CN108395862A - A kind of SMT low-temperature setting patch red glue in pb-free solder - Google Patents
A kind of SMT low-temperature setting patch red glue in pb-free solder Download PDFInfo
- Publication number
- CN108395862A CN108395862A CN201810356789.2A CN201810356789A CN108395862A CN 108395862 A CN108395862 A CN 108395862A CN 201810356789 A CN201810356789 A CN 201810356789A CN 108395862 A CN108395862 A CN 108395862A
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- China
- Prior art keywords
- parts
- temperature setting
- free solder
- low
- smt
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2265—Oxides; Hydroxides of metals of iron
- C08K2003/2272—Ferric oxide (Fe2O3)
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
Abstract
The invention discloses a kind of SMT low-temperature setting patch red glue in pb-free solder, including：Modifying epoxy resin by organosilicon, sorbierite poly epihydric alcohol, dithio-salicylic acid, aerosil, silica, white carbon and iron oxide red, it is described to be used in the SMT low-temperature setting patch red glue in pb-free solder parts by weight shared by each ingredient：1.1 2.2 parts of 20 35 parts of modifying epoxy resin by organosilicon, 16 25 parts of sorbierite poly epihydric alcohol, 6 12 parts of dithio-salicylic acid, 16 25 parts of aerosil, 5 12 parts of silica, 16 parts of white carbon and iron oxide red.By the above-mentioned means, provided by the present invention for the SMT low-temperature setting patch red glue in pb-free solder, at low ambient temperatures can the very fast time solidification, while adhesion strength greatly improves.
Description
Technical field
The present invention relates to electronics adhesive fields, more particularly to a kind of SMT low-temperature settings in pb-free solder
Patch red glue.
Background technology
Our electronic product is all to add various capacitances by PCB in general, and the electronic components such as resistance are pressed
Made of the electric circuit diagram design of design, so panoramic electric appliance needs
A variety of different SMT Heraeus are bonded.
Patch red glue majority solidification temperature at 150 DEG C or so, differ by hardening time 2-5 minute in the market.With electronics electricity
The miniaturization of device, hot setting adversely affect certain component performances, and energy consumption is also high, increases entreprise cost, so
Urgent need will develop a kind of patch red glue suitable for low-temperature setting.
Invention content
The invention mainly solves the technical problem of providing a kind of SMT low-temperature setting patch reds in pb-free solder
Glue, at low ambient temperatures can the very fast time solidification, while adhesion strength greatly improves.
In order to solve the above technical problems, one aspect of the present invention is：It provides a kind of in pb-free solder
SMT low-temperature setting patch red glue, including：Modifying epoxy resin by organosilicon, sorbierite poly epihydric alcohol, dithio-salicylic acid,
Aerosil, silica, white carbon and iron oxide red, the SMT low-temperature setting patch red glue in pb-free solder
In parts by weight shared by each ingredient：It is 20-35 parts of modifying epoxy resin by organosilicon, 16-25 parts of sorbierite poly epihydric alcohol, two thio
1.1-2.2 parts of 6-12 parts of salicylic acid, 16-25 parts of aerosil, 5-12 parts of silica, 1-6 parts of white carbon and iron oxide red.
In a preferred embodiment of the present invention, each in the SMT low-temperature setting patch red glue in pb-free solder
Parts by weight shared by ingredient：20 parts of modifying epoxy resin by organosilicon, 16 parts of sorbierite poly epihydric alcohol, 6 parts of dithio-salicylic acid,
1.1 parts of 16 parts of aerosil, 5 parts of silica, 1 part of white carbon and iron oxide red.
In a preferred embodiment of the present invention, each in the SMT low-temperature setting patch red glue in pb-free solder
Parts by weight shared by ingredient：22 parts of modifying epoxy resin by organosilicon, 17 parts of sorbierite poly epihydric alcohol, 7 parts of dithio-salicylic acid,
1.3 parts of 18 parts of aerosil, 6 parts of silica, 2 parts of white carbon and iron oxide red.
In a preferred embodiment of the present invention, each in the SMT low-temperature setting patch red glue in pb-free solder
Parts by weight shared by ingredient：25 parts of modifying epoxy resin by organosilicon, 18 parts of sorbierite poly epihydric alcohol, 8 parts of dithio-salicylic acid,
1.6 parts of 19 parts of aerosil, 7 parts of silica, 3 parts of white carbon and iron oxide red.
In a preferred embodiment of the present invention, each in the SMT low-temperature setting patch red glue in pb-free solder
Parts by weight shared by ingredient：29 parts of modifying epoxy resin by organosilicon, 20 parts of sorbierite poly epihydric alcohol, 9 parts of dithio-salicylic acid,
1.9 parts of 20 parts of aerosil, 9 parts of silica, 5 parts of white carbon and iron oxide red.
In a preferred embodiment of the present invention, each in the SMT low-temperature setting patch red glue in pb-free solder
Parts by weight shared by ingredient：33 parts of modifying epoxy resin by organosilicon, 22 parts of sorbierite poly epihydric alcohol, dithio-salicylic acid 12
Part, 22 parts of aerosil, 10 parts of silica, 6 parts of white carbon and 2.2 parts of iron oxide red.
The beneficial effects of the invention are as follows：A kind of SMT low-temperature setting patch reds in pb-free solder that the present invention points out
Glue, at low ambient temperatures can the very fast time solidification, while adhesion strength greatly improves.
Specific implementation mode
The technical scheme in the embodiments of the invention will be clearly and completely described below, it is clear that described implementation
Example is only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, this field is common
All other embodiment that technical staff is obtained without making creative work belongs to the model that the present invention protects
It encloses.
Embodiment 1：
It weighs：20 kilograms of modifying epoxy resin by organosilicon, 16 kilograms of sorbierite poly epihydric alcohol, 6 kilograms of dithio-salicylic acid, gas
The low-temperature solid of the present invention is made in 1.1 kilograms of 16 kilograms of aerosil, 5 kilograms of silica, 1 kilogram of white carbon and iron oxide red
Change patch red glue.
Embodiment 2：
It weighs：22 kilograms of modifying epoxy resin by organosilicon, 17 kilograms of sorbierite poly epihydric alcohol, 7 kilograms of dithio-salicylic acid, gas
The low-temperature solid of the present invention is made in 1.3 kilograms of 18 kilograms of aerosil, 6 kilograms of silica, 2 kilograms of white carbon and iron oxide red
Change patch red glue.
Embodiment 3：
It weighs：25 kilograms of modifying epoxy resin by organosilicon, 18 kilograms of sorbierite poly epihydric alcohol, 8 kilograms of dithio-salicylic acid, gas
The low-temperature solid of the present invention is made in 1.6 kilograms of 19 kilograms of aerosil, 7 kilograms of silica, 3 kilograms of white carbon and iron oxide red
Change patch red glue.
Embodiment 4：
It weighs：29 kilograms of modifying epoxy resin by organosilicon, 20 kilograms of sorbierite poly epihydric alcohol, 9 kilograms of dithio-salicylic acid, gas
The low-temperature solid of the present invention is made in 1.9 kilograms of 20 kilograms of aerosil, 9 kilograms of silica, 5 kilograms of white carbon and iron oxide red
Change patch red glue.
Embodiment 5：
It weighs：33 kilograms of modifying epoxy resin by organosilicon, 22 kilograms of sorbierite poly epihydric alcohol, 12 kilograms of dithio-salicylic acid,
The low temperature of the present invention is made in 2.2 kilograms of 22 kilograms of aerosil, 10 kilograms of silica, 6 kilograms of white carbon and iron oxide red
Cure patch red glue.
Low-temperature setting patch red glue prepared by embodiment 1-5, is detected according to relevant criterion, testing result such as table 1.
Table 1：
| 150 DEG C of conventional solidified speed（s） | 100 DEG C of low-temperature setting speed（s） | |
| Embodiment 1 | 92 | 123 |
| Embodiment 2 | 91 | 122 |
| Embodiment 3 | 93 | 121 |
| Embodiment 4 | 90 | 120 |
| Embodiment 5 | 94 | 124 |
| Existing product | 122 | 152 |
In conclusion a kind of SMT low-temperature setting patch red glue in pb-free solder that the present invention points out, at low ambient temperatures
The solidification of energy very fast time, while adhesion strength greatly improves.
Example the above is only the implementation of the present invention is not intended to limit the scope of the invention, every to utilize this hair
Equivalent structure or equivalent flow shift made by bright description is applied directly or indirectly in other relevant technology necks
Domain is included within the scope of the present invention.
Claims (6)
1. a kind of SMT low-temperature setting patch red glue in pb-free solder, which is characterized in that including：Silicon-modified epoxy
Resin, sorbierite poly epihydric alcohol, dithio-salicylic acid, aerosil, silica, white carbon and iron oxide red, it is described
For parts by weight shared by each ingredient in the SMT low-temperature setting patch red glue in pb-free solder：Modifying epoxy resin by organosilicon 20-
35 parts, 16-25 parts of sorbierite poly epihydric alcohol, 6-12 parts of dithio-salicylic acid, 16-25 parts of aerosil, silica 5-
1.1-2.2 parts of 12 parts, 1-6 parts of white carbon and iron oxide red.
2. the SMT low-temperature setting patch red glue according to claim 1 in pb-free solder, which is characterized in that described
For parts by weight shared by each ingredient in the SMT low-temperature setting patch red glue in pb-free solder：Modifying epoxy resin by organosilicon 20
Part, 16 parts of sorbierite poly epihydric alcohol, 6 parts of dithio-salicylic acid, 16 parts of aerosil, 5 parts of silica, 1 part of white carbon
With 1.1 parts of iron oxide red.
3. the SMT low-temperature setting patch red glue according to claim 1 in pb-free solder, which is characterized in that described
For parts by weight shared by each ingredient in the SMT low-temperature setting patch red glue in pb-free solder：Modifying epoxy resin by organosilicon 22
Part, 17 parts of sorbierite poly epihydric alcohol, 7 parts of dithio-salicylic acid, 18 parts of aerosil, 6 parts of silica, 2 parts of white carbon
With 1.3 parts of iron oxide red.
4. the SMT low-temperature setting patch red glue according to claim 1 in pb-free solder, which is characterized in that described
For parts by weight shared by each ingredient in the SMT low-temperature setting patch red glue in pb-free solder：Modifying epoxy resin by organosilicon 25
Part, 18 parts of sorbierite poly epihydric alcohol, 8 parts of dithio-salicylic acid, 19 parts of aerosil, 7 parts of silica, 3 parts of white carbon
With 1.6 parts of iron oxide red.
5. the SMT low-temperature setting patch red glue according to claim 1 in pb-free solder, which is characterized in that described
For parts by weight shared by each ingredient in the SMT low-temperature setting patch red glue in pb-free solder：Modifying epoxy resin by organosilicon 29
Part, 20 parts of sorbierite poly epihydric alcohol, 9 parts of dithio-salicylic acid, 20 parts of aerosil, 9 parts of silica, 5 parts of white carbon
With 1.9 parts of iron oxide red.
6. the SMT low-temperature setting patch red glue according to claim 1 in pb-free solder, which is characterized in that described
For parts by weight shared by each ingredient in the SMT low-temperature setting patch red glue in pb-free solder：Modifying epoxy resin by organosilicon 33
Part, 22 parts of sorbierite poly epihydric alcohol, 12 parts of dithio-salicylic acid, 22 parts of aerosil, 10 parts of silica, white carbon 6
2.2 parts of part and iron oxide red.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810356789.2A CN108395862A (en) | 2018-04-20 | 2018-04-20 | A kind of SMT low-temperature setting patch red glue in pb-free solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810356789.2A CN108395862A (en) | 2018-04-20 | 2018-04-20 | A kind of SMT low-temperature setting patch red glue in pb-free solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108395862A true CN108395862A (en) | 2018-08-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810356789.2A Pending CN108395862A (en) | 2018-04-20 | 2018-04-20 | A kind of SMT low-temperature setting patch red glue in pb-free solder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108395862A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103756611A (en) * | 2013-12-23 | 2014-04-30 | 东莞市亚聚电子材料有限公司 | Low-temperature curing patch red gum and preparation method thereof |
| CN105315959A (en) * | 2015-11-24 | 2016-02-10 | 苏州盖德精细材料有限公司 | High-temperature-resistant SMT adhesive and preparing method thereof |
-
2018
- 2018-04-20 CN CN201810356789.2A patent/CN108395862A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103756611A (en) * | 2013-12-23 | 2014-04-30 | 东莞市亚聚电子材料有限公司 | Low-temperature curing patch red gum and preparation method thereof |
| CN105315959A (en) * | 2015-11-24 | 2016-02-10 | 苏州盖德精细材料有限公司 | High-temperature-resistant SMT adhesive and preparing method thereof |
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| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180814 |
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