CN102559119A - One-component epoxy encapsulating adhesive with good rheological stability and preparation method thereof - Google Patents
One-component epoxy encapsulating adhesive with good rheological stability and preparation method thereof Download PDFInfo
- Publication number
- CN102559119A CN102559119A CN2011104131817A CN201110413181A CN102559119A CN 102559119 A CN102559119 A CN 102559119A CN 2011104131817 A CN2011104131817 A CN 2011104131817A CN 201110413181 A CN201110413181 A CN 201110413181A CN 102559119 A CN102559119 A CN 102559119A
- Authority
- CN
- China
- Prior art keywords
- resin
- encapsulating compound
- component epoxy
- bisphenol
- arocy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
Abstract
The invention discloses a one-component epoxy encapsulating adhesive with good rheological stability and a preparation method thereof. The one-component epoxy encapsulating adhesive is characterized in that the adhesive comprises the following components in parts by weight: 30-45 parts of epoxy resin, 5-15 parts of epoxy diluent, 5-10 parts of latent curing agent, 0.5-2.0 parts of stabilizer, 40-50 parts of filler and 0.1-1.0 part of pigment; and the method comprises the following steps: (a) adding the epoxy resin, active diluent and stabilizer in a reaction kettle in turn, and stirring evenly under vacuum; (b) adding the filler and pigment in the mixture, and stirring evenly under vacuum; and (c) adding the latent curing agent in the mixture, stirring evenly under vacuum and performing vacuum debubbling treatment.
Description
Technical field
The present invention relates to tackiness agent, particularly relate to single-component epoxy encapsulating compound and preparation method with good rheology stability, this encapsulating compound is used for the encapsulation of electronic industry chip in room temperature storage.
Background technology
(chip on board is a kind of typically manufacturing technology between encapsulation and assembling COB) to chip on board, and bare chip directly is installed on the printed circuit board, rather than is assembled on the printed circuit board after " encapsulation " earlier.The COB ME is similar with traditional bare chip encapsulation, and just base plate for packaging has changed conventional printed circuit board into, through routing, carrier band or upside-down mounting core celery mode bare chip is directly connected in the circuit.In order to protect bare chip not affected by environment, prevent that chip and wire from damaging, and need seal chip and bonding wire with glue.COB technology is also referred to as " binding " (boarding transliteration), adopts the COB technology, has saved packaging cost, can significantly reduce cost of goods manifactured, and is particularly outstanding in production in enormous quantities.In addition, the COB mode of connection is a proven technique in the encapsulation technology, and corresponding technology, equipment all can use, and do not have technical barrier.
Encapsulating compound need carry out applying glue on hot platform; Hot platform applying glue purpose one is in order to increase the flowability of glue; Make glue can be good at being penetrated in the slit between chip and the baseline, the 2nd, realize the primary solidification location in order to make glue meet the heat back, to the scope sealed with seal shape and fix.Encapsulating compound not only requires low coefficient of linear thermal expansion, low modulus, intermediate temperature setting, bonding strength big, and requires to have good rheological, promptly in the applying glue process, satisfies the suitable scope of sealing and seals height.
In addition, require glue in storage and transportation, to keep rheological property stable.The rheological property variation causes on hot platform mobile inconsistent, and velocity of flow is slow, and glue is difficult to sprawl; Velocity of flow is fast, and glue exceeds the scope of sealing easily, pollutes.
The major ingredient of encapsulating compound is epoxy resin, filler, latent curing agent etc.Encapsulating compound is generally 2-8 ℃ of storage, but store and transportation in, be difficult to avoid contact with high temperature, therefore, the rheological that glue often occurs changes, and causes and can't use, and causes waste.
The stability of rheological property is main relevant with latent curing agent.The latent curing agent that can realize intermediate temperature setting on the market carries out the transpassivation processing, and reactive behavior is very low, and low temperature is difficult to down react with epoxy resin, can well keep stability in storage.The basic group that exists on the latent curing agent still can influence the rheology system that forms between filler and the resin, causes rheological property to change but even so.Particularly under room temperature and hot environment, rheological property changes more obvious.The rheological property of glue changes, and causes glue when hot platform applying glue, to be prone to trickling, exceeds the scope of sealing, and pollutes.
Summary of the invention
The object of the present invention is to provide a kind of intermediate temperature setting, under the condition of room temperature storage, have the single-component epoxy encapsulating compound and the preparation method of good rheology stability.
In order to realize the object of the invention.Propose a kind of single-component epoxy encapsulating compound with good rheology stability, said single-component epoxy encapsulating compound is by weight by to be grouped into:
Wherein, described epoxy resin is one or more the mixing in bisphenol A epoxide resin E51, bisphenol A epoxide resin 128, bisphenol A epoxide resin E44, bisphenol A epoxide resin E54, bisphenol A epoxide resin E56, the bisphenol F epoxy resin 862;
Described epoxide diluent is one or more the mixing in trihydroxymethylpropanyltri diglycidyl ether, glycerine glycidyl ether, the tertiary carbonic acid glycidyl ester.
Described latent curing agent is a Dyhard RU 100, amine modified firming agent EH4070s, the mixing of one or more among amine modified firming agent 9506, amine modified firming agent FXR1020, amine modified firming agent FXR1030, the imidazole curing agent EH4337s.
Described stablizer is a cyanate ester resin, is the thermosetting resin that contains two or more cyanates functional group-OCN in a kind of molecular structure;
Described filler is mineral filler, in silicon powder, lime carbonate, talcum powder, the calcium sulfate-kind or several kinds;
Described pigment is carbon black, nigrosine.
Said cyanate ester resin comprises bisphenol A-type cyanic acid resin, Arocy B, Arocy M, Arocy F, Arocy L-10, Arocy T-10 or RTX-366.
Said single-component epoxy encapsulating compound can be formed by following concrete component by weight:
Said single-component epoxy encapsulating compound also can be made up of following concrete component by weight:
The present invention also proposes the preparation method of said encapsulating compound, and this method is made up of following steps successively:
(a) epoxy resin, reactive thinner and stablizer are added in the reaction kettle successively, stir under the vacuum;
(b) filler, pigment are added in the said mixture, stir under the vacuum;
(c) latent curing agent is added in the said mixture, stir under the vacuum, and carry out vacuum defoamation and handle.
The invention has the beneficial effects as follows:
1. have lower Young's modulus and thermal linear expansion coefficient, can well reduce baseline fracture odds, reduce and reprocess cost.
2. can store for a long time under the room temperature, and have good rheology stability, effectively avoid because the too high and performance change that cause long of storing temp, reduce the problem of the wasting of resources with the storage time.
According to The above results, this tackiness agent satisfies the manufacturing technique requirent of encapsulating compound fully.
Embodiment
For making the object of the invention, technical scheme and advantage clearer, below in conjunction with specific embodiment, to further explain of the present invention.
Embodiment 1
Preparing method: accurately weigh various raw materials by above-mentioned formula rate; Earlier epoxy resin, reactive thinner, stablizer are added in the reaction kettle successively, stir under the vacuum, add filler, pigment then; After treating to stir under the vacuum; Add latent curing agent, be uniformly dispersed, and carry out vacuum defoamation and handle.
Embodiment 2
Preparing method: accurately weigh various raw materials by above-mentioned formula rate; Earlier epoxy resin, reactive thinner, stablizer are added in the reaction kettle successively, stir under the vacuum, add filler, pigment then; After treating to stir under the vacuum; Add latent curing agent, be uniformly dispersed, and carry out vacuum defoamation and handle.
Listed embodiment of table 1 and curing characteristics thereof and storge quality test result show: encapsulating compound thermal linear expansion coefficient of the present invention is low, and Young's modulus is low, and bonding strength is high, the rheological property good stability, and the storage time is long, gives production, uses and storage offers convenience.
Table 1
The invention solves room temperature storage rheology stability problem; In prescription, add the cyanate stablizer; Utilize its can with N-H key addition principle, catch the organic amine that latent curing agent discharges, avoid the N-H key that the rheology system of mineral filler and resin formation is caused a devastating effect.The encapsulating compound of preparation can store 3 months for 25 ℃ in room temperature like this, and rheological property is constant.The present invention is fit to the COB technological process, has good applying glue property and consistence.
With preferred embodiment openly as above they are not to be used for limiting the present invention though the present invention is own, and the content that protection scope of the present invention should be defined with the application's claim protection domain is as the criterion.Anyly have the knack of present technique field person, do not breaking away from the spirit and scope of the present invention, various variations of being done or be equal to replacement all should belong to protection scope of the present invention.
Claims (5)
1. one kind has good rheology stable single-component epoxy encapsulating compound and preparation method, it is characterized in that said single-component epoxy encapsulating compound is composed of the following components by weight:
Wherein, described epoxy resin is one or more the mixing in bisphenol A epoxide resin E51, bisphenol A epoxide resin 128, bisphenol A epoxide resin E44, bisphenol A epoxide resin E54, bisphenol A epoxide resin E56, the bisphenol F epoxy resin 862;
Described epoxide diluent is one or more the mixing in trihydroxymethylpropanyltri diglycidyl ether, glycerine glycidyl ether, the tertiary carbonic acid glycidyl ester.
Described latent curing agent is a Dyhard RU 100, amine modified firming agent EH4070s, the mixing of one or more among amine modified firming agent 9506, amine modified firming agent FXR1020, amine modified firming agent FXR1030, the imidazole curing agent EH4337s.
Described stablizer is a cyanate ester resin, is the thermosetting resin that contains two or more cyanates functional group-OCN in a kind of molecular structure;
Described filler is mineral filler, one or more in silicon powder, lime carbonate, talcum powder, the calcium sulfate;
Described pigment is carbon black, nigrosine.
2. single-component epoxy encapsulating compound according to claim 1 is characterized in that, said cyanate ester resin comprises bisphenol A-type cyanic acid resin, Arocy B, Arocy M, Arocy F, Arocy L-10, Arocy T-10 or RTX-366.
3. single-component epoxy encapsulating compound according to claim 1 is characterized in that, said single-component epoxy encapsulating compound is composed of the following components by weight:
4. single-component epoxy encapsulating compound according to claim 1 is characterized in that, said single-component epoxy encapsulating compound is composed of the following components by weight:
5. preparation is characterized in that like the method for each said encapsulating compound of claim 1-4 said method is made up of following steps successively:
(a) epoxy resin, reactive thinner and stablizer are added in the reaction kettle successively, stir under the vacuum;
(b) filler, pigment are added in the said mixture, stir under the vacuum;
(c) latent curing agent is added in the said mixture, stir under the vacuum, and carry out vacuum defoamation and handle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104131817A CN102559119A (en) | 2011-12-13 | 2011-12-13 | One-component epoxy encapsulating adhesive with good rheological stability and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104131817A CN102559119A (en) | 2011-12-13 | 2011-12-13 | One-component epoxy encapsulating adhesive with good rheological stability and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102559119A true CN102559119A (en) | 2012-07-11 |
Family
ID=46405761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011104131817A Pending CN102559119A (en) | 2011-12-13 | 2011-12-13 | One-component epoxy encapsulating adhesive with good rheological stability and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102559119A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103173172A (en) * | 2013-03-23 | 2013-06-26 | 东莞市松山湖微电子材料研发中心 | High-damping halogen-free pouring sealant and preparation method thereof |
| CN103555247A (en) * | 2013-10-30 | 2014-02-05 | 安田信邦（厦门）电子科技有限公司 | Low-temperature curved high-strength plastic package glue and preparation method thereof |
| CN112048271A (en) * | 2020-09-14 | 2020-12-08 | 深圳市安伯斯科技有限公司 | Single-component underfill and preparation method thereof |
| CN115011298A (en) * | 2022-06-01 | 2022-09-06 | 道尔化成电子材料(上海)有限公司 | Rheological-stable single-component epoxy encapsulating adhesive and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1237186A (en) * | 1997-07-24 | 1999-12-01 | 洛克泰特公司 | Thermosetting resin compositions useful as underfill sealants |
| US6114450A (en) * | 1996-01-11 | 2000-09-05 | International Business Corporation | Aryl Cyanate and/or diepoxide and tetrahydropyranyl-protected hydroxymethylated phenolic or hydroxystyrene resin |
| CN101760162A (en) * | 2010-01-18 | 2010-06-30 | 北京海斯迪克新材料有限公司 | Stable single-component epoxy surface mount adhesive in room temperature storage and preparation method thereof |
-
2011
- 2011-12-13 CN CN2011104131817A patent/CN102559119A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6114450A (en) * | 1996-01-11 | 2000-09-05 | International Business Corporation | Aryl Cyanate and/or diepoxide and tetrahydropyranyl-protected hydroxymethylated phenolic or hydroxystyrene resin |
| CN1237186A (en) * | 1997-07-24 | 1999-12-01 | 洛克泰特公司 | Thermosetting resin compositions useful as underfill sealants |
| CN101760162A (en) * | 2010-01-18 | 2010-06-30 | 北京海斯迪克新材料有限公司 | Stable single-component epoxy surface mount adhesive in room temperature storage and preparation method thereof |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103173172A (en) * | 2013-03-23 | 2013-06-26 | 东莞市松山湖微电子材料研发中心 | High-damping halogen-free pouring sealant and preparation method thereof |
| CN103555247A (en) * | 2013-10-30 | 2014-02-05 | 安田信邦（厦门）电子科技有限公司 | Low-temperature curved high-strength plastic package glue and preparation method thereof |
| CN112048271A (en) * | 2020-09-14 | 2020-12-08 | 深圳市安伯斯科技有限公司 | Single-component underfill and preparation method thereof |
| CN115011298A (en) * | 2022-06-01 | 2022-09-06 | 道尔化成电子材料(上海)有限公司 | Rheological-stable single-component epoxy encapsulating adhesive and preparation method thereof |
| CN115011298B (en) * | 2022-06-01 | 2022-12-27 | 道尔化成电子材料(上海)有限公司 | Rheological-stable single-component epoxy encapsulating adhesive and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101864147B (en) | Underfill with low viscosity and low linear expansion coefficient | |
| CN101831143B (en) | High-performance liquid epoxy resin composition for packaging LEDs | |
| CN102115655B (en) | Single component flexible epoxy sealant | |
| CN103540285B (en) | A kind of epoxyn for Intelligent card package | |
| KR101823979B1 (en) | Reworkable epoxy resin and curative blend for low thermal expansion applications | |
| TWI711132B (en) | Epoxy resin composition | |
| KR20170094115A (en) | Liquid epoxy resin composition, semiconductor sealing agent, semiconductor device, and method for producing liquid epoxy resin composition | |
| CN104178081B (en) | A kind of patch red glue | |
| CN102031081A (en) | Liquid epoxy encapsulating material and preparation method thereof | |
| CN102559119A (en) | One-component epoxy encapsulating adhesive with good rheological stability and preparation method thereof | |
| CN102627928A (en) | Low temperature curing adhesive for camera modules, and preparation method thereof | |
| CN104804687A (en) | Conductive die bond glue solution, conductive die bond glue film, preparation methods and applications | |
| CN104974475A (en) | Chip packaging material for computer | |
| CN105623583B (en) | A kind of single-component epoxy encapsulating compound | |
| CN106085318A (en) | A kind of composite epoxy casting glue of LED display magnetic heat radiation | |
| JPH04348120A (en) | Sealing epoxy resin composition | |
| CN111073572A (en) | Two-component normal-temperature curing epoxy resin pouring sealant, preparation and use method thereof | |
| JP6443853B2 (en) | Encapsulant composition and semiconductor device using the same | |
| JPH0276248A (en) | Semiconductor device | |
| CN103814056B (en) | Resin combination | |
| KR102545654B1 (en) | Epoxy Resin Composition for Sealing Semiconductor | |
| JP6080160B2 (en) | Reactive diluent | |
| JPH02210853A (en) | Semiconductor device | |
| WO2020021961A1 (en) | Epoxy resin composition and resin sealed substrate | |
| JPH03232258A (en) | Semiconductor device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20120711 |