CN108676523A - A kind of military project electronic component Heatproof hot melt adhesive and preparation method thereof - Google Patents
A kind of military project electronic component Heatproof hot melt adhesive and preparation method thereof Download PDFInfo
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- CN108676523A CN108676523A CN201810684674.6A CN201810684674A CN108676523A CN 108676523 A CN108676523 A CN 108676523A CN 201810684674 A CN201810684674 A CN 201810684674A CN 108676523 A CN108676523 A CN 108676523A
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- electronic component
- hot melt
- military project
- melt adhesive
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C09J123/0853—Vinylacetate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a kind of military project electronic component Heatproof hot melt adhesives and preparation method thereof, include the raw material of following parts by weight：30 45 parts of EVA resin, 18 26 parts of liquid thermoset polyimides pure resin, 16 25 parts of terpene phenolic resin, 58 parts of polyethylene wax, 24 parts of isobutyl triethoxy silane, 35 parts of expanded graphite, 24 parts of linear low density polyethylene, it is bonded 2.5 4.5 parts of modifying agent, 0.8 1.3 parts of antioxidant, 1 1.5 parts of heat stabilizer.It is reasonable that the military project electronic component of present invention Heatproof hot melt adhesive is formulated, there is good high and low temperature resistance after preparation, adhesive property, thermal stability, mechanical performance etc., excellent combination property can be used in component or the equipment preparation of the industries such as aerospace, naval vessel, radar, electronic information equipment, and effect is preferable.
Description
Technical field
The invention belongs to macromolecule glue formula technique fields, and in particular to a kind of military project electronic component is heated with heatproof
Glue and preparation method thereof.
Background technology
Electronic component is the component part of electronic component and electric small-sized machine, instrument, itself is often by several parts
It constitutes, it can be general in similar product；Often refer to electric appliance, radio, the industry such as instrument certain parts, as capacitance, transistor,
The general name of the sub- device such as balance spring, clockwork spring.It common are diode etc..Electronic component includes：Resistance, capacitor, potentiometer, electricity
Sub- pipe, radiator, electromechanical compo, connector, semi-conductor discrete device, electro-acoustic element, laser device, electron display device, light
Electrical part, sensor, power supply, switch, small and special electric machine, electronic transformer, relay, printed circuit board, integrated circuit, all kinds of electricity
Road, piezoelectricity, crystal, quartz, ceramic magnet material, base material substrate used for printed circuit, electric function technique proprietary material, electronic pastes
(band) product, electron chemistry material and component etc..Military project grade electronic component is mainly used in guided missile, tank, satellite, aircraft carrier
Deng, performance requirement considerably beyond technical grade or business level electronic component.Hot melt adhesive is a kind of adhesive of plasticity, room temperature
It, can rapid link after heating and melting in solid state；It is usually used in the structure connection of various parts in component.However, hot melt adhesive
There are some disadvantages：Mainly resistant of high or low temperature and adhesive strength is relatively low, thus is not suitable for using as sqtructural adhesive.It is based on
Above statement, the present invention propose a kind of military project electronic component Heatproof hot melt adhesive and preparation method thereof.
Invention content
In view of the foregoing, it is an object to provide a kind of military project electronic component Heatproof hot melt adhesive and its system
Preparation Method, the military project electronic component Heatproof hot melt adhesive being prepared have good high and low temperature resistance, adhesive property, heat
Stability, mechanical performance etc., excellent combination property.
To achieve the goals above, the technical solution adopted by the present invention is：A kind of military project electronic component is heated with heatproof
Glue is made of the raw material of following parts by weight：30-45 parts of EVA resin, 18-26 parts of liquid thermoset polyimides pure resin, terpenes
16-25 parts of phenolic resin, 5-8 parts of polyethylene wax, 2-4 parts of isobutyl triethoxy silane, 3-5 parts of expanded graphite are linear low close
2-4 parts of polyethylene is spent, 2.5-4.5 parts of modifying agent, 0.8-1.3 parts of antioxidant, 1-1.5 parts of heat stabilizer are bonded.
The mass ratio of the polyethylene wax and isobutyl triethoxy silane is (2-4)：1.
The expanded graphite and the mass ratio of linear low density polyethylene are (1-2.5)：1.
The bonding modifying agent is the compound of end hydroxy butadiene and ethylene-methyl acrylate copolymer；Wherein, it holds
The mass ratio of hydroxyl polybutadiene and ethylene-methyl acrylate copolymer is 1：(0.9-1.5).
The antioxidant is antioxidant 1010, and heat stabilizer is epoxidized soybean oil.
The preparation method of above-mentioned military project electronic component Heatproof hot melt adhesive, including following preparation method：
(1) formula rate is pressed, by expanded graphite, linear low density polyethylene, polyethylene wax and isobutyl group triethoxy
Silane is placed in stirrer for mixing and stirs evenly, and blender stir speed (S.S.) is 500-600r/min；
(2) formula rate is pressed, by EVA resin, liquid thermoset polyimides pure resin, terpene phenolic resin, bonding changes
Property agent, antioxidant and heat stabilizer be placed in stirrer for mixing and stir evenly, and blender stir speed (S.S.) is 350-450r/min；
(3) mixture obtained by step (1) is added in the mixture obtained by step (2), is subsequently placed in blender
It is mixed evenly, then is granulated by twin-screw mixer extruder blending extrusion, as military project electronic component is heated with heatproof
Glue；Wherein, blender stir speed (S.S.) is 200-300r/min.
The military project electronic component Heatproof hot melt adhesive of the present invention, with EVA resin and the pure tree of liquid thermoset polyimides
Terpene phenolic resin is added in matrix of the fat as hot melt adhesive, is bonded modifying agent, antioxidant and heat stabilizer, reduces matrix
Melt viscosity, have preferable workability；Then it adds polyethylene wax and isobutyl triethoxy silane is processed
Expanded graphite and linear low density polyethylene mixture, increase the performances such as high and low temperature resistance, the bonding of hot melt adhesive so that heat
The excellent combination property of melten gel.Wherein, the compounding of expanded graphite and linear low density polyethylene mixture, with good
The compounding of high-low temperature resistant synergistic effect, polyethylene wax and isobutyl triethoxy silane is anti-with softening, lubrication and antibacterial
Mould effect, compounds in matrix together, can improve the performance of hot melt adhesive various aspects.
Beneficial effects of the present invention：It is reasonable that the military project electronic component of present invention Heatproof hot melt adhesive is formulated, and has after preparation
There is a good high and low temperature resistance, adhesive property, thermal stability, mechanical performance etc., excellent combination property can be used for aviation
In prepared by the component or equipment of the industries such as space flight, naval vessel, radar, electronic information equipment, effect is preferable.
Specific implementation mode
The specific implementation mode of the present invention is described in detail below.It should be understood that described herein specific
Embodiment is merely to illustrate and explain the present invention, it is not limited to these embodiments.In embodiment, all raw materials are commercially available
Product.
Embodiment 1
A kind of military project electronic component Heatproof hot melt adhesive, is made of the raw material of following parts by weight：
42 parts of EVA resin, 23 parts of liquid thermoset polyimides pure resin, 22 parts of terpene phenolic resin, polyethylene wax 6
Part, 3 parts of isobutyl triethoxy silane, 4 parts of expanded graphite, 3 parts of linear low density polyethylene, 3.8 parts of modifying agent of bonding, antioxygen
1.1 parts of agent, 1.2 parts of heat stabilizer.
The bonding modifying agent is the compound of end hydroxy butadiene and ethylene-methyl acrylate copolymer；Wherein, it holds
The mass ratio of hydroxyl polybutadiene and ethylene-methyl acrylate copolymer is 1：1.2.
The antioxidant is antioxidant 1010, and heat stabilizer is epoxidized soybean oil.
The preparation method of above-mentioned military project electronic component Heatproof hot melt adhesive, including following preparation method：
(1) formula rate is pressed, by expanded graphite, linear low density polyethylene, polyethylene wax and isobutyl group triethoxy
Silane is placed in stirrer for mixing and stirs evenly, and blender stir speed (S.S.) is 560r/min；
(2) formula rate is pressed, by EVA resin, liquid thermoset polyimides pure resin, terpene phenolic resin, bonding changes
Property agent, antioxidant and heat stabilizer be placed in stirrer for mixing and stir evenly, and blender stir speed (S.S.) is 420r/min；
(3) mixture obtained by step (1) is added in the mixture obtained by step (2), is subsequently placed in blender
It is mixed evenly, then is granulated by twin-screw mixer extruder blending extrusion, as military project electronic component is heated with heatproof
Glue；Wherein, blender stir speed (S.S.) is 260r/min.
Embodiment 2
A kind of military project electronic component Heatproof hot melt adhesive, is made of the raw material of following parts by weight：
43 parts of EVA resin, 25 parts of liquid thermoset polyimides pure resin, 24 parts of terpene phenolic resin, polyethylene wax 7.6
Part, 3.6 parts of isobutyl triethoxy silane, 4.6 parts of expanded graphite, 3.4 parts of linear low density polyethylene, bonding modifying agent 4.2
Part, 1.2 parts of antioxidant, 1.3 parts of heat stabilizer.
The bonding modifying agent is the compound of end hydroxy butadiene and ethylene-methyl acrylate copolymer；Wherein, it holds
The mass ratio of hydroxyl polybutadiene and ethylene-methyl acrylate copolymer is 1：1.3.
The antioxidant is antioxidant 1010, and heat stabilizer is epoxidized soybean oil.
The preparation method of above-mentioned military project electronic component Heatproof hot melt adhesive, including following preparation method：
(1) formula rate is pressed, by expanded graphite, linear low density polyethylene, polyethylene wax and isobutyl group triethoxy
Silane is placed in stirrer for mixing and stirs evenly, and blender stir speed (S.S.) is 580r/min；
(2) formula rate is pressed, by EVA resin, liquid thermoset polyimides pure resin, terpene phenolic resin, bonding changes
Property agent, antioxidant and heat stabilizer be placed in stirrer for mixing and stir evenly, and blender stir speed (S.S.) is 430r/min；
(3) mixture obtained by step (1) is added in the mixture obtained by step (2), is subsequently placed in blender
It is mixed evenly, then is granulated by twin-screw mixer extruder blending extrusion, as military project electronic component is heated with heatproof
Glue；Wherein, blender stir speed (S.S.) is 300r/min.
Embodiment 3
A kind of military project electronic component Heatproof hot melt adhesive, is made of the raw material of following parts by weight：
42 parts of EVA resin, 24 parts of liquid thermoset polyimides pure resin, 23 parts of terpene phenolic resin, polyethylene wax 7.4
Part, 3.2 parts of isobutyl triethoxy silane, 4.3 parts of expanded graphite, 3.5 parts of linear low density polyethylene, bonding modifying agent 4.2
Part, 1.1 parts of antioxidant, 1.3 parts of heat stabilizer.
The bonding modifying agent is the compound of end hydroxy butadiene and ethylene-methyl acrylate copolymer；Wherein, it holds
The mass ratio of hydroxyl polybutadiene and ethylene-methyl acrylate copolymer is 1：1.3.
The antioxidant is antioxidant 1010, and heat stabilizer is epoxidized soybean oil.
The preparation method of above-mentioned military project electronic component Heatproof hot melt adhesive, including following preparation method：
(1) formula rate is pressed, by expanded graphite, linear low density polyethylene, polyethylene wax and isobutyl group triethoxy
Silane is placed in stirrer for mixing and stirs evenly, and blender stir speed (S.S.) is 580r/min；
(2) formula rate is pressed, by EVA resin, liquid thermoset polyimides pure resin, terpene phenolic resin, bonding changes
Property agent, antioxidant and heat stabilizer be placed in stirrer for mixing and stir evenly, and blender stir speed (S.S.) is 420r/min；
(3) mixture obtained by step (1) is added in the mixture obtained by step (2), is subsequently placed in blender
It is mixed evenly, then is granulated by twin-screw mixer extruder blending extrusion, as military project electronic component is heated with heatproof
Glue；Wherein, blender stir speed (S.S.) is 280r/min.
Test example
The high and low temperature resistance and stripping performance of military project electronic component Heatproof hot melt adhesive produced by the present invention are carried out
Test, test result is as follows shown in table：
| Index request | Embodiment 1 | Embodiment 2 | Embodiment 3 | |
| Heat resistance | ℃ | -8.6-154.2 | -11.6-156.3 | -9.8-155.4 |
| Peel strength | ≧20N/cm | 29.3 | 32.2 | 31.4 |
In conclusion the military project electronic component of present invention Heatproof hot melt adhesive has good high and low temperature resistance and glues
Performance is connect, can be used in component or the equipment preparation of the industries such as aerospace, naval vessel, radar, electronic information equipment.
Claims (6)
1. a kind of military project electronic component Heatproof hot melt adhesive, which is characterized in that be made of the raw material of following parts by weight：EVA trees
30-45 parts of fat, 18-26 parts of liquid thermoset polyimides pure resin, 16-25 parts of terpene phenolic resin, 5-8 parts of polyethylene wax,
2-4 parts of isobutyl triethoxy silane, 3-5 parts of expanded graphite, 2-4 parts of linear low density polyethylene, bonding modifying agent 2.5-4.5
Part, 0.8-1.3 parts of antioxidant, 1-1.5 parts of heat stabilizer.
2. a kind of military project electronic component Heatproof hot melt adhesive according to claim 1, which is characterized in that the polyethylene
The mass ratio of wax and isobutyl triethoxy silane is (2-4)：1.
3. a kind of military project electronic component Heatproof hot melt adhesive according to claim 1, which is characterized in that the expansion stone
Ink and the mass ratio of linear low density polyethylene are (1-2.5)：1.
4. a kind of military project electronic component Heatproof hot melt adhesive according to claim 1, which is characterized in that the bonding changes
Property agent be end hydroxy butadiene and ethylene-methyl acrylate copolymer compound；Wherein, end hydroxy butadiene and second
The mass ratio of alkene-methyl acrylate copolymer is 1：(0.9-1.5).
5. a kind of military project electronic component Heatproof hot melt adhesive according to claim 1, which is characterized in that described anti-oxidant
Agent is antioxidant 1010, and heat stabilizer is epoxidized soybean oil.
6. a kind of preparation method of military project electronic component Heatproof hot melt adhesive as described in claim 1-5 any one,
It is characterized in that, including following preparation method：
(1) formula rate is pressed, by expanded graphite, linear low density polyethylene, polyethylene wax and isobutyl triethoxy silane
It is placed in stirrer for mixing to stir evenly, blender stir speed (S.S.) is 500-600r/min；
(2) formula rate is pressed, by EVA resin, liquid thermoset polyimides pure resin, terpene phenolic resin is bonded modifying agent,
Antioxidant and heat stabilizer are placed in stirrer for mixing and stir evenly, and blender stir speed (S.S.) is 350-450r/min；
(3) mixture obtained by step (1) is added in the mixture obtained by step (2), is subsequently placed in stirrer for mixing
It stirs evenly, then is granulated by twin-screw mixer extruder blending extrusion, as military project electronic component Heatproof hot melt adhesive；Its
In, blender stir speed (S.S.) is 200-300r/min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810684674.6A CN108676523A (en) | 2018-06-28 | 2018-06-28 | A kind of military project electronic component Heatproof hot melt adhesive and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810684674.6A CN108676523A (en) | 2018-06-28 | 2018-06-28 | A kind of military project electronic component Heatproof hot melt adhesive and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108676523A true CN108676523A (en) | 2018-10-19 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810684674.6A Withdrawn CN108676523A (en) | 2018-06-28 | 2018-06-28 | A kind of military project electronic component Heatproof hot melt adhesive and preparation method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN108676523A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111162218A (en) * | 2019-12-30 | 2020-05-15 | 常州天晟新材料研究院有限公司 | Battery pack buffering heat insulation sheet and preparation method and application thereof |
| CN114806459A (en) * | 2022-06-01 | 2022-07-29 | 云阳金田塑业有限公司 | Modified EVA hot melt adhesive suitable for adhesive-free film and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060228480A1 (en) * | 2005-03-30 | 2006-10-12 | David Lin | Method of manufacturing a release liner |
| CN106243475A (en) * | 2016-08-15 | 2016-12-21 | 合肥汇通控股股份有限公司 | A kind of high-performance ethylene-vinyl acetate copolymer composite |
| CN108130021A (en) * | 2017-12-22 | 2018-06-08 | 广州宝之泰电子科技有限公司 | A kind of co-extrusion type high fire-retardance hot melt adhesive and preparation method thereof |
-
2018
- 2018-06-28 CN CN201810684674.6A patent/CN108676523A/en not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060228480A1 (en) * | 2005-03-30 | 2006-10-12 | David Lin | Method of manufacturing a release liner |
| CN106243475A (en) * | 2016-08-15 | 2016-12-21 | 合肥汇通控股股份有限公司 | A kind of high-performance ethylene-vinyl acetate copolymer composite |
| CN108130021A (en) * | 2017-12-22 | 2018-06-08 | 广州宝之泰电子科技有限公司 | A kind of co-extrusion type high fire-retardance hot melt adhesive and preparation method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111162218A (en) * | 2019-12-30 | 2020-05-15 | 常州天晟新材料研究院有限公司 | Battery pack buffering heat insulation sheet and preparation method and application thereof |
| CN114806459A (en) * | 2022-06-01 | 2022-07-29 | 云阳金田塑业有限公司 | Modified EVA hot melt adhesive suitable for adhesive-free film and preparation method thereof |
| CN114806459B (en) * | 2022-06-01 | 2023-09-01 | 云阳金田塑业有限公司 | Modified EVA hot melt adhesive suitable for glue-free film and preparation method thereof |
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Application publication date: 20181019 |
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