CN103540285A - Epoxy resin adhesive used for encapsulating smart cards - Google Patents
Epoxy resin adhesive used for encapsulating smart cards Download PDFInfo
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- CN103540285A CN103540285A CN201310500721.4A CN201310500721A CN103540285A CN 103540285 A CN103540285 A CN 103540285A CN 201310500721 A CN201310500721 A CN 201310500721A CN 103540285 A CN103540285 A CN 103540285A
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Abstract
The invention discloses an epoxy resin adhesive used for encapsulating smart cards. The epoxy resin adhesive is non-conductive adhesive and conductive adhesive and comprises the following components in percentage by weight: 20-40% of epoxy resin, 5-20% of diluent, 4-8% of amine curing agent, 4-8% of curing accelerator, 0.1-1% of coupling agent, 0.1-1% of surfactant, 1-5% of glass microspheres and 20-40% of fillers. The epoxy resin adhesive is prepared in a special preparation sequence. The surfactant is added to effectively inhibit the resin overflow, improve the routing yield and ensure the reliability of the product at the same time, the glass microspheres are added to effectively control the thickness of the adhesive layer, prevent the adhesive layer from becoming excessive thin or thick after being pasted, ensure the reliability of the encapsulated product, and meanwhile, reduce the height difference of four corners and improve the routing yield and efficiency.
Description
Technical field
The present invention relates to the epoxyn for Intelligent card package, relate in particular to a kind of for intelligent card chip and flexible substrates framework or the bonding tackiness agent of carrier band.
Background technology
The utilization of smart card has become the important component part of the industries such as world today's banking industry, communications and mobile communication access.In daily life, the smart card that we see is conventionally the miniature SIM in phonecard and mobile phone.Certainly, well-known, smart card also has many widespread uses, and its development prospect is very wide.Sustainable development Dou Jiangshi China of global economic integration and Chinese national economy becomes maximum application of IC cards market, the whole world.Domestic smart card has good development prospect, especially fairly obvious to the demand of lower cost, high reliability, flexibility, thin card.
At present, the intelligent card chip adhesive for packaging on market has serious resin spillover on the flexible carrier band of smart card, overflows area covering routing position, often causes routing yield low, the reliability of plastic packaged products is also caused to serious impact simultaneously; And smart card module require to be controlled the thickness of integral module, to guarantee the thin card demand of smart card, and tackiness agent of the prior art conventionally exist paster after glue-line cross thin or blocked up phenomenon, cause integral module thickness not reach requirement.
Therefore, prior art needs further improve and develop.
Summary of the invention
In view of above-mentioned the deficiencies in the prior art, the object of the present invention is to provide a kind of low resin to overflow, the epoxyn that the Intelligent card package of controlled glue layer thickness is used, comprises non-conductive adhesive stick and electro-conductive adhesive.
Technical scheme of the present invention is as follows:
An epoxy resin non-conductive adhesive stick for Intelligent card package, it comprises following composition according to weight percent:
Described epoxy resin non-conductive adhesive stick, wherein, described epoxy resin is a kind of or its mixture in bisphenol A epoxide resin, bisphenol F epoxy resin, novolac epoxy, has been both matrix resin in formula, increases again the thixotropy of tackiness agent simultaneously.Described thinner is that quality purity surpasses 92% BDDE; Described amine curing agent is a kind of or its mixture in Dyhard RU 100, polyetheramine, diaminodiphenylsulfone(DDS), polymeric amide.Described curing catalyst is imidazoles and imidazole derivative.Described coupling agent is silane coupling agent.Described tensio-active agent is silane surface active agent or fluorochemical surfactant, by improving the surface tension of adhesive system, further suppresses resin and overflows.Described glass microballon is the hollow glass bead of 15-25um, is used for controlling bondline thickness, prevents that chip from tilting.Described filler is a kind of in silicon powder, ptfe micropowder or aerosil, and wherein, silicon powder and ptfe micropowder are all crossed 1000 mesh sieves.
Described epoxy resin non-conductive adhesive stick, wherein, described imidazoles and imidazole derivative are glyoxal ethyline, 2-ethyl imidazol(e), a kind of or its mixture in 2-ethyl-4-methylimidazole, it and amine curing agent are used in conjunction with, can accelerated reaction, complete fast setting.
Described epoxy resin non-conductive adhesive stick, wherein, described silane coupling agent is a kind of or its mixture in aminopropyl triethoxysilane, propyl trimethoxy silicane, aminopropyl trimethoxysilane, two (tri-ethoxy silylpropyl) polysulfide.
For an epoxy resin conductive adhesive for Intelligent card package, it comprises following composition according to weight percent:
Described epoxy resin conductive adhesive, wherein, described epoxy resin is a kind of or its mixture in bisphenol A epoxide resin, bisphenol F epoxy resin, novolac epoxy, has been both matrix resin in formula, increases again the thixotropy of tackiness agent simultaneously.Described thinner is that quality purity surpasses 92% BDDE; Described amine curing agent is a kind of or its mixture in Dyhard RU 100, polyetheramine, diaminodiphenylsulfone(DDS), polymeric amide.Described curing catalyst is imidazoles and imidazole derivative.Described coupling agent is silane coupling agent.Described tensio-active agent is silane surface active agent or fluorochemical surfactant, by improving the surface tension of adhesive system, further suppresses resin and overflows.Described silver powder was the flake silver powder of 400 mesh sieves.
Described epoxy resin conductive adhesive, wherein, described imidazoles and imidazole derivative are glyoxal ethyline, 2-ethyl imidazol(e), a kind of or its mixture in 2-ethyl-4-methylimidazole, it and amine curing agent are used in conjunction with, can accelerated reaction, complete fast setting.
Described epoxy resin conductive adhesive, wherein, described silane coupling agent is a kind of or its mixture in aminopropyl triethoxysilane, propyl trimethoxy silicane, aminopropyl trimethoxysilane, two (tri-ethoxy silylpropyl) polysulfide.
A kind of epoxyn for Intelligent card package provided by the invention, comprise non-conductive adhesive stick and electro-conductive adhesive, adopt thinner, amine curing agent, curing catalyst, coupling agent, tensio-active agent, glass microballon and filler, or use silver powder to replace the formula of filler, by specific preparation sequential system, obtain epoxyn, by adding of tensio-active agent, effectively having suppressed resin overflows, when having improved routing yield, guaranteed the reliability of product, by adding glass microballon, effectively controlled bondline thickness, after making paster, glue-line can not crossed thin or blocked up, guaranteed the reliability of product after encapsulation, four jiaos of difference of altitude have been reduced simultaneously, routing yield and efficiency have been improved.
Embodiment
The invention provides a kind of epoxyn for Intelligent card package, for making object of the present invention, technical scheme and effect clearer, clear and definite, below the present invention is described in more detail.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
The invention provides a kind of epoxyn for Intelligent card package, such epoxyn is non-conductive adhesive stick, its according to weight percent, comprise the epoxy resin of following composition: 20-40%, the amine curing agent of the thinner of 5-20%, 4-8%, the coupling agent of the curing catalyst of 4-8%, 0.1-1%, the glass microballon of the tensio-active agent of 0.1-1%, 1-5% and the filler of 20-40%.Avoid the situation that occurs that resin overflows, when having improved routing yield, guaranteed the reliability of product.
Further, described epoxy resin non-conductive adhesive stick, wherein, described epoxy resin is a kind of or its mixture in bisphenol A epoxide resin, bisphenol F epoxy resin, novolac epoxy, in formula, be both matrix resin, increased again the thixotropy of tackiness agent simultaneously.Described thinner is that quality purity surpasses 92% BDDE; Described amine curing agent is a kind of or its mixture in Dyhard RU 100, polyetheramine, diaminodiphenylsulfone(DDS), polymeric amide.Described curing catalyst is imidazoles and imidazole derivative.Described coupling agent is silane coupling agent.
Described tensio-active agent is silane surface active agent or fluorochemical surfactant, by improving the surface tension of adhesive system, further suppresses resin and overflows.Described glass microballon is the hollow glass bead of 15-25um, is used for controlling bondline thickness, prevents that chip from tilting.Described filler is a kind of in silicon powder, ptfe micropowder or aerosil, and wherein, silicon powder and ptfe micropowder are all crossed 1000 mesh sieves.
Described imidazoles and imidazole derivative are glyoxal ethyline, 2-ethyl imidazol(e), and a kind of or its mixture in 2-ethyl-4-methylimidazole, it and amine curing agent are used in conjunction with, can accelerated reaction, complete fast setting.Described silane coupling agent is a kind of or its mixture in aminopropyl triethoxysilane, propyl trimethoxy silicane, aminopropyl trimethoxysilane, two (tri-ethoxy silylpropyl) polysulfide.
For more detailed description epoxyn of the present invention, below enumerate more detailed embodiment and describe.
Embodiment 1
Formula is:
Preparation method: according to dosage by bisphenol A epoxide resin, 92%1,4-butanediol diglycidyl ether, Dyhard RU 100, glyoxal ethyline, aminopropyl triethoxysilane and silane surface active agent mix, through three-roller, mix twice, add again silicon powder, stir, then through three-roller mixing both sides time, then add glass microballon, stir half hour, vacuum defoamation 30min, makes the non-conductive epoxyn of the present invention.
Get 0.5ml tackiness agent and test its viscosity: 25 ℃ of viscosity are 10000Cp; Thixotropy index is 5.2; 150 ℃ of 3min glue can solidify; 2*2mm chip, 25 ℃ of horizontal shear forces that can bear of Ag/Cu framework are more than 15kg; Before solidifying, resin overflows and is measured as 0, and it is 0 that curing rear resin overflows; Bondline thickness is 10-15 micron, and four jiaos of difference of altitude are 6um to the maximum.Obvious, the performance of epoxyn of the present invention is far superior to the performance of relative adhesive in prior art.
Embodiment 2
Formula is:
Preparation method: according to dosage by bisphenol F epoxy resin, 92% BDDE, polyetheramine, 2-ethyl imidazol(e), propyl trimethoxy silicane and silane surface active agent mix, through three-roller, mix twice, add again ptfe micropowder, stir, then through three-roller mixing both sides time, then add glass microballon, stir half hour, vacuum defoamation 30min, makes the non-conductive epoxyn of the present invention.
Get 0.5ml tackiness agent and test its viscosity: 25 ℃ of viscosity are 12000Cp; Thixotropy index is 5.5; 150 ℃ of 3min glue can solidify; 2*2mm chip, 25 ℃ of horizontal shear forces that can bear of Ag/Cu framework are more than 15kg; Before solidifying, resin overflows and is measured as 0, and it is 0 that curing rear resin overflows; Bondline thickness is 15-20 micron, and four jiaos of difference of altitude are 8um to the maximum.Obvious, the performance of epoxyn of the present invention is far superior to the performance of relative adhesive in prior art.
Embodiment 3
Formula is:
Preparation method: according to dosage by bisphenol A epoxide resin, novolac epoxy, 92% 1,4-butanediol diglycidyl ether, polyetheramine, 2-ethyl-4-methylimidazole, two (tri-ethoxy silylpropyl) polysulfides and fluorochemical surfactant mix, and mix twice, then add aerosil through three-roller, stir, through three-roller, mix twice again, then add glass microballon, stir half hour, vacuum defoamation 30min, makes the non-conductive epoxyn of the present invention.
Get 0.5ml tackiness agent and test its viscosity: 25 ℃ of viscosity are 11000Cp; Thixotropy index is 6.0; 150 ℃ of 3min glue can solidify; 2*2mm chip, 25 ℃ of horizontal shear forces that can bear of Ag/Cu framework are more than 20kg; Before solidifying, resin overflows and is measured as 0, and it is 0 that curing rear resin overflows; Bondline thickness is 20-25 micron, and four jiaos of difference of altitude are 10um to the maximum.Obvious, the performance of epoxyn of the present invention is far superior to the performance of relative adhesive in prior art.
In the above-described embodiments, only enumerated the concrete content of corresponding composition in preferred embodiment, embodiment as for endpoints thereof and the intermediate value of each component content, at this, will not enumerate, in its concrete process of implementing, can in the content range of each composition, complete the present invention as required completely.Obvious, can adjust as required the content of each composition, obtain optimum performance.
The present invention also provides the another kind of epoxyn for Intelligent card package, such epoxyn is electro-conductive adhesive, its according to weight percent, comprise the epoxy resin of following composition: 10-25%, the amine curing agent of the thinner of 5-10%, 1-4%, the coupling agent of the curing catalyst of 1-4%, 0.1-1%, the glass microballon of the tensio-active agent of 0.1-1%, 1-5% and the silver powder of 55-80%.
Further, described epoxy resin conductive adhesive, wherein, described epoxy resin is a kind of or its mixture in bisphenol A epoxide resin, bisphenol F epoxy resin, novolac epoxy, in formula, be both matrix resin, increased again the thixotropy of tackiness agent simultaneously.Described thinner is that quality purity surpasses 92% BDDE; Described amine curing agent is a kind of or its mixture in Dyhard RU 100, polyetheramine, diaminodiphenylsulfone(DDS), polymeric amide.Described curing catalyst is imidazoles and imidazole derivative.Described coupling agent is silane coupling agent.
Described tensio-active agent is silane surface active agent or fluorochemical surfactant, by improving the surface tension of adhesive system, further suppresses resin and overflows.Described glass microballon is the hollow glass bead of 15-25um, is used for controlling bondline thickness, prevents that chip from tilting.Described silver powder was the flake silver powder of 400 mesh sieves.
Described imidazoles and imidazole derivative are glyoxal ethyline, 2-ethyl imidazol(e), and a kind of or its mixture in 2-ethyl-4-methylimidazole, it and amine curing agent are used in conjunction with, can accelerated reaction, complete fast setting.Described silane coupling agent is a kind of or its mixture in aminopropyl triethoxysilane, propyl trimethoxy silicane, aminopropyl trimethoxysilane, two (tri-ethoxy silylpropyl) polysulfide.
For more detailed description epoxyn of the present invention, below enumerate more detailed embodiment and describe.
Embodiment 4
Formula is:
Preparation method: according to dosage by bisphenol A epoxide resin, 92% 1,4-butanediol diglycidyl ether, Dyhard RU 100, glyoxal ethyline, aminopropyl triethoxysilane and silane surface active agent mix, through three-roller, mix 2 times, add flake silver powder to stir half hour, vacuum defoamation 15min, makes the epoxyn that the present invention is conducted electricity again.
Get 0.5ml tackiness agent and test its viscosity: 25 ℃ of viscosity are 11000Cp; Thixotropy index is 5.5; 150 ℃ of 3min glue can solidify; 2*2mm chip, 25 ℃ of horizontal shear forces that can bear of Ag/Cu framework are more than 10kg; Volume specific resistance is 2 * 10
-2ohmcm; Before solidifying, resin overflows and is measured as 0, and it is 0 that curing rear resin overflows; Bondline thickness is 10-15 micron, and four jiaos of difference of altitude are 7um to the maximum.Obvious, the performance of epoxyn of the present invention is far superior to the performance of relative adhesive in prior art.
Embodiment 5
Formula is:
Preparation method: according to dosage by bisphenol F epoxy resin, 92% 1,4-butanediol diglycidyl ether, polyetheramine, 2-ethyl imidazol(e), propyl trimethoxy silicane and silane surface active agent mix, through three-roller, mix 2 times, add flake silver powder to stir half hour, vacuum defoamation 15min, makes the epoxyn that the present invention is conducted electricity again.
Get 0.5ml tackiness agent and test its viscosity: 25 ℃ of viscosity are 12000Cp; Thixotropy index is 5.7; 150 ℃ of 3min glue can solidify; 2*2mm chip, 25 ℃ of horizontal shear forces that can bear of Ag/Cu framework are more than 10kg; Volume specific resistance is 1 * 10
-2ohmcm; Before solidifying, resin overflows and is measured as 0, and it is 0 that curing rear resin overflows; Bondline thickness is 15-20 micron, and four jiaos of difference of altitude are 8um to the maximum.Obvious, the performance of epoxyn of the present invention is far superior to the performance of relative adhesive in prior art.
Embodiment 6
Formula is:
Preparation method: according to dosage by bisphenol F epoxy resin, novolac epoxy, 92% Isosorbide-5-Nitrae
-butanediol diglycidyl ether, polymeric amide, 2-ethyl-4-methylimidazole, two (tri-ethoxy silylpropyl) polysulfides and fluorochemical surfactant mix, through three-roller, mix 2 times, add glass microballon and flake silver powder to stir half hour, vacuum defoamation 15min, makes the epoxyn that the present invention is conducted electricity again.
Get 0.5ml tackiness agent and test its viscosity: 25 ℃ of viscosity are 10000Cp; Thixotropy index is 5.0; 150 ℃ of 3min glue can solidify; 2*2mm chip, 25 ℃ of horizontal shear forces that can bear of Ag/Cu framework are more than 15kg; Volume specific resistance is 4 * 10
-2ohmcm; Before solidifying, resin overflows and is measured as 0, and it is 0 that curing rear resin overflows; Bondline thickness is 15-25 micron, and four jiaos of difference of altitude are 10um to the maximum.Obvious, the performance of epoxyn of the present invention is far superior to the performance of relative adhesive in prior art.
In the above-described embodiments, only enumerated the concrete content of corresponding composition in preferred embodiment, embodiment as for endpoints thereof and the intermediate value of each component content, at this, will not enumerate, in its concrete process of implementing, can in the content range of each composition, complete the present invention as required completely.Obvious, can adjust as required the content of each composition, obtain optimum performance.
Should be understood that, application of the present invention is not limited to above-mentioned giving an example, and for those of ordinary skills, can be improved according to the above description or convert, and all these improvement and conversion all should belong to the protection domain of claims of the present invention.
Claims (8)
1. for an epoxy resin non-conductive adhesive stick for Intelligent card package, it comprises following composition according to weight percent:
2. epoxyn according to claim 1, is characterized in that, described epoxy resin is a kind of or its mixture in bisphenol A epoxide resin, bisphenol F epoxy resin, novolac epoxy; Described thinner is that quality purity surpasses 92% BDDE; Described amine curing agent is a kind of or its mixture in Dyhard RU 100, polyetheramine, diaminodiphenylsulfone(DDS), polymeric amide; Described curing catalyst is imidazoles and imidazole derivative; Described coupling agent is silane coupling agent; Described tensio-active agent is silane surface active agent or fluorochemical surfactant; Described glass microballon is the hollow glass bead of 15-25um; Described filler is a kind of in silicon powder, ptfe micropowder or aerosil.
3. epoxyn according to claim 2, is characterized in that, described imidazoles and imidazole derivative are glyoxal ethyline, 2-ethyl imidazol(e), a kind of or its mixture in 2-ethyl-4-methylimidazole.
4. epoxyn according to claim 2, it is characterized in that, described silane coupling agent is a kind of or its mixture in aminopropyl triethoxysilane, propyl trimethoxy silicane, aminopropyl trimethoxysilane, two (tri-ethoxy silylpropyl) polysulfide.
5. for an epoxy resin conductive adhesive for Intelligent card package, it comprises following composition according to weight percent:
6. epoxyn according to claim 5, is characterized in that, described epoxy resin is a kind of or its mixture in bisphenol A epoxide resin, bisphenol F epoxy resin, novolac epoxy; Described thinner is that quality purity surpasses 92% BDDE; Described amine curing agent is a kind of or its mixture in Dyhard RU 100, polyetheramine, diaminodiphenylsulfone(DDS), polymeric amide; Described curing catalyst is imidazoles and imidazole derivative; Described coupling agent is silane coupling agent; Described tensio-active agent is silane surface active agent or fluorochemical surfactant; Described glass microballon is the hollow glass bead of 15-25um; Described filler is a kind of in silicon powder, ptfe micropowder or aerosil.
7. epoxyn according to claim 6, is characterized in that, described imidazoles and imidazole derivative are glyoxal ethyline, 2-ethyl imidazol(e), a kind of or its mixture in 2-ethyl-4-methylimidazole.
8. epoxyn according to claim 6, it is characterized in that, described silane coupling agent is a kind of or its mixture in aminopropyl triethoxysilane, propyl trimethoxy silicane, aminopropyl trimethoxysilane, two (tri-ethoxy silylpropyl) polysulfide.
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| CN201310500721.4A CN103540285B (en) | 2013-10-14 | 2013-10-14 | A kind of epoxyn for Intelligent card package |
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| CN201310500721.4A CN103540285B (en) | 2013-10-14 | 2013-10-14 | A kind of epoxyn for Intelligent card package |
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| CN104804692A (en) * | 2015-05-05 | 2015-07-29 | 南京信息工程大学 | Double-component aluminum metal anti-corrosion repairing agent and preparation method thereof |
| CN105860893A (en) * | 2016-04-26 | 2016-08-17 | 安徽康瑞鑫电子科技有限公司 | Epoxy resin pouring sealant |
| CN107075328A (en) * | 2014-11-11 | 2017-08-18 | 陶氏环球技术有限责任公司 | Adhesion agent composition with glass marble |
| CN107474773A (en) * | 2017-09-09 | 2017-12-15 | 烟台德邦科技有限公司 | A kind of intelligent card chip adhesive and preparation method thereof |
| CN107641491A (en) * | 2017-10-25 | 2018-01-30 | 浙江星丰科技有限公司 | A kind of flame-retarding adhesive and preparation method thereof |
| CN108342175A (en) * | 2018-02-07 | 2018-07-31 | 滕凤琴 | A kind of epoxyn and preparation method thereof |
| CN108865031A (en) * | 2018-06-11 | 2018-11-23 | 南京夜视丽精细化工有限责任公司 | Fabrication special-purpose adhesive and preparation method thereof |
| CN109438924A (en) * | 2018-11-10 | 2019-03-08 | 东莞市艾博龙新型材料有限公司 | Vacuum forming film die epoxy resin composite plate |
| CN114774044A (en) * | 2022-04-22 | 2022-07-22 | 深圳市津诚科技有限公司 | Conductive adhesive film and preparation method and application thereof |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107075328A (en) * | 2014-11-11 | 2017-08-18 | 陶氏环球技术有限责任公司 | Adhesion agent composition with glass marble |
| CN104804692A (en) * | 2015-05-05 | 2015-07-29 | 南京信息工程大学 | Double-component aluminum metal anti-corrosion repairing agent and preparation method thereof |
| CN105860893A (en) * | 2016-04-26 | 2016-08-17 | 安徽康瑞鑫电子科技有限公司 | Epoxy resin pouring sealant |
| CN107474773A (en) * | 2017-09-09 | 2017-12-15 | 烟台德邦科技有限公司 | A kind of intelligent card chip adhesive and preparation method thereof |
| CN107641491A (en) * | 2017-10-25 | 2018-01-30 | 浙江星丰科技有限公司 | A kind of flame-retarding adhesive and preparation method thereof |
| CN108342175A (en) * | 2018-02-07 | 2018-07-31 | 滕凤琴 | A kind of epoxyn and preparation method thereof |
| CN108865031A (en) * | 2018-06-11 | 2018-11-23 | 南京夜视丽精细化工有限责任公司 | Fabrication special-purpose adhesive and preparation method thereof |
| CN109438924A (en) * | 2018-11-10 | 2019-03-08 | 东莞市艾博龙新型材料有限公司 | Vacuum forming film die epoxy resin composite plate |
| CN109438924B (en) * | 2018-11-10 | 2020-11-20 | 东莞市艾博龙新型材料有限公司 | Epoxy resin composite board for vacuum plastic film mold |
| CN114774044A (en) * | 2022-04-22 | 2022-07-22 | 深圳市津诚科技有限公司 | Conductive adhesive film and preparation method and application thereof |
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| CN103540285B (en) | 2016-03-02 |
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