CN108485571A - A kind of low-temperature setting patch red glue - Google Patents
A kind of low-temperature setting patch red glue Download PDFInfo
- Publication number
- CN108485571A CN108485571A CN201810292606.5A CN201810292606A CN108485571A CN 108485571 A CN108485571 A CN 108485571A CN 201810292606 A CN201810292606 A CN 201810292606A CN 108485571 A CN108485571 A CN 108485571A
- Authority
- CN
- China
- Prior art keywords
- parts
- low
- temperature setting
- red glue
- patch red
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Abstract
The invention discloses a kind of low-temperature setting patch red glue, including：Low-temperature epoxy resin, sorbierite polyglycidyl ether, triphenyl phosphite, konjac glucomannan, attapulgite, diluent, accelerating agent, coupling agent and pigment, parts by weight shared by each ingredient in the low-temperature setting patch red glue：1.1 1.8 parts of 26 35 parts of Low-temperature epoxy resin, 10 16 parts of sorbierite polyglycidyl ether, 17 25 parts of triphenyl phosphite, 1.1 2.2 parts of konjac glucomannan, 1.8 3.5 parts of attapulgite, 1.9 2.6 parts of diluent, 5.6 7.9 parts of accelerating agent, 2.3 3.4 parts of coupling agent and pigment.By the above-mentioned means, low-temperature setting patch red glue provided by the invention, at low ambient temperatures can the very fast time solidification, ensure component performance, reducing can be good, reduces enterprise's production cost.
Description
Technical field
The present invention relates to electronics adhesive fields, more particularly to a kind of low-temperature setting patch red glue.
Background technology
Our electronic product is all to add various capacitances by PCB in general, and the electronic components such as resistance are pressed
Made of the electric circuit diagram design of design, so panoramic electric appliance needs a variety of different SMT patches
Piece glue is bonded.
Patch red glue majority solidification temperature at 150 DEG C or so, differ by hardening time 2-5 minute in the market.With electronics electricity
The miniaturization of device, hot setting adversely affect certain component performances, and energy consumption is also high, increases entreprise cost, so
Urgent need will develop a kind of patch red glue suitable for low-temperature setting.
Invention content
The invention mainly solves the technical problem of providing a kind of low-temperature setting patch red glue, at low ambient temperatures can be very fast
The solidification of time.
In order to solve the above technical problems, one aspect of the present invention is：A kind of low-temperature setting patch red is provided
Glue, including：Low-temperature epoxy resin, sorbierite polyglycidyl ether, triphenyl phosphite, konjac glucomannan, attapulgite, diluent,
Accelerating agent, coupling agent and pigment, parts by weight shared by each ingredient in the low-temperature setting patch red glue：Low-temperature epoxy resin 26-
35 parts, 10-16 parts of sorbierite polyglycidyl ether, 17-25 parts of triphenyl phosphite, 1.1-2.2 parts of konjac glucomannan, attapulgite
1.1-1.8 parts of 1.8-3.5 parts, 1.9-2.6 parts of diluent, 5.6-7.9 parts of accelerating agent, 2.3-3.4 parts of coupling agent and pigment.
In a preferred embodiment of the present invention, parts by weight shared by each ingredient in the low-temperature setting patch red glue：It is low
26 parts of temperature epoxy resin, 10 parts of sorbierite polyglycidyl ether, 17 parts of triphenyl phosphite, 1.1 parts of konjac glucomannan, attapulgite
1.1 parts of 1.8 parts, 1.9 parts of diluent, 5.6 parts of accelerating agent, 2.3 parts of coupling agent and pigment.
In a preferred embodiment of the present invention, parts by weight shared by each ingredient in the low-temperature setting patch red glue：It is low
28 parts of temperature epoxy resin, 11 parts of sorbierite polyglycidyl ether, 18 parts of triphenyl phosphite, 1.4 parts of konjac glucomannan, attapulgite
1.2 parts of 2.1 parts, 2.2 parts of diluent, 5.9 parts of accelerating agent, 2.5 parts of coupling agent and pigment.
In a preferred embodiment of the present invention, parts by weight shared by each ingredient in the low-temperature setting patch red glue：It is low
29 parts of temperature epoxy resin, 12 parts of sorbierite polyglycidyl ether, 19 parts of triphenyl phosphite, 1.5 parts of konjac glucomannan, attapulgite
1.3 parts of 2.5 parts, 2.3 parts of diluent, 6.3 parts of accelerating agent, 2.8 parts of coupling agent and pigment.
In a preferred embodiment of the present invention, parts by weight shared by each ingredient in the low-temperature setting patch red glue：It is low
31 parts of temperature epoxy resin, 13 parts of sorbierite polyglycidyl ether, 21 parts of triphenyl phosphite, 1.8 parts of konjac glucomannan, attapulgite
1.4 parts of 2.6 parts, 2.4 parts of diluent, 6.6 parts of accelerating agent, 2.9 parts of coupling agent and pigment.
In a preferred embodiment of the present invention, parts by weight shared by each ingredient in the low-temperature setting patch red glue：It is low
35 parts of temperature epoxy resin, 16 parts of sorbierite polyglycidyl ether, 23 parts of triphenyl phosphite, 1.9 parts of konjac glucomannan, attapulgite
1.5 parts of 2.6 parts, 2.6 parts of diluent, 6.9 parts of accelerating agent, 3.1 parts of coupling agent and pigment.
The beneficial effects of the invention are as follows：A kind of low-temperature setting patch red glue that the present invention points out, at low ambient temperatures can be compared with
The solidification of fast time, ensures component performance, and reducing can be good, reduces enterprise's production cost.
Specific implementation mode
The technical scheme in the embodiments of the invention will be clearly and completely described below, it is clear that described implementation
Example is only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, this field is common
All other embodiment that technical staff is obtained without making creative work belongs to the model that the present invention protects
It encloses.
Embodiment 1：
It weighs：26 kilograms of Low-temperature epoxy resin, 10 kilograms of sorbierite polyglycidyl ether, 17 kilograms of triphenyl phosphite, konjaku
1.1 kilograms of glue, 1.8 kilograms of attapulgite, 1.9 kilograms of diluent, 5.6 kilograms of accelerating agent, 2.3 kilograms of coupling agent and pigment 1.1
Kilogram, the low-temperature setting patch red glue of the present invention is made.
Embodiment 2：
It weighs：28 kilograms of Low-temperature epoxy resin, 11 kilograms of sorbierite polyglycidyl ether, 18 kilograms of triphenyl phosphite, konjaku
1.4 kilograms of glue, 2.1 kilograms of attapulgite, 2.2 kilograms of diluent, 5.9 kilograms of accelerating agent, 2.5 kilograms of coupling agent and pigment 1.2
Kilogram, the low-temperature setting patch red glue of the present invention is made.
Embodiment 3：
It weighs：29 kilograms of Low-temperature epoxy resin, 12 kilograms of sorbierite polyglycidyl ether, 19 kilograms of triphenyl phosphite, konjaku
1.5 kilograms of glue, 2.5 kilograms of attapulgite, 2.3 kilograms of diluent, 6.3 kilograms of accelerating agent, 2.8 kilograms of coupling agent and pigment 1.3
Kilogram, the low-temperature setting patch red glue of the present invention is made.
Embodiment 4：
It weighs：31 kilograms of Low-temperature epoxy resin, 13 kilograms of sorbierite polyglycidyl ether, 21 kilograms of triphenyl phosphite, konjaku
1.8 kilograms of glue, 2.6 kilograms of attapulgite, 2.4 kilograms of diluent, 6.6 kilograms of accelerating agent, 2.9 kilograms of coupling agent and pigment 1.4
Kilogram, the low-temperature setting patch red glue of the present invention is made.
Embodiment 5：
It weighs：35 kilograms of Low-temperature epoxy resin, 16 kilograms of sorbierite polyglycidyl ether, 23 kilograms of triphenyl phosphite, konjaku
1.9 kilograms of glue, 2.6 kilograms of attapulgite, 2.6 kilograms of diluent, 6.9 kilograms of accelerating agent, 3.1 kilograms of coupling agent and pigment 1.5
Kilogram, the low-temperature setting patch red glue of the present invention is made.
Low-temperature setting patch red glue prepared by embodiment 1-5, is detected according to relevant criterion, testing result such as table 1.
Table 1：
| 150 DEG C of conventional solidified speed（s） | 100 DEG C of low-temperature setting speed（s） | |
| Embodiment 1 | 90 | 121 |
| Embodiment 2 | 89 | 120 |
| Embodiment 3 | 91 | 119 |
| Embodiment 4 | 88 | 118 |
| Embodiment 5 | 92 | 122 |
| Existing product | 120 | 150 |
In conclusion a kind of low-temperature setting patch red glue that the present invention points out, at low ambient temperatures can the very fast time solidification, protect
Hinder component performance, reducing can be good, reduces enterprise's production cost.
Example the above is only the implementation of the present invention is not intended to limit the scope of the invention, every to utilize this hair
Equivalent structure or equivalent flow shift made by bright description is applied directly or indirectly in other relevant technology necks
Domain is included within the scope of the present invention.
Claims (6)
1. a kind of low-temperature setting patch red glue, which is characterized in that including：Low-temperature epoxy resin, sorbierite polyglycidyl ether, Asia
Triphenyl phosphate, konjac glucomannan, attapulgite, diluent, accelerating agent, coupling agent and pigment, in the low-temperature setting patch red glue
Parts by weight shared by each ingredient：26-35 parts of Low-temperature epoxy resin, 10-16 parts of sorbierite polyglycidyl ether, triphenyl phosphite
17-25 parts, it is 1.1-2.2 parts of konjac glucomannan, 1.8-3.5 parts of attapulgite, 1.9-2.6 parts of diluent, 5.6-7.9 parts of accelerating agent, even
Join 1.1-1.8 parts of 2.3-3.4 parts of agent and pigment.
2. low-temperature setting patch red glue according to claim 1, which is characterized in that each in the low-temperature setting patch red glue
Parts by weight shared by ingredient：26 parts of Low-temperature epoxy resin, 10 parts of sorbierite polyglycidyl ether, 17 parts of triphenyl phosphite, evil spirit
1.1 parts of 1.1 parts of taro glue, 1.8 parts of attapulgite, 1.9 parts of diluent, 5.6 parts of accelerating agent, 2.3 parts of coupling agent and pigment.
3. low-temperature setting patch red glue according to claim 1, which is characterized in that each in the low-temperature setting patch red glue
Parts by weight shared by ingredient：28 parts of Low-temperature epoxy resin, 11 parts of sorbierite polyglycidyl ether, 18 parts of triphenyl phosphite, evil spirit
1.2 parts of 1.4 parts of taro glue, 2.1 parts of attapulgite, 2.2 parts of diluent, 5.9 parts of accelerating agent, 2.5 parts of coupling agent and pigment.
4. low-temperature setting patch red glue according to claim 1, which is characterized in that each in the low-temperature setting patch red glue
Parts by weight shared by ingredient：29 parts of Low-temperature epoxy resin, 12 parts of sorbierite polyglycidyl ether, 19 parts of triphenyl phosphite, evil spirit
1.3 parts of 1.5 parts of taro glue, 2.5 parts of attapulgite, 2.3 parts of diluent, 6.3 parts of accelerating agent, 2.8 parts of coupling agent and pigment.
5. low-temperature setting patch red glue according to claim 1, which is characterized in that each in the low-temperature setting patch red glue
Parts by weight shared by ingredient：31 parts of Low-temperature epoxy resin, 13 parts of sorbierite polyglycidyl ether, 21 parts of triphenyl phosphite, evil spirit
1.4 parts of 1.8 parts of taro glue, 2.6 parts of attapulgite, 2.4 parts of diluent, 6.6 parts of accelerating agent, 2.9 parts of coupling agent and pigment.
6. low-temperature setting patch red glue according to claim 1, which is characterized in that each in the low-temperature setting patch red glue
Parts by weight shared by ingredient：35 parts of Low-temperature epoxy resin, 16 parts of sorbierite polyglycidyl ether, 23 parts of triphenyl phosphite, evil spirit
1.5 parts of 1.9 parts of taro glue, 2.6 parts of attapulgite, 2.6 parts of diluent, 6.9 parts of accelerating agent, 3.1 parts of coupling agent and pigment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810292606.5A CN108485571A (en) | 2018-04-04 | 2018-04-04 | A kind of low-temperature setting patch red glue |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810292606.5A CN108485571A (en) | 2018-04-04 | 2018-04-04 | A kind of low-temperature setting patch red glue |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108485571A true CN108485571A (en) | 2018-09-04 |
Family
ID=63318323
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810292606.5A Pending CN108485571A (en) | 2018-04-04 | 2018-04-04 | A kind of low-temperature setting patch red glue |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108485571A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103756611A (en) * | 2013-12-23 | 2014-04-30 | 东莞市亚聚电子材料有限公司 | Low-temperature curing patch red gum and preparation method thereof |
| CN105315959A (en) * | 2015-11-24 | 2016-02-10 | 苏州盖德精细材料有限公司 | High-temperature-resistant SMT adhesive and preparing method thereof |
-
2018
- 2018-04-04 CN CN201810292606.5A patent/CN108485571A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103756611A (en) * | 2013-12-23 | 2014-04-30 | 东莞市亚聚电子材料有限公司 | Low-temperature curing patch red gum and preparation method thereof |
| CN105315959A (en) * | 2015-11-24 | 2016-02-10 | 苏州盖德精细材料有限公司 | High-temperature-resistant SMT adhesive and preparing method thereof |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180904 |
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| RJ01 | Rejection of invention patent application after publication |