CN103468194B - Patch inductor packaging single-component glue and preparation method thereof - Google Patents
Patch inductor packaging single-component glue and preparation method thereof Download PDFInfo
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- CN103468194B CN103468194B CN201310426529.5A CN201310426529A CN103468194B CN 103468194 B CN103468194 B CN 103468194B CN 201310426529 A CN201310426529 A CN 201310426529A CN 103468194 B CN103468194 B CN 103468194B
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Abstract
The invention relates to chip inductor packaging single-component glue. The chip inductor packaging single-component glue comprises the following components in parts by weight: 30 to 60 parts of bisphenol A type epoxy resin, 5 to 20 parts of toughening agent which is butadiene-acrylonitrile rubber modified epoxy resin, 1 to 10 parts of curing agent, 30 to 60 parts of filler and 0-3 parts of assistant. The invention also disclosed a preparation method of the chip inductor packaging single-component glue. The preparation method comprises the following steps: mixing raw materials uniformly under the condition of lower than 30 DEG C, grinding to be fine power with the average particle size of lower than 30 microns under the condition of lower than 35 DEG C, and then discharging and filling. The chip inductor packaging single-component glue has the beneficial effects that the shelf life of a product is longer, the surface of a cured product is not likely to seep oil, and after reflow soldering, the product is not likely to crack and short-circuit.
Description
Technical field
The present invention relates to a kind of packaging plastic, specifically, relate to a kind of chip inductor encapsulation single-component glue and preparation method thereof.
Background technology
Packaging plastic of the prior art, the epoxy glue as main flow mostly is two component, operation inconvenience, and the glue of single-component, and one or several problem ftractureed in short circuit after often there is the surperficial fuel-displaced or Reflow Soldering of shelf lives short, cured article, cannot accomplish that three takes into account.
Along with the miniaturization of intelligent equipment gets more and more, the components and parts of its inside corresponding also require miniaturization, and the chip inductor of one of them is the demand meeting this miniaturization, and its structure changes into by glue package by metal shell; Except reduced volume, also have by glue package the advantage that performance is more stable and cost is lower, all properties that this glue being applied to frontier need meet described in leading portion simultaneously just can achieve the above object.
Summary of the invention
The object of the invention is to, provide longer, cured article of a kind of shelf lives surperficial not easily fuel-displaced and single-component packaging plastic that is short circuit not easy to crack after Reflow Soldering.
The present invention is achieved by the following technical solutions:
Chip inductor encapsulation single-component glue obtained by the present invention, comprises the component of following parts by weight: bisphenol A type epoxy resin 30 ~ 60 parts; Toughner 5 ~ 20 parts, described toughner is acrylonitrile butadiene rubber modified epoxy resin; 1 ~ 10 part, solidifying agent; Filler 30 ~ 60 parts; Auxiliary agent 0 ~ 3 part.
Further, described auxiliary agent comprises coupling agent, flow agent and defoamer.
Further, described filler is the mixture of one or more in calcium carbonate, barium sulfate and silicon powder.
The invention also discloses the preparation method of a kind of chip inductor encapsulation single-component glue, raw material is comprised the steps: to mix under lower than the environment of 30 DEG C, and be ground to median size under lower than the environment of 35 DEG C lower than the fine powder of 30 microns, rear discharging, filling.
Above-mentioned raw materials comprises bisphenol A type epoxy resin 30 ~ 60 parts; Toughner 5 ~ 20 parts, described toughner is acrylonitrile butadiene rubber modified epoxy resin; 1 ~ 10 part, solidifying agent; Filler 30 ~ 60 parts; Auxiliary agent 0 ~ 3 part.
Further, described auxiliary agent comprises coupling agent, flow agent and defoamer.
Further, described filler is the mixture of one or more in calcium carbonate, barium sulfate and silicon powder.
Further, after discharging, the condition of cure of product is hot setting at least 1 hour in the environment of more than 120 DEG C.
Beneficial effect of the present invention is that product shelf life is longer, the surperficial not easily fuel-displaced and short circuit not easy to crack after Reflow Soldering of cured article.
Embodiment
Below in conjunction with specific embodiment, the present invention is described further:
Embodiment 1
Raw material is mixed under the environment of 25 DEG C, and under the environment of 25 DEG C, is ground to the fine powder of median size about 20 microns, rear discharging, filling.Above-mentioned raw materials comprises bisphenol A type epoxy resin 46 parts; Toughner 8 parts, described toughner is acrylonitrile butadiene rubber modified epoxy resin; 4 parts, solidifying agent; Filler 40 parts; Auxiliary agent 2 parts.Described auxiliary agent comprises coupling agent, flow agent and defoamer.Described filler is calcium carbonate.After discharging, the condition of cure of product is hot setting at least 1 hour in the environment of more than 120 DEG C.
Embodiment 2
Raw material is mixed under the environment of 28 DEG C, and under the environment of 30 DEG C, is ground to the fine powder of median size 25 microns, rear discharging, filling.Above-mentioned raw materials comprises bisphenol A type epoxy resin 50 parts; Toughner 13 parts, described toughner is acrylonitrile butadiene rubber modified epoxy resin; 5 parts, solidifying agent; Filler 30 parts; Auxiliary agent 2 parts.Described auxiliary agent comprises coupling agent, flow agent and defoamer.Described filler is the mixture of calcium carbonate, barium sulfate and silicon powder.After discharging, the condition of cure of product is hot setting at least 1 hour in the environment of more than 120 DEG C.
The requirement of commercially available single-component glue general satisfaction normal temperature 2 months shelf lifes, cured article surface is not fuel-displaced under normal circumstances,-40 DEG C ~ 125 DEG C cold cycling do not ftracture for 100 times not short circuit, 9 Reflow Solderings are not ftractureed not short circuit, the product of above-described embodiment 1,2 gained meets above-mentioned requirements, simultaneously, shelf lives can extend to 3 months, there is not the phenomenons such as solidification, precipitation, and cured article surface can not be fuel-displaced when artificial force extrudes, and also slightly promotes compared with commercially available single-component glue performance.
The glue that the present invention develops, also have that exothermic peak is low, thermal expansivity and cure shrinkage low, in long-time use, components and parts produce thermal value large when can play buffering and provide protection.Detailed correlation data please refer to below form.
The foregoing is only the preferred embodiment of this patent, can not be interpreted as limitation of the present invention, on basis of the present invention, those skilled in the art the equivalent technical solutions that draws of association can still fall into the protection domain of this patent according to above disclosed content.
Claims (3)
1. a chip inductor encapsulation single-component glue, comprises the component of following parts by weight: bisphenol A type epoxy resin 30 ~ 60 parts; Toughner 5 ~ 20 parts, described toughner is acrylonitrile butadiene rubber modified epoxy resin; 1 ~ 10 part, solidifying agent; Filler 30 ~ 60 parts; Auxiliary agent 0 ~ 3 part; Described auxiliary agent comprises coupling agent, flow agent and defoamer; Described filler is the mixture of one or more in calcium carbonate, barium sulfate and silicon powder.
2. a preparation method for chip inductor encapsulation single-component glue, comprises the steps: raw material to mix under lower than the environment of 30 DEG C, and is ground to median size under lower than the environment of 35 DEG C lower than the fine powder of 30 microns, rear discharging, filling; Above-mentioned raw materials comprises bisphenol A type epoxy resin 30 ~ 60 parts; Toughner 5 ~ 20 parts, described toughner is acrylonitrile butadiene rubber modified epoxy resin; 1 ~ 10 part, solidifying agent; Filler 30 ~ 60 parts; Auxiliary agent 0 ~ 3 part; Described auxiliary agent comprises coupling agent, flow agent and defoamer; Described filler is the mixture of one or more in calcium carbonate, barium sulfate and silicon powder.
3. according to the preparation method of chip inductor according to claim 2 encapsulation single-component glue, it is characterized in that: after discharging, the condition of cure of product is hot setting at least 1 hour in the environment of more than 120 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310426529.5A CN103468194B (en) | 2013-09-17 | 2013-09-17 | Patch inductor packaging single-component glue and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310426529.5A CN103468194B (en) | 2013-09-17 | 2013-09-17 | Patch inductor packaging single-component glue and preparation method thereof |
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| Publication Number | Publication Date |
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| CN103468194A CN103468194A (en) | 2013-12-25 |
| CN103468194B true CN103468194B (en) | 2015-05-13 |
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| CN201310426529.5A Active CN103468194B (en) | 2013-09-17 | 2013-09-17 | Patch inductor packaging single-component glue and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103865461B (en) * | 2014-04-08 | 2015-12-30 | 株洲时代新材料科技股份有限公司 | A kind of tackiness agent |
| CN116694275B (en) * | 2023-04-26 | 2024-03-08 | 湖北三选科技有限公司 | Liquid epoxy plastic package material and preparation method thereof |
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| CN100532490C (en) * | 2005-08-05 | 2009-08-26 | 比亚迪股份有限公司 | Encapsulating material and method for making same |
| CN102161871A (en) * | 2011-03-09 | 2011-08-24 | 烟台德邦电子材料有限公司 | Heat-conductive insulated adhesive tape for large-power light-emitting diode (LED) and preparation method thereof |
| CN103102857B (en) * | 2012-11-29 | 2014-12-10 | 广州市尤特新材料有限公司 | High-temperature resistant adhesive for glass and preparation method thereof |
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Address after: 510000 Yonghe Economic Zone, Guangzhou economic and Technological Development Zone, Guangzhou, Guangdong Patentee after: GUANGZHOU POCHELY NEW MATERIAL TECHNOLOGY CO., LTD. Address before: 510000 Yonghe Economic Zone, Guangzhou economic and Technological Development Zone, Guangzhou, Guangdong Patentee before: Guangzhou Juhe Electronic Materials Co., Ltd. |