CN108395861A - A kind of fire safe type SMT paster adhesive in pb-free solder - Google Patents
A kind of fire safe type SMT paster adhesive in pb-free solder Download PDFInfo
- Publication number
- CN108395861A CN108395861A CN201810356788.8A CN201810356788A CN108395861A CN 108395861 A CN108395861 A CN 108395861A CN 201810356788 A CN201810356788 A CN 201810356788A CN 108395861 A CN108395861 A CN 108395861A
- Authority
- CN
- China
- Prior art keywords
- parts
- free solder
- safe type
- smt paster
- fire safe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/02—Organic and inorganic ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/21—Urea; Derivatives thereof, e.g. biuret
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/524—Esters of phosphorous acids, e.g. of H3PO3
- C08K5/526—Esters of phosphorous acids, e.g. of H3PO3 with hydroxyaryl compounds
Abstract
The invention discloses a kind of fire safe type SMT paster adhesives in pb-free solder, including：Modifying epoxy resin by organosilicon, trimethylolethane trimethacrylate glycidol ether, triphenyl phosphite, phenyl dimethylurea, nano aluminium oxide, everbright fast red and boron phosphide, it is described to be used in the fire safe type SMT paster adhesive in pb-free solder parts by weight shared by each ingredient：5 12 parts of 40 50 parts of modifying epoxy resin by organosilicon, 4.5 5.5 parts of trimethylolethane trimethacrylate glycidol ether, 5.1 6.2 parts of triphenyl phosphite, 13 18 parts of phenyl dimethylurea, 5.5 6.2 parts of nano aluminium oxide, 1.8 2.6 parts of everbright fast red and boron phosphide.By the above-mentioned means, provided by the present invention for the fire safe type SMT paster adhesive in pb-free solder, there is preferable fire resistance.
Description
Technical field
The present invention relates to electronics adhesive fields, more particularly to a kind of fire safe type SMT patches in pb-free solder
The red glue of piece.
Background technology
Our electronic product is all to add various capacitances by PCB in general, and the electronic components such as resistance are pressed
Made of the electric circuit diagram design of design, so panoramic electric appliance needs a variety of different SMT patches
Piece glue is bonded.
There are the bad defects of heat resistance and fire resistance for SMT Heraeus, are susceptible to and ask in the higher environment of temperature
Topic.
Invention content
The invention mainly solves the technical problem of providing a kind of fire safe type SMT paster adhesive in pb-free solder,
With preferable fire resistance.
In order to solve the above technical problems, one aspect of the present invention is：It provides a kind of for unleaded
Fire safe type SMT paster adhesive in welding, including：Modifying epoxy resin by organosilicon, trimethylolethane trimethacrylate glycidol
Ether, triphenyl phosphite, phenyl dimethylurea, nano aluminium oxide, everbright fast red and boron phosphide, it is described for resistance in pb-free solder
Parts by weight shared by each ingredient in fire type SMT paster adhesive：40-50 parts of modifying epoxy resin by organosilicon, trimethylolethane trimethacrylate
4.5-5.5 parts of glycidol ether, 5.1-6.2 parts of triphenyl phosphite, 13-18 parts of phenyl dimethylurea, nano aluminium oxide 5.5-6.2
5-12 parts of part, 1.8-2.6 parts of everbright fast red and boron phosphide.
In a preferred embodiment of the present invention, in the fire safe type SMT paster adhesive in pb-free solder respectively at
Parts by weight shared by point：40 parts of modifying epoxy resin by organosilicon, 4.5 parts of trimethylolethane trimethacrylate glycidol ether, phosphorous acid three
5 parts of 5.1 parts of phenyl ester, 13 parts of phenyl dimethylurea, 5.5 parts of nano aluminium oxide, 1.8 parts of everbright fast red and boron phosphide.
In a preferred embodiment of the present invention, in the fire safe type SMT paster adhesive in pb-free solder respectively at
Parts by weight shared by point：42 parts of modifying epoxy resin by organosilicon, 4.7 parts of trimethylolethane trimethacrylate glycidol ether, phosphorous acid three
6 parts of 5.3 parts of phenyl ester, 14 parts of phenyl dimethylurea, 5.6 parts of nano aluminium oxide, 1.9 parts of everbright fast red and boron phosphide.
In a preferred embodiment of the present invention, in the fire safe type SMT paster adhesive in pb-free solder respectively at
Parts by weight shared by point：44 parts of modifying epoxy resin by organosilicon, 4.8 parts of trimethylolethane trimethacrylate glycidol ether, phosphorous acid three
7 parts of 5.4 parts of phenyl ester, 15 parts of phenyl dimethylurea, 5.8 parts of nano aluminium oxide, 2.1 parts of everbright fast red and boron phosphide.
In a preferred embodiment of the present invention, in the fire safe type SMT paster adhesive in pb-free solder respectively at
Parts by weight shared by point：46 parts of modifying epoxy resin by organosilicon, 5.1 parts of trimethylolethane trimethacrylate glycidol ether, phosphorous acid three
8 parts of 5.6 parts of phenyl ester, 16 parts of phenyl dimethylurea, 5.9 parts of nano aluminium oxide, 2.3 parts of everbright fast red and boron phosphide.
In a preferred embodiment of the present invention, in the fire safe type SMT paster adhesive in pb-free solder respectively at
Parts by weight shared by point：48 parts of modifying epoxy resin by organosilicon, 5.3 parts of trimethylolethane trimethacrylate glycidol ether, phosphorous acid three
9 parts of 5.9 parts of phenyl ester, 17 parts of phenyl dimethylurea, 6.2 parts of nano aluminium oxide, 2.5 parts of everbright fast red and boron phosphide.
The beneficial effects of the invention are as follows：A kind of fire safe type SMT paster adhesive in pb-free solder that the present invention points out,
With preferable fire resistance.
Specific implementation mode
The technical scheme in the embodiments of the invention will be clearly and completely described below, it is clear that described implementation
Example is only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, this field is common
All other embodiment that technical staff is obtained without making creative work belongs to the model that the present invention protects
It encloses.
Embodiment 1：
It weighs：40 kilograms of modifying epoxy resin by organosilicon, 4.5 kilograms of trimethylolethane trimethacrylate glycidol ether, phosphorous triphenyl phosphate
5 kilograms of 5.1 kilograms of ester, 13 kilograms of phenyl dimethylurea, 5.5 kilograms of nano aluminium oxide, 1.8 kilograms of everbright fast red and boron phosphide, system
Obtain fire safe type SMT paster adhesive of the invention.
Embodiment 2：
It weighs：42 kilograms of modifying epoxy resin by organosilicon, 4.7 kilograms of trimethylolethane trimethacrylate glycidol ether, phosphorous triphenyl phosphate
6 kilograms of 5.3 kilograms of ester, 14 kilograms of phenyl dimethylurea, 5.6 kilograms of nano aluminium oxide, 1.9 kilograms of everbright fast red and boron phosphide, system
Obtain fire safe type SMT paster adhesive of the invention.
Embodiment 3：
It weighs：44 kilograms of modifying epoxy resin by organosilicon, 4.8 kilograms of trimethylolethane trimethacrylate glycidol ether, phosphorous triphenyl phosphate
7 kilograms of 5.4 kilograms of ester, 15 kilograms of phenyl dimethylurea, 5.8 kilograms of nano aluminium oxide, 2.1 kilograms of everbright fast red and boron phosphide, system
Obtain fire safe type SMT paster adhesive of the invention.
Embodiment 4：
It weighs：46 kilograms of modifying epoxy resin by organosilicon, 5.1 kilograms of trimethylolethane trimethacrylate glycidol ether, phosphorous triphenyl phosphate
8 kilograms of 5.6 kilograms of ester, 16 kilograms of phenyl dimethylurea, 5.9 kilograms of nano aluminium oxide, 2.3 kilograms of everbright fast red and boron phosphide, system
Obtain fire safe type SMT paster adhesive of the invention.
Embodiment 5：
It weighs：48 kilograms of modifying epoxy resin by organosilicon, 5.3 kilograms of trimethylolethane trimethacrylate glycidol ether, phosphorous triphenyl phosphate
9 kilograms of 5.9 kilograms of ester, 17 kilograms of phenyl dimethylurea, 6.2 kilograms of nano aluminium oxide, 2.5 kilograms of everbright fast red and boron phosphide, system
Obtain fire safe type SMT paster adhesive of the invention.
SMT paster adhesive prepared by embodiment 1-5, is detected according to relevant criterion, testing result such as table 1.
Table 1：
| Existing product | Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 | |
| Temperature of initial decomposition（℃） | 255 | 412 | 414 | 415 | 411 | 410 |
| Temperature when thermal weight loss 50%（℃） | 465 | 532 | 533 | 534 | 531 | 530 |
| Limit oxygen index（%） | 23.1 | 37.4 | 37.1 | 37.2 | 37.6 | 37.5 |
In conclusion a kind of fire safe type SMT paster adhesive in pb-free solder that the present invention points out, has preferable fire resisting
Performance.
Example the above is only the implementation of the present invention is not intended to limit the scope of the invention, every to utilize this hair
Equivalent structure or equivalent flow shift made by bright description is applied directly or indirectly in other relevant technology necks
Domain is included within the scope of the present invention.
Claims (6)
1. a kind of fire safe type SMT paster adhesive in pb-free solder, which is characterized in that including：Silicon-modified epoxy tree
Fat, trimethylolethane trimethacrylate glycidol ether, triphenyl phosphite, phenyl dimethylurea, nano aluminium oxide, everbright fast red and phosphatization
Boron, it is described to be used in the fire safe type SMT paster adhesive in pb-free solder parts by weight shared by each ingredient：Silicon-modified epoxy tree
40-50 parts of fat, 4.5-5.5 parts of trimethylolethane trimethacrylate glycidol ether, 5.1-6.2 parts of triphenyl phosphite, phenyl dimethylurea
5-12 parts of 13-18 parts, 5.5-6.2 parts of nano aluminium oxide, 1.8-2.6 parts of everbright fast red and boron phosphide.
2. the fire safe type SMT paster adhesive according to claim 1 in pb-free solder, which is characterized in that the use
Parts by weight shared by each ingredient in fire safe type SMT paster adhesive in pb-free solder：40 parts of modifying epoxy resin by organosilicon, three
4.5 parts of hydroxymethyl ethane triglycidyl ether, 5.1 parts of triphenyl phosphite, 13 parts of phenyl dimethylurea, 5.5 parts of nano aluminium oxide,
5 parts of 1.8 parts of everbright fast red and boron phosphide.
3. the fire safe type SMT paster adhesive according to claim 1 in pb-free solder, which is characterized in that the use
Parts by weight shared by each ingredient in fire safe type SMT paster adhesive in pb-free solder：42 parts of modifying epoxy resin by organosilicon, three
4.7 parts of hydroxymethyl ethane triglycidyl ether, 5.3 parts of triphenyl phosphite, 14 parts of phenyl dimethylurea, 5.6 parts of nano aluminium oxide,
6 parts of 1.9 parts of everbright fast red and boron phosphide.
4. the fire safe type SMT paster adhesive according to claim 1 in pb-free solder, which is characterized in that the use
Parts by weight shared by each ingredient in fire safe type SMT paster adhesive in pb-free solder：44 parts of modifying epoxy resin by organosilicon, three
4.8 parts of hydroxymethyl ethane triglycidyl ether, 5.4 parts of triphenyl phosphite, 15 parts of phenyl dimethylurea, 5.8 parts of nano aluminium oxide,
7 parts of 2.1 parts of everbright fast red and boron phosphide.
5. the fire safe type SMT paster adhesive according to claim 1 in pb-free solder, which is characterized in that the use
Parts by weight shared by each ingredient in fire safe type SMT paster adhesive in pb-free solder：46 parts of modifying epoxy resin by organosilicon, three
5.1 parts of hydroxymethyl ethane triglycidyl ether, 5.6 parts of triphenyl phosphite, 16 parts of phenyl dimethylurea, 5.9 parts of nano aluminium oxide,
8 parts of 2.3 parts of everbright fast red and boron phosphide.
6. the fire safe type SMT paster adhesive according to claim 1 in pb-free solder, which is characterized in that the use
Parts by weight shared by each ingredient in fire safe type SMT paster adhesive in pb-free solder：48 parts of modifying epoxy resin by organosilicon, three
5.3 parts of hydroxymethyl ethane triglycidyl ether, 5.9 parts of triphenyl phosphite, 17 parts of phenyl dimethylurea, 6.2 parts of nano aluminium oxide,
9 parts of 2.5 parts of everbright fast red and boron phosphide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810356788.8A CN108395861A (en) | 2018-04-20 | 2018-04-20 | A kind of fire safe type SMT paster adhesive in pb-free solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810356788.8A CN108395861A (en) | 2018-04-20 | 2018-04-20 | A kind of fire safe type SMT paster adhesive in pb-free solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108395861A true CN108395861A (en) | 2018-08-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810356788.8A Pending CN108395861A (en) | 2018-04-20 | 2018-04-20 | A kind of fire safe type SMT paster adhesive in pb-free solder |
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| CN (1) | CN108395861A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111057504A (en) * | 2020-01-09 | 2020-04-24 | 深圳市邦大科技有限公司 | High-strength patch red glue and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103756611A (en) * | 2013-12-23 | 2014-04-30 | 东莞市亚聚电子材料有限公司 | Low-temperature curing patch red gum and preparation method thereof |
| CN105315959A (en) * | 2015-11-24 | 2016-02-10 | 苏州盖德精细材料有限公司 | High-temperature-resistant SMT adhesive and preparing method thereof |
| CN105315941A (en) * | 2015-11-23 | 2016-02-10 | 苏州盖德精细材料有限公司 | Heatproof and fireproof SMT adhesive and preparing method thereof |
-
2018
- 2018-04-20 CN CN201810356788.8A patent/CN108395861A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103756611A (en) * | 2013-12-23 | 2014-04-30 | 东莞市亚聚电子材料有限公司 | Low-temperature curing patch red gum and preparation method thereof |
| CN105315941A (en) * | 2015-11-23 | 2016-02-10 | 苏州盖德精细材料有限公司 | Heatproof and fireproof SMT adhesive and preparing method thereof |
| CN105315959A (en) * | 2015-11-24 | 2016-02-10 | 苏州盖德精细材料有限公司 | High-temperature-resistant SMT adhesive and preparing method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111057504A (en) * | 2020-01-09 | 2020-04-24 | 深圳市邦大科技有限公司 | High-strength patch red glue and preparation method thereof |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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Application publication date: 20180814 |