CN103442522B - A kind of welding assembly technique of automobile dynamo governor - Google Patents
A kind of welding assembly technique of automobile dynamo governor Download PDFInfo
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- CN103442522B CN103442522B CN201310334895.8A CN201310334895A CN103442522B CN 103442522 B CN103442522 B CN 103442522B CN 201310334895 A CN201310334895 A CN 201310334895A CN 103442522 B CN103442522 B CN 103442522B
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- welding
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- heat sink
- pcb
- assembly technique
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a kind of automobile dynamo governor welding assembly technique, be to reach to weld IC, welding PCB and support, welding external connected electronic material, solidify thermal paste and combine the purpose of glue by the use of a reflow ovens.Its advantage is: this welding assembly technique simplifies operation, decreases the input of personnel and equipment, improves welding quality, and does not has tin sweat(ing) to occur.
Description
Technical field
The present invention relates to a kind of actuator welding assembly technique containing PCB assembly, IC or external connected electronic material, especially a kind of automobile dynamo governor welding assembly technique.
Background technology
Actuator containing PCB assembly, IC or external connected electronic material mainly has following material, regulator bracket, heat sink, IC, PCB assembly, thermal paste at present, in conjunction with glue, protects glue, and welding assembly main technique is as follows:
| Sequence number | Operation | Specification |
| 1 | Welding IC | Manual welding IC and PCB assembly |
| 2 | It is coated with thermal paste | The heat making IC is more preferably shed by heat sink |
| 3 | Beat support and combine glue | In conjunction with support and heat sink |
| 4 | Welding PCB and support | By on PCB components welding to support |
| 5 | Welding external connected electronic material | Part actuator has outer meeting resistance and diode |
| 6 | Baking | Make thermal paste and combine adhesive curing |
Existing technique welding times is more, and operation is loaded down with trivial details, and production line floor space is big, it is difficult to ensure that good concordance during manual welding, and often has tin sweat(ing) to produce when welding.
Summary of the invention
It is an object of the invention to overcome the deficiency of prior art, it is provided that the welding assembly technique of a kind of automobile dynamo governor, this welding assembly technique simplifies operation, decreases the input of personnel and equipment.Improve welding quality, and do not have tin sweat(ing) to occur.
The object of the present invention is achieved like this: the welding assembly technique of a kind of automobile dynamo governor, it is characterised in that: step is as follows:
(1) on heat sink, first it is coated with thermal paste, rubber alloy of tiing a knot on support；
(2) regulator bracket, heat sink, IC, PCB assembly are then assembled；
(3) use equipment point tin cream at needs weld the most again or use preformed soldering；
(4) put in reflow ovens after using tool fixing, reach to weld IC, welding PCB and support, welding external connected electronic material, solidify thermal paste and combine glue by the use of a reflow ovens.
Owing to using technique scheme, the invention has the beneficial effects as follows:
1) the original components and parts using flatiron to weld step by step, disposably weld now by Reflow Soldering.Thus simplify operation, decrease the input of personnel and equipment.
2) solidification of glue material and the welding of components and parts are carried out simultaneously, and PCB assembly, external connected electronic material, heat sink and support etc. are as entirely through Reflow Soldering.Thus improving welding quality, equipment point tin cream can control stannum amount accurately, can reach good welding quality and concordance, and do not have tin sweat(ing) after reflow ovens optimization of profile.
3) decreasing floor space, reflow ovens is almost identical with the floor space of curing oven, decreases the floor space of streamline.
Detailed description of the invention
Below in conjunction with embodiment, the invention will be further described.
Embodiment 1
On heat sink, first it is coated with thermal paste, rubber alloy of tiing a knot on support, then regulator bracket, heat sink, IC, PCB assembly are assembled, equipment point tin cream is used the most again at needs weld, put in reflow ovens after using tool fixing, reach to weld IC, welding PCB and support, welding external connected electronic material, solidify thermal paste and combine glue by the use of a reflow ovens.This packaging technology simplifies operation, decreases the input of personnel and equipment, improves welding quality, and does not has tin sweat(ing) to occur.
Embodiment 2
On heat sink, first it is coated with thermal paste, rubber alloy of tiing a knot on support, then regulator bracket, heat sink, IC, PCB assembly are assembled, preformed soldering is used the most again at needs weld, put in reflow ovens after using tool fixing, reach to weld IC, welding PCB and support, welding external connected electronic material, solidify thermal paste and combine glue by the use of a reflow ovens.This packaging technology simplifies operation, decreases the input of personnel and equipment, improves welding quality, and does not has tin sweat(ing) to occur.
Claims (1)
1. the welding assembly technique of an automobile dynamo governor, it is characterised in that: step is as follows:
(1) on heat sink, first it is coated with thermal paste, rubber alloy of tiing a knot on support；
(2) regulator bracket, heat sink, IC, PCB assembly are then assembled；
(3) use equipment point tin cream at needs weld the most again or use preformed soldering；
(4) put in reflow ovens after using tool fixing, reach to weld IC, welding PCB and support, welding external connected electronic material, solidify thermal paste and combine glue by the use of a reflow ovens；The solidification of glue material and the welding of components and parts are carried out simultaneously, and PCB assembly, external connected electronic material, heat sink and support are as entirely through Reflow Soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310334895.8A CN103442522B (en) | 2013-08-05 | 2013-08-05 | A kind of welding assembly technique of automobile dynamo governor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310334895.8A CN103442522B (en) | 2013-08-05 | 2013-08-05 | A kind of welding assembly technique of automobile dynamo governor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103442522A CN103442522A (en) | 2013-12-11 |
| CN103442522B true CN103442522B (en) | 2016-08-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310334895.8A Active CN103442522B (en) | 2013-08-05 | 2013-08-05 | A kind of welding assembly technique of automobile dynamo governor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103442522B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105722337A (en) * | 2014-12-01 | 2016-06-29 | 中国航空工业集团公司第六三一研究所 | Method for installing and reinforcing high-density mixed printed circuit assembly containing BGA device |
| CN110177437A (en) * | 2019-06-13 | 2019-08-27 | 安徽华东光电技术研究所有限公司 | S-band 2W solid-state power amplifier production method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1655400A (en) * | 2004-12-02 | 2005-08-17 | 上海山罗科技有限公司 | Method for connecting automobile dynamo governor assembly |
| CN102065646A (en) * | 2011-01-18 | 2011-05-18 | 武汉正维电子技术有限公司 | Surface mount technology of ratio frequency power amplification mainboard |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101374387B (en) * | 2007-08-24 | 2012-09-26 | 富葵精密组件(深圳)有限公司 | Method for welding electronic element on circuit board |
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2013
- 2013-08-05 CN CN201310334895.8A patent/CN103442522B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1655400A (en) * | 2004-12-02 | 2005-08-17 | 上海山罗科技有限公司 | Method for connecting automobile dynamo governor assembly |
| CN102065646A (en) * | 2011-01-18 | 2011-05-18 | 武汉正维电子技术有限公司 | Surface mount technology of ratio frequency power amplification mainboard |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103442522A (en) | 2013-12-11 |
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