or its mixture.Described curing catalyst is imidazoles and imidazole derivative.Described coupling agent is silane coupling agent.Described tensio-active agent is silane surface active agent or fluorochemical surfactant, suppresses resin to overflow further by the surface tension improving adhesive system.Described glass microballon is the hollow glass bead of 15-25um, is used for controlling bondline thickness, prevents chip from tilting.Described filler is the one in silicon powder, ptfe micropowder or aerosil, and wherein, silicon powder and ptfe micropowder all cross 1000 mesh sieves.
Described epoxy resin non-conductive adhesive, wherein, described imidazoles and imidazole derivative are glyoxal ethyline, 2-ethyl imidazol(e), the one in 2-ethyl-4-methylimidazole or its mixture, it and amine curing agent with the use of, can accelerated reaction, complete fast setting.
Described epoxy resin non-conductive adhesive, wherein, described silane coupling agent is one in aminopropyl triethoxysilane, propyl trimethoxy silicane, aminopropyl trimethoxysilane, two (tri-ethoxy silylpropyl) polysulfide or its mixture.
For an epoxy resin conductive adhesive for Intelligent card package, it comprises following composition according to weight percent:
Described epoxy resin conductive adhesive, wherein, described epoxy resin is one in bisphenol A epoxide resin, bisphenol F epoxy resin, novolac epoxy or its mixture, has both been matrix resin in formula, increases again the thixotropy of tackiness agent simultaneously.Described thinner is the BDDE of quality purity more than 92%; Described amine curing agent is one in Dyhard RU 100, polyetheramine, diaminodiphenylsulfone(DDS), polymeric amide or its mixture.Described curing catalyst is imidazoles and imidazole derivative.Described coupling agent is silane coupling agent.Described tensio-active agent is silane surface active agent or fluorochemical surfactant, suppresses resin to overflow further by the surface tension improving adhesive system.Described silver powder was the flake silver powder of 400 mesh sieves.
Described epoxy resin conductive adhesive, wherein, described imidazoles and imidazole derivative are glyoxal ethyline, 2-ethyl imidazol(e), the one in 2-ethyl-4-methylimidazole or its mixture, it and amine curing agent with the use of, can accelerated reaction, complete fast setting.
Described epoxy resin conductive adhesive, wherein, described silane coupling agent is one in aminopropyl triethoxysilane, propyl trimethoxy silicane, aminopropyl trimethoxysilane, two (tri-ethoxy silylpropyl) polysulfide or its mixture.
A kind of epoxyn for Intelligent card package provided by the invention, comprise non-conductive adhesive and electro-conductive adhesive, adopt thinner, amine curing agent, curing catalyst, coupling agent, tensio-active agent, glass microballon and filler, or use silver powder to replace the formula of filler, epoxyn is obtained by specifically preparing sequential system, adding by tensio-active agent, resin is effectively inhibit to overflow, the reliability of product is ensure that while improve routing yield, by adding glass microballon, effectively control bondline thickness, after making paster, glue-line can not be crossed thin or blocked up, ensure that the reliability of the rear product of encapsulation, reduce corner difference of altitude simultaneously, improve routing yield and efficiency.
Embodiment
The invention provides a kind of epoxyn for Intelligent card package, for making object of the present invention, technical scheme and effect clearly, clearly, the present invention is described in more detail below.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
The invention provides a kind of epoxyn for Intelligent card package, such epoxyn is non-conductive adhesive, and it comprises following composition according to weight percent: the filler of the coupling agent of the amine curing agent of the epoxy resin of 20-40%, the thinner of 5-20%, 4-8%, the curing catalyst of 4-8%, 0.1-1%, the tensio-active agent of 0.1-1%, the glass microballon of 1-5% and 20-40%.Avoid the situation occurring that resin overflows, while improve routing yield, ensure that the reliability of product.
Further, described epoxy resin non-conductive adhesive, wherein, described epoxy resin is one in bisphenol A epoxide resin, bisphenol F epoxy resin, novolac epoxy or its mixture, both be matrix resin in formula, increased again the thixotropy of tackiness agent simultaneously.Described thinner is the BDDE of quality purity more than 92%; Described amine curing agent is one in Dyhard RU 100, polyetheramine, diaminodiphenylsulfone(DDS), polymeric amide or its mixture.Described curing catalyst is imidazoles and imidazole derivative.Described coupling agent is silane coupling agent.
Described tensio-active agent is silane surface active agent or fluorochemical surfactant, suppresses resin to overflow further by the surface tension improving adhesive system.Described glass microballon is the hollow glass bead of 15-25um, is used for controlling bondline thickness, prevents chip from tilting.Described filler is the one in silicon powder, ptfe micropowder or aerosil, and wherein, silicon powder and ptfe micropowder all cross 1000 mesh sieves.
Described imidazoles and imidazole derivative are glyoxal ethyline, 2-ethyl imidazol(e), the one in 2-ethyl-4-methylimidazole or its mixture, it and amine curing agent with the use of, can accelerated reaction, complete fast setting.Described silane coupling agent is one in aminopropyl triethoxysilane, propyl trimethoxy silicane, aminopropyl trimethoxysilane, two (tri-ethoxy silylpropyl) polysulfide or its mixture.
In order to more detailed description epoxyn of the present invention, below enumerate more detailed embodiment and be described.
Embodiment 1
Formula is:
Preparation method: according to dosage by bisphenol A epoxide resin, 92%1,4-butanediol diglycidyl ether, Dyhard RU 100, glyoxal ethyline, aminopropyl triethoxysilane and silane surface active agent mix, through three-roller mixing twice, add silicon powder again, stir, then through three-roller mixing both sides time, then glass microballon is added, stir half hour, vacuum defoamation 30min, the epoxyn that obtained the present invention is non-conductive.
Get 0.5ml tackiness agent and test its viscosity: 25 DEG C of viscosity are 10000Cp; Thixotropy index is 5.2; 150 DEG C of 3min glue can solidify; 2*2mm chip, Ag/Cu framework 25 DEG C of horizontal shear forces that can bear are more than 15kg; Before solidification, resin overflows and is measured as 0, and after solidification, resin overflows is 0; Bondline thickness is 10-15 micron, and corner difference of altitude is 6um to the maximum.Obvious, the performance of epoxyn of the present invention is far superior to the performance of relative adhesive in prior art.
Embodiment 2
Formula is:
Preparation method: according to dosage by bisphenol F epoxy resin, the BDDE of 92%, polyetheramine, 2-ethyl imidazol(e), propyl trimethoxy silicane and silane surface active agent mix, through three-roller mixing twice, add ptfe micropowder again, stir, then through three-roller mixing both sides time, then glass microballon is added, stir half hour, vacuum defoamation 30min, the epoxyn that obtained the present invention is non-conductive.
Get 0.5ml tackiness agent and test its viscosity: 25 DEG C of viscosity are 12000Cp; Thixotropy index is 5.5; 150 DEG C of 3min glue can solidify; 2*2mm chip, Ag/Cu framework 25 DEG C of horizontal shear forces that can bear are more than 15kg; Before solidification, resin overflows and is measured as 0, and after solidification, resin overflows is 0; Bondline thickness is 15-20 micron, and corner difference of altitude is 8um to the maximum.Obvious, the performance of epoxyn of the present invention is far superior to the performance of relative adhesive in prior art.
Embodiment 3
Formula is:
Preparation method: according to dosage by bisphenol A epoxide resin, novolac epoxy, 92% 1,4-butanediol diglycidyl ether, polyetheramine, 2-ethyl-4-methylimidazole, two (tri-ethoxy silylpropyl) polysulfide and fluorochemical surfactant mix, and through three-roller mixing twice, then add aerosil, stir, again through three-roller mixing twice, then add glass microballon, stir half hour, vacuum defoamation 30min, the epoxyn that obtained the present invention is non-conductive.
Get 0.5ml tackiness agent and test its viscosity: 25 DEG C of viscosity are 11000Cp; Thixotropy index is 6.0; 150 DEG C of 3min glue can solidify; 2*2mm chip, Ag/Cu framework 25 DEG C of horizontal shear forces that can bear are more than 20kg; Before solidification, resin overflows and is measured as 0, and after solidification, resin overflows is 0; Bondline thickness is 20-25 micron, and corner difference of altitude is 10um to the maximum.Obvious, the performance of epoxyn of the present invention is far superior to the performance of relative adhesive in prior art.
In the above-described embodiments, only list the concrete content of corresponding composition in preferred embodiment, as for the endpoints thereof of each component content and the embodiment of intermediate value, will not enumerate at this, in the process that it is specifically implemented, the present invention can be completed as required in the content range of each composition completely.Obvious, the content of each composition can be adjusted as required, obtain optimum performance.
Present invention also offers the another kind of epoxyn for Intelligent card package, such epoxyn is electro-conductive adhesive, and it comprises following composition according to weight percent: the silver powder of the coupling agent of the amine curing agent of the epoxy resin of 10-25%, the thinner of 5-10%, 1-4%, the curing catalyst of 1-4%, 0.1-1%, the tensio-active agent of 0.1-1%, the glass microballon of 1-5% and 55-80%.
Further, described epoxy resin conductive adhesive, wherein, described epoxy resin is one in bisphenol A epoxide resin, bisphenol F epoxy resin, novolac epoxy or its mixture, both be matrix resin in formula, increased again the thixotropy of tackiness agent simultaneously.Described thinner is the BDDE of quality purity more than 92%; Described amine curing agent is one in Dyhard RU 100, polyetheramine, diaminodiphenylsulfone(DDS), polymeric amide or its mixture.Described curing catalyst is imidazoles and imidazole derivative.Described coupling agent is silane coupling agent.
Described tensio-active agent is silane surface active agent or fluorochemical surfactant, suppresses resin to overflow further by the surface tension improving adhesive system.Described glass microballon is the hollow glass bead of 15-25um, is used for controlling bondline thickness, prevents chip from tilting.Described silver powder was the flake silver powder of 400 mesh sieves.
Described imidazoles and imidazole derivative are glyoxal ethyline, 2-ethyl imidazol(e), the one in 2-ethyl-4-methylimidazole or its mixture, it and amine curing agent with the use of, can accelerated reaction, complete fast setting.Described silane coupling agent is one in aminopropyl triethoxysilane, propyl trimethoxy silicane, aminopropyl trimethoxysilane, two (tri-ethoxy silylpropyl) polysulfide or its mixture.
In order to more detailed description epoxyn of the present invention, below enumerate more detailed embodiment and be described.
Embodiment 4
Formula is:
Preparation method: according to dosage by bisphenol A epoxide resin, 92% 1,4-butanediol diglycidyl ether, Dyhard RU 100, glyoxal ethyline, aminopropyl triethoxysilane and silane surface active agent mix, 2 times are mixed through three-roller, add flake silver powder again and stir half hour, vacuum defoamation 15min, the epoxyn of obtained the present invention's conduction.
Get 0.5ml tackiness agent and test its viscosity: 25 DEG C of viscosity are 11000Cp; Thixotropy index is 5.5; 150 DEG C of 3min glue can solidify; 2*2mm chip, Ag/Cu framework 25 DEG C of horizontal shear forces that can bear are more than 10kg; Volume specific resistance is 2 × 10
-2ohmcm; Before solidification, resin overflows and is measured as 0, and after solidification, resin overflows is 0; Bondline thickness is 10-15 micron, and corner difference of altitude is 7um to the maximum.Obvious, the performance of epoxyn of the present invention is far superior to the performance of relative adhesive in prior art.
Embodiment 5
Formula is:
Preparation method: according to dosage by bisphenol F epoxy resin, 92% 1,4-butanediol diglycidyl ether, polyetheramine, 2-ethyl imidazol(e), propyl trimethoxy silicane and silane surface active agent mix, 2 times are mixed through three-roller, add flake silver powder again and stir half hour, vacuum defoamation 15min, the epoxyn of obtained the present invention's conduction.
Get 0.5ml tackiness agent and test its viscosity: 25 DEG C of viscosity are 12000Cp; Thixotropy index is 5.7; 150 DEG C of 3min glue can solidify; 2*2mm chip, Ag/Cu framework 25 DEG C of horizontal shear forces that can bear are more than 10kg; Volume specific resistance is 1 × 10
-2ohmcm; Before solidification, resin overflows and is measured as 0, and after solidification, resin overflows is 0; Bondline thickness is 15-20 micron, and corner difference of altitude is 8um to the maximum.Obvious, the performance of epoxyn of the present invention is far superior to the performance of relative adhesive in prior art.
Embodiment 6
Formula is:
Preparation method: according to dosage by bisphenol F epoxy resin, novolac epoxy, the Isosorbide-5-Nitrae of 92%
-butanediol diglycidyl ether, polymeric amide, 2-ethyl-4-methylimidazole, two (tri-ethoxy silylpropyl) polysulfide and fluorochemical surfactant mix, 2 times are mixed through three-roller, add glass microballon and flake silver powder stirring half hour again, vacuum defoamation 15min, the epoxyn of obtained the present invention's conduction.
Get 0.5ml tackiness agent and test its viscosity: 25 DEG C of viscosity are 10000Cp; Thixotropy index is 5.0; 150 DEG C of 3min glue can solidify; 2*2mm chip, Ag/Cu framework 25 DEG C of horizontal shear forces that can bear are more than 15kg; Volume specific resistance is 4 × 10
-2ohmcm; Before solidification, resin overflows and is measured as 0, and after solidification, resin overflows is 0; Bondline thickness is 15-25 micron, and corner difference of altitude is 10um to the maximum.Obvious, the performance of epoxyn of the present invention is far superior to the performance of relative adhesive in prior art.
In the above-described embodiments, only list the concrete content of corresponding composition in preferred embodiment, as for the endpoints thereof of each component content and the embodiment of intermediate value, will not enumerate at this, in the process that it is specifically implemented, the present invention can be completed as required in the content range of each composition completely.Obvious, the content of each composition can be adjusted as required, obtain optimum performance.
Should be understood that, application of the present invention is not limited to above-mentioned citing, for those of ordinary skills, can be improved according to the above description or convert, and all these improve and convert the protection domain that all should belong to claims of the present invention.
Claims (4)
1. the epoxy resin non-conductive adhesive for Intelligent card package, it comprises following composition according to weight percent: the epoxy resin of 20-40%, the thinner of 5-20%, the amine curing agent of 4-8%, the curing catalyst of 4-8%, the coupling agent of 0.1-1%, the tensio-active agent of 0.1-1%, the glass microballon of 1-5%, the filler of 20-40%;
Wherein, tensio-active agent is silane surface active agent or fluorochemical surfactant;
Wherein, glass microballon is the hollow glass bead that D90 is respectively 15-25um, and weight percent content is 1-5%;
Wherein, filler is the one in silicon powder, ptfe micropowder or aerosil;
Wherein, the preparation order of non-conductive adhesive is for mixing after the weighing of epoxy resin, thinner, amine curing agent, curing catalyst, coupling agent and tensio-active agent, after three-roller mixing, add filler again to mix, again after three-roller mixing, finally add glass microballon to stir, vacuum defoamation.
2. epoxyn according to claim 1, is characterized in that, described epoxy resin is one in bisphenol A epoxide resin, bisphenol F epoxy resin, novolac epoxy or its mixture; Described thinner is the BDDE of quality purity more than 92%; Described amine curing agent is one in Dyhard RU 100, polyetheramine, diaminodiphenylsulfone(DDS), polymeric amide or its mixture; Described curing catalyst is glyoxal ethyline, 2-ethyl imidazol(e), the one in 2-ethyl-4-methylimidazole or its mixture; Described coupling agent is one in aminopropyl triethoxysilane, propyl trimethoxy silicane, aminopropyl trimethoxysilane, two (tri-ethoxy silylpropyl) polysulfide or its mixture.
3. the epoxy resin conductive adhesive for Intelligent card package, it comprises following composition according to weight percent: the epoxy resin of 10-25%, the thinner of 5-10%, the amine curing agent of 1-4%, the curing catalyst of 1-4%, the coupling agent of 0.1-1%, the tensio-active agent of 0.1-1%, the glass microballon of 1-5%, the silver powder of 55-80%;
Wherein, tensio-active agent is silane surface active agent or fluorochemical surfactant;
Wherein, glass microballon is the hollow glass bead that D90 is respectively 15-25um, and weight percent content is 1-5%;
Wherein, the preparation order of electro-conductive adhesive, for mixing after the weighing of epoxy resin, thinner, amine curing agent, curing catalyst, coupling agent and tensio-active agent, after three-roller mixing, then adds glass microballon and silver powder stirring, vacuum defoamation.
4. epoxyn according to claim 3, is characterized in that, described epoxy resin is one in bisphenol A epoxide resin, bisphenol F epoxy resin, novolac epoxy or its mixture; Described thinner is the BDDE of quality purity more than 92%; Described amine curing agent is one in Dyhard RU 100, polyetheramine, diaminodiphenylsulfone(DDS), polymeric amide or its mixture; Described curing catalyst is glyoxal ethyline, 2-ethyl imidazol(e), the one in 2-ethyl 4-methylimidazole or its mixture; Described coupling agent is one in aminopropyl triethoxysilane, propyl trimethoxy silicane, aminopropyl trimethoxysilane, two (tri-ethoxy silylpropyl) polysulfide or its mixture; Described silver powder was the flake silver powder of 400 mesh sieves.
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| EP3218433A1 (en) * | 2014-11-11 | 2017-09-20 | Dow Global Technologies LLC | Adhesive composition with glass spheres |
| CN104804692A (en) * | 2015-05-05 | 2015-07-29 | 南京信息工程大学 | Double-component aluminum metal anti-corrosion repairing agent and preparation method thereof |
| CN105860893A (en) * | 2016-04-26 | 2016-08-17 | 安徽康瑞鑫电子科技有限公司 | Epoxy resin pouring sealant |
| CN107474773B (en) * | 2017-09-09 | 2020-08-14 | 烟台德邦科技有限公司 | Smart card chip adhesive and preparation method thereof |
| CN107641491A (en) * | 2017-10-25 | 2018-01-30 | 浙江星丰科技有限公司 | A kind of flame-retarding adhesive and preparation method thereof |
| CN108342175A (en) * | 2018-02-07 | 2018-07-31 | 滕凤琴 | A kind of epoxyn and preparation method thereof |
| CN108865031A (en) * | 2018-06-11 | 2018-11-23 | 南京夜视丽精细化工有限责任公司 | Fabrication special-purpose adhesive and preparation method thereof |
| CN109438924B (en) * | 2018-11-10 | 2020-11-20 | 东莞市艾博龙新型材料有限公司 | Epoxy resin composite board for vacuum plastic film mold |
| CN114774044A (en) * | 2022-04-22 | 2022-07-22 | 深圳市津诚科技有限公司 | Conductive adhesive film and preparation method and application thereof |
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| CN102876273A (en) * | 2012-10-08 | 2013-01-16 | 合肥杰事杰新材料股份有限公司 | Room temperature cured anti-flow sealing adhesive used for engineering plastic methane tank, and application thereof |
| CN103242775A (en) * | 2013-05-16 | 2013-08-14 | 长春永固科技有限公司 | Acrylic ester modified epoxy resin conductive chip adhesive |
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| KR20100088531A (en) * | 2009-01-30 | 2010-08-09 | 디아이씨 가부시끼가이샤 | Fluorine-containing radical-polymerizable copolymer, active energy ray-curable resin composition using the same and manufacturing method of fluorine-containing radical-polymerizable copolymer |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102876273A (en) * | 2012-10-08 | 2013-01-16 | 合肥杰事杰新材料股份有限公司 | Room temperature cured anti-flow sealing adhesive used for engineering plastic methane tank, and application thereof |
| CN103242775A (en) * | 2013-05-16 | 2013-08-14 | 长春永固科技有限公司 | Acrylic ester modified epoxy resin conductive chip adhesive |
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